Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Similar
Filing Names

Advanced Optoelectronic Technology Inc
Advanced Optoelectronic Technology Inc_20100107
Advanced Optoelectronic Technology Inc_20100114
Advanced Optoelectronic Technology Inc_20100121
Advanced Optoelectronic Technology Inc_20100128
  

Advanced Optoelectronic Technology Inc patents

Recent patent applications related to Advanced Optoelectronic Technology Inc. Advanced Optoelectronic Technology Inc is listed as an Agent/Assignee. Note: Advanced Optoelectronic Technology Inc may have other listings under different names/spellings. We're not affiliated with Advanced Optoelectronic Technology Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Advanced Optoelectronic Technology Inc-related inventors




Date Advanced Optoelectronic Technology Inc patents (updated weekly) - BOOKMARK this page
10/19/17 new patent  Led package
09/21/17Light emitting diode die and manufacturing method thereof
06/08/17Lead frame and light emitting diode package having the same
05/04/17Light emitting diode lamp
03/02/17Light emitting diode (led) element
03/02/17Led element with protecting layer
12/08/16Lens for light emitting device
11/17/16Photoelectric device and manufacturing the same
08/18/16Light emitting diode package and method thereof
08/04/16Fault detection apparatus and fault detection method thereof
07/21/16Led die
07/21/16Light emitting diode module and manufacturing the same
04/28/16Led package with reflecting cup
04/21/16Light emitting device
04/14/16Led package
03/31/16Light emitting diode and manufacturing the same
03/24/16Light emitting diode die and manufacturing method thereof
03/24/16Light emitting diode (led) die module, led element with the led die module and manufacturing the led die module
03/17/16Light emitting diode chip and manufacturing same
03/03/16Lens and light emitting device having the same
03/03/16Reflector and light emitting diode illumination device having the same
03/03/16Method for manufacturing light emitting diode package
03/03/16Flip chip light emitting diode packaging structure
03/03/16Led die and manufacturing the same
03/03/16Epitaxial substrate, manufacturing the epitaxial substrate and light emitting diode having epitaxial substrate
03/03/16Light emitting diode and manufacturing the same
03/03/16Light emitting diode package and manufacturing method thereof
03/03/16Led package and manufacturing method thereof
01/28/16Lead frame and light emitting diode package having the same
10/29/15Flip chip light emitting diode and manufacturing the same
08/27/15Semiconductor lighting module package
08/27/15Fault detection circuit and fault detection method
07/02/15Light emitting diode package and manufacturing same
07/02/15Photoelectric device
06/25/15Led package
06/18/15Photoelectric device and manufacturing the same
06/11/15Light emitting diode package and manufacuring the same
06/11/15Light emitting diode package and manufacturing the same
05/21/15Method for manufacturing light emitting diode package
04/30/15Optoelectronic module and manufacturing the same
03/26/15Method for manufacturing light emitting diode
03/12/15Single photon source die and manufacturing the same
03/12/15Light emitting diode package
03/05/15Light emitting diode package having zener diode covered by reflective material
03/05/15Led module
03/05/15Led module
02/26/15Light emitting diode package and manufacturing same
02/26/15Led die and manufacturing the same
02/19/15Light emitting diode having carbon nanotubes therein and manufacturing the same
02/19/15Led die and manufacturing the same
02/19/15Light emitting diode lamp
02/12/15Led die and manufacturing the same
02/05/15Light emitting diode and manufacturing same
02/05/15Optical lens and backlight module incorporating the same
02/05/15Light emitting diode lamp
02/05/15Light emitting diode lamp
01/29/15Light emitting diode illumination device
01/15/15Led lamp
01/08/15Lens and light emitting element using the same
01/01/15Light emitting diode module
11/27/14Light emitting diode die
11/20/14Method of photocuring a coating film
11/06/14Light emitting diode chip and manufacturing method thereof
11/06/14Method for manufacturing light emitting diodes
10/30/14Light emitting diode package having a transparent metal layer function as an electrode thereof
Patent Packs
10/30/14Semiconductor light emitting device with light transmissive roughened structure and manufacturing the same
10/30/14Light emitting diode package and manucfacturing same
10/30/14Light emitting diode package
10/30/14Light emitting diode module for direct-type backlight module
10/23/14Light emitting diode chip
10/23/14Light emitting diode light bulb havign a light dispersing layer attached on an envelope thereof
10/23/14Testing system for light-emitting diode and testing light-emitting diode using the same
10/16/14Light emitting diode and manufacturing light emitting diodes
10/16/14Light emitting diode package
10/16/14Method for manufacturing light emitting diode packages
10/02/14Light emitting diode with wave-shaped bragg reflective layer and manufacturing same
10/02/14Flip-chip light emitting diode package with moisture barrier layer
10/02/14Light emitting diode device and manufacturing same
09/25/14Light emitting diode package
09/25/14Light emitting diode package
Patent Packs
09/04/14Method for manufacturing light emitting diode packages
09/04/14Method for manufacturing light emitting diode packages
08/28/14Manufacturing an led
08/07/14Method for manufacturing light emitting diode package
08/07/14Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers
07/31/14Light emitting diode package with oxidation-resistant metal coating layer
07/03/14Light emitting diode chip and manufacturing the same
06/26/14Light emitting diode device
06/26/14Light emitting diode package with light reflecting cup internally slanted
06/26/14Light emitting diode package
06/26/14Light emitting diode package
06/26/14Led epitaxial structure
06/26/14Light emitting device and mixing light thereof
06/26/14Light-emitting diode manufacturing method
06/19/14Lead frame and light emitting diode package having the same
06/19/14Method for manufacturing liquid crystal display panel
06/12/14Light emitting device and manufacturing the same
06/12/14Lamp mounting base and light emitting diode lamp incorporating the same
06/05/14Light emitting diode (led) light source device having uniform illumination
06/05/14Light emitting diode bulb
05/29/14Led with wire support
05/29/14Illumination device having air purifying apparatus
05/22/14Light emitting diode
05/22/14Method for manufacturing light emitting diode chip
05/15/14Light emitting diode chip and manufacturing the same
05/15/14Light emitting diode epitaxy structure
05/15/14Light emitting diode chip and manufacturing the same
05/15/14Method of manufacturing light emitting device package
05/15/14Method for making light emitting diode chip
05/08/14Light emitting diode and manufacturing the same
Social Network Patent Pack
05/01/14Light emitting diode package
05/01/14Light emitting diode bulb
05/01/14Light emitting diode bulb
04/17/14Method for manufacturing light emitting diodes
04/10/14Led device
04/03/14Light emitting diode having two separated substrate parts connected together by encapsulation
03/27/14Light emitting diode package and manufacturing the same
03/27/14Light emitting diode package and manufacturing the same
03/27/14Light emitting diode package and manufacturing the same
03/27/14Light-emitting diode and manufacturing method thereof
Patent Packs
03/20/14Light emitting diode light source device
03/13/14Led lamp having a large illumination angle
03/13/14Method for epitaxial growth of light emitting diode
03/06/14Light emitting diode package and manufcturing the same
03/06/14Side view light emitting diode package and manufacturing the same
03/06/14Method of manufacturing light emitting diode die
03/06/14Method for manufacturing light emitting diode
02/27/14Light emitting diode illuminating device having uniform color temperature
02/20/14Light-emitting element package and fabrication method thereof
02/20/14Method of manufacturing encapsulation structure for encapsulating led chip
01/30/14Method for manufacturing led
01/02/14Light emitting diode
01/02/14Light emitting diode lamp
01/02/14Led light bar
01/02/14Light emitting diode package and manufacturing the same
01/02/14Method for manufcturing light emitting diode package
01/02/14Method for manufacturing led package
01/02/14Method for manufacturing led package
12/26/13Led module
12/05/13High voltage light emitting diode package and manufacuting the same
11/28/13Light emitting diode with multiple quantum well structure
11/21/13Method for manufacturing led chip with inclined side surface
11/14/13Light emitting diode with two alternative mounting sides for mounting on circuit board
10/31/13Method for manufacturing supporting boards of light emitting diode modules
10/31/13Light emitting diode package structure having a substrate including ceramic fibers
10/31/13Light emitting diode light source device
10/31/13Light emitting diode package and manufacturing the same
10/31/13Side-view light emitting diode package and manufacturing the same
10/31/13Led bulb capable of mating with light bulb sockets havign different configurations
10/31/13Method for manufacturing light emitting diode package having led die fixed by anisotropic conductive paste
Patent Packs
10/31/13Method for manufacturing led package
10/31/13Method for manufacturing led
10/31/13Method for manufacturing light emitting diode
10/24/13Led light emitting apparatus having a light guiding device to achieve a uniform color distribution
10/24/13Method for manufacturing led
10/17/13Led module
10/17/13Light emitting diode die and light emitting diode package incorporating the same
10/17/13Led lighting apparatus having snow melting function
10/10/13Surface-mounting led chip
09/26/13Flip-chip semiconductor optoelectronic device and fabricating the same
09/19/13Traffic light assembly
09/19/13Method of manufacturing light emitting diode
09/12/13Light emitting diode and manufacturing method thereof
09/12/13Led module
09/12/13Method for manufacturing led package struture and manufacturing leds using the led packange struture
09/05/13Light source device having light emitting diode
09/05/13Backlight module having optcial fiber
09/05/13Backlight module
08/29/13Backlight module
08/22/13Backlight module and liquid crystal display using the same
Social Network Patent Pack
08/22/13Method for manufacturing light emitting diode package
08/22/13Method for manufacturing phosphor film and making led package having the phosphor film
07/11/13Light emitting diode
07/11/13Light emitting diode package having interconnection structures
07/11/13Method for packaging light emitting diode
07/04/13Light emitting diode device with multiple light emitting diodes
07/04/13Led device having uniform distribution of light intensity of light filed
07/04/13Light emitting diode assembly having a deformable lens
07/04/13Light emitting diode lamp having variable light field
06/27/13Light emitting diode and manufacturing method thereof
06/27/13Light emitting diode package and making same
06/27/13Light emitting diode with sidewise light output structure and manufacturing the same
06/27/13Light emitting diode package with improved optical lens structure
06/27/13Light emitting diode package having fluorescent film directly coated on light emitting diode die and manufacturing the same
06/27/13Led with versatile mounting ways
06/27/13Method for packaging light emitting diode having fluorescent material directly coated on led die thereof
06/13/13Light emitting diode with multiple transparent conductive layers and manufacturing the same
06/13/13Light emitting diode package and lens module used therein
05/30/13Led package and light emitting device having the same
05/30/13Led and backlight module using the same
Social Network Patent Pack
05/30/13Light source apparatus of backlight module
05/16/13Light emitting diode epitaxial structure and manufacturing the same
05/16/13Led package and mold of manufacturing the same
05/02/13Led illumination module
04/25/13Light emitting diode with chamfered top peripheral edge
04/18/13Gallium nitride-based semiconductor device and manufacturing the same
04/18/13Method for manufacturing led
04/04/13Led package device
03/28/13Light emitting diode with multiple transparent conductive layers and manufacturing the same
03/21/13Light-emitting diode and method manufacturing the same
03/21/13Optoelectronic device having conductive substrate
03/21/13Method for manufacturing led and led obtained thereby
03/14/13Led device having two led dies separated by a dam
03/14/13Led package device
03/14/13Led package and mold of manufacturing the same
03/14/13Method for manufacturing led with an encapsulant having a flat top face
02/28/13Led package device
02/28/13Method for packaging light emitting diode
02/07/13Light emitting diode and manufacturing method thereof
02/07/13Light emitting diode array and manufacturing the same
02/07/13Light emitting diode and manufacturing method thereof
02/07/13Led light bar
02/07/13Manufacturing led package structure
01/31/13Light emitting diode device
01/31/13Light-emitting diode package and manufacturing the same
01/24/13Led module and manufacturing the same
01/17/13Method for packaging light emitting diodes and light emitting module having led packages formed by the method
01/17/13Light emitting diode package and manufacturing the same
01/17/13Led and manufacturing the same
01/17/13Method for manufacturing light emitting diode
Social Network Patent Pack
01/10/13Light emitting diode package and manufacturing the same
01/03/13Light emitting diode
01/03/13Light emitting diode package and making the same
01/03/13Led and manufacturing the same
12/27/12Led package and making the same
12/27/12Flip-chip light emitting diode and making the same
12/20/12Method for packaging light emitting diodes
12/20/12Method for fabricating light emitting diode
12/13/12Led package
12/13/12Method for manufacturing light emitting diode package
12/06/12Led package and making the same
12/06/12Led device and manufacturing the same
11/22/12Light emitting diode array and manufacturing the same
11/08/12Semiconductor light emitting device and manufacturing thereof
11/08/12Planar lighting module
11/01/12Light emitting diode and manufacturing the same
11/01/12Light emitting diode device
11/01/12Led package structure
11/01/12Led package and making the same
11/01/12Method for manufacturing light emitting diodes and light emitting diodes obtained thereby
11/01/12Light emitting diode chip and manufacturing the same
10/18/12Light emitting diode epitaxial structure and manufacturing method thereof
10/11/12Light emitting diode and manufacturing method thereof
10/11/12Light emitting diode package and manufacturing the same
10/04/12Led package and manufacturing the same
09/27/12Led bar module with good heat dissipation efficiency
09/27/12Led package, making the led package and light source having the same
09/27/12Led package
09/27/12Method for manufacturing light emitting diode







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Advanced Optoelectronic Technology Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Advanced Optoelectronic Technology Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###




';