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Advanced Semiconductor Engineering Inc
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Advanced Semiconductor Engineering Inc_20100128
Advanced Semiconductor Engineering Inc_20100114

Advanced Semiconductor Engineering Inc patents


Recent patent applications related to Advanced Semiconductor Engineering Inc. Advanced Semiconductor Engineering Inc is listed as an Agent/Assignee. Note: Advanced Semiconductor Engineering Inc may have other listings under different names/spellings. We're not affiliated with Advanced Semiconductor Engineering Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Advanced Semiconductor Engineering Inc-related inventors


Semiconductor device packages and stacked package assemblies including high density interconnections

A semiconductor device package includes an electronic device and a redistribution stack. The redistribution stack includes a dielectric layer disposed over an active surface of the electronic device and defining an opening exposing at least a portion of a contact pad of the electronic device. The redistribution stack also includes... Advanced Semiconductor Engineering Inc

Molding for large panel fan-out package

The present disclosure relates to wafer level packages including one or more semiconductor dies and a method of manufacturing the same. A method comprises: providing a carrier having a predetermined area, disposing a semiconductor device on the predetermined area, and forming a sacrificial wall on a periphery of the predetermined... Advanced Semiconductor Engineering Inc

Semiconductor substrate, semiconductor module and manufacturing the same

A semiconductor substrate includes: (1) a first dielectric structure having a first surface and a second surface opposite the first surface; (2) a second dielectric structure having a third surface and a fourth surface opposite the third surface, wherein the fourth surface faces the first surface, the second dielectric structure... Advanced Semiconductor Engineering Inc

Semiconductor package device and manufacturing the same

An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. The optical module... Advanced Semiconductor Engineering Inc

Semiconductor package device and manufacturing the same

A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the... Advanced Semiconductor Engineering Inc

Semiconductor package device and manufacturing the same

A semiconductor package device includes a first die, an adhesive layer, and an encapsulant layer. The first die comprises a first electrode at a first surface of the first die and a second electrode at a second surface of the first die opposite to the first surface of the first... Advanced Semiconductor Engineering Inc

Semiconductor device packages

A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.... Advanced Semiconductor Engineering Inc

Substrate, semiconductor package including the same, and manufacturing the same

A substrate includes a dielectric layer having a first surface and a second surface opposite to the first surface, a first circuit layer and at least one second conductive element. The first circuit layer is disposed adjacent to the first surface of the dielectric layer, and includes at least one... Advanced Semiconductor Engineering Inc

Testing system, testing an integrated circuit and a circuit board including the same

A testing system includes a subtractor and a divider. The subtractor is configured to receive a first voltage of a circuit being tested and a second voltage of the circuit, and to derive a difference between the first voltage and the second voltage. The divider is configured to receive the... Advanced Semiconductor Engineering Inc

Semiconductor package structure and manufacturing the same

The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first... Advanced Semiconductor Engineering Inc

Semiconductor device package

A semiconductor device package includes a first conductive base, a first semiconductor die, a dielectric layer, a first patterned conductive layer, and a second patterned conductive layer. The first conductive base defines a first cavity. The first semiconductor die is on a bottom surface of the first cavity. The dielectric... Advanced Semiconductor Engineering Inc

Semiconductor device package

A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface... Advanced Semiconductor Engineering Inc

Semiconductor devices and methods of manufacturing the same

A semiconductor package includes a first semiconductor component, a second semiconductor component, and a connecting element. The first semiconductor component includes a first substrate, and a first bonding pad disposed adjacent to a first surface of the first substrate, and at least one conductive via structure extending from a second... Advanced Semiconductor Engineering Inc

Interposer, semiconductor package structure, and semiconductor process

An interposer includes an interconnection structure and a redistribution layer. The interconnection structure includes a metal layer, at least one metal via and an isolation material. The metal layer defines at least one through hole having a side wall. The at least one metal via is disposed in the through... Advanced Semiconductor Engineering Inc

Semiconductor device packages

A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall... Advanced Semiconductor Engineering Inc

Low loss substrate for high data rate applications

In one or more embodiments, a substrate includes a patterned conductive layer and a reference layer. The patterned conductive layer includes a pair of first conductive traces, a pair of second conductive traces and a reference trace between the pair of first conductive traces and the pair of second conductive... Advanced Semiconductor Engineering Inc

Double plated conductive pillar package substrate

The present disclosure relates to a package substrate. The package substrate includes a patterned conductive layer and conductive pillars. Each of the conductive pillars includes a first portion and a second portion, where the first portion contacts the patterned conductive layer at one end of the first portion, and the... Advanced Semiconductor Engineering Inc

Semiconductor device package and a manufacturing the same

A semiconductor package comprises a substrate, a pad, a first isolation layer, an interconnection layer, and a conductive post. The substrate has a first surface and a second surface opposite the first surface. The pad has a first portion and a second portion on the first surface of the substrate.... Advanced Semiconductor Engineering Inc

Embedded component package structure and manufacturing the same

An embedded component package structure includes a substrate. A first conductive component extends from a first surface of the substrate to a second surface of the substrate, a first conductive layer is disposed on the first surface of the substrate, and a second conductive layer is disposed on the second... Advanced Semiconductor Engineering Inc

Lid array panel, package with lid and making the same

A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array... Advanced Semiconductor Engineering Inc

Semiconductor package structure, package on package structure and packaging method

A semiconductor package structure includes a substrate, a first semiconductor device, a first encapsulant and a second encapsulant. The substrate has a first coefficient of thermal expansion CTE1. The first semiconductor device is disposed adjacent to a first surface of the substrate. The first encapsulant is disposed on the first... Advanced Semiconductor Engineering Inc

Semiconductor device package and a manufacturing the same

At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first... Advanced Semiconductor Engineering Inc

Semiconductor package device and manufacturing the same

A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed... Advanced Semiconductor Engineering Inc

Fan-out wafer level packaging structure

A semiconductor device includes a first die including a first pad and a first passivation layer, a second die including a second pad and a second passivation layer, and an encapsulant surrounding the first die and the second die. Surfaces of the first die are not coplanar with corresponding surfaces... Advanced Semiconductor Engineering Inc

Semiconductor die, semiconductor wafer and manufacturing the same

A semiconductor die includes a semiconductor body, an insulating layer, a conductive circuit layer and at least one conductive bump. The semiconductor body has a first surface, a second surface and a side surface extending between the first surface and the second surface. The insulating layer is disposed on the... Advanced Semiconductor Engineering Inc

Semiconductor package structure and manufacturing the same

A semiconductor package structure includes a conductive structure, a semiconductor element disposed on and electrically connected to the conductive structure, a supporting structure, an encapsulant, and a metal layer. The supporting structure is disposed on the conductive structure and surrounds the semiconductor element. The encapsulant covers the semiconductor element. The... Advanced Semiconductor Engineering Inc

Semiconductor devices and semiconductor packages

A semiconductor device includes a semiconductor element, a trace disposed adjacent to a surface of the semiconductor element, a bonding pad disposed adjacent to the surface of the semiconductor element and connected to the trace, and a pillar disposed on the bonding pad. The pillar includes a first end wall,... Advanced Semiconductor Engineering Inc

Package process and package structure

A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the... Advanced Semiconductor Engineering Inc

Semiconductor device package and manufacturing the same

A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package substrate includes a first surface, a second surface opposite to the first surface, and an edge. The first electronic device is positioned over and electrically connected to... Advanced Semiconductor Engineering Inc

Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same

The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. The cladding portion encloses the core portion, and includes a light reflection surface and a light incident... Advanced Semiconductor Engineering Inc

Semiconductor chip, semiconductor device and manufacturing process for manufacturing the same

A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (RDL). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile... Advanced Semiconductor Engineering Inc

Semiconductor device and manufacturing the same

The present disclosure relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes a substrate, a first package body and at least one connecting element. The substrate has a first surface. The first package body is disposed adjacent to the first surface of the... Advanced Semiconductor Engineering Inc

Semiconductor devices

A semiconductor device includes a substrate and at least one inductor on the substrate. The inductor includes top portions separated from one another, bottom portions separated from one another, and side portions separated from one other. Each side portion extends between one of the top portions and one of the... Advanced Semiconductor Engineering Inc

Double side via last double embedded patterned substrate

An interposer substrate includes a first circuit pattern embedded at a first surface of a dielectric layer and a second circuit pattern embedded at a second surface of the dielectric layer; a middle patterned conductive layer in the dielectric layer between the first circuit pattern and the second circuit pattern;... Advanced Semiconductor Engineering Inc

Reduced-dimension via-land structure and making the same

A package substrate includes a dielectric layer, a conductive via disposed in the dielectric layer, and a conductive pattern layer exposed from a first surface of the dielectric layer. The conductive pattern layer includes traces and a via land, the via land extends into the conductive via, and a circumferential... Advanced Semiconductor Engineering Inc

08/03/17 / #20170221805

Semiconductor package device

An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open... Advanced Semiconductor Engineering Inc

08/03/17 / #20170222093

Led packages and related methods

An LED package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion... Advanced Semiconductor Engineering Inc

07/20/17 / #20170207151

Semiconductor package structure and manufacturing the same

A semiconductor package structure includes a conductive structure, at least two semiconductor elements and an encapsulant. The conductive structure has a first surface and a second surface opposite the first surface. The semiconductor elements are disposed on and electrically connected to the first surface of the conductive structure. The encapsulant... Advanced Semiconductor Engineering Inc

07/20/17 / #20170207153

Semiconductor package device and manufacturing the same

In one or more embodiments, a semiconductor package includes a redistribution layer, a conductive pad, a dielectric layer, a silicon layer, and a conductive contact. The redistribution layer includes a first surface and a second surface opposite to the first surface. The conductive pad is on the first surface of... Advanced Semiconductor Engineering Inc

07/20/17 / #20170207352

Electronic device, package structure and manufacturing the same

An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is... Advanced Semiconductor Engineering Inc

07/13/17 / #20170200682

Semiconductor device package and manufacturing the same

A semiconductor device package includes a carrier, an electronic component disposed over a top surface of the carrier, and a package body disposed over the top surface of the carrier and covering the electronic component. The semiconductor device package further includes a shield layer, which in turn includes a first... Advanced Semiconductor Engineering Inc

07/13/17 / #20170200702

Power and ground design for through-silicon via structure

In one or more embodiments, a semiconductor device includes a substrate, a first dielectric layer and a first conductive layer. The substrate includes a first surface and a second surface opposite the first surface. The first dielectric layer is on the first surface of the substrate. The first conductive layer... Advanced Semiconductor Engineering Inc

05/25/17 / #20170148746

Semiconductor device package

A semiconductor device package includes a conductive base, and a cavity defined from a first surface of the conductive base, the cavity having a bottom surface and a depth. A semiconductor die is disposed on the bottom surface of the cavity, the semiconductor die having a first surface and a... Advanced Semiconductor Engineering Inc

05/18/17 / #20170138566

Optical device package and manufacturing the same

In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a... Advanced Semiconductor Engineering Inc

05/18/17 / #20170141007

Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages

The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.... Advanced Semiconductor Engineering Inc

05/18/17 / #20170141257

Semiconductor package structures and manufacturing the same

An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The... Advanced Semiconductor Engineering Inc

05/11/17 / #20170133311

Semiconductor package and manufacturing method thereof

The present disclosure relates to a semiconductor package and a manufacturing method thereof The semiconductor package includes a semiconductor element including a main body, a plurality of conductive vias, and at least one filler. The conductive vias penetrate through the main body. The filler is located in the main body,... Advanced Semiconductor Engineering Inc

05/11/17 / #20170133360

Semiconductor device and process of making the same

A semiconductor device includes a substrate, a seed layer, a first patterned metal layer, a dielectric layer and a second metal layer. The seed layer is disposed on a surface of the substrate. The first patterned metal layer is disposed on the seed layer and has a first thickness. The... Advanced Semiconductor Engineering Inc

05/04/17 / #20170125310

Semiconductor process

The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a... Advanced Semiconductor Engineering Inc

04/27/17 / #20170113922

Semiconductor device package and manufacturing the same

A semiconductor device package includes a carrier, a sensor element disposed on or within the carrier, a cover and a filter. The cover includes a base substrate and a periphery barrier. The base substrate includes an inner sidewall. The inner sidewall of the base substrate defines a penetrating hole extending... Advanced Semiconductor Engineering Inc

04/27/17 / #20170113922

Semiconductor device package and manufacturing the same

A semiconductor device package includes a carrier, a sensor element disposed on or within the carrier, a cover and a filter. The cover includes a base substrate and a periphery barrier. The base substrate includes an inner sidewall. The inner sidewall of the base substrate defines a penetrating hole extending... Advanced Semiconductor Engineering Inc

04/27/17 / #20170117240

Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and manufacturing the same

The present disclosure relates to redistribution layer structures useful in semiconductor substrate packages, semiconductor package structures, and chip structures. In an embodiment, a redistribution layer structure includes a dielectric layer, an anti-plating layer, and a conductive material. The dielectric layer defines one or more trenches. The conductive material is disposed... Advanced Semiconductor Engineering Inc

04/20/17 / #20170108357

Optical module and manufacturing process thereof

The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the... Advanced Semiconductor Engineering Inc

04/20/17 / #20170110392

Semiconductor package structure and manufacturing the same structure

A semiconductor package structure includes a first semiconductor substrate, a second semiconductor substrate, a semiconductor die electrically connected to the first semiconductor substrate, an interconnection element and an encapsulant. The first semiconductor substrate includes a first top pad, and the second semiconductor substrate includes a second bottom pad. The interconnection... Advanced Semiconductor Engineering Inc

04/20/17 / #20170110426

Lid structure and semiconductor device package including the same

The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated... Advanced Semiconductor Engineering Inc

04/13/17 / #20170103946

Semiconductor device and manufacturing the same

A semiconductor device includes a substrate, at least one integrated passive device, a first redistribution layer, a second redistribution layer, and conductive vias. The at least one integrated passive device includes at least one capacitor disposed adjacent to a first surface of the substrate. The first redistribution layer is disposed... Advanced Semiconductor Engineering Inc

03/23/17 / #20170082485

Optical device, electrical device and passive optical component

An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a... Advanced Semiconductor Engineering Inc

03/16/17 / #20170073221

Semiconductor device package and manufacturing the same

A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall... Advanced Semiconductor Engineering Inc

03/16/17 / #20170077023

Semiconductor substrate, semiconductor module and manufacturing the same

A semiconductor substrate includes: 1) a first dielectric structure having a first surface and a second surface opposite the first surface; 2) a second dielectric structure having a third surface and a fourth surface opposite the third surface, wherein the fourth surface faces the first surface, the second dielectric structure... Advanced Semiconductor Engineering Inc

03/16/17 / #20170077039

Semiconductor package device and manufacturing the same

The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a semiconductor package device includes a carrier, a first antenna, a second antenna, a package body and a first shield. The carrier includes an antenna area and a component... Advanced Semiconductor Engineering Inc

02/16/17 / #20170047276

Semiconductor device package and manufacturing the same

The present disclosure relates to a semiconductor device package and a method for manufacturing the same. The semiconductor device package comprises a substrate, a first patterned conductive layer, an insulator layer, a second patterned conductive layer, and a dielectric layer. The first patterned conductive layer is disposed on a surface... Advanced Semiconductor Engineering Inc

02/09/17 / #20170040279

Semiconductor device and semiconductor package

The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor element, two pillar structures, and an insulation layer. The semiconductor element has a surface and includes at least one bonding pad disposed adjacent to the surface. The two pillar structures... Advanced Semiconductor Engineering Inc

01/26/17 / #20170025322

Fan-out wafer level packaging structure

A semiconductor device includes a first die including a first pad and a first passivation layer, a second die including a second pad and a second passivation layer, and an encapsulant surrounding the first die and the second die. Surfaces of the first die are not coplanar with corresponding surfaces... Advanced Semiconductor Engineering Inc

01/26/17 / #20170025363

Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and manufacturing the same

The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. The shield includes multiple non-magnetic conductive layers, multiple insulating... Advanced Semiconductor Engineering Inc

01/19/17 / #20170018550

Semiconductor device and manufacturing the same

A semiconductor device and a method for manufacturing the same is described. The semiconductor device includes a substrate, a first capacitor and a second capacitor. The first capacitor includes a first conductive layer, a first insulating layer and a second conductive layer. The first conductive layer is disposed on the... Advanced Semiconductor Engineering Inc

Patent Packs
01/19/17 / #20170019993

Semiconductor substrate, semiconductor module and manufacturing the same

The present disclosure relates to a semiconductor substrate, a semiconductor module and a method for manufacturing the same. The semiconductor substrate includes a first dielectric structure, a second dielectric structure, a first patterned conductive layer and a second patterned conductive layer. The first dielectric structure has a first surface and... Advanced Semiconductor Engineering Inc

01/12/17 / #20170012007

Semiconductor packages with thermal-enhanced conformal shielding and related methods

The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on... Advanced Semiconductor Engineering Inc

01/05/17 / #20170005042

Semiconductor device packages

The present disclosure relates to a semiconductor device package and a method for manufacturing the semiconductor device package. The semiconductor device package includes a substrate, a grounding element, a component, a package body and a conductive layer. The grounding element is disposed in the substrate and includes a connection surface... Advanced Semiconductor Engineering Inc








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