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Air Water Inc
Air Water Inc_20100107
  

Air Water Inc patents

Recent patent applications related to Air Water Inc. Air Water Inc is listed as an Agent/Assignee. Note: Air Water Inc may have other listings under different names/spellings. We're not affiliated with Air Water Inc, we're just tracking patents.

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Date Air Water Inc patents (updated weekly) - BOOKMARK this page
08/17/17Semiconductor device and manufacturing the same
05/11/17Vinylbenzylated phenol compound, manufacturing vinylbenzylated phenol compound, activated ester resin, manufacturing activated ester resin, thermoset resin composition, hardened material of thermoset resin composition, interlayer insulating material, prepreg, and manufacturing prepreg
02/16/17Composition containing 3-chloro-4-methoxybenzylamine hydrochloride, and producing same
03/05/15Ventilator
04/17/14Method of heat treatment and the directions for use of furnace of heat treatment
02/20/14Method for producing single crystal sic substrate and single crystal sic substrate produced by the same
12/26/13Carbon dioxide snow ejecting device
10/03/13Resin composition, and prepreg and laminate using same
08/29/13Production refined 6-bromo-2-naphthalenecarboxylic acid product
08/22/13Cryogenic pump for liquefied gases
09/20/12Non-thermofusible phenol resin powder, producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
05/31/12Non-thermofusible phenol resin powder, producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
05/10/12Angiogenesis regulating composition and regulating angiogenesis
02/16/12Process for producing pyridine compound, and pyridine compound
11/17/11Method of sealing a semiconductor element with an epoxy resin composition
04/08/10Phenol resin powder, producing the same, and phenol resin powder dispersion liquid
03/25/10Non-thermofusible phenol resin powder, producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
03/25/10Non-thermofusible phenol resin powder, producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
01/07/10Non-thermofusible phenol resin powder, producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
09/10/09Method of generating nitrogen and use in the same
05/28/09Phenolic resin, production method and use thereof
03/12/09Process for producing 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl
01/07/10Non-thermofusible phenol resin powder, producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Air Water Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Air Water Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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