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American Air Liquide Inc
American Air Liquide Inc_20100107

American Air Liquide Inc patents


Recent patent applications related to American Air Liquide Inc. American Air Liquide Inc is listed as an Agent/Assignee. Note: American Air Liquide Inc may have other listings under different names/spellings. We're not affiliated with American Air Liquide Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | American Air Liquide Inc-related inventors


Method of etching semiconductor structures with etch gas

Disclosed are sulfur-containing compounds for plasma etching channel holes, gate trenches, staircase contacts, capacitor holes, contact holes, etc., in Si-containing layers on a substrate and plasma etching methods of using the same. The plasma etching compounds may provide improved selectivity between the Si-containing layers and mask material, less damage to... American Air Liquide Inc

Organodisilane precursors for ald/cvd silicon-containing film applications

Disclosed are Si-containing film forming composition comprising organodisilane precursors. The organodisilane precursors have the formula (E-(CR)n-E)SiH2—SiHx(E-(CR)n-E)3-x, wherein x is 2 or 3; each n is independently 1 or 3; each (E-(CR)n-E) group is a monoanionic bidentate ligand bonding to the Si through each E; each E is independently chosen from... American Air Liquide Inc

Carbosilane substituted amine precursors for deposition of si-containing films and methods thereof

Disclosed are Si-containing film forming compositions comprising carbosilane substituted amine precursors. The carbosilane substituted amine precursors have the formula (R1)aN(—SiHR2—CH2—SiH2R3)3-a, wherein a=0 or 1; R1 is H, a C1 to C6 alkyl group, or a halogen; R2 and R3 is each independently H; a halogen; an alkoxy group having the... American Air Liquide Inc

Adjustable cylinder bracket

A cylinder transport and mounting system is provided. This system includes a object mounting yoke, and at least one bracket selected from the group consisting of a conveyance mounting bracket, and user mounting bracket, wherein the cylinder mounting yoke is configured to attach securely to a cylinder and to detachably... American Air Liquide Inc

Adjustable cylinder bracket

A cylinder transport and mounting system is provided. This system includes a object mounting yoke, and at least one bracket selected from the group consisting of a conveyance mounting bracket, and user mounting bracket, wherein the cylinder mounting yoke is configured to attach securely to a cylinder and to detachably... American Air Liquide Inc

Nitrogen-containing compounds for etching semiconductor structures

A method for etching silicon-containing films is disclosed. The method includes the steps of introducing a vapor of a nitrogen containing etching compound into a reaction chamber containing a silicon-containing film on a substrate, wherein the nitrogen containing etching compound is an organofluorine compound containing at least one C≡N or... American Air Liquide Inc

Iodine-containing compounds for etching semiconductor structures

A method for etching silicon-containing films is disclosed. The method includes the steps of introducing a vapor of an iodine-containing etching compound into a reaction chamber containing a silicon-containing film on a substrate, wherein the iodine-containing etching compound has the formula CaHxFyIz, wherein a=1-3, x=0-6, y=1-7, z=1-2, x+y+z=4 when a=1,... American Air Liquide Inc

Method and burner using the curie effect for controlling reactant velocity for operation in pre-heated and non-pre-heated modes

Methods, burner, apparatuses, and systems are provided for controlling a velocity of a jet of gas exiting a burner when the gas is heated or not and at a corresponding second higher temperature or lower first temperature. Through the use of a temperature-sensitive magnetic valve, the flow of a gas... American Air Liquide Inc

Chemistries for tsv/mems/power device etching

Replacement chemistries for the cC4F8 passivation gas in the Bosch etch process and processes for using the same are disclosed. These chemistries have the formula CxHyFz, with 1 ≦x<7, 1≦y≦13, and 1≦z≦13. The replacement chemistries may reduce RIE lag associated with deep silicon aperture etching.... American Air Liquide Inc

Fluorocarbon molecules for high aspect ratio oxide etch

Etching gases are disclosed for plasma etching channel holes, gate trenches, staircase contacts, capacitor holes, contact holes, etc., in Si-containing layers on a substrate and plasma etching methods of using the same. The etching gases are trans-1,1,1,4,4,4-hexafluoro-2-butene; cis-1,1,1,4,4,4-hexafluoro-2-butene; hexafluoroisobutene; hexafluorocyclobutane (trans-1,1,2,2,3,4); pentafluorocyclobutane (1,1,2,2,3-); tetrafluorocyclobutane (1,1,2,2-); or hexafluorocyclobutane (cis-1,1,2,2,3,4). The etching... American Air Liquide Inc








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