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Amkor Technology Inc
Amkor Technology Inc_20131212

Amkor Technology Inc patents


Recent patent applications related to Amkor Technology Inc. Amkor Technology Inc is listed as an Agent/Assignee. Note: Amkor Technology Inc may have other listings under different names/spellings. We're not affiliated with Amkor Technology Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Amkor Technology Inc-related inventors


 new patent  Method and system for packing optimization of semiconductor devices

Provided is a disclosure for optimizing the number of semiconductor devices on a wafer/substrate. The optimization comprises laying out, cutting, and packaging the devices efficiently.... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.... Amkor Technology Inc

Semiconductor package with clip alignment notch

An electronic component includes a leadframe and a first semiconductor die. The leadframe includes a leadframe top side, a leadframe bottom side opposite the leadframe top side, and a top notch at the leadframe top side. The top notch includes a top notch base located between the leadframe top side... Amkor Technology Inc

Semiconductor package and fabricating method thereof

A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.... Amkor Technology Inc

Method of manufacturing a package-on-package type semiconductor package

A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.... Amkor Technology Inc

Semiconductor package using a coreless signal distribution structure

A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

An electronic device and a method of manufacturing an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing metal studs to further set a semiconductor die into the encapsulant.... Amkor Technology Inc

Fingerprint sensor and manufacturing method thereof

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a... Amkor Technology Inc

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor... Amkor Technology Inc

Wafer level fan out semiconductor device and manufacturing method thereof

A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and a method of manufacturing thereof, that comprises a substrate including a dielectric layer, at least one conductive trace and conductive bump pad formed on one... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal... Amkor Technology Inc

Method of forming a semiconductor package with conductive interconnect frame and structure

A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame having leadfingers configured for directly attaching to a semiconductor device, such as an integrated power semiconductor device that includes both power devices and logic type devices. The leadfingers... Amkor Technology Inc

System and laser assisted bonding of semiconductor die

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.... Amkor Technology Inc

Method of forming a plurality of electronic component packages

A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and... Amkor Technology Inc

Semiconductor package and manufacturing method thereof

Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.... Amkor Technology Inc

Embedded die in panel method and structure

Methods for an embedded die panel are disclosed and may include fabricating a first layered structure by: forming first redistribution layers on a first carrier, forming a first dielectric layer on the first redistribution layers and carrier, forming a mask pattern on the first dielectric layer exposing a portion of... Amkor Technology Inc

Semiconductor package and fabricating method thereof

A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.... Amkor Technology Inc

Semiconductor device using emc wafer support system and fabricating method thereof

Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A thin semiconductor device with enhanced edge protection, and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a thin semiconductor device comprising a substrate with an edge-protection region, and a method of manufacturing thereof.... Amkor Technology Inc

Semiconductor package and manufacturing method thereof

A semiconductor device with enhanced interposer quality, and method of manufacturing thereof. For example and without limitation, various aspects of the present disclosure provide an interposer die that comprises a first signal distribution structure comprising at least a first dielectric layer and a first conductive layer, wherein the signal distribution... Amkor Technology Inc

Semiconductor device having conductive wire with increased attachment angle and method

A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one... Amkor Technology Inc

Fingerprint sensor and manufacturing method thereof

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints... Amkor Technology Inc

Semiconductor device with thin redistribution layers

A semiconductor device with thin redistribution layers is disclosed and may include forming a first redistribution layer on a dummy substrate, electrically coupling a semiconductor die to the first redistribution layer, and forming a first encapsulant layer on the redistribution layer and around the semiconductor die. The dummy substrate may... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches... Amkor Technology Inc

Method for fabricating semiconductor package and semiconductor package using the same

Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

Disclosed are a semiconductor device and a manufacturing method thereof, which can easily increase the number of input/output pads by increasing regions for forming the input/output pads such that a redistribution layer is formed to extend up to an encapsulant. In one embodiment, the manufacturing method includes preparing a wafer... Amkor Technology Inc

Capacitor of semiconductor integrated circuit and manufacturing the same

Provided are a capacitor of a semiconductor integrated circuit and a method for manufacturing the same, for example a metal-insulator-metal (MIM) type capacitor of a semiconductor integrated circuit, which is capable of improving adhesive force between an electrode layer and a dielectric layer of a capacitor, and a method for... Amkor Technology Inc

A semiconductor package having an etched groove for an embedded device formed on bottom surface of a support substrate and a fabricating the same

A semiconductor device with etched grooves for embedded devices is disclosed and may, for example, include a substrate comprising a top surface and a bottom surface, a groove extending into the substrate from the bottom surface, and a redistribution structure in the substrate between the top surface and the bottom... Amkor Technology Inc

Semiconductor product with interlocking metal-to-metal bonds and manufacturing thereof

A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.... Amkor Technology Inc

Semiconductor device package and manufacturing method thereof

Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a signal redistribution structure that comprises an anti-oxidation layer.... Amkor Technology Inc

Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects

A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion... Amkor Technology Inc

Semiconductor device and manufacturing method thereof

A semiconductor device and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor package, and a semiconductor package resulting therefrom, that comprises attaching at least one semiconductor die to a metal plate, encapsulating the at least... Amkor Technology Inc

Transient interface gradient bonding for metal bonds

A method and apparatus for performing metal-to-metal bonding for an electrical device and an electrical device produced thereby. For example and without limitation, various aspects of this disclosure provide a process that comprises depositing a thin metal layer on a copper pillar and then mating the copper pillar with another... Amkor Technology Inc

06/01/17 / #20170154861

Semiconductor device and manufacturing method thereof

A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via... Amkor Technology Inc

05/18/17 / #20170140988

Encapsulated semiconductor package and manufacturing thereof

Encapsulated semiconductor packages and methods of production thereof. As a non-limiting example, a semiconductor package may be produced by partially dicing a wafer, molding the partially diced wafer, and completely dicing the molded and partially diced wafer.... Amkor Technology Inc

05/18/17 / #20170141046

Semiconductor device with an electromagnetic interference (emi) shield

A method for forming a semiconductor device with an electromagnetic interference shield is disclosed and may include coupling a semiconductor die to a first surface of a substrate, encapsulating the semiconductor die and portions of the substrate using an encapsulant, placing the encapsulated substrate and semiconductor die on an adhesive... Amkor Technology Inc

05/18/17 / #20170141081

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.... Amkor Technology Inc

05/11/17 / #20170133310

Semiconductor package and fabricating method thereof

A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.... Amkor Technology Inc

05/11/17 / #20170133334

Semiconductor device and manufacturing method thereof

A semiconductor device and a manufacturing method thereof, which can reduce a number of manufacturing processes and/or can reduce a thickness of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for the elimination process steps and/or a reduction in package size based on dielectric layer... Amkor Technology Inc

05/04/17 / #20170125264

Semiconductor device and manufacturing method thereof

Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a... Amkor Technology Inc

05/04/17 / #20170125881

Packaged electronic device having integrated antenna and locking structure

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the... Amkor Technology Inc

04/27/17 / #20170117200

Semiconductor device and manufacturing method thereof

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at... Amkor Technology Inc

04/27/17 / #20170117214

Semiconductor device with through-mold via

In accordance with the present invention, there is provided multiple embodiments of a semiconductor device. In each embodiment, the semiconductor device comprises a substrate having a conductive pattern formed thereon. In addition to the substrate, each embodiment of the semiconductor device includes at least one semiconductor die which is electrically... Amkor Technology Inc

04/27/17 / #20170117249

Manufacturing semiconductor device and semiconductor device thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die... Amkor Technology Inc

03/09/17 / #20170069558

Semiconductor package having routable encapsulated conductive substrate and method

A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias... Amkor Technology Inc

03/02/17 / #20170062364

Semiconductor package and manufacturing method thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or... Amkor Technology Inc

03/02/17 / #20170062372

Semiconductor device and manufacturing method thereof

A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.... Amkor Technology Inc

01/19/17 / #20170018493

Semiconductor package and manufacturing method thereof

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least... Amkor Technology Inc

01/05/17 / #20170005029

Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure

In one embodiment, a semiconductor package includes a multi-layer encapsulated conductive substrate having a fine pitch. The multi-layer encapsulated conductive substrate includes a conductive leads spaced apart from each other, a first encapsulant disposed between the leads, a first conductive layer electrically connected to the plurality of leads, conductive pillars... Amkor Technology Inc

01/05/17 / #20170005029

Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure

In one embodiment, a semiconductor package includes a multi-layer encapsulated conductive substrate having a fine pitch. The multi-layer encapsulated conductive substrate includes a conductive leads spaced apart from each other, a first encapsulant disposed between the leads, a first conductive layer electrically connected to the plurality of leads, conductive pillars... Amkor Technology Inc

01/05/17 / #20170005070

Method of manufacturing a semiconductor package

Methods for a semiconductor device package formed in a chip-on-wafer last process using thin film adhesives are disclosed and may include bonding a first carrier to a first surface of an interposer in wafer form, forming conductive bumps on a second surface of the interposer, bonding a second carrier to... Amkor Technology Inc








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