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Ams Ag patents


Recent patent applications related to Ams Ag. Ams Ag is listed as an Agent/Assignee. Note: Ams Ag may have other listings under different names/spellings. We're not affiliated with Ams Ag, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Ams Ag-related inventors


 new patent  Method to produce a ruggedized package of an image sensor

A method to produce a ruggedized package (1) of an image sensor comprises a step of producing a plurality of image sensors (100a, . . ... Ams Ag

Sensor circuit and method for measuring a physical or chemical quantity

A sensor circuit for measuring a physical or chemical quantity comprises a capacitive sensor. A sense and a base electrode of the sensor form a capacitive element with a capacity depending on the quantity. ... Ams Ag

Field effect transistor device with separate source and body contacts and method of producing the device

The field effect transistor device comprises a substrate (1) of semiconductor material, a body well of a first type of electric conductivity in the substrate, a source region in the body well, the source region having an opposite second type of electric conductivity, a source contact (3) on the source region, a body contact region of the first type of electric conductivity in the body well, a body contact (5) on the body contact region, and a gate electrode layer (2) partially overlapping the body well. A portion (2*) of the gate electrode layer (2) is present between the source contact (3) and the body contact (5).. ... Ams Ag

Rfid transponder, rfid transponder arrangement and method for communication between an rfid transponder and a reading device

An rfid transponder (t) suitable for communication with a reading device (rd) and adapted to be connected to a monitored unit (mu) is provided. The rfid transponder (t) comprises a comparing unit (cu) adapted to and arranged to receive a status signal from the monitored unit (mu) and configured to compare a value of the status signal to at least one predefined reference value and a state machine circuit (stm) connected to the comparing unit (cu) and configured to determine, based on a result of the comparison, whether the value of the status signal lies outside a range of operation defined by the at least one reference value. ... Ams Ag

Avalanche diode arrangement and method for providing a detection signal

An avalanche diode arrangement (10) comprises an avalanche diode (11) that is coupled to a first voltage terminal (16) and to a first node (13), an event detector (14) for detecting a trigger event of the avalanche diode (11) and being coupled to the first node (13), a quenching circuit (15) that is coupled to the first node (13), and a detection circuit (20) coupled to the first node (13). The detection circuit (20) is configured to provide a detection signal (svc2) that depends on a value of a node voltage (sva) at the first node (13).. ... Ams Ag

Method of producing an interposer-chip-arrangement for dense packaging of chips

The method of producing an interposer-chip-arrangement, comprises providing an interposer (1) with an integrated circuit (25), arranging a dielectric layer (2) with metal layers embedded in the dielectric layer above a main surface (10) of the interposer, connecting the integrated circuit with at least one of the metal layers, forming an interconnection (7) through the interposer, the interconnection contacting one of the metal layers, arranging a further dielectric layer (3) above a further main surface (11) of the interposer opposite the main surface and arranging a further metal layer in or on the further dielectric layer, the further metal layer being connected with the interconnection, arranging a chip provided with at least one contact pad at the main surface or at the further main surface, and electrically conductively connecting the contact pad with the interconnection.. . ... Ams Ag

Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component

According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.. ... Ams Ag

Sensor arrangement and method for operating a sensor arrangement

A sensor arrangement comprises at least a first, a second, and a third light sensor. A three-dimensional framework comprises at least a first, a second, and a third connection means which are connected to the at least first, second, and third light sensor, respectively. ... Ams Ag

Charger control circuit and method for charger control

A charger control circuit (cc) comprises a first charger terminal (ct1) and a system terminal (st) and is configured to assign a voltage applied at the first charger terminal (ct1) to one of at least three voltage ranges by performing at least one voltage comparison. The charger control circuit (cc) is configured to determine and distinguish, based on the assignment, whether an external charger (exc1) or a secondary battery (sbat) is connected to the first charger terminal (ct1). ... Ams Ag

Low dropout regulator circuit and method for controlling a voltage of a low dropout regulator circuit

An ldo circuit comprises a pass element, and input stage, a current sink, a comparator and a control circuit. The pass element is configured to generate an output voltage depending on a gate signal and on an input voltage. ... Ams Ag

Method of producing a semiconductor device with through-substrate via covered by a solder ball

A semiconductor substrate is provided with an annular cavity extending from a front side of the substrate to an opposite rear side. A metallization is applied in the annular cavity, thereby forming a through-substrate via and leaving an opening of the annular cavity at the front side. ... Ams Ag

Sensor amplifier arrangement and method of amplifying a sensor signal

A sensor amplifier arrangement includes an amplifier having a signal input to receive a sensor signal and a signal output, and a feedback path that couples the signal output to the signal input, wherein the feedback path includes an anti-parallel circuit of diodes, and a voltage divider including a first and a second divider resistor and a voltage divider tap between the first and the second divider resistor, wherein the voltage divider couples the signal output to a reference potential terminal, and the voltage divider tap is coupled to the anti-parallel circuit of diodes and the anti-parallel circuit of diodes is coupled to the signal input.. . ... Ams Ag

Controller to reduce integral non-linearity errors of a magnetic rotary encoder

A controller (1) to reduce integral non-linearity errors of a magnetic rotary encoder (2) comprises a position error determining unit (20) to determine a plurality of time marks (p0, . . ... Ams Ag

Method of producing a high-voltage semiconductor drift device

The method comprises implanting a deep well of a first type of electrical conductivity provided for a drift region in a substrate of semiconductor material, the deep well of the first type comprising a periphery, implanting a deep well or a plurality of deep wells of a second type of electrical conductivity opposite to the first type of electrical conductivity at the periphery of the deep well of the first type, implanting shallow wells of the first type of electrical conductivity at the periphery of the deep well of the first type, the shallow wells of the first type extending into the deep well of the first type; and implanting shallow wells of the second type of electrical conductivity adjacent to the deep well of the first type between the shallow wells of the first type of electrical conductivity.. . ... Ams Ag

11/09/17 / #20170323171

Arrangement of an aperture and a filter region for a filter sensor device and filter sensor device

The arrangement comprises a filter region (10) filtering electromagnetic radiation and a shielding component (20) inhibiting propagation of electromagnetic radiation. The filter region comprises a central filter region (11) and a separate peripheral filter region (13). ... Ams Ag

10/26/17 / #20170310291

Amplifier circuit and amplifier arrangement

An amplifier circuit with a differential input and a differential output comprises a first and a second pair of matched transistors having a first threshold voltage and comprising control terminals connected to the differential input. A first and a second pair of triplets of transistors having a second threshold voltage being different from the first threshold voltage is connected to each one of the pairs of matched transistors such that respective current paths are formed with these transistors. ... Ams Ag

10/26/17 / #20170309665

Semiconductor device comprising an aperture array and method of producing such a semiconductor device

A photosensor (2) is arranged in a semiconductor substrate (1) at a main surface (10), a dielectric layer (4) is arranged on or above the main surface, the dielectric layer including a metal layer (6) electrically connected with the photosensor, and an aperture layer (16) formed from an opaque or semitransparent material is arranged on or above the dielectric layer. The aperture layer is provided with an array of transparent aperture zones (18) above the photosensor, each of the aperture zones penetrating the aperture layer.. ... Ams Ag

10/05/17 / #20170288728

Interface circuits and communication system for coupling a host device to an accessory device and method for communication between such devices

A host interface circuit operates in a power mode when connected to an accessory device compatible with a power supply via a first line of a data cable. During power mode, the host interface circuit couples a power regulator to the first line. ... Ams Ag

10/05/17 / #20170285145

Optical driver arrangement and method for generating a driver signal

An optical driver arrangement (10) comprises a comparator (11) and a pulse generator (15). The comparator (11) comprises a first input (12) for receiving a sensed output signal (s1) derived from a sensor signal (s2) generated by a light sensor (24), a second input (13) for receiving a reference signal (s3) and a comparator output (14) for providing a comparator signal (s4). ... Ams Ag

09/14/17 / #20170264340

Connector, component and method for capacitive coupling in a communication system and capacitively coupled communication system

A connector for capacitive coupling of a first communicator and a second communicator of a communication system has a first, a second, a third and a fourth electrode, all of which are electrically conductive. The first and third electrodes are designed to be coupled to the first communicator. ... Ams Ag

08/31/17 / #20170250169

Optical proximity sensor arrangement and method for producing an optical proximity sensor arrangement

An optical proximity sensor arrangement comprises a semiconductor substrate (100) with a main surface (101). A first integrated circuit (200) comprises at least one light sensitive component (201). ... Ams Ag

08/24/17 / #20170244441

Transceiver circuit and methods for tuning a communication system and for communication between transceivers

A transceiver circuit with a front-end and a back-end is provided. The front-end has terminals for coupling to a first and a second capacitor and tunable resistors coupled between the terminals and a reference terminal. ... Ams Ag

08/24/17 / #20170244324

Converter arrangement having a control die with control logic for generating a control signal and a control output for controlling a converter die

A converter arrangement, in particular a switched dc/dc converter arrangement, comprises a control die and a converter die. The control die comprises a control logic for generating a control signal and a control output for controlling the converter die by means of the control signal. ... Ams Ag

08/24/17 / #20170243863

Protective circuit and method for protecting a circuit

A protective circuit (10) comprises a terminal (11), a reference potential terminal (12) and a protective structure (13) that is arranged between the terminal (11) and the reference potential terminal (12), and is designed to be conductive in the event of an electrostatic discharge. The protective circuit (10) furthermore comprises a voltage supply circuit (14) that is coupled to a control input (16) of the protective structure (13) with its output side and is designed for delivering, in the event of radiofrequency interference, a control signal (st) to the control input (16) with such a high voltage value that conduction of the protective structure (13) is prevented.. ... Ams Ag

08/17/17 / #20170237548

Circuit arrangement and method for clock and data recovery

A circuit arrangement for clock and data recovery comprises a control unit, a phase-locked loop circuit and a sampling unit. The control unit is configured to derive a first reference signal and a second reference signal from an input signal. ... Ams Ag

08/10/17 / #20170229598

Semiconductor element with a single photon avalanche diode and method for manufacturing such semiconductor element

A method for manufacturing a semiconductor element comprising a single photon avalanche diode having a multiplication zone (ar) a guard ring structure with a second type of electrical conductivity comprises providing a semiconductor wafer with a first region (r) comprising a semiconductor material with the first type of conductivity. The method further comprises generating by a first doping process a first well (w1) of the guard ring structure having a first vertical depth, the first well (w1) laterally surrounding the multiplication zone (ar) and having a lateral distance (a) from the multiplication zone (ar). ... Ams Ag

07/13/17 / #20170200647

Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging

A semiconductor substrate (1) is provided with integrated circuits. Dicing trenches (7) are formed in the substrate (1) between the integrated circuits, a polyimide layer (8) spanning the trenches (7) is applied above the integrated circuits, a tape layer (14) is applied above the polyimide layer (8), and a layer portion of the substrate (1) is removed from the substrate side (17) opposite the tape layer (14), until the trenches (7) are opened and dicing of the substrate (1) is thus effected. ... Ams Ag

07/06/17 / #20170195785

Headphones, audio device, audio system and method for transmitting signals

A set of headphones includes a connector with a first connection contact and a second connection contact as well as a loudspeaker, which is connected to the first connection contact in order to supply a loudspeaker signal. The set of headphones also includes a first and a second digital microphone, each of which is set up to generate a digital microphone signal, in particular with a binary bit stream. ... Ams Ag

06/22/17 / #20170179755

Wireless power receiver, charging arrangement and method for operating a wireless power receiver

A wireless power receiver (11) comprises an antenna (13), a capacitor (14) having a first terminal permanently connected to a first terminal (16) of the antenna (13) and a second terminal permanently connected to a second terminal (17) of the antenna (13), a first charge switch (18), a rectifier (15) having a first input (19) coupled to the antenna (13) via the first charge switch (18) and having a first output (22), and a communicator unit (35) with a first terminal coupled to the antenna (13).. . ... Ams Ag

06/22/17 / #20170179183

Semiconductor device for wafer-scale integration

The semiconductor device comprises a semiconductor wafer with an integrated circuit, formed by a plurality of dies, a further semiconductor wafer, which differs from the semiconductor wafer in diameter and semiconductor material, the semiconductor wafer and the further semiconductor wafer being bonded to one another by means of a bonding layer, and an electrically conductive contact layer arranged on the further semiconductor wafer opposite to the bonding layer.. . ... Ams Ag

06/22/17 / #20170179056

Semiconductor device with a bump contact on a tsv comprising a cavity and method of producing such a semiconductor device

The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a tsv (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the tsv, an under-bump metallization (5) and a bump contact (6) at least partially covering the tsv at the further main surface. The tsv (3) comprises a cavity (15), which may be filled with a gas or liquid. ... Ams Ag

06/08/17 / #20170162130

Method for calibrating a color space transformation, method for color space transformation and color control system

A method for calibrating a color space transformation according comprises driving of a light source at a first ambient temperature t1. The light source it is tuned to emit light with a number n of combinations of at least two correlated color temperatures and at least two intensities. ... Ams Ag

06/01/17 / #20170155365

Amplifier arrangement and amplification method

An amplifier arrangement has an input transistor being connected between reference potential terminals by a current source and a current sink. An amplifier stage has an amplifier output coupled to a first connection node between the current sink and a first terminal of the input transistor by means of a feedback path, and an amplifier input connected to a second connection node between the current source and the second terminal of the input transistor. ... Ams Ag

05/18/17 / #20170140746

Control circuit for active noise control and method for active noise control

We disclose a control circuit for active noise control, anc, coupled to a speaker generating a speaker signal based on an amplified audio signal and to an anc microphone generating a disturbed audio signal based on ambient noise and the speaker signal. The control circuit has a first mixer generating an intermediate audio signal by superposing an audio signal and a first compensation signal, a first amplifier generating the amplified audio signal based on the intermediate audio signal and a compensation unit generating a second compensation signal based on the audio signal. ... Ams Ag

05/11/17 / #20170134851

Host interface, accessory interface and method for managing a connection between a host interface and an accessory device

A host interface for a media device comprises a first and a second host audio terminal for receiving a first and a second analog audio signal, a first and a second connector audio terminal for connecting a first and a second pole of a four-pole connector, and a host control circuit. The host control circuit is adapted to detect whether a device requiring a supply signal over the four-pole connector is connected. ... Ams Ag

05/11/17 / #20170133281

Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component

According to the improved concept, a method for analyzing a semiconductor element comprising polymer residues located on a surface of the semiconductor element is provided. The method comprises marking at least a fraction of the residues by exposing the semiconductor element to a fluorescent substance and detecting the marked residues by visualizing the marked residues on the surface of the semiconductor element using fluorescence microscopy.. ... Ams Ag

05/11/17 / #20170132440

Optical reader device, tag for use on a disposable or replaceable component, optical data validation system and method for optical data validation

The presented principles relate to an optical reader device, to a tag for use on a disposable or replaceable component, to an optical data validation system and to a method for optical data validation. The optical reader device comprises a sensor unit and a signal processing unit. ... Ams Ag

05/11/17 / #20170131119

Position sensor device and method for providing a filtered position signal

A position sensor device comprises at least two hall elements (11, 12) and a signal evaluation circuit (14) that is coupled on its input side to the at least two hall elements (11, 12) and is designed to provide a digital position signal (ans). Moreover, the position sensor device (10) comprises a processing unit (15) comprising a loop filter (16) that is coupled on its input side to the signal evaluation unit (14). ... Ams Ag

05/04/17 / #20170125613

Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method

The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). ... Ams Ag

03/30/17 / #20170092787

Photonic semiconductor device for enhanced propagation of radiation and method of producing such a semiconductor device

The semiconductor device comprises a semiconductor substrate (2), a transition layer (5) in or on the semiconductor substrate, the transition layer allowing propagation of incident radiation (7) according to a refractive index, and a photonic component (4) facing the transition layer. A surface (6) of the transition layer is structured such that the effective refractive index is gradually changed through the transition layer with changing distance from the photonic component.. ... Ams Ag

03/16/17 / #20170077946

Delta-sigma modulator and method for signal conversion

A delta-sigma modulator (10) comprises a modulator loop (11) and a code generator (12). The modulator loop (11) comprises a loop filter (18). ... Ams Ag

03/16/17 / #20170074725

Bolometer and method for measurement of electromagnetic radiation

A bolometer (10) comprises a first and a second suspension beam (12, 13) and a semiconductor portion (11) that is suspended by the first and the second suspension beam (12, 13) and comprises a first region (17) of a first conductivity type and a second region (18) of a second conductivity type. The first region (17) comprises a first triangle (21) or at least two stripes (40, 41) or islands (60, 61) which each contribute to a non-short-circuited diode (20) with the second region (18).. ... Ams Ag

03/02/17 / #20170062504

Semiconductor device with surface integrated focusing element and method of producing a semiconductor device with focusing element

The semiconductor device comprises a semiconductor substrate (1), a sensor or sensor array (2) arranged at a main surface (10) of the substrate, an integrated circuit (3) arranged at or above the main surface, and a focusing element (17) comprising recesses (4) formed within a further main surface (11) of the substrate opposite the main surface. The focusing element may be arranged opposite the sensor or sensor array (2), which may be a photosensor or photodetector or an array of photosensors or photodetectors, for instance. ... Ams Ag

03/02/17 / #20170062277

Dicing method

The dicing method comprises the steps of providing a substrate (1) of semiconductor material, the substrate having a main surface (10), where integrated components (3) of chips (13) are arranged, and a rear surface (11) opposite the main surface, fastening a first handling wafer above the main surface, thinning the substrate at the rear surface, and forming trenches (20) penetrating the substrate and separating the chips by a single etching step after the substrate has been thinned.. . ... Ams Ag

02/23/17 / #20170052064

Optical sensor arrangement for proximity detection

An optical sensor arrangement comprises an optical barrier which is placed between a light-emitting device and a photodetector. Herein the light-emitting device and the photodetector are arranged on a first plane and are covered by a cover. ... Ams Ag

02/09/17 / #20170041017

Driver arrangement and method for providing an analog output signal

A driver arrangement (10) comprises a digital controller (11) that is configured to receive a digital input signal (sdi) and a driver (12) that comprises a driver input (14) and a driver output (15) and is configured to provide an analog output signal (sano) at the driver output (15). The driver arrangement (10) comprises a coupling circuit (13) that comprises a digital-to-analog converter (19) and a feedback circuit (24). ... Ams Ag

02/02/17 / #20170027488

Biometric sensor arrangement and method for generating a biometric signal

A biometric sensor arrangement (10) comprises a first radiation source (11), a second radiation source (12) that is implemented as a flash radiation source and a driver (13) coupled to the first and the second radiation source (11, 12) and configured to selectively operate the first and the second radiation source (11, 12). Moreover, the biometric sensor arrangement (10) comprises a photosensor (16) and a signal conditioning unit (18) coupled to the photosensor (16) and designed to provide a biometric signal (sb).. ... Ams Ag

01/26/17 / #20170025351

Semiconductor device with through-substrate via covered by a solder ball

The semiconductor device comprises a semiconductor substrate (10) with a metallization (111) having an upper terminal layer (22) located at a front side (20) of the substrate. The metallization forms a through-substrate via (23) from the upper terminal layer to a rear terminal layer (13) located opposite to the front side at a rear side (21) of the substrate. ... Ams Ag

01/19/17 / #20170018518

Method of producing a semiconductor device with through-substrate via covered by a solder ball

A semiconductor substrate is provided with a through-substrate via comprising a metallization and an opening. A solder ball is placed on the opening. ... Ams Ag

01/12/17 / #20170010309

Integrated current sensor system and method for producing an integrated current sensor system

An integrated current sensor system has a printed circuit board with a magnetic field sensor with a sensor interface. The printed circuit board has a first side on which, isolated from the printed circuit board, a first current conductor is arranged with a longitudinal edge of a portion of the first current conductor being proximate to a sensitive area of sensor. ... Ams Ag

01/05/17 / #20170005622

Amplifier arrangement

An amplifier arrangement is presented, comprising a first differential stage (ds1) comprising at least two transistors (m1, m1′) having a first threshold voltage (vth1), at least a second differential stage (ds2) comprising at least two transistors (m3, m3′) having a second threshold voltage different from the first threshold voltage, at least one of the transistors of the first and second differential stage (ds1, ds2), respectively, has a control input commonly coupled to an input of the amplifier arrangement, at least one transistor (m1) of the first differential stage and one transistor (m3) of the second differential stage are arranged in a common current path, which is coupled to an output of the amplifier arrangement.. . ... Ams Ag








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