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Applied Materials Inc
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Applied Materials Inc patents

Recent patent applications related to Applied Materials Inc. Applied Materials Inc is listed as an Agent/Assignee. Note: Applied Materials Inc may have other listings under different names/spellings. We're not affiliated with Applied Materials Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Applied Materials Inc-related inventors




Date Applied Materials Inc patents (updated weekly) - BOOKMARK this page
09/30/10Mechanism for continuously varying radial position of a magnetron
11/12/09Deposition and densification process for titanium nitride barrier layers
12/07/17 new patent  Effective and novel design for lower particle count and better wafer quality by diffusing the flow inside the chamber
12/07/17 new patent  High pressure ammonia nitridation of tunnel oxide for 3dnand applications
12/07/17 new patent  Sputtering target for pvd chamber
12/07/17 new patent  Integrated cluster tool for selective area deposition
12/07/17 new patent  Halogen-containing silane-based metal silicide as nucleation layer for tungsten ald
12/07/17 new patent  Symmetrical inductively coupled plasma source with symmetrical flow chamber
12/07/17 new patent  Inductively coupled plasma source with multiple dielectric windows and window supporting structure
12/07/17 new patent  Vacuum platform with process chambers for removing carbon contaminants and surface oxide from semiconductor substrates
12/07/17 new patent  Energy efficient communication and display device
12/07/17 new patent  Substrate distance monitoring
12/07/17 new patent  Apparatus and selective deposition
12/07/17 new patent  Method for wafer outgassing control
12/07/17 new patent  Rotary plasma electrical feedthrough
12/07/17 new patent  Dodecadon transfer chamber and processing system having the same
12/07/17 new patent  Workpiece carrier for high power with enhanced edge sealing
12/07/17 new patent  High power electrostatic chuck design with radio frequency coupling
12/07/17 new patent  Electrostatic chuck having properties for optimal thin film deposition or etch processes
12/07/17 new patent  Contour pocket and hybrid susceptor for wafer uniformity
12/07/17 new patent  Hardmask layer for 3d nand staircase structure in semiconductor applications
12/07/17 new patent  Methods for forming fin structures with desired profile for 3d structure semiconductor applications
12/07/17 new patent  Self-centering pedestal heater
11/30/17Mask arrangement for masking a substrate in a processing chamber
11/30/17Plating power supply with headroom control and ethercat interface
11/30/17Non-contact temperature measurement by dual-wavelength shift in brewster's angle
11/30/17Semiconductor device search and classification
11/30/17Apparatus and methods for reducing particles in semiconductor process chambers
11/30/17Processing chamber with irradiance curing lens
11/30/17Substrate support assembly
11/30/17Visual feedback for process control in rtp chambers
11/30/17Electrostatic chuck impedance evaluation
11/30/17Evaporation source for organic material, deposition depositing organic materials in a vacuum chamber having an evaporation source for organic material, and evaporating organic material
11/30/17Dynamic control band for rf plasma current ratio control
11/23/17Structure for relaxed sige buffers including forming
11/23/17Gas distribution showerhead for semiconductor processing
11/23/17Gas distribution showerhead for semiconductor processing
11/23/17Non-shadow frame plasma processing chamber
11/23/17Electroplating apparatus with current crowding adapted contact ring seal and thief electrode
11/23/17Two-step fluorine radical etch of hafnium oxide
11/23/17Systems and methods for improved semiconductor etching and component protection
11/23/17Systems and methods for improved semiconductor etching and component protection
11/23/17Thermal coupled quartz dome heat sink
11/16/17Sensor based auto-calibration wafer
11/16/17Rf choke for gas delivery to an rf driven electrode in a plasma processing apparatus
11/16/17Pyrometer background elimination
11/16/17Integrated controller solution for monitoring and controlling manufacturing equipment
11/16/17Increasing the gas efficiency for an electrostatic chuck
11/16/17Utilization of angled trench for effective aspect ratio trapping of defects in strain-relaxed heteroepitaxy of semiconductor films
11/16/17Liquid particle counting of semiconductor component parts
11/16/17Pyrometry filter for thermal process chamber
11/16/17Forming non-line-of-sight source drain extension in an nmos finfet using n-doped selective epitaxial growth
11/09/17Material source arrangment and nozzle for vacuum deposition
11/09/17Selective cobalt deposition on copper surfaces
11/09/17Full-area counter-flow heat exchange substrate support
11/09/17Apparatus and methods for depositing ald films with enhanced chemical exchange
11/09/17Gas panel reducing exhaust requirements
11/09/17Dual loop susceptor temperature control system
11/09/17Plasma treatment process for in-situ chamber cleaning efficiency enhancemnet in plasma processing chamber
11/09/17Protective metal oxy-fluoride coatings
11/09/17Methods of depositing sicon with c, o and n compositional control
11/09/17Selectively lateral growth of silicon oxide thin film
11/09/17Plasma poisoning to enable selective deposition
11/09/17Selective deposition through formation of self-assembled monolayers
11/09/17Method of selective etching on epitaxial film on source/drain area of transistor
Patent Packs
11/09/17Single use rinse in a linear marangoni drier
11/09/17Robot subassemblies, end effector assemblies, and methods with reduced cracking
11/09/17Systems, apparatus, and methods for an improved substrate handling assembly
11/09/17Lithium metal coating on battery separators
11/02/17Stepped retaining ring
11/02/17Material deposition arrangement, a vacuum deposition depositing material
11/02/17Ceramic coated quartz lid for processing chamber
11/02/17Atomic layer deposition of protective coatings for semiconductor process chamber components
11/02/17Side inject nozzle design for processing chamber
11/02/17Methods and deposition processes
11/02/17Non-disappearing anode for use with dielectric deposition
11/02/17Methods for conformal treatment of dielectric films with low thermal budget
11/02/17Methods for chemical etching of silicon
11/02/17Direct optical heating of substrates
11/02/17Dome cooling using compliant material
Patent Packs
11/02/17Apparatus and methods for a mask inverter
11/02/17System and all wrap around porous silicon formation
10/26/17Apparatus for controlling temperature uniformity of a showerhead
10/26/17Temperature controlled remote plasma clean for exhaust deposit removal
10/26/17Integration of laser processing with deposition of electrochemical device layers
10/26/17Shadow frame support
10/26/17Gas feedthrough assembly
10/26/17Enhanced spatial ald of metals through controlled precursor mixing
10/26/17Chemical delivery chamber for self-assembled monolayer processes
10/26/17Method & apparatus to prevent deposition rate/thickness drift, reduce particle defects & increase remote plasma system lifetime
10/26/17Substrate support pedestal having plasma confinement features
10/26/17Coolant and a method to control the ph and resistivity of coolant used in a heat exchanger
10/26/17Eco-efficiency characterization tool
10/26/17Doped and undoped vanadium oxides for low-k spacer applications
10/26/17Surface functionalization and passivation with a control layer
10/26/17Chemical mechanical polishing apparatus and methods
10/26/17High temperature chuck for plasma processing systems
10/26/17Apparatus for prevention of backside deposition in a spatial ald process chamber
10/26/17Microwave anneal to improve cvd metal gap-fill and throughput
10/26/17Method for pecvd overlay improvement
10/26/17Dynamic wafer leveling/tilting/swiveling during a chemical vapor deposition process
10/26/17System for non radial temperature control for rotating substrates
10/26/17Horizontal gate all around device nanowire air gap spacer formation
10/19/17Plasma abatement solids avoidance by use of oxygen plasma cleaning cycle
10/19/17Chemical mechanical polishing apparatus and methods
10/19/17Nanoparticle based cerium oxide slurries
10/19/17Micro-volume deposition chamber
10/19/1730 nm in-line lpc testing and cleaning of semiconductor processing equipment
10/19/17Rps assisted rf plasma source for semiconductor processing
10/19/17Coating architecture for plasma sprayed chamber components
Social Network Patent Pack
10/19/17Ion assisted deposition for rare-earth oxide based thin film coatings on process rings
10/19/17Apparatus for exhaust cooling
10/19/17Ultra-conformal carbon film deposition
10/19/17Device conformity control by low temperature, low pressure, inductively coupled ammonia-nitrogen trifluoride plasma
10/19/17Multilayer thin film device encapsulation using soft and pliable layer first
10/19/17Multilayer thin film device encapsulation using soft and pliable layer first
10/19/17Energy storage device with wraparound encapsulation
10/19/17Multilayer thin film device encapsulation using soft and pliable layer first
10/19/17Energy storage device with encapsulation anchoring
10/19/17Thin film device encapsulation using volume change accommodating materials
Patent Packs
10/19/17System and maskless thin film battery fabrication
10/19/17Device and maskless thin film etching
10/19/17Thin film battery device and formation
10/19/17Thin film battery device and formation
10/19/17Thin film battery device having recessed substrate and formation
10/19/17Energy storage device having an interlayer between electrode and electrolyte layer
10/19/17Optically heated substrate support assembly with removable optical fibers
10/12/17Fluorine reduction with scope with controlled oxidation
10/12/17Solution precursor plasma spray of ceramic coating for semiconductor chamber applications
10/12/17Method to reduce line waviness
10/12/17Plasma-enhanced anneal chamber for wafer outgassing
10/12/17Hkmg integration
10/12/17Semiconductor processing chamber
10/12/17Vacuum chuck pressure control system
10/12/17Methods for forming 2-dimensional self-aligned vias
10/05/17Cleaning process that precipitates yttrium oxy-flouride
10/05/17Low temperature fluoride glasses and glazes
10/05/17Fluoride glazes from fluorine ion treatment
10/05/17Apparatus and providing a uniform flow of gas
10/05/17Electroplating wafers having a notch
10/05/17Smart tool monitoring system
10/05/17Aerosol deposition coating for semiconductor chamber components
10/05/17Integrated metrology and process tool to enable local stress/overlay correction
10/05/17Apparatus and methods for wafer rotation in carousel susceptor
10/05/17High solids content paste formulations for secondary battery electrode
10/05/17Laser patterned thin film battery
10/05/17Mixed-platform apparatus, systems, and methods for substrate processing
09/28/17Chamber components with polished internal apertures
09/28/17Polishing system with local area rate control and oscillation mode
09/28/17Local area polishing system and polishing pad assemblies for a polishing system
Patent Packs
09/28/17Chamber liner for high temperature processing
09/28/17Apparatus and methods to remove residual precursor inside gas lines post-deposition
09/28/17Substrate support assembly with non-uniform gas flow clearance
09/28/17Alumina layer formation on aluminum surface to protect aluminum parts
09/28/17Electroplating contact ring with radially offset contact fingers
09/28/17Susceptor support
09/28/17Ceramic heater with enhanced rf power delivery
09/28/17Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning
09/28/17Electrochemical cell with protected negative electrode
09/28/17Special lipon mask to increase lipon ionic conductivity and tfb fabrication yield
09/28/17Electrochemical device stacks including interlayers for reducing interfacial resistance and over-potential
09/21/17Symmetric plasma process chamber
09/21/17Oriented laser activated processing chamber
09/21/17Substrate support assembly having metal bonded protective layer
09/21/17Method and reducing radiation induced change in semiconductor structures
09/21/17In-situ temperature measurement in a noisy environment
09/21/17Methods and assemblies for gas flow ratio control
09/21/17Methods and assemblies for gas flow ratio control
09/21/17Methods for gapfill in high aspect ratio structures
09/14/17Substrate processing system having susceptorless substrate support with enhanced substrate heating control
Social Network Patent Pack
09/14/17Pad structure and fabrication methods
09/14/17Plasma resistant coating with tailorable coefficient of thermal expansion
09/14/17Method for electrochemically grown yttria or yttrium oxide on semiconductor processing equipment
09/14/17Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
09/14/17Intelligent hardstop for gap detection and control mechanism
09/14/17Apparatus for cost-effective conversion of unsupervised fault detection (fd) system to supervised fd system
09/14/17Heated substrate support
09/14/17Selective deposition of silicon nitride films for spacer applications
09/14/17Methods and selective dry etch
09/14/17Bottom processing
09/14/17Multiple wafer rotary processing
09/14/17Multi-zone pedestal for plasma processing
09/14/17Method to remove residual charge on a electrostatic chuck during the de-chucking step
09/14/17Support cylinder for thermal processing cylinder
09/07/17Methods and controlling ion fraction in physical vapor deposition processes
09/07/17In-situ spatially resolved plasma monitoring by using optical emission spectroscopy
09/07/17Self-assembled monolayer blocking with intermittent air-water exposure
09/07/17Methods and conserving electronic device manufacturing resources
09/07/17Substrate support assembly for high temperature processes
09/07/17Universal process kit
Social Network Patent Pack
09/07/17Doping control of metal nitride films
08/31/17Window in thin polishing pad
08/31/17High purity metallic top coat for semiconductor manufacturing components
08/31/17Enhanced plating bath and additive chemistries for cobalt plating
08/31/17Method for inter-chamber process
08/31/17Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device str
08/31/17Electrostatic chuck having thermally isolated zones with minimal crosstalk
08/31/17Electrostatic chuck optimized for refurbishment
08/31/17Fluoro polymer contact layer to carbon nanotube chuck
08/31/17Methods for integration of organic and inorganic materials for oled encapsulating structures
08/31/17Evaporation source having multiple source ejection directions
08/24/17Lid assembly for a processing system to facilitate sequential deposition techniques
08/24/17Systems, apparatus, and methods for an electromagnetic interference shielding optical polarizer
08/24/17Showerhead having an extended detachable gas distribution plate
08/24/17Cyclic oxide spacer etch process
08/24/17Method and forming porous silicon layers
08/24/17Carrier head membrane with a bead
08/24/17Thin film transistor fabrication utlizing an interface layer on a metal electrode layer
08/24/17Parallel plate inline substrate processing tool
08/24/17System for depositing one or more layers on a substrate supported by a carrier and method using the same
08/17/17Medical bodily fluid sampling device
08/17/17In-situ temperature control during chemical mechanical polishing with a condensed gas
08/17/17Reactor gas panel common exhaust
08/17/17Particle generation suppresor by dc bias modulation
08/17/17Chemical control features in wafer process equipment
08/17/17Rotatable substrate support having radio frequency applicator
08/17/17Fluorination during ald high-k, fluorination post high-k and use of a post fluorination anneal to engineer fluorine bonding and incorporation
08/17/17Manufacturing of high capacity prismatic lithium-ion alloy anodes
08/17/17Three-dimensional thin film battery
08/10/17Systems, apparatus, and methods for chemical polishing
Social Network Patent Pack
08/10/17Process chamber for dielectric gapfill
08/10/17Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating
08/10/17Oxide etch selectivity systems and methods
08/10/17Semiconductor processing systems having multiple plasma configurations
08/10/17Methods and systems to enhance process uniformity
08/10/17Systems and methods for internal surface conditioning in plasma processing equipment
08/10/17Method for removing native oxide and residue from a iii-v group containing surface
08/10/17Flow distribution plate for surface fluorine reduction
08/10/17Methods for selective etching of a silicon material
08/10/17Integrated layer etch system with multiple type chambers
08/10/17Process chamber for etching low k and other dielectric films
08/10/17Low temperature chuck for plasma processing systems
08/10/17Bolted wafer chuck thermal management wafer processing systems
08/10/17Thermal management wafer processing systems
08/10/17Substrate support chuck cooling for deposition chamber
08/10/17Interface engineering for high capacitance capacitor for liquid crystal display
08/10/17High-k dielectric materials utilized in display devices
08/10/17Substrate support with quadrants
08/03/17Plasma abatement of compounds containing heavy atoms
08/03/17Compact eye module layout
08/03/17Methods for igniting a plasma in a substrate processing chamber
08/03/17Rtp process for directed self-aligned patterns
08/03/17System and method in indium-gallium-arsenide channel height control for sub 7nm finfet
08/03/17Conductive wafer lift pin o-ring gripper with resistor
08/03/17High speed epitaxy system and methods
07/27/17Sputter source for semiconductor process chambers
07/27/17Ceramic showerhead with embedded conductive layers
07/27/17Ceramic slit valve doors and assemblies
07/27/17Gas splitting by time average injection into different zones by fast gas valves







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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