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Filing Names

Applied Materials Inc
Applied Materials Inc A Delaware Corporation
Applied Materials Incorporated
Applied Materials Inc A Corporation Of The State Of Delaware U s a
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Applied Materials Inc_20100121
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Applied Materials Inc patents

Recent patent applications related to Applied Materials Inc. Applied Materials Inc is listed as an Agent/Assignee. Note: Applied Materials Inc may have other listings under different names/spellings. We're not affiliated with Applied Materials Inc, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Applied Materials Inc-related inventors

Date Applied Materials Inc patents (updated weekly) - BOOKMARK this page
09/30/10Mechanism for continuously varying radial position of a magnetron
11/12/09Deposition and densification process for titanium nitride barrier layers
03/23/17 new patent  Evaporation source for organic material
03/23/17 new patent  Shadow frame with non-uniform gas flow clearance for improved cleaning
03/23/17 new patent  Showerhead support structures
03/23/17 new patent  Ambient laminar gas flow distribution in laser processing systems
03/23/17 new patent  3d printed magnetron having enhanced cooling characteristics
03/23/17 new patent  Low temperature conformal deposition of silicon nitride on high aspect ratio structures
03/23/17 new patent  Apparatus and selective deposition
03/23/17 new patent  Cleaning method
03/23/17 new patent  Titanium-compound based hard mask films
03/23/17 new patent  Method of enabling seamless cobalt gap-fill
03/23/17 new patent  Amorphization layer, selective, defect free superactivation
03/23/17 new patent  Large area dual substrate processing system
03/16/17Selectively openable support platen for additive manufacturing
03/16/17Fabrication of base plate, fabrication of enclosure, and fabrication of support posts in additive manufacturing
03/16/17Pulse train annealing method and apparatus
03/16/17Scheduling in manufacturing environments
03/16/17Planning for manufacturing environments
03/16/17Substrate support with real time force and film stress control
03/16/17Plasma module with slotted ground plate
03/16/17One-piece process kit shield for reducing the impact of an electric field near the substrate
03/16/17Substrate carrier using the same
03/16/17System to detect wafer arcing in semiconductor manufacturing equipment
03/09/17Evaporation system with measurement unit
03/09/17Apparatus and thin-film processing applications
03/09/17Line edge roughness reduction via step size alteration
03/09/17Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor
03/09/17Seasoning process for establishing a stable process and extending chamber uptime for semiconductor chip processing
03/09/17Method and apparatus of achieving high input impedance without using ferrite materials for rf filter applications in plasma chambers
03/09/17Process chamber for cyclic and selective material removal and etching
03/09/17Methods and uniformly and high-rate depositing low resistivity microcrystalline silicon films for display devices
03/02/17Method for removing aluminum fluoride contamination from semiconductor processing equipment
03/02/17Deposition platform for flexible substrates and operation thereof
03/02/17Plasma etching systems and methods with secondary plasma injection
03/02/17Methods and in-situ cleaning of copper surfaces and deposition and removal of self-assembled monolayers
03/02/17Nanocrystaline diamond carbon film for 3d nand hardmask application
03/02/17Methods to improve in-film particle performance of amorphous boron-carbon hardmask process in pecvd system
03/02/17Methods of depositing metal films using metal oxyhalide precursors
03/02/17In-situ removable electrostatic chuck
03/02/17Electrostatic carrier for thin substrate handling
03/02/17Vnand tensile thick teos oxide
03/02/17Battery separator with dielectric coating
02/23/17Heating source for spatial atomic layer deposition
02/23/17Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
02/23/17Methods and co-sputtering multiple targets
02/23/17High temperature thermal ald silicon nitride films
02/23/17Selective atomic layer deposition process utilizing patterned self assembled monolayers for 3d structure semiconductor applications
02/16/17Topography prediction using system state information
02/16/17Methods for producing interconnects in semiconductor devices
02/16/17Electrostatic chuck with electrostatic fluid seal for containing backside gas
02/09/17Method and the selective deposition of epitaxial germanium stressor alloys
02/09/17Low temperature ald on semiconductor and metallic surfaces
02/09/17Self-limiting and saturating chemical vapor deposition of a silicon bilayer and ald
02/09/17Design of disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing
02/09/17Oxide etch selectivity systems and methods
02/09/17Gas-phase silicon oxide selective etch
02/09/17Thermal management wafer processing systems
02/09/17Bolted wafer chuck thermal management wafer processing systems
02/09/17Thin heated substrate support
02/09/17Process sheet resistance uniformity improvement using multiple melt laser exposures
02/09/17Ceramic heater and esc with enhanced wafer edge performance
02/09/17Integrated bit-line airgap formation and gate stack post clean
02/09/17Structure for relaxed sige buffers including forming
02/02/17High pressure rf-dc sputtering and methods to improve film uniformity and step-coverage of this process
Patent Packs
02/02/17Batch processing chamber
02/02/17Rotating substrate laser anneal
02/02/17Locally heated multi-zone substrate support
02/02/17Substrate lift pin actuator
01/26/17Additive manufacturing with pre-heating
01/26/17Exothermic powders for additive manufacturing
01/26/17A processing processing devices, particularly devices including organic materials therein, and transferring an evaporation source from a processing vacuum chamber to a maintenance vacuum chamber or from the maintenance vacuum chamber to the processing vacuum chamber
01/26/17Heteroleptic diazadiene-containing tungsten precursors for thin film deposition
01/26/17Electroplating apparatus with electrolyte agitation
01/26/17Method and gas abatement
01/19/17Brace structures for additive manufacturing
01/19/17Selective material dispensing in additive manufacturing
01/19/17Deposition of metal films using beta-hydrogen free precursors
01/19/17Pecvd process
01/19/17Inert anode electroplating processor and replenisher
Patent Packs
01/19/17Process for removing contamination on ruthenium surface
01/19/17Quarter wave light splitting
01/19/17Adjustable process spacing, centering, and improved gas conductance
01/19/17Method of selective epitaxy
01/19/17Metal removal with reduced surface roughness
01/19/17Methods and substrate edge cleaning
01/19/17Uv-assisted material injection into porous films
01/19/17Horizontal gate all around device isolation
01/19/17Methods for forming structures with desired crystallinity for mram applications
01/19/17Fluorine-containing polymerized hmdso applications for oled thin film encapsulation
01/12/17Wafer electroplating chuck assembly
01/12/17Electroplating apparatus with membrane tube shield
01/12/17Uv-assisted reactive ion etch for copper
01/12/17Etch rate and critical dimension uniformity by selection of focus ring material
01/12/17Atomic layer epitaxy for semiconductor gate stack layer for advanced channel devices
01/12/17Adjustable remote dissociation
01/12/17Sion gradient concept
01/05/17Textured membrane for a multi-chamber carrier head
01/05/17Process kit having tall deposition ring and deposition ring clamp
01/05/17Correction of non-uniform patterns using time-shifted exposures
01/05/17Semiconductor device
01/05/17Selective deposition of silicon oxide films
01/05/17Batch processing apparatus
01/05/17Pixelated capacitance controlled esc
01/05/17Method to reduce trap-induced capacitance in interconnect dielectric barrier stack
01/05/17Plasma enhanced thermal evaporator
12/29/16Temperature controlled additive manufacturing
12/29/16Recursive inject improved distribution of gas
12/29/16Method and apparatus to abate pyrophoric byproducts from ion implant process
12/29/16Glass ceramic for ultraviolet lithography and manufacturing thereof
Social Network Patent Pack
12/29/16Interconnect integration for sidewall pore seal and via cleanliness
12/22/16Material dispensing and compaction in additive manufacturing
12/22/16Material dispensing and compaction in additive manufacturing
12/22/16Gas control in process chamber
12/22/16Injector for batch processing and methods of use
12/22/16In-situ metrology thickness measurement during pecvd processes
12/22/16Multiple electrode substrate support assembly and phase control system
12/22/16Methods for depositing dielectric films via physical vapor deposition processes
12/22/16Deposition methods for uniform and conformal hybrid titanium oxide films
12/22/16Pvd deposition and anneal of multi-layer metal-dielectric film
Patent Packs
12/22/16Method and microwave assisted chalcogen radicals generation for 2-d materials
12/22/16Method for forming interconnects
12/22/16Methods for forming low resistivity interconnects
12/22/16Limiting adjustment of polishing rates during substrate polishing
12/15/16Atomic layer deposition processing chamber permitting low-pressure tool replacement
12/15/16Injector for semiconductor epitaxy growth
12/15/16Apparatus for sensing a level of a processing medium in a delivery apparatus
12/15/16Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning
12/15/16Wafer carrier for smaller wafers and wafer pieces
12/08/16Printed chemical mechanical polishing pad having abrasives therein and system for printing
12/08/16Mask for deposition using the mask
12/08/16Susceptor position and rotation apparatus and methods of use
12/08/16Method of forming metal and metal alloy features
12/08/16Immersion field guided exposure and post-exposure bake process
12/08/16Process chamber
12/08/16Apparatus for decreasing substrate temperature non-uniformity
12/08/16Gas chamber ports
12/08/16Transparent electrostatic carrier
12/08/16Graded in-situ charge trapping layers to enable electrostatic chucking and excellent particle performance for boron-doped carbon films
12/08/16Shutter disk for physical vapor deposition chamber
12/01/16High speed epi system and chamber concepts
12/01/16Retaining ring having inner surfaces with features
12/01/16Apparatus for printing a chemical mechanical polishing pad
12/01/16Grounding of conductive mask for deposition processes
12/01/16Electroplating apparatus
12/01/16Heat shield ring for high growth rate epi chamber
12/01/16Process chamber with reflector
12/01/16Methods for texturing a chamber component and chamber components having a textured surface
12/01/16Dual endpoint detection for advanced phase shift and binary photomasks
12/01/16Hard mask for patterning magnetic tunnel junctions
Patent Packs
12/01/16Plasma curing of pecvd hmdso film for oled applications
12/01/16Methods and a microwave batch curing process
11/24/16Methods and forming a resist array using chemical mechanical planarization
11/24/16Powders for additive manufacturing
11/24/16Deposition ring and electrostatic chuck for physical vapor deposition chamber
11/24/16Roller for spreading of a flexible substrate, processing a flexible substrate and operating thereof
11/24/16Substrate carrier door assemblies, substrate carriers, and methods including magnetic door seal
11/24/16Annular baffle
11/24/16Monitoring system for deposition and operation thereof
11/24/16Extreme ultraviolet lithography system having chuck assembly and manufacturing thereof
11/24/16Methods and systems for applying run-to-run control and virtual metrology to reduce equipment recovery time
11/24/16Deposition of solid state electrolyte on electrode layers in electrochemical devices
11/24/16Electrostatic puck assembly with metal bonded backing plate for high temperature processes
11/24/16Method for forming group iii/v conformal layers on silicon substrates
11/24/16Azimuthally tunable multi-zone electrostatic chuck
11/17/16Methods for increasing the rate of electrochemical deposition
11/17/16Chamber component with wear indicator
11/17/16Deposition of silicon and oxygen-containing films without an oxidizer
11/17/16Absorbing lamphead face
11/17/16Tungsten films by organometallic or silane pre-treatment of substrate
Social Network Patent Pack
11/17/16Horizontal gate all around and finfet device isolation
11/17/16Encapsulating film stacks for oled applications
11/10/16Substrate rotary loader
11/10/16Rare-earth oxide based monolithic chamber material
11/10/16Rare-earth oxide based monolithic chamber material
11/10/16Ion beam sputtering with ion assisted deposition for coatings on chamber components
11/10/16Ion assisted deposition top coat of rare-earth oxide
11/10/16Method for controlling a processing system
11/10/16Apparatus for selectively sealing a gas feedthrough
11/10/16Customized pupil stop shape for control of edge profile in laser annealing systems
11/10/16Method for improving cd micro-loading in photomask plasma etching
11/10/16Resist hardening and development processes for semiconductor device manufacturing
11/10/16Methods and electrostatic chuck repair and refurbishment
11/10/16Tunable temperature controlled substrate support assembly
11/10/16Methods and controlling substrate uniformity
11/03/16Rare-earth oxide based monolithic chamber material
11/03/16Thin film encapsulation processing system and process kit permitting low-pressure tool replacement
11/03/16Oxidized showerhead and process kit parts and methods of using same
11/03/16Inspection of regions of interest using an electron beam system
11/03/16Dual-channel showerhead for formation of film stacks
Social Network Patent Pack
11/03/16Selective deposition of thin film dielectrics using surface blocking chemistry
11/03/16Methods for depositing low k and low wet etch rate dielectric thin films
11/03/16Methods for selective deposition of metal silicides via atomic layer deposition cycles
11/03/16Methods and correcting substrate deformity
11/03/16Methods and cleaning a substrate
11/03/16Method and controlling plasma near the edge of a substrate
11/03/16Method for depositing a diffusion barrier layer and a metal conductive layer
11/03/16Gallium arsenide based materials used in thin film transistor applications
11/03/16Internal chamber rotation motor, alternative rotation
10/27/16Process kit including flow isolator ring
10/27/16Atomic layer deposition chamber with funnel-shaped gas dispersion channel and gas distribution plate
10/27/16Symmetric plasma process chamber
10/27/16Symmetric plasma process chamber
10/27/16Symmetric plasma process chamber
10/27/16Symmetric plasma process chamber
10/27/16In-situ etch rate determination for chamber clean endpoint
10/27/16Plasma treatment to improve adhesion between hardmask film and silicon oxide film
10/27/16Cleaning high aspect ratio vias
10/27/16Wafer swapper
10/27/16Loadlock apparatus, cooling plate assembly, and electronic device processing systems and methods
10/27/16External substrate rotation in a semiconductor processing system
10/20/16Demagnetization of magnetic media by c doping for hdd patterned media application
10/20/16Ground return for plasma processes
10/20/16Electroplating wafers having a notch
10/20/16Enhanced re-hosting capability for legacy hardware and software
10/20/16Edge ring for bevel polymer reduction
10/20/16Deposition of si-h free silicon nitride
10/20/16Gas flow profile modulated control of overlay in plasma cvd films
10/20/16Single platform, multiple cycle spacer deposition and etch
10/20/16Gas-phase silicon nitride selective etch
Social Network Patent Pack
10/20/16Spacer formation process with flat top profile
10/20/16Utlization of angled trench for effective aspect ratio trapping of defects in strain-relaxed heteroepitaxy of semiconductor films
10/20/16Buffer chamber wafer heating mechanism and supporting robot
10/20/16Method for hybrid encapsulation of an organic light emitting diode
10/20/16Electrochemical cell with solid and liquid electrolytes
10/20/16Methods for forming cobalt interconnects
10/13/16Method and hardware for cleaning uv chambers
10/13/16Microelectronic substrate electro processing system
10/13/16Process gas preheating double-sided multi-substrate batch processing
10/13/16Laser annealing and electric field
10/13/16Apparatus for treating a gas in a conduit
10/13/16Semiconductor processing with dc assisted rf power for improved control
10/13/16Method for forming spacers for a transistor gate
10/13/16Apparatus and selective oxidation at lower temperature using remote plasma source
10/13/16Method to enhance growth rate for selective epitaxial growth
10/13/16Methods of etchback profile tuning
10/13/16Support cylinder for thermal processing chamber
10/13/16Dielectric constant recovery
10/06/16Mask etch for patterning
10/06/16Apparatus and uv treatment, chemical treatment, and deposition
10/06/16Field guided post exposure bake application for photoresist microbridge defects
10/06/16Methods for removing contamination from surfaces in substrate processing systems
10/06/16Crystallization methods
10/06/16Methods for manufacturing a spacer with desired profile in an advanced patterning process
10/06/16Cyclic spacer etching process with improved profile control
10/06/16Cyclic spacer etching process with improved profile control
10/06/16Methods of etching films comprising transition metals
10/06/16Process of filling the high aspect ratio trenches by co-flowing ligands during thermal cvd
10/06/16Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3d nand memory devices

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Applied Materials Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Applied Materials Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by