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Applied Materials Inc
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Applied Materials Inc patents

Recent patent applications related to Applied Materials Inc. Applied Materials Inc is listed as an Agent/Assignee. Note: Applied Materials Inc may have other listings under different names/spellings. We're not affiliated with Applied Materials Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Applied Materials Inc-related inventors




Date Applied Materials Inc patents (updated weekly) - BOOKMARK this page
09/30/10Mechanism for continuously varying radial position of a magnetron
11/12/09Deposition and densification process for titanium nitride barrier layers
10/12/17 new patent  Fluorine reduction with scope with controlled oxidation
10/12/17 new patent  Solution precursor plasma spray of ceramic coating for semiconductor chamber applications
10/12/17 new patent  Method to reduce line waviness
10/12/17 new patent  Plasma-enhanced anneal chamber for wafer outgassing
10/12/17 new patent  Hkmg integration
10/12/17 new patent  Semiconductor processing chamber
10/12/17 new patent  Vacuum chuck pressure control system
10/12/17 new patent  Methods for forming 2-dimensional self-aligned vias
10/05/17Cleaning process that precipitates yttrium oxy-flouride
10/05/17Low temperature fluoride glasses and glazes
10/05/17Fluoride glazes from fluorine ion treatment
10/05/17Apparatus and providing a uniform flow of gas
10/05/17Electroplating wafers having a notch
10/05/17Smart tool monitoring system
10/05/17Aerosol deposition coating for semiconductor chamber components
10/05/17Integrated metrology and process tool to enable local stress/overlay correction
10/05/17Apparatus and methods for wafer rotation in carousel susceptor
10/05/17High solids content paste formulations for secondary battery electrode
10/05/17Laser patterned thin film battery
10/05/17Mixed-platform apparatus, systems, and methods for substrate processing
09/28/17Chamber components with polished internal apertures
09/28/17Polishing system with local area rate control and oscillation mode
09/28/17Local area polishing system and polishing pad assemblies for a polishing system
09/28/17Chamber liner for high temperature processing
09/28/17Apparatus and methods to remove residual precursor inside gas lines post-deposition
09/28/17Substrate support assembly with non-uniform gas flow clearance
09/28/17Alumina layer formation on aluminum surface to protect aluminum parts
09/28/17Electroplating contact ring with radially offset contact fingers
09/28/17Susceptor support
09/28/17Ceramic heater with enhanced rf power delivery
09/28/17Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning
09/28/17Electrochemical cell with protected negative electrode
09/28/17Special lipon mask to increase lipon ionic conductivity and tfb fabrication yield
09/28/17Electrochemical device stacks including interlayers for reducing interfacial resistance and over-potential
09/21/17Symmetric plasma process chamber
09/21/17Oriented laser activated processing chamber
09/21/17Substrate support assembly having metal bonded protective layer
09/21/17Method and reducing radiation induced change in semiconductor structures
09/21/17In-situ temperature measurement in a noisy environment
09/21/17Methods and assemblies for gas flow ratio control
09/21/17Methods and assemblies for gas flow ratio control
09/21/17Methods for gapfill in high aspect ratio structures
09/14/17Substrate processing system having susceptorless substrate support with enhanced substrate heating control
09/14/17Pad structure and fabrication methods
09/14/17Plasma resistant coating with tailorable coefficient of thermal expansion
09/14/17Method for electrochemically grown yttria or yttrium oxide on semiconductor processing equipment
09/14/17Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
09/14/17Intelligent hardstop for gap detection and control mechanism
09/14/17Apparatus for cost-effective conversion of unsupervised fault detection (fd) system to supervised fd system
09/14/17Heated substrate support
09/14/17Selective deposition of silicon nitride films for spacer applications
09/14/17Methods and selective dry etch
09/14/17Bottom processing
09/14/17Multiple wafer rotary processing
09/14/17Multi-zone pedestal for plasma processing
09/14/17Method to remove residual charge on a electrostatic chuck during the de-chucking step
09/14/17Support cylinder for thermal processing cylinder
09/07/17Methods and controlling ion fraction in physical vapor deposition processes
09/07/17In-situ spatially resolved plasma monitoring by using optical emission spectroscopy
09/07/17Self-assembled monolayer blocking with intermittent air-water exposure
09/07/17Methods and conserving electronic device manufacturing resources
09/07/17Substrate support assembly for high temperature processes
09/07/17Universal process kit
Patent Packs
09/07/17Doping control of metal nitride films
08/31/17Window in thin polishing pad
08/31/17High purity metallic top coat for semiconductor manufacturing components
08/31/17Enhanced plating bath and additive chemistries for cobalt plating
08/31/17Method for inter-chamber process
08/31/17Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device str
08/31/17Electrostatic chuck having thermally isolated zones with minimal crosstalk
08/31/17Electrostatic chuck optimized for refurbishment
08/31/17Fluoro polymer contact layer to carbon nanotube chuck
08/31/17Methods for integration of organic and inorganic materials for oled encapsulating structures
08/31/17Evaporation source having multiple source ejection directions
08/24/17Lid assembly for a processing system to facilitate sequential deposition techniques
08/24/17Systems, apparatus, and methods for an electromagnetic interference shielding optical polarizer
08/24/17Showerhead having an extended detachable gas distribution plate
08/24/17Cyclic oxide spacer etch process
Patent Packs
08/24/17Method and forming porous silicon layers
08/24/17Carrier head membrane with a bead
08/24/17Thin film transistor fabrication utlizing an interface layer on a metal electrode layer
08/24/17Parallel plate inline substrate processing tool
08/24/17System for depositing one or more layers on a substrate supported by a carrier and method using the same
08/17/17Medical bodily fluid sampling device
08/17/17In-situ temperature control during chemical mechanical polishing with a condensed gas
08/17/17Reactor gas panel common exhaust
08/17/17Particle generation suppresor by dc bias modulation
08/17/17Chemical control features in wafer process equipment
08/17/17Rotatable substrate support having radio frequency applicator
08/17/17Fluorination during ald high-k, fluorination post high-k and use of a post fluorination anneal to engineer fluorine bonding and incorporation
08/17/17Manufacturing of high capacity prismatic lithium-ion alloy anodes
08/17/17Three-dimensional thin film battery
08/10/17Systems, apparatus, and methods for chemical polishing
08/10/17Process chamber for dielectric gapfill
08/10/17Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating
08/10/17Oxide etch selectivity systems and methods
08/10/17Semiconductor processing systems having multiple plasma configurations
08/10/17Methods and systems to enhance process uniformity
08/10/17Systems and methods for internal surface conditioning in plasma processing equipment
08/10/17Method for removing native oxide and residue from a iii-v group containing surface
08/10/17Flow distribution plate for surface fluorine reduction
08/10/17Methods for selective etching of a silicon material
08/10/17Integrated layer etch system with multiple type chambers
08/10/17Process chamber for etching low k and other dielectric films
08/10/17Low temperature chuck for plasma processing systems
08/10/17Bolted wafer chuck thermal management wafer processing systems
08/10/17Thermal management wafer processing systems
08/10/17Substrate support chuck cooling for deposition chamber
Social Network Patent Pack
08/10/17Interface engineering for high capacitance capacitor for liquid crystal display
08/10/17High-k dielectric materials utilized in display devices
08/10/17Substrate support with quadrants
08/03/17Plasma abatement of compounds containing heavy atoms
08/03/17Compact eye module layout
08/03/17Methods for igniting a plasma in a substrate processing chamber
08/03/17Rtp process for directed self-aligned patterns
08/03/17System and method in indium-gallium-arsenide channel height control for sub 7nm finfet
08/03/17Conductive wafer lift pin o-ring gripper with resistor
08/03/17High speed epitaxy system and methods
Patent Packs
07/27/17Sputter source for semiconductor process chambers
07/27/17Ceramic showerhead with embedded conductive layers
07/27/17Ceramic slit valve doors and assemblies
07/27/17Gas splitting by time average injection into different zones by fast gas valves
07/27/17Symmetric plasma source to generate pie shaped treatment
07/27/17Dual-feed tunable plasma source
07/27/17Slit valve gate coating and methods for cleaning slit valve gates
07/27/17Methods for in-situ chamber clean in plasma etching processing chamber
07/27/17Acetylide-based silicon precursors and their use as ald/cvd precursors
07/27/17High productivity soak anneal system
07/27/17Systems and methods for detecting the existence of one or more environmental conditions within a substrate processing system
07/27/17Controlling the rf amplitude of an edge ring of a capacitively coupled plasma process device
07/27/17Wafer edge ring lifting solution
07/27/17Process and chemistry of plating of through silicon vias
07/27/17Mask-less fabrication of thin film batteries
07/27/17Sensor system for multi-zone electrostatic chuck
07/20/17Additive manufacturing with laser and plasma
07/20/17Carrier for small pad for chemical mechanical polishing
07/20/17Porous chemical mechanical polishing pads
07/20/17Method and forming porous advanced polishing pads using an additive manufacturing process
07/20/17Chamber component with protective coating suitable for protection against fluorine plasma
07/20/17Resist fortification for magnetic media patterning
07/20/17Rps defect reduction by cyclic clean induced rps cooling
07/20/17Pecvd tungsten containing hardmask films and methods of making
07/20/17Hybrid carbon hardmask for lateral hardmask recess reduction
07/20/17Oxygen vacancy of igzo passivation by fluorine treatment
07/13/17Source rf power split inner coil to improve bcd and etch depth performance
07/13/17Atomic layer etching system with remote plasma source and dc electrode
07/13/17Minimization of ring erosion during plasma processes
07/13/17Hydrogen plasma based cleaning process for etch hardware
Patent Packs
07/13/17Co or ni and cu integration for small and large features in integrated circuits
07/06/17Materials and formulations for three-dimensional printing
07/06/17Non-metallic thermal cvd/ald gas injector and purge system
07/06/17Cooled gas feed block with baffle and nozzle for hdp-cvd
07/06/17Systems and methods for shielding features of a workpiece during electrochemical deposition
07/06/17Inductive plasma source with metallic shower head using b-field concentrator
07/06/17Methods for depositing fluorine/carbon-free conformal tungsten
07/06/17Quad chamber and platform having multiple quad chambers
07/06/17Method for fabricating nanowires for horizontal gate all around devices for semiconductor applications
07/06/17High temperature heater for processing chamber
06/29/17Additive manufacturing with laser and gas flow
06/29/17Methods and stable substrate processing with multiple rf power supplies
06/29/17Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake
06/29/17Apparatus and reducing substrate sliding in process chambers
06/22/17Methods for treating exhaust gas in a processing system
06/22/17Methods for bonding substrates
06/22/17Flat susceptor with grooves for minimizing temperature profile across a substrate
06/22/17Anodization architecture for electro-plate adhesion
06/22/17Surface acoustic wave sensors in semiconductor processing equipment
06/22/17Uniform wafer temperature achievement in unsymmetric chamber environment
Social Network Patent Pack
06/22/17Showerhead having a detachable gas distribution plate
06/22/17Gas diffuser having grooved hollow cathodes
06/22/17Methods and processing a substrate
06/22/17Cleaning method
06/22/17Methods for selective etching of a silicon material using hf gas without nitrogen etchants
06/22/17Oxide etch selectivity enhancement
06/22/17Methods of treating nitride films
06/22/17Methods and interactively and dynamically updating a schematic overlay
06/22/17Method and depositing cobalt in a feature
06/22/17Method to grow thin epitaxial films at low temperature
06/22/17Conformal amorphous silicon as nucleation layer for w ald process
06/22/17Multi-threshold voltage structures with a lanthanum nitride film and methods of formation thereof
06/15/17Exothermic powders for additive manufacturing
06/15/17Method of processing a substrate support assembly
06/15/17Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
06/15/17Environmental control of systems for photolithography process
06/15/17Matching process controllers for improved matching of process
06/15/17In-situ film annealing with spatial atomic layer deposition
06/15/17Conformal amorphous carbon for spacer and spacer protection applications
06/15/17High speed rotary sorter
Social Network Patent Pack
06/15/17Methods for forming structures with desired crystallinity for mram applications
06/08/17Method and surface nanoparticle measurement
06/08/17Advanced coating method and materials to prevent hdp-cvd chamber arcing
06/08/17Forming cobalt interconnections on a substrate
06/08/17Continuous liquid level measurement detector for closed metal containers
06/08/17Extreme ultraviolet mask blank production system with thin absorber and manufacturing system therefor
06/08/17Providing dynamic content in context of particular equipment
06/08/17Method and controlling a magnetic field in a plasma chamber
06/08/17Arcing detection plasma processing
06/08/17Methods and solutions for cleaning ingaas (or iii-v) substrates
06/08/17Wafer rotation in a semiconductor chamber
06/08/17High efficiency high accuracy heater driver
06/08/17Method and clamping and declamping substrates using electrostatic chucks
06/08/17Amalgamated cover ring
06/08/17Dielectric/metal barrier integration to prevent copper diffusion
06/08/17Multilayer passivation or etch stop tft
06/01/17Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing
06/01/17Vacuum processing mounting a processing system
06/01/17Corrosion control for chamber components
06/01/173d material modification for advanced processing
06/01/17Method and post exposure processing of photoresist wafers
05/25/17Pre-coated shield using in vhf-rf pvd chambers
05/25/17Seal rings in electrochemical processors
05/25/17Particle generation suppresor by dc bias modulation
05/25/17Supercritical carbon dioxide process for low-k thin films
05/25/17Lateral plasma/radical source
05/25/17Growing graphene on substrates
05/25/17Method for modifying epitaxial growth shape
05/25/17Self-aligned shielding of silicon oxide
05/25/17Self-aligned shielding of silicon oxide
Social Network Patent Pack
05/25/17On-board metrology (obm) design and implication in process tool
05/25/17Methods for forming low-resistance contacts through integrated process flow systems
05/25/17Semiconductor processing method and semiconductor device
05/25/17Materials for tensile stress and low contact resistance and forming
05/25/17Configurations of solid state thin film batteries
05/18/17Apparatus and forming a polishing pads by use of an additive manufacturing process
05/18/17Copolymerized high temperature bonding component
05/18/17Low vapor pressure aerosol-assisted cvd
05/18/17Inert anode electroplating processor and replenisher with anionic membranes
05/18/17Apparatus and methods for photomask backside cleaning
05/18/17Method and determining when to perform or trigger events in semi-conductor processing equipment
05/18/17Uniform low electron temperature plasma source with reduced wafer charging and independent control over radical composition
05/18/17Low vapor pressure aerosol-assisted cvd
05/18/17Substrate support assembly with deposited surface features
05/18/17Techniques for filling a structure using selective surface modification
05/11/17Ion assisted deposition for rare-earth oxide based coatings
05/11/17Multizone control of lamps in a conical lamphead using pyrometers
05/11/17Planarized extreme ultraviolet lithography blank with absorber and manufacturing system therefor
05/11/17Extreme ultraviolet reflective element with multilayer stack and manufacturing thereof
05/11/17Wafer point by point analysis and data presentation
05/11/17Rare-earth oxide based coatings based on ion assisted deposition
05/11/17Hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system
05/11/17Integrated process and structure to form iii-v channel for sub-7nm cmos devices
05/11/17Methods for selective etching of a silicon material
05/11/17Cooling base with spiral channels for esc
05/11/17Techniques for combining cmp process tracking data with 3d printed cmp consumables
05/11/17Bottom processing
05/11/17Method of igzo and zno tft fabrication with pecvd sio2 passivation
05/04/17Apparatus and forming a polishing article that has a desired zeta potential







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