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Applied Materials Inc
Applied Materials Inc A Delaware Corporation
Applied Materials Incorporated
Applied Materials Inc A Corporation Of The State Of Delaware U s a
Applied Materials Inc_20100107
Applied Materials Inc_20100121
Applied Materials Inc_20131212
Applied Materials Inc_20100128
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Applied Materials Inc patents

Recent patent applications related to Applied Materials Inc. Applied Materials Inc is listed as an Agent/Assignee. Note: Applied Materials Inc may have other listings under different names/spellings. We're not affiliated with Applied Materials Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Applied Materials Inc-related inventors

Date Applied Materials Inc patents (updated weekly) - BOOKMARK this page
09/30/10Mechanism for continuously varying radial position of a magnetron
11/12/09Deposition and densification process for titanium nitride barrier layers
10/12/17 new patent  Fluorine reduction with scope with controlled oxidation
10/12/17 new patent  Solution precursor plasma spray of ceramic coating for semiconductor chamber applications
10/12/17 new patent  Method to reduce line waviness
10/12/17 new patent  Plasma-enhanced anneal chamber for wafer outgassing
10/12/17 new patent  Hkmg integration
10/12/17 new patent  Semiconductor processing chamber
10/12/17 new patent  Vacuum chuck pressure control system
10/12/17 new patent  Methods for forming 2-dimensional self-aligned vias
10/05/17Cleaning process that precipitates yttrium oxy-flouride
10/05/17Low temperature fluoride glasses and glazes
10/05/17Fluoride glazes from fluorine ion treatment
10/05/17Apparatus and providing a uniform flow of gas
10/05/17Electroplating wafers having a notch
10/05/17Smart tool monitoring system
10/05/17Aerosol deposition coating for semiconductor chamber components
10/05/17Integrated metrology and process tool to enable local stress/overlay correction
10/05/17Apparatus and methods for wafer rotation in carousel susceptor
10/05/17High solids content paste formulations for secondary battery electrode
10/05/17Laser patterned thin film battery
10/05/17Mixed-platform apparatus, systems, and methods for substrate processing
09/28/17Chamber components with polished internal apertures
09/28/17Polishing system with local area rate control and oscillation mode
09/28/17Local area polishing system and polishing pad assemblies for a polishing system
09/28/17Chamber liner for high temperature processing
09/28/17Apparatus and methods to remove residual precursor inside gas lines post-deposition
09/28/17Substrate support assembly with non-uniform gas flow clearance
09/28/17Alumina layer formation on aluminum surface to protect aluminum parts
09/28/17Electroplating contact ring with radially offset contact fingers
09/28/17Susceptor support
09/28/17Ceramic heater with enhanced rf power delivery
09/28/17Conformal strippable carbon film for line-edge-roughness reduction for advanced patterning
09/28/17Electrochemical cell with protected negative electrode
09/28/17Special lipon mask to increase lipon ionic conductivity and tfb fabrication yield
09/28/17Electrochemical device stacks including interlayers for reducing interfacial resistance and over-potential
09/21/17Symmetric plasma process chamber
09/21/17Oriented laser activated processing chamber
09/21/17Substrate support assembly having metal bonded protective layer
09/21/17Method and reducing radiation induced change in semiconductor structures
09/21/17In-situ temperature measurement in a noisy environment
09/21/17Methods and assemblies for gas flow ratio control
09/21/17Methods and assemblies for gas flow ratio control
09/21/17Methods for gapfill in high aspect ratio structures
09/14/17Substrate processing system having susceptorless substrate support with enhanced substrate heating control
09/14/17Pad structure and fabrication methods
09/14/17Plasma resistant coating with tailorable coefficient of thermal expansion
09/14/17Method for electrochemically grown yttria or yttrium oxide on semiconductor processing equipment
09/14/17Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
09/14/17Intelligent hardstop for gap detection and control mechanism
09/14/17Apparatus for cost-effective conversion of unsupervised fault detection (fd) system to supervised fd system
09/14/17Heated substrate support
09/14/17Selective deposition of silicon nitride films for spacer applications
09/14/17Methods and selective dry etch
09/14/17Bottom processing
09/14/17Multiple wafer rotary processing
09/14/17Multi-zone pedestal for plasma processing
09/14/17Method to remove residual charge on a electrostatic chuck during the de-chucking step
09/14/17Support cylinder for thermal processing cylinder
09/07/17Methods and controlling ion fraction in physical vapor deposition processes
09/07/17In-situ spatially resolved plasma monitoring by using optical emission spectroscopy
09/07/17Self-assembled monolayer blocking with intermittent air-water exposure
09/07/17Methods and conserving electronic device manufacturing resources
09/07/17Substrate support assembly for high temperature processes
09/07/17Universal process kit
Patent Packs
09/07/17Doping control of metal nitride films
08/31/17Window in thin polishing pad
08/31/17High purity metallic top coat for semiconductor manufacturing components
08/31/17Enhanced plating bath and additive chemistries for cobalt plating
08/31/17Method for inter-chamber process
08/31/17Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device str
08/31/17Electrostatic chuck having thermally isolated zones with minimal crosstalk
08/31/17Electrostatic chuck optimized for refurbishment
08/31/17Fluoro polymer contact layer to carbon nanotube chuck
08/31/17Methods for integration of organic and inorganic materials for oled encapsulating structures
08/31/17Evaporation source having multiple source ejection directions
08/24/17Lid assembly for a processing system to facilitate sequential deposition techniques
08/24/17Systems, apparatus, and methods for an electromagnetic interference shielding optical polarizer
08/24/17Showerhead having an extended detachable gas distribution plate
08/24/17Cyclic oxide spacer etch process
Patent Packs
08/24/17Method and forming porous silicon layers
08/24/17Carrier head membrane with a bead
08/24/17Thin film transistor fabrication utlizing an interface layer on a metal electrode layer
08/24/17Parallel plate inline substrate processing tool
08/24/17System for depositing one or more layers on a substrate supported by a carrier and method using the same
08/17/17Medical bodily fluid sampling device
08/17/17In-situ temperature control during chemical mechanical polishing with a condensed gas
08/17/17Reactor gas panel common exhaust
08/17/17Particle generation suppresor by dc bias modulation
08/17/17Chemical control features in wafer process equipment
08/17/17Rotatable substrate support having radio frequency applicator
08/17/17Fluorination during ald high-k, fluorination post high-k and use of a post fluorination anneal to engineer fluorine bonding and incorporation
08/17/17Manufacturing of high capacity prismatic lithium-ion alloy anodes
08/17/17Three-dimensional thin film battery
08/10/17Systems, apparatus, and methods for chemical polishing
08/10/17Process chamber for dielectric gapfill
08/10/17Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating
08/10/17Oxide etch selectivity systems and methods
08/10/17Semiconductor processing systems having multiple plasma configurations
08/10/17Methods and systems to enhance process uniformity
08/10/17Systems and methods for internal surface conditioning in plasma processing equipment
08/10/17Method for removing native oxide and residue from a iii-v group containing surface
08/10/17Flow distribution plate for surface fluorine reduction
08/10/17Methods for selective etching of a silicon material
08/10/17Integrated layer etch system with multiple type chambers
08/10/17Process chamber for etching low k and other dielectric films
08/10/17Low temperature chuck for plasma processing systems
08/10/17Bolted wafer chuck thermal management wafer processing systems
08/10/17Thermal management wafer processing systems
08/10/17Substrate support chuck cooling for deposition chamber
Social Network Patent Pack
08/10/17Interface engineering for high capacitance capacitor for liquid crystal display
08/10/17High-k dielectric materials utilized in display devices
08/10/17Substrate support with quadrants
08/03/17Plasma abatement of compounds containing heavy atoms
08/03/17Compact eye module layout
08/03/17Methods for igniting a plasma in a substrate processing chamber
08/03/17Rtp process for directed self-aligned patterns
08/03/17System and method in indium-gallium-arsenide channel height control for sub 7nm finfet
08/03/17Conductive wafer lift pin o-ring gripper with resistor
08/03/17High speed epitaxy system and methods
Patent Packs
07/27/17Sputter source for semiconductor process chambers
07/27/17Ceramic showerhead with embedded conductive layers
07/27/17Ceramic slit valve doors and assemblies
07/27/17Gas splitting by time average injection into different zones by fast gas valves
07/27/17Symmetric plasma source to generate pie shaped treatment
07/27/17Dual-feed tunable plasma source
07/27/17Slit valve gate coating and methods for cleaning slit valve gates
07/27/17Methods for in-situ chamber clean in plasma etching processing chamber
07/27/17Acetylide-based silicon precursors and their use as ald/cvd precursors
07/27/17High productivity soak anneal system
07/27/17Systems and methods for detecting the existence of one or more environmental conditions within a substrate processing system
07/27/17Controlling the rf amplitude of an edge ring of a capacitively coupled plasma process device
07/27/17Wafer edge ring lifting solution
07/27/17Process and chemistry of plating of through silicon vias
07/27/17Mask-less fabrication of thin film batteries
07/27/17Sensor system for multi-zone electrostatic chuck
07/20/17Additive manufacturing with laser and plasma
07/20/17Carrier for small pad for chemical mechanical polishing
07/20/17Porous chemical mechanical polishing pads
07/20/17Method and forming porous advanced polishing pads using an additive manufacturing process
07/20/17Chamber component with protective coating suitable for protection against fluorine plasma
07/20/17Resist fortification for magnetic media patterning
07/20/17Rps defect reduction by cyclic clean induced rps cooling
07/20/17Pecvd tungsten containing hardmask films and methods of making
07/20/17Hybrid carbon hardmask for lateral hardmask recess reduction
07/20/17Oxygen vacancy of igzo passivation by fluorine treatment
07/13/17Source rf power split inner coil to improve bcd and etch depth performance
07/13/17Atomic layer etching system with remote plasma source and dc electrode
07/13/17Minimization of ring erosion during plasma processes
07/13/17Hydrogen plasma based cleaning process for etch hardware
Patent Packs
07/13/17Co or ni and cu integration for small and large features in integrated circuits
07/06/17Materials and formulations for three-dimensional printing
07/06/17Non-metallic thermal cvd/ald gas injector and purge system
07/06/17Cooled gas feed block with baffle and nozzle for hdp-cvd
07/06/17Systems and methods for shielding features of a workpiece during electrochemical deposition
07/06/17Inductive plasma source with metallic shower head using b-field concentrator
07/06/17Methods for depositing fluorine/carbon-free conformal tungsten
07/06/17Quad chamber and platform having multiple quad chambers
07/06/17Method for fabricating nanowires for horizontal gate all around devices for semiconductor applications
07/06/17High temperature heater for processing chamber
06/29/17Additive manufacturing with laser and gas flow
06/29/17Methods and stable substrate processing with multiple rf power supplies
06/29/17Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake
06/29/17Apparatus and reducing substrate sliding in process chambers
06/22/17Methods for treating exhaust gas in a processing system
06/22/17Methods for bonding substrates
06/22/17Flat susceptor with grooves for minimizing temperature profile across a substrate
06/22/17Anodization architecture for electro-plate adhesion
06/22/17Surface acoustic wave sensors in semiconductor processing equipment
06/22/17Uniform wafer temperature achievement in unsymmetric chamber environment
Social Network Patent Pack
06/22/17Showerhead having a detachable gas distribution plate
06/22/17Gas diffuser having grooved hollow cathodes
06/22/17Methods and processing a substrate
06/22/17Cleaning method
06/22/17Methods for selective etching of a silicon material using hf gas without nitrogen etchants
06/22/17Oxide etch selectivity enhancement
06/22/17Methods of treating nitride films
06/22/17Methods and interactively and dynamically updating a schematic overlay
06/22/17Method and depositing cobalt in a feature
06/22/17Method to grow thin epitaxial films at low temperature
06/22/17Conformal amorphous silicon as nucleation layer for w ald process
06/22/17Multi-threshold voltage structures with a lanthanum nitride film and methods of formation thereof
06/15/17Exothermic powders for additive manufacturing
06/15/17Method of processing a substrate support assembly
06/15/17Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
06/15/17Environmental control of systems for photolithography process
06/15/17Matching process controllers for improved matching of process
06/15/17In-situ film annealing with spatial atomic layer deposition
06/15/17Conformal amorphous carbon for spacer and spacer protection applications
06/15/17High speed rotary sorter
Social Network Patent Pack
06/15/17Methods for forming structures with desired crystallinity for mram applications
06/08/17Method and surface nanoparticle measurement
06/08/17Advanced coating method and materials to prevent hdp-cvd chamber arcing
06/08/17Forming cobalt interconnections on a substrate
06/08/17Continuous liquid level measurement detector for closed metal containers
06/08/17Extreme ultraviolet mask blank production system with thin absorber and manufacturing system therefor
06/08/17Providing dynamic content in context of particular equipment
06/08/17Method and controlling a magnetic field in a plasma chamber
06/08/17Arcing detection plasma processing
06/08/17Methods and solutions for cleaning ingaas (or iii-v) substrates
06/08/17Wafer rotation in a semiconductor chamber
06/08/17High efficiency high accuracy heater driver
06/08/17Method and clamping and declamping substrates using electrostatic chucks
06/08/17Amalgamated cover ring
06/08/17Dielectric/metal barrier integration to prevent copper diffusion
06/08/17Multilayer passivation or etch stop tft
06/01/17Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishing
06/01/17Vacuum processing mounting a processing system
06/01/17Corrosion control for chamber components
06/01/173d material modification for advanced processing
06/01/17Method and post exposure processing of photoresist wafers
05/25/17Pre-coated shield using in vhf-rf pvd chambers
05/25/17Seal rings in electrochemical processors
05/25/17Particle generation suppresor by dc bias modulation
05/25/17Supercritical carbon dioxide process for low-k thin films
05/25/17Lateral plasma/radical source
05/25/17Growing graphene on substrates
05/25/17Method for modifying epitaxial growth shape
05/25/17Self-aligned shielding of silicon oxide
05/25/17Self-aligned shielding of silicon oxide
Social Network Patent Pack
05/25/17On-board metrology (obm) design and implication in process tool
05/25/17Methods for forming low-resistance contacts through integrated process flow systems
05/25/17Semiconductor processing method and semiconductor device
05/25/17Materials for tensile stress and low contact resistance and forming
05/25/17Configurations of solid state thin film batteries
05/18/17Apparatus and forming a polishing pads by use of an additive manufacturing process
05/18/17Copolymerized high temperature bonding component
05/18/17Low vapor pressure aerosol-assisted cvd
05/18/17Inert anode electroplating processor and replenisher with anionic membranes
05/18/17Apparatus and methods for photomask backside cleaning
05/18/17Method and determining when to perform or trigger events in semi-conductor processing equipment
05/18/17Uniform low electron temperature plasma source with reduced wafer charging and independent control over radical composition
05/18/17Low vapor pressure aerosol-assisted cvd
05/18/17Substrate support assembly with deposited surface features
05/18/17Techniques for filling a structure using selective surface modification
05/11/17Ion assisted deposition for rare-earth oxide based coatings
05/11/17Multizone control of lamps in a conical lamphead using pyrometers
05/11/17Planarized extreme ultraviolet lithography blank with absorber and manufacturing system therefor
05/11/17Extreme ultraviolet reflective element with multilayer stack and manufacturing thereof
05/11/17Wafer point by point analysis and data presentation
05/11/17Rare-earth oxide based coatings based on ion assisted deposition
05/11/17Hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system
05/11/17Integrated process and structure to form iii-v channel for sub-7nm cmos devices
05/11/17Methods for selective etching of a silicon material
05/11/17Cooling base with spiral channels for esc
05/11/17Techniques for combining cmp process tracking data with 3d printed cmp consumables
05/11/17Bottom processing
05/11/17Method of igzo and zno tft fabrication with pecvd sio2 passivation
05/04/17Apparatus and forming a polishing article that has a desired zeta potential

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Applied Materials Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Applied Materials Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by