Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Atotech Deutschland Gmbh patents


Recent patent applications related to Atotech Deutschland Gmbh. Atotech Deutschland Gmbh is listed as an Agent/Assignee. Note: Atotech Deutschland Gmbh may have other listings under different names/spellings. We're not affiliated with Atotech Deutschland Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Atotech Deutschland Gmbh-related inventors


 new patent  Activation silicon substrates

The present invention relates to an activation composition for activation of silicon substrates, which is an aqueous solution comprising a source of palladium ions, a source of fluoride ions and at least two aromatic acids. The present invention further relates to a method for its use and optionally for subsequent... Atotech Deutschland Gmbh

Method and electroplating a metal onto a substrate

Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward... Atotech Deutschland Gmbh

Plating bath and electroless deposition of nickel layers

The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising ions of group IIIA metals and iodine containing, inorganic compounds in order to enhance bath stability.... Atotech Deutschland Gmbh

Method and electrolytically depositing a deposition metal on a workpiece

For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte AE are arranged and which has a device for electric current generation 60... Atotech Deutschland Gmbh

Method for fine line manufacturing

A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing... Atotech Deutschland Gmbh

Plating bath compositions for electroless plating of metals and metal alloys

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable... Atotech Deutschland Gmbh

Novel electromagnetic shielding and thermal management of active components

The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or... Atotech Deutschland Gmbh

Plating bath composition and electroless plating of palladium

The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aldehyde compound.... Atotech Deutschland Gmbh

Substrate holder for vertical galvanic metal deposition

A substrate holder for vertical galvanic metal deposition on a substrate, comprising a first substrate holder part and a second substrate holder part, wherein both said parts comprise an inner metal comprising part and an outer non-metallic part in which the substrate holder further comprises a hanging element in each... Atotech Deutschland Gmbh

Process for metallizing plastic parts

The present invention relates to a method for preventing the metallization of a support of at least one plastic part subjected to a metallization process, comprising the successive stages of oxidation of the surface of said part, of activation of the oxidized surface and of chemical and/or electrochemical deposition of... Atotech Deutschland Gmbh

Composition and micro etching of copper and copper alloys

wherein R1 is selected from the group consisting of hydrogen, C1-C5-alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C1-C5-alkyl or C1-C5-alkoxy; R3, R4 are selected from the group consisting of hydrogen and C1-C5-alkyl; and X− is a suitable anion. Further, the... Atotech Deutschland Gmbh

Acidic zinc and zinc nickel alloy plating bath composition and electroplating method

The present invention relates to an acidic zinc or zinc-nickel alloy plating bath composition comprising a source for zinc ions, optionally a source for nickel ions, a source for chloride ions and at least one dithiocarbamyl alkyl sulfonic acid or salt thereof. Said plating bath composition and the corresponding plating... Atotech Deutschland Gmbh

Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained... Atotech Deutschland Gmbh

Desmear module of a horizontal process line and a separation and removal of desmear particles from such a desmear module

A desmear module for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated for a removal of precipitates comprising a desmear container connectable to a desmear unit, a pump and at least a first liquid connection element for connecting said... Atotech Deutschland Gmbh

Electroplating bath and producing dark chromium layers

The invention relates to electroplating baths and methods for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. The dark chromium deposits and workpieces carrying dark chromium deposits... Atotech Deutschland Gmbh

Composition and process for metallizing nonconductive plastic surfaces

The present invention relates to a composition of an etching solution and a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.... Atotech Deutschland Gmbh

Composition, use thereof and electrodepositing gold containing layers

The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold... Atotech Deutschland Gmbh

Method of forming a metal layer and manufacturing a substrate having such metal layer

In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including... Atotech Deutschland Gmbh

Plating bath composition and electroless plating of palladium

The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and... Atotech Deutschland Gmbh

Iron boron alloy coatings and a process for their preparation

An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value... Atotech Deutschland Gmbh

Solution and process for the pre-treatment of copper surfaces using an n-alkoxylated adhesion-promoting compound

and R2 in another —(CHR1—CHR2—O)— moiety.... Atotech Deutschland Gmbh

Process to deposit zinc-iron alloy layer material

A process for depositing a zinc-iron alloy layer material having a body centred cubic crystal structure of the Γ-phase, a (330) texture and an iron content of 12 to 20 wt.-% including the steps (i) providing a metallic substrate, (ii) contacting the substrate with an alkaline aqueous zinc-iron alloy plating... Atotech Deutschland Gmbh








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Atotech Deutschland Gmbh in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Atotech Deutschland Gmbh with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###