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Atotech Deutschland Gmbh patents


Recent patent applications related to Atotech Deutschland Gmbh. Atotech Deutschland Gmbh is listed as an Agent/Assignee. Note: Atotech Deutschland Gmbh may have other listings under different names/spellings. We're not affiliated with Atotech Deutschland Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Atotech Deutschland Gmbh-related inventors


Activation method for silicon substrates

The present invention relates to an activation composition for activation of silicon substrates, which is an aqueous solution comprising a source of palladium ions, a source of fluoride ions and at least two aromatic acids. The present invention further relates to a method for its use and optionally for subsequent metallization of such treated substrates. ... Atotech Deutschland Gmbh

Method and apparatus for electroplating a metal onto a substrate

Method for electroplating a metal onto a flat substrate p. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. ... Atotech Deutschland Gmbh

Method for fine line manufacturing

A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing a photosensitive composition on the front side of the substrate and on the pattern of light-shielding activation layer, photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation, removing any uncured remnants of the photosensitive composition; and thereby exposing recessed structures and deposition of at least one metal into the thus formed recessed structures whereby a transparent substrate with fine line circuitry thereon is formed. The method allows for very uniform and fine line circuitry with a line and space dimension of 0.5 to 10 μm.. ... Atotech Deutschland Gmbh

Method and apparatus for electrolytically depositing a deposition metal on a workpiece

For improving the current transfer during the electrolytic metallization of workpieces, a method is proposed: (a) providing a metal depositing apparatus 17, in which the workpiece, at least one anode 40, 41 and a metal deposition electrolyte ae are arranged and which has a device for electric current generation 60 and at least one current feeding device 31 with in each case at least one electrical contact element 34, 35 for making electrical contact with the workpiece; (b) bringing the at least one electrical contact element 34, 35 into contact with the workpiece; and (c) feeding electric current to the workpiece via the at least one electrical contact element 34, 35 in order that the deposition metal deposits on the workpiece. Before method step (b), in a further method step (d), deposition metal is deposited on the at least one electrical contact element 34, 35.. ... Atotech Deutschland Gmbh

Plating bath and method for electroless deposition of nickel layers

The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising ions of group iiia metals and iodine containing, inorganic compounds in order to enhance bath stability.. . ... Atotech Deutschland Gmbh

Plating bath compositions for electroless plating of metals and metal alloys

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, ic substrates and semiconductor substrates. ... Atotech Deutschland Gmbh

Substrate holder for vertical galvanic metal deposition

A substrate holder for vertical galvanic metal deposition on a substrate, comprising a first substrate holder part and a second substrate holder part, wherein both said parts comprise an inner metal comprising part and an outer non-metallic part in which the substrate holder further comprises a hanging element in each substrate holder part, a first sealing element in each substrate holder part, a second sealing element between the inner metal comprising part and the outer non-metallic part of the substrate holder, a fastening system for detachably fastening both substrate holder parts to each other, a first contact element in each substrate holder part for forwarding current from an outer source through the hanging element to the at least second contact element, and a second contact element in each substrate holder part for forwarding current from the at least first contact element to the substrate to be treated.. . ... Atotech Deutschland Gmbh

Plating bath composition and method for electroless plating of palladium

The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aldehyde compound. ... Atotech Deutschland Gmbh

Process for metallizing plastic parts

The present invention relates to a method for preventing the metallization of a support of at least one plastic part subjected to a metallization process, comprising the successive stages of oxidation of the surface of said part, of activation of the oxidized surface and of chemical and/or electrochemical deposition of metal on the activated surface, characterized in that it comprises a stage in which said support, before said oxidation stage, is brought into contact with an inhibiting solution comprising at least one specific metallization inhibitor. The invention also relates to a process for the selective metallization of a plastic part combined with a support, comprising bringing said part into contact with said inhibiting solution.. ... Atotech Deutschland Gmbh

Atotech Deutschland Gmbh

. . ... Atotech Deutschland Gmbh

Acidic zinc and zinc nickel alloy plating bath composition and electroplating method

The present invention relates to an acidic zinc or zinc-nickel alloy plating bath composition comprising a source for zinc ions, optionally a source for nickel ions, a source for chloride ions and at least one dithiocarbamyl alkyl sulfonic acid or salt thereof. Said plating bath composition and the corresponding plating method result in zinc or zinc-nickel alloy layers having an improved throwing power and thickness distribution, particularly when plating substrates having a complex shape and/or in rack-and-barrel plating.. ... Atotech Deutschland Gmbh

Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. ... Atotech Deutschland Gmbh

Desmear module of a horizontal process line and a method for separation and removal of desmear particles from such a desmear module

A desmear module for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated for a removal of precipitates comprising a desmear container connectable to a desmear unit, a pump and at least a first liquid connection element for connecting said pump with the desmear unit, wherein said pump is in conjunction with said desmear unit by said at least first liquid connection element; and wherein a treatment liquid level is provided inside the desmear module, which is above an intake area of the pump; wherein the desmear module further comprises at least a first liquid area, at least an adjacent second liquid area comprising the intake area of the pump, and at least a first separating element arranged between said at least first liquid area and said at least second liquid area.. . ... Atotech Deutschland Gmbh

Electroplating bath and method for producing dark chromium layers

The invention relates to electroplating baths and methods for electrodepositing a dark chromium layer on a workpiece. The trivalent chromium electroplating baths comprise sulphur compounds and the methods for electrodepositing a dark chromium layer employ these trivalent chromium electroplating baths. ... Atotech Deutschland Gmbh

06/15/17 / #20170166812

Composition and process for metallizing nonconductive plastic surfaces

The present invention relates to a composition of an etching solution and a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. ... Atotech Deutschland Gmbh

06/08/17 / #20170159195

Composition, use thereof and method for electrodepositing gold containing layers

The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. ... Atotech Deutschland Gmbh

05/11/17 / #20170130354

Method of forming a metal layer and method of manufacturing a substrate having such metal layer

In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a ph of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.. . ... Atotech Deutschland Gmbh

05/04/17 / #20170121824

Iron boron alloy coatings and a process for their preparation

An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one ph buffer and at least one base wherein its ph value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. ... Atotech Deutschland Gmbh

05/04/17 / #20170121823

Plating bath composition and method for electroless plating of palladium

The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect. ... Atotech Deutschland Gmbh

03/23/17 / #a method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. the method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (i),

Atotech Deutschland Gmbh

. . ... Atotech Deutschland Gmbh

02/02/17 / #20170029971

Process to deposit zinc-iron alloy layer material

A process for depositing a zinc-iron alloy layer material having a body centred cubic crystal structure of the Γ-phase, a (330) texture and an iron content of 12 to 20 wt.-% including the steps (i) providing a metallic substrate, (ii) contacting the substrate with an alkaline aqueous zinc-iron alloy plating bath containing 4 to 6 g/l zinc ions, 1 to 3 g/l iron ions, 25 to 35 g/l hydroxyl ions, 0.5 to 2.5 g/l of a quaternary ammonium polymer and at least one complexing agent selected from the group consisting of hydroxyl carboxylic acids and salts thereof and simultaneously applying a current to the substrate. The zinc alloy layer material provides a high corrosion protection to metallic substrates, has a high hardness and a bright appearance.. ... Atotech Deutschland Gmbh








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