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Atotech Deutschland Gmbh patents

Recent patent applications related to Atotech Deutschland Gmbh. Atotech Deutschland Gmbh is listed as an Agent/Assignee. Note: Atotech Deutschland Gmbh may have other listings under different names/spellings. We're not affiliated with Atotech Deutschland Gmbh, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Atotech Deutschland Gmbh-related inventors




Date Atotech Deutschland Gmbh patents (updated weekly) - BOOKMARK this page
11/16/17 new patent  Plating bath compositions for electroless plating of metals and metal alloys
11/16/17 new patent  Novel electromagnetic shielding and thermal management of active components
11/09/17Plating bath composition and electroless plating of palladium
11/09/17Substrate holder for vertical galvanic metal deposition
10/12/17Process for metallizing plastic parts
09/28/17Composition and micro etching of copper and copper alloys
09/28/17Acidic zinc and zinc nickel alloy plating bath composition and electroplating method
08/24/17Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device
08/10/17Desmear module of a horizontal process line and a separation and removal of desmear particles from such a desmear module
07/27/17Electroplating bath and producing dark chromium layers
06/15/17Composition and process for metallizing nonconductive plastic surfaces
06/08/17Composition, use thereof and electrodepositing gold containing layers
05/11/17Method of forming a metal layer and manufacturing a substrate having such metal layer
05/04/17Plating bath composition and electroless plating of palladium
05/04/17Iron boron alloy coatings and a process for their preparation
03/23/17Solution and process for the pre-treatment of copper surfaces using an n-alkoxylated adhesion-promoting compound
02/02/17Process to deposit zinc-iron alloy layer material
12/08/16Methods of treating metal surfaces and devices formed thereby
12/01/16Pre-treatment process for electroless plating
09/22/16Electroless copper plating solution
09/15/16Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
09/08/16Copper electroplating method
08/18/16Novel adhesion promoting agents for metallisation of substrate surfaces
08/04/16Method of selectively treating copper in the presence of further metal
08/04/16Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material
07/21/16Novel adhesion promoting process for metallisation of substrate surfaces
07/14/16Method for treatment of recessed structures in dielectric materials for smear removal
07/07/16Method for depositing a copper seed layer onto a barrier layer and copper plating bath
07/07/16Device for vertical galvanic metal deposition on a substrate
06/16/16Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material
06/16/16Method for cathodic corrosion protection of chromium surfaces
06/02/16Method and regeneration regenerating a plating composition
03/10/16Electroplating bath and producing dark chromium layers
03/03/16Method for depositing thick copper layers onto sintered materials
02/25/16Electroless copper plating solution
02/25/16Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
02/11/16Method for activating a copper surface for electroless plating
01/28/16Functional chromium layer with improved corrosion resistance
01/28/16Apparatus and electrolytic deposition of metal layers on workpieces
01/07/16Process for corrosion protection of iron containing materials
12/24/15Method for depositing a first metallic layer onto non-conductive polymers
12/03/15Method for metallization of solar cell substrates
11/19/15Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
11/05/15Plated electrical contacts for solar modules
10/29/15Process for metallizing nonconductive plastic surfaces
10/29/15Aqueous composition for etching of copper and copper alloys
10/22/15Copper plating bath composition
10/08/15Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes
10/08/15Method for combined through-hole plating and via filling
10/01/15Manufacture of coated copper pillars
09/10/15Device and the treatment of flat material to be treated
08/13/15Holding device for a product and treatment method
06/18/15Composition for forming a seed layer
06/11/15Electroless nickel plating bath
06/11/15Method and regeneration regenerating a plating composition
05/14/15Process for metallizing nonconductive plastic surfaces
04/23/15Plating bath for electroless deposition of nickel layers
04/09/15Method and electrolytically depositing a deposition metal on a workpiece
03/26/15Method for manufacture of fine line circuitry
03/05/15Process for metallizing nonconductive plastic surfaces
02/19/15Method for promoting adhesion between dielectric substrates and metal layers
01/15/15Method for producing matt copper deposits
01/15/15Process for metallizing nonconductive plastic surfaces
01/08/15Method for electroless nickel-phosphorous alloy deposition onto flexible substrates
01/01/15Process for metallizing nonconductive plastic surfaces
Patent Packs
12/25/14Composition and removal of organic paint coatings from substrates
12/25/14Alkaline plating bath for electroless deposition of cobalt alloys
12/18/14Novel adhesion promoting agents for metallization of substrate surfaces
09/25/14Chrome-plated part and manufacturing the same
09/18/14Methods of treating metal surfaces and devices formed thereby
09/11/14Methods of treating metal surfaces and devices formed thereby
08/28/14Formaldehyde-free electroless copper plating solution
08/28/14Electroless palladium plating bath composition
06/05/14Electroless nickel plating bath composition
05/22/14Aqueous acidic bath for electrolytic deposition of copper
05/22/14Method for providing organic resist adhesion to a copper or copper alloy surface
05/08/14Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
05/01/14Device and recovering a recovering material from a recovering fluid containing the recovering material
04/24/14Wire bondable surface for microelectronic devices
04/24/14Method for electroless plating
Patent Packs
04/17/14Method for copper plating
03/20/14Solution and process for the pre-treatment of copper surfaces using an n-alkoxylated adhesion-promoting compound
02/13/14Electroplating bath and producing dark chromium layers
01/02/14Process for etching a recessed structure filled with tin or a tin alloy
11/28/13Zinc-iron alloy layer material
11/21/13Autocatalytic plating bath composition for deposition of tin and tin alloys
10/31/13Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and ic-substrates
10/24/13Immersion tin or tin alloy plating bath with improved removal of cuprous ions
08/08/13Composite build-up material for embedding of circuitry
08/08/13Composite build-up materials for embedding of active components
07/04/13Method to form solder deposits on substrates
05/09/13Method for etching of copper and copper alloys
05/02/13Method to form solder deposits and non-melting bump structures on substrates
04/04/13Method to form solder alloy deposits on substrates
03/28/13Process for forming corrosion protection layers on metal surfaces
03/07/13Composition and micro etching of copper and copper alloys
12/06/12Method for metallising objects which have at least two different plastics on the surface
11/29/12Membrane electrolysis stack, electrodialysis device including the stack and the regeneration of an electroless plating bath
11/29/12Method and device for the wet-chemical treatment of material to be treated
07/26/12Treatment solution for producing chrome and cobalt-free black conversion coatings
06/28/12Process for applying a metal coating to a non-conductive substrate
06/28/12Polymers having terminal amino groups and use thereof as additives for zinc and zinc alloy electrodeposition baths
06/14/12Method for electroless plating of tin and tin alloys
05/17/12Method of manufacturing a circuit carrier layer and a use of said manufacturing a circuit carrier
05/10/12Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
05/03/12Method, holding means, apparatus and system for transporting a flat material to be treated and loading or unloading apparatus
04/05/12Method, treatment station and assembly for treating a planar material to be treated
12/01/11Method and device for producing a plastic coating
09/08/11Method of inspecting a metal coating and a analytical control of a deposition electrolyte serving to deposit said metal coating
08/18/11Stress-reduced ni-p/pd stacks for bondable wafer surfaces
Social Network Patent Pack
08/11/11Metal plating additive, and plating substrates and products therefrom
06/09/11Method for electrochemically depositing a metal on a substrate
04/28/11Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (ib)-group 13 (iiia)-group 16 (via)
01/20/11Aqueous, acid bath and the electrolytic deposition of copper
12/30/10Ni-p layer system and process for its preparation
12/30/10Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
12/23/10Non-etching non-resist adhesion composition and preparing a work piece
12/09/10Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards
12/02/10Pyrophosphate-based bath for plating of tin alloy layers
09/23/10Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings
Patent Packs
08/05/10Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface
07/29/10Process for the preparation of electrodes for use in a fuel cell
07/22/10Anti-corrosion treatment for conversion layers
07/15/10Apparatus and the electrolytic treatment of a plate-shaped product
07/15/10Apparatus and the wet chemical treatment of a product and installing a flow member into the apparatus
06/24/10Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings
06/03/10Chromium(vi)-free black passivation of surfaces containing zinc
05/27/10Agent for the production of anti-corrosion layers on metal surfaces
05/13/10Process for applying a metal coating to a non-conductive substrate
03/11/10Electrodeposition method with analysis of the electrolytic bath by solid phase extraction
02/11/10Composition and improved adhesion of polymeric materials to copper or copper alloy surfaces
12/10/09Electrolytic filling holes and cavities with metals
10/08/09Process for manufacturing a microreactor and its use as a reformer
08/13/09Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement
08/13/09Method for bonding work pieces made of stainless steel, nickel or nickel alloys, using a bonding layer consisting of nickel-phosphorous, producing a micro-structured component using such method; micro-structured component obtained by such method
07/16/09Method, clip and device for transporting an article to be treated in an electrolytic system
05/21/09Method for continuously operating acid or alkaline zinc or zinc alloy baths
04/30/09Alkaline electroplating bath having a filtration membrane
03/26/09Method for coating substrates containing antimony compounds with tin and tin alloys
02/05/09Aqueous reaction solution and passivating workpieces having zinc or zinc alloy surfaces and use of a heteroaromatic compound







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