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C Uyemura & Co Ltd patents

Recent patent applications related to C Uyemura & Co Ltd. C Uyemura & Co Ltd is listed as an Agent/Assignee. Note: C Uyemura & Co Ltd may have other listings under different names/spellings. We're not affiliated with C Uyemura & Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | C Uyemura & Co Ltd-related inventors

Surface treating apparatus

To provide surface treatment that can reduce occurrence of defects caused by incorporation of dust. Rollers 40 are rotatably fixed to rotating shafts 72 provided to protrude from lateral protective walls 49. The lateral protective walls 49 are fixed perpendicularly to lower protective walls 47 fixed to outer walls 39.... C Uyemura & Co Ltd

Surface treating apparatus

A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side... C Uyemura & Co Ltd

Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same

The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic... C Uyemura & Co Ltd

Clamper and holding jig including same

A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the... C Uyemura & Co Ltd

Copper plating solution and copper plating method

A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with... C Uyemura & Co Ltd

Method for manufacturing wiring substrate and wiring substrate manufactured thereby

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes... C Uyemura & Co Ltd

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with C Uyemura & Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for C Uyemura & Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by