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C Uyemura & Co Ltd patents

Recent patent applications related to C Uyemura & Co Ltd. C Uyemura & Co Ltd is listed as an Agent/Assignee. Note: C Uyemura & Co Ltd may have other listings under different names/spellings. We're not affiliated with C Uyemura & Co Ltd, we're just tracking patents.

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Clamper and holding jig including same

A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the... C Uyemura & Co Ltd

Copper plating solution and copper plating method

A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with... C Uyemura & Co Ltd

Method for manufacturing wiring substrate and wiring substrate manufactured thereby

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes... C Uyemura & Co Ltd

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with C Uyemura & Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for C Uyemura & Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by