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Cabot Microelectronics Corporation
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Cabot Microelectronics Corporation patents

Recent patent applications related to Cabot Microelectronics Corporation. Cabot Microelectronics Corporation is listed as an Agent/Assignee. Note: Cabot Microelectronics Corporation may have other listings under different names/spellings. We're not affiliated with Cabot Microelectronics Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | Cabot Microelectronics Corporation-related inventors




Date Cabot Microelectronics Corporation patents (updated weekly) - BOOKMARK this page
08/17/17 new patent  Method of polishing group iii-v materials
07/27/17Polishing composition comprising cationic polymer additive
07/06/17Tungsten processing slurry with catalyst
07/06/17Method of polishing a low-k substrate
06/29/17Cmp processing composition comprising alkylamine and cyclodextrin
06/08/17Cleaning composition following cmp and methods related thereto
06/08/17Stabilization of tris(2 hydroxyethyl)methylammonium hydroxide against decomposition with dialkyhydroxylamine
05/04/17Polishing pad with foundation layer and window attached thereto
05/04/17Tungsten-processing slurry with cationic surfactant and cyclodextrin
05/04/17Tungsten-processing slurry with cationic surfactant
03/30/17Polyurethane cmp pads having a high modulus ratio
03/09/17Selective nitride slurries with improved stability and improved polishing characteristics
03/09/17Methods and compositions for processing dielectric substrate
02/23/17Polishing composition and method utilizing abrasive particles treated with an aminosilane
02/16/17Polishing composition containing ceria abrasive
02/09/17Cmp polishing pad with columnar structure and methods related thereto
01/19/17Methods and compositions for processing dielectric substrate
10/06/16Cmp composition and polishing rigid disks
09/08/16Polishing composition containing cationic polymer additive
09/08/16Polishing composition containing ceria particles and use
09/08/16Polishing composition containing ceria abrasive
08/25/16Composition and polishing memory hard disks exhibiting reduced edge roll-off
08/04/16Cmp composition for silicon nitride removal
07/14/16Cleaning composition and cleaning semiconductor wafers after cmp
06/16/16Cmp compositions exhibiting reduced dishing in sti wafer polishing
04/28/16Cobalt polishing accelerators
04/21/16Corrosion inhibitors and related compositions and methods
04/21/16Cobalt dishing control agents
04/21/16Slurry for chemical mechanical polishing of cobalt
04/14/16Nickel phosphorous cmp compositions and methods
03/31/16Composition for tungsten cmp
03/03/16Composition and polishing a sapphire surface
02/25/16Germanium chemical mechanical polishing
12/31/15Colloidal silica chemical-mechanical polishing composition
12/31/15Colloidal silica chemical-mechanical polishing composition
12/31/15Methods for fabricating a chemical-mechanical polishing composition
12/31/15Colloidal silica chemical-mechanical polishing concentrate
12/31/15Tungsten chemical-mechanical polishing composition
12/31/15Copper barrier chemical-mechanical polishing composition
12/24/15Cmp slurry compositions and methods for aluminum polishing
11/12/15Multi-layer polishing pad for cmp
11/05/15Polishing composition for edge roll-off improvement
10/22/15Polishing pad with offset concentric grooving pattern and polishing a substrate therewith
09/24/15Composition for tungsten buffing
09/24/15Mixed abrasive tungsten cmp composition
09/24/15Mixed abrasive tungsten cmp composition
09/17/15Composition for tungsten cmp
09/17/15Composition for tungsten cmp
09/17/15Composition for tungsten cmp
09/17/15Compositions and methods for cmp of tungsten materials
08/06/15Composition and polishing molybdenum
08/06/15Cmp suppression of titanium nitride and titanium/titanium nitride removal
07/16/15Composition and polishing memory hard disks
07/02/15Polishing composition and method utilizing abrasive particles treated with an aminosilane
06/11/15Cmp compositions and methods for selective removal of silicon nitride
06/04/15Cmp compositions and methods for polishing nickel phosphorous surfaces
04/30/15Polishing composition and nickel-phosphorous coated memory disks
04/23/15Cmp polishing pad having edge exclusion region of offset concentric groove pattern
04/16/15Wet-process ceria compositions for polishing substrates, and methods related thereto
04/16/15Mixed abrasive polishing compositions
03/26/15Chemical-mechanical planarization of polymer films
02/26/15Polishing pad with porous interface and solid core, and related apparatus and methods
02/26/15Ultra high void volume polishing pad with closed pore structure
01/29/15Composition and polishing bulk silicon
01/22/15Compositions and methods for cmp of silicon oxide, silicon nitride, and polysilicon materials
Patent Packs
12/18/14Low surface roughness polishing pad
09/04/14Composition and polishing glass
07/31/14Chemical-mechanical polishing composition containing zirconia and metal oxidizer
12/12/13Composition and polishing molybdenum
11/28/13Cmp composition containing zirconia particles and use
11/28/13Polishing composition for nickel-phosphorous-coated memory disks
10/17/13Polishing pad with light-stable light-transmitting region
09/19/13Cmp compositions selective for oxide and nitride with high removal rate and low defectivity
09/12/13Polishing pad comprising transmissive region
08/29/13Method for polishing aluminum/copper and titanium in damascene structures
11/08/12Compositions for polishing silicon-containing substrates
11/01/12Polishing composition for nickel phosphorous memory disks
07/26/12Silicon polishing compositions with improved psd performance
04/19/12Cmp compositions and methods for suppressing polysilicon removal rates
02/23/12Cmp slurry recycling system and methods
Patent Packs
10/13/11Dilutable cmp composition containing a surfactant
10/06/11Composition for improving dryness during wire sawing
10/06/11Cutting fluid composition for wiresawing
06/09/11Composition and polishing polysilicon
05/05/11Metal-passivating cmp compositions and methods
03/17/11Composition and polishing bulk silicon
03/17/11Metal cations for initiating polishing
01/20/11Grooved cmp polishing pad
12/16/10Compositions for cmp of semiconductor materials
11/04/10Cmp system utilizing halogen adduct
10/28/10Cmp porous pad with particles in a polymeric matrix
08/12/10Oxidation-stabilized cmp compositions and methods
08/05/10Polishing composition for nickel-phosphorous memory disks
06/10/10Method to selectively polish silicon carbide films
03/25/10Barrier slurry for low-k dielectrics
03/11/10Methods for polishing aluminum nitride
01/14/10Method of polishing nickel-phosphorous
11/26/09Polishing composition containing polyether amine
11/26/09Stable, high rate silicon slurry
09/24/09Compositions for polishing aluminum/copper and titanium in damascene structures
09/17/09X-ray source with nonparallel geometry
08/27/09Polishing composition and high silicon nitride to silicon oxide removal rate ratios
07/30/09Cmp improved oxide removal rate
07/09/09Composition and polishing nickel-phosphorous-coated aluminum hard disks
06/18/09Chemical-mechanical polishing composition and using the same
05/28/09Polishing composition and high silicon nitride to silicon oxide removal rate ratios
05/14/09Compositions and methods for ruthenium and tantalum barrier cmp
04/09/09Slurries for polishing oxide and nitride with high removal rates
03/26/09Polishing composition and method utilizing abrasive particles treated with an aminosilane
03/26/09Polishing composition and method utilizing abrasive particles treated with an aminosilane
Social Network Patent Pack
03/19/09Low ph barrier slurry based on titanium dioxide
12/12/13Composition and polishing molybdenum
01/14/10Method of polishing nickel-phosphorous







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