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Chengdu Haicun Ip Technology Llc patents


Recent patent applications related to Chengdu Haicun Ip Technology Llc. Chengdu Haicun Ip Technology Llc is listed as an Agent/Assignee. Note: Chengdu Haicun Ip Technology Llc may have other listings under different names/spellings. We're not affiliated with Chengdu Haicun Ip Technology Llc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | Chengdu Haicun Ip Technology Llc-related inventors


 new patent  Configurable computing array comprising three-dimensional writable memory

The present invention discloses a configurable computing array comprising three-dimensional writable memory (3D-W). It is a monolithic integrated circuit comprising an array of configurable computing elements, an array of configurable logic elements and an array of configurable interconnects. Each configurable computing element comprises at least a 3D-W array, which stores... Chengdu Haicun Ip Technology Llc

 new patent  Configurable computing array

The present invention discloses a configurable computing array. It comprises an array of configurable computing elements and an array of configurable logic elements. Each configurable computing element comprises at least a writable-memory array, which stores at least a portion of a look-up table (LUT) for a math function.... Chengdu Haicun Ip Technology Llc

 new patent  Configurable computing array based on three-dimensional vertical writable memory

The present invention discloses a configurable computing array. It is a monolithic integrated circuit comprising at least a configurable computing element and a configurable logic element. The configurable computing element comprises at least a three-dimensional vertical writable memory (3D-WV) array, which is stacked above the configurable logic element and stores... Chengdu Haicun Ip Technology Llc

 new patent  Configurable computing array using two-sided integration

The present invention discloses a configurable computing array using two-sided integration. It is a monolithic integrated circuit comprising at least a configurable computing element located on one side of the substrate and at least a configurable logic element on the other side of the substrate. Each configurable computing element comprises... Chengdu Haicun Ip Technology Llc

 new patent  Configurable computing-array package

The present invention discloses a configurable computing-array package. It comprises a configurable computing die including an array of configurable computing elements and a configurable logic die including an array of configurable logic elements. Each configurable computing element comprises at least a writable-memory array, which stores at least a portion of... Chengdu Haicun Ip Technology Llc

Processor for enhancing computer security

The present invention discloses a processor for enhancing computer security, i.e. a three-dimensional (3-D) security processor. It is a monolithic integrated circuit comprising a plurality of storage-processing units (SPU). Each SPU comprises at least a three-dimensional memory (3D-M) array for permanently storing virus patterns and a pattern-processing circuit for performing... Chengdu Haicun Ip Technology Llc

Processor for enhancing network security

The present invention discloses a processor for enhancing network security, i.e. a three-dimensional (3-D) security processor. It is a monolithic integrated circuit comprising a plurality of storage-processing units (SPU). Each SPU comprises at least a three-dimensional memory (3D-M) array for permanently storing rule/virus patterns and a pattern-processing circuit for performing... Chengdu Haicun Ip Technology Llc

Processor for realizing at least two categories of functions

The present invention discloses a first preferred processor comprising a fixed look-up table circuit (LTC) and a writable LTC. The fixed LTC realizes at least a common function while the writable LTC realizes at least a non-common function. The present invention further discloses a second preferred processor comprising a two-dimensional... Chengdu Haicun Ip Technology Llc

Processor with backside look-up table

The present invention discloses a processor for computing a mathematical function. The processor comprises a look-up table circuit (LUT) and an arithmetic logic circuit (ALC). The LUT is formed on the backside of the processor substrate and stores data related to the mathematical function. The ALC is formed on the... Chengdu Haicun Ip Technology Llc

Configurable processor with in-package look-up table

The present invention discloses a configurable processor with an in-package look-up table. The configurable processor comprises a programmable memory die and a logic die located in a same package. The programmable memory die comprises a look-up table circuit (LUT) for storing data related to a desired function. The logic die... Chengdu Haicun Ip Technology Llc

Configurable processor with backside look-up table

The present invention discloses a configurable processor with a backside look-up table. The configurable processor comprises a look-up table circuit (LUT) on the backside of the processor substrate and an arithmetic logic circuit (ALC) on the front side of the processor substrate. The LUT stores data related to a desired... Chengdu Haicun Ip Technology Llc

Processor with in-package look-up table

The present invention discloses a processor for computing a mathematical function. The processor comprises a memory die and a logic die. The memory die comprises a look-up table circuit (LUT) for storing data related to the mathematical function. The logic die comprises an arithmetic logic circuit (ALC) for performing arithmetic... Chengdu Haicun Ip Technology Llc

Simulation processor with in-package look-up table

The present invention discloses a simulation processor for simulating a system comprising a system component. The simulation processor comprises a memory die and a logic die. The memory die comprises a look-up table circuit (LUT) for storing data related to a mathematical model of the system component. The logic die... Chengdu Haicun Ip Technology Llc

Simulation processor with backside look-up table

The present invention discloses a simulation processor for simulating a system comprising a system component. The simulation processor comprises a look-up table circuit (LUT) and an arithmetic logic circuit (ALC). The LUT is formed on the backside of the processor substrate and stores data related to a mathematical model of... Chengdu Haicun Ip Technology Llc

Multi-bit-per-cell three-dimensional one-time-programmable memory

The present invention discloses a multi-bit-per-cell three-dimensional read-only memory (3D-OTPMB). It comprises a plurality of OTP cells stacked above a semiconductor substrate. Each OTP cell comprises an antifuse layer, which is irreversibly switched from a high-resistance state to a low-resistance state during programming. By adjusting the programming current, the programmed... Chengdu Haicun Ip Technology Llc

Three-dimensional vertical one-time-programmable memory

The present invention discloses a three-dimensional vertical read-only memory (3D-OTPV). It comprises a plurality of vertical OTP strings formed side-by-side on a substrate circuit. Each OTP string is vertical to the substrate and comprises a plurality of vertically stacked OTP cells. Each OTP cell comprises an antifuse layer. The antifuse... Chengdu Haicun Ip Technology Llc

Night detection of side-by-side parked vehicles

To detect side-by-side parked vehicles at night, the present invention discloses a night-detection device and method. The night-detection device comprises a moving-vehicle sensor and a parked-vehicle sensor. It uses the light beam from a passing-by vehicle to extract at least a reflection of at least a head-light or at least... Chengdu Haicun Ip Technology Llc

Field-repair system and mask-programmed read-only memory

The present invention discloses field-repair system and method for a mask-programmed memory (mask-ROM). The mask-ROM data are encoded with an error-checking-and-correction (ECC) scheme. A self-checking circuit detects errors in read-out data without using any external data. When an error is detected, a communicating circuit fetches the good data from a... Chengdu Haicun Ip Technology Llc

Mobile vending machine

The present invention discloses a mobile vending machine and the associated card-rental method for long-distance travels. The mobile vending machine contains a large number of content cards (e.g. TF cards). A user may rent a content card from the mobile vending machine. To facilitate playback in all types of mobile... Chengdu Haicun Ip Technology Llc

Compact three-dimensional memory with semi-conductive address line portion

In a compact three-dimensional memory (3D-MC), a memory array and an above-substrate decoding stage thereof are formed on a same memory level. For the memory devices in the memory array, the overlap portion and the non-overlap portions of the x-line are both highly-conductive; for the decoding device in the above-substrate... Chengdu Haicun Ip Technology Llc

Manufacturing methods of mosfet-type compact three-dimensional memory

Manufacturing methods of MOSFET-type compact three-dimensional memory (3D-MC) are disclosed. In a memory level stacked above the substrate, an x-line extends from a memory array to an above-substrate decoding stage. A MOSFET-type transistor is formed on the x-line as a decoding device for the above-substrate decoding stage, where the overlap... Chengdu Haicun Ip Technology Llc

Imprinted memory

Although photolithography is the preferred pattern-transfer method for even the 10 nm electrically-programmable memory (EPM, which comprises only periodic patterns), imprint-lithography is the preferred method to form the sub-25 nm printed memory (which comprises at least one non-periodic data-pattern). Accordingly, the present invention discloses an imprinted memory.... Chengdu Haicun Ip Technology Llc

Three-dimensional 3d-op-based package

The present invention discloses a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package (3D2-oP). The mask-patterns for different dice in a same 3D2-oP package are merged onto a same data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask... Chengdu Haicun Ip Technology Llc

Offset-printing three-dimensional package

The present invention discloses an offset-printing method for a three-dimensional 3D-oP (three-dimensional offset-printed memory)-based package. The mask-patterns for different 3D-op dice are merged onto a same data-mask. At different printing steps, a wafer is offset by different values with respect to the data-mask. Accordingly, data-patterns from a same data-mask are... Chengdu Haicun Ip Technology Llc

Secure printed memory

The present invention discloses a secure printed memory. It comprises a laser-programmable read-only memory (LP-ROM) which stores at least a key. The key is written during manufacturing and different LP-ROMs store different keys. The output of the secure printed memory is encrypted with the key stored in the LP-ROM and... Chengdu Haicun Ip Technology Llc

Three-dimensional mask-programmed read-only memory with reserved space

The present invention discloses a 3D-MPROM with reserved level (3D-MPROMRL). Versions of the 3D-MPROMRL, including an original 3D-MPROMRL and at least an updated 3D-MPROMRL, collectively form a 3D-MPROMRL family. Within a 3D-MPROMRL family, 3D-MPROMRL's of different versions are same except for at least a reserved level, which is absent in... Chengdu Haicun Ip Technology Llc








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