Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Chipbond Technology Corporation patents


Recent patent applications related to Chipbond Technology Corporation. Chipbond Technology Corporation is listed as an Agent/Assignee. Note: Chipbond Technology Corporation may have other listings under different names/spellings. We're not affiliated with Chipbond Technology Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | Chipbond Technology Corporation-related inventors


Wafer dicing method

A wafer dicing method comprises providing a wafer and performing a cutting procedure and a contacting procedure. The wafer includes a plurality of dies and a metal layer, wherein the metal layer is formed on a scribe line which is formed between adjacent dies. A cutter is used to cut... Chipbond Technology Corporation

Flexible substrate

A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on... Chipbond Technology Corporation








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Chipbond Technology Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Chipbond Technology Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###