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Cooler Master Co Ltd patents


Recent patent applications related to Cooler Master Co Ltd. Cooler Master Co Ltd is listed as an Agent/Assignee. Note: Cooler Master Co Ltd may have other listings under different names/spellings. We're not affiliated with Cooler Master Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | Cooler Master Co Ltd-related inventors


Liquid supply device and liquid cooling system

A liquid supply device includes a casing, a cover, a plunger, a driving unit and a sensing unit. The casing has a liquid outlet. The cover is connected to the casing. A chamber is formed between the casing and the cover. The chamber communicates with the liquid outlet. The plunger... Cooler Master Co Ltd

Multifunction integrated connection head assembly structure

A multifunction integrated connection head assembly structure includes a first connection head module and a second connection head module. The first connection head module includes a first carrier body, at least two first fluid connectors, a first power connector, and a first retaining body. The second connection head module includes... Cooler Master Co Ltd

External function extension device

An external function extension device includes a casing, a transition circuit board, a liquid cooling system, at least one connecting member and a power supply unit. The transition circuit board, the liquid cooling system and the power supply unit are disposed in the casing. The transition circuit board has a... Cooler Master Co Ltd

Liquid cooling system

A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at... Cooler Master Co Ltd

Thermal conducting structure

A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered... Cooler Master Co Ltd

Liquid cooling apparatus

A liquid cooling apparatus has a chassis, a cover mounted on the chassis, and a dividing structure disposed in an inner chamber defined between the chassis and the cover. The dividing structure divides the inner chamber into a liquid inlet compartment and a liquid outlet compartment. The liquid inlet compartment... Cooler Master Co Ltd

Pipe connector and electronic device

A pipe connector for connecting with an additional pipe connector includes a first leak-proof pipe, a first sleeve, at least one clamping element and a restricting structure. The first sleeve covers the first leak-proof pipe and allows the first leak-proof pipe to relatively slide therein. The clamping element and the... Cooler Master Co Ltd

Heat pipe module and heat dissipating device using the same

A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part... Cooler Master Co Ltd

Anti-gravity heat pipe device

A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam... Cooler Master Co Ltd

Water cooling system

Disclosed is a water cooling system for a circuit board with heat generating components. The water cooling system includes a fin module, a water block, a liquid guiding tube and a fan. The fin module is installed on the circuit board and has a through hole; the water block is... Cooler Master Co Ltd

Three-dimensional heat transfer device

A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is... Cooler Master Co Ltd

Heat dissipation device and electronic system

A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured... Cooler Master Co Ltd

Heat exchange module and serial pump thereof

A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening,... Cooler Master Co Ltd

Intelligent control

The invention relates to an intelligent control method and an intelligent control device adapted to be used in a heat-dissipating system. The intelligent control device includes at least a set of sensors and a micro-controller. The intelligent control method includes steps of obtaining a set of first state parameters and... Cooler Master Co Ltd

Cooling electronic components

A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes... Cooler Master Co Ltd

Liquid cooling apparatus, projector and apparatus having a heat source

In a liquid cooling apparatus, a projector and an apparatus having a heat source, the liquid cooling apparatus includes a chassis and a cover. The chassis has upper and lower surfaces, a boss protruded from the lower surface, and a recessed groove formed on the upper surface and inside the... Cooler Master Co Ltd

Portable electronic device and detachable auxiliary heat-dissipating module thereof

A portable electronic device using a fixed main heat-dissipating module and a detachable auxiliary heat-dissipating module for contacting the fixed main heat-dissipating module. The detachable auxiliary heat-dissipating module includes an outer casing structure and an inside mounted heat-dissipating structure. The outer casing structure includes a detachable casing detachably disposed inside... Cooler Master Co Ltd

Heat dissipating system

A heat dissipating system provided herein comprises a cooling tank for storing a cooling liquid and a heat element, wherein the cooling liquid is phase-changed into a working gas due to thermal energy generated by the heat element; an evaporator installed in the cooling tank for absorbing thermal energy of... Cooler Master Co Ltd

Impeller structure with improved rotation stability

An impeller for used in a fluid pump device includes a shaft controlled to revolve in a first direction; an impeller body coupled to the shaft and driven by the revolving shaft to rotate, the impeller body having a top surface, a bottom surface and a circumferential surface; a first... Cooler Master Co Ltd

Electronic system and external auxiliary heat dissipation device thereof

An external auxiliary heat dissipation device includes an external connection head module, a fluid driving module, a heat dissipation module, and a plurality of first pipes. The external connection head module includes a first carrier body and at least two first fluid connection heads disposed on the first carrier body.... Cooler Master Co Ltd

Pressure relief device and liquid cooling system

A pressure relief device is applied to a liquid cooling system. The pressure relief device includes an exhaust valve and a valve seat. The valve seat is connected with the exhaust valve to form a chamber. The valve seat has an inlet, an outlet and a protrusion. The inlet and... Cooler Master Co Ltd

Liquid-cooling heat dissipation device

A liquid-cooling heat dissipation device includes: a flow guiding shell body (1) formed with a first flow channel (13), a second flow channel (14) and a third flow channel (15), wherein a heat dissipation space (16) is defined by the above-mentioned three flow channels (13, 14, 15); a primary pipe... Cooler Master Co Ltd

Liquid-cooled heat sink head and heat sink system having the same

A liquid-cooled heat sink head includes a metal substrate, a first cover, and a plurality of heat dissipation fins. The first cover covers the metal substrate to form a heat exchange chamber and includes a first liquid inlet and a liquid outlet to allow a working fluid to flow in... Cooler Master Co Ltd

Liquid cooling block with shunt design and heat dissipating structure thereof

Disclosed are a liquid cooling block with a shunt design and its heat dissipating structure. The liquid cooling block includes a base plate, a cover plate, and a heat dissipating structure, and the cover plate includes a liquid inlet and a liquid outlet for a working fluid flowing in a... Cooler Master Co Ltd

Liquid supply device and liquid cooling system

A liquid supply device adapted to a liquid cooling system includes a casing, a cover, a plunger, a driving unit and a sensing unit. The casing has a liquid outlet. The cover is connected to the casing. A chamber is formed between the casing and the cover and contains a... Cooler Master Co Ltd

Modular fan blade

A modular fan blade includes a first fan blade and a second fan blade. The first fan blade includes a hub and plural first vanes, and the hub has an external periphery, and the first vane is combined with the external periphery, and a flange is formed at the external... Cooler Master Co Ltd








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Cooler Master Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Cooler Master Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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