Real Time Touch

new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)

Real Time Touch

Filing Names

Covalent Materials Corporation
Covalent Materials Corporation_20100128

Covalent Materials Corporation patents

Recent patent applications related to Covalent Materials Corporation. Covalent Materials Corporation is listed as an Agent/Assignee. Note: Covalent Materials Corporation may have other listings under different names/spellings. We're not affiliated with Covalent Materials Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | Covalent Materials Corporation-related inventors

Date Covalent Materials Corporation patents (updated weekly) - BOOKMARK this page
01/07/16Heat insulator
12/24/15Heat insulating material
09/03/15Wavelength coverting member
08/27/15Focus ring
11/20/14Nitride semiconductor substrate
10/30/14Nitride semiconductor substrate
04/24/14Heat-insulating material
02/27/14Method of analyzing nitride semiconductor layer and manufacturing nitride semiconductor substrate using the analysis method
10/03/13Ceramics composite
08/29/13Carbon-fiber-reinforced silicon-carbide-based composite material and braking material
04/04/13Nitride semiconductor substrate
04/04/13Corrosion resistant member and manufacturing the same
09/27/12Thermal treatment silicon wafer and silicon wafer
08/23/12Nitride semiconductor substrate and manufacturing the same
07/19/12Method for heat treating a silicon wafer
06/28/12Titanium oxide porous particle for blood purification, blood purification material and module for blood purification
06/07/12Silicon wafer and heat-treating silicon wafer
03/22/12Single crystal pulling-up apparatus and single crystal pulling-up method
02/23/12Ceramics composite
02/09/12Cell culture support and cell culture method
09/08/11Method of manufacturing silicon single crystal
03/17/11Compound semiconductor substrate
03/03/11Silicon wafer
09/30/10Compound semiconductor substrate
09/02/10Process for producing ceramic fine particles, and ceramic fine particle producing apparatus used therein
08/26/10Method for producing bonded wafer
08/05/10Method of heat treating silicon wafer
07/15/10Cell culture module
04/29/10Manufacturing silicon single crystal
04/15/10Method for production of silicon wafer for epitaxial substrate and production of epitaxial substrate
03/18/10Ceramics for plasma treatment apparatus
03/04/10Manufacturing silicon wafer
02/18/10Silicon wafer, manufacturing the same and heat-treating the same
01/28/10Ceramic particles and producing method thereof
11/12/09Crucible for melting silicon and release agent used to the same
10/22/09Silicon wafer
09/10/09Sintered body and member used for plasma processing apparatus
03/12/09Compound semiconductor substrate
03/12/09Surface inspection apparatus and surface inspection strained silicon wafer
02/05/09Decompression apparatus and inorganic porous body
01/28/10Ceramic particles and producing method thereof

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Covalent Materials Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Covalent Materials Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by