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Cyntec Co Ltd
Cyntec Co Ltd_20131212

Cyntec Co Ltd patents


Recent patent applications related to Cyntec Co Ltd. Cyntec Co Ltd is listed as an Agent/Assignee. Note: Cyntec Co Ltd may have other listings under different names/spellings. We're not affiliated with Cyntec Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "C" | Cyntec Co Ltd-related inventors


Choke having a core with a pillar having a non-circular and non-rectangular cross section

A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a... Cyntec Co Ltd

Methods to spray paint on a body of an inductor

Multiple methods are provided to paint a body of an inductor so that there is no residual glue remained in the lead that may cause extra cleaning work and soldering issues when the lead is soldered with an external circuit.... Cyntec Co Ltd

Leadframe and the method to fabricate thereof

The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive... Cyntec Co Ltd

Multilayer inductor and the fabrication method thereof

A multilayer electrical component is disclosed, wherein the multilayer electrical component comprises: a plurality of magnetic layers stacked over one another, wherein each magnetic layer is made of a first magnetic material, and wherein for each magnetic layer, a trench is formed in the magnetic layer, the bottom surface of... Cyntec Co Ltd

Stack frame for electrical connections and the method to fabricate thereof

A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer over the top surface or the bottom surface of the plurality of metal parts; and forming a... Cyntec Co Ltd

Wireless charging coil with a high q factor

A wireless charging coil with a high Q factor includes a plurality of wire groups. Each of the wire groups includes a plurality of wires, a self-bonding film and a plurality of insulation layers. The wires are spun together in a helical manner to form a self-woven structure of the... Cyntec Co Ltd

Mixed magnetic powders and the electronic device using the same

Mixed magnetic powders for making a magnetic core or body is disclosed, wherein the mixed magnetic powders comprises a first magnetic powder and a second magnetic powder, each of the first magnetic powder and the second magnetic powder being made of a soft magnetic material, wherein the average particle diameter... Cyntec Co Ltd

An inductor with an electrode structure

An inductor having a magnetic body, wherein a recess is formed in the magnetic body; a coil, formed by a conductive wire and disposed in the magnetic body, wherein a first terminal part of the conductive wire is placed on a bottom surface of the recess, wherein a first portion... Cyntec Co Ltd

Encapsulated electronic device mounted on a redistribution layer

A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are... Cyntec Co Ltd

Stacked electronic structure

A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The... Cyntec Co Ltd

Electronic module with a magnetic devcie

An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of... Cyntec Co Ltd

Electronic module and forming package

An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed... Cyntec Co Ltd

Semiconductor package with antenna

A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an... Cyntec Co Ltd

Planar reactor

A planar reactor includes a core and a coil. The core includes an upper board, a lower board and a pillar. The pillar is located between the upper board and the lower board. A winding space is located among the upper board, the lower board and the pillar. The coil... Cyntec Co Ltd

Method of wafer level packaging of a module

The method of a wafer level packaging includes preparing a substrate, assembling a system on a first side of the substrate, and placing solder balls on a second side of the substrate. The soldering balls s fixed on to the second side of the substrate after the module has been... Cyntec Co Ltd

Magnetic device and manufacturing the same

A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through... Cyntec Co Ltd

Three-dimensional package structure

The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element... Cyntec Co Ltd

Reduction of leakage current from supercapacitor by modifying electrode material

A composite material of an electrode unit includes: a porous electrode material being 50˜95 wt % of the composite material; an electret material being greater than O wt % and less than 15 wt % of the composite material; a dispersant material being 0˜15 wt % of the composite material;... Cyntec Co Ltd

Apparatus of coupled inductors with balanced electromotive forces

An apparatus of coupled inductors includes a first coil and a second coil arranged in a way that an inter-coil capacitance between the first coil and the second coil can keep electromotive forces induced by a first inductance of the first coil and a second inductance of the second coil... Cyntec Co Ltd

Method for producing magnetic element with two magnetic cores for increasing coiling space and magnetic element thereof

A magnetic element includes a first magnetic core, a second magnetic core and a plurality of conducting wires. The first magnetic core includes a first coiling body, a first protruding portion and a second protruding portion. The second magnetic core includes a second coiling body, a third protruding portion and... Cyntec Co Ltd

Optoelectronic module and producing same

An optoelectronic module includes an interposer base having first and second recesses formed on a specified surface thereof; a joint material layer filled in the first and second recesses; a first optoelectronic element placed in the first recess and coupled to the interposer base via the joint material layer, wherein... Cyntec Co Ltd

Stack frame for electrical connections and the method to fabricate thereof

A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on... Cyntec Co Ltd

Package structure and the method to fabricate thereof

The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive... Cyntec Co Ltd

Electronic module having electromagnetic shielding structure and manufacturing method thereof

An electronic module having an electromagnetic shielding structure and its manufacturing method are provided. At first, a first substrate and a second substrate are separately provided. At least one electronic element and at least one connection pad are formed on a surface of the first substrate. The second substrate includes... Cyntec Co Ltd

Structure of an electronic component and an inductor

An electronic component is disclosed, wherein electronic component comprises: a body; a conductive element disposed in the body; a first lead disposed on the body, wherein a first part of the first lead is disposed on a first surface of the body, a second part of the first lead is... Cyntec Co Ltd

Electronic device and manufacturing method thereof

A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the... Cyntec Co Ltd

Multi-layer wiring structure, magnetic element and manufacturing method thereof

A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then,... Cyntec Co Ltd

Microresistor

A micro-resistor includes a resistor material layer, an electrode set and a first protective layer. The electrode set includes a first electrode and a second electrode to define an opening which exposes the resistor material layer. A space between the first electrode and the second electrode represents an opening size.... Cyntec Co Ltd

Transformer structure

A transformer structure with high magnetic permeability utilization is provided. The transformer structure includes a first magnetically permeable unit, at least one winding and a second magnetically permeable unit. The winding is wound around a winding portion of the first magnetically permeable unit to generate magnetic flux in the winding... Cyntec Co Ltd

Magnetic component and manufacturing magnetic component

A magnetic component includes a first core, a supporting base, at least one winding, at least one insulation member and a second core. The first core has an accommodating space. The supporting base is disposed in the accommodating space and the supporting base has an electrode platform. The at least... Cyntec Co Ltd








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