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Danfoss Silicon Power Gmbh patents


Recent patent applications related to Danfoss Silicon Power Gmbh. Danfoss Silicon Power Gmbh is listed as an Agent/Assignee. Note: Danfoss Silicon Power Gmbh may have other listings under different names/spellings. We're not affiliated with Danfoss Silicon Power Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Danfoss Silicon Power Gmbh-related inventors


Lead frame and method of fabricating the same

A lead frame is provided, including one or more power terminals and one or more control terminals, wherein at least one of the control terminals is externally terminated with a press-fit contact member, and wherein at least one of the control terminals and at least one power terminals are formed from different materials. With the disclosed lead frame of the invention, lower material cross sections in the power terminals will be provided because of the better electrical conductivity when using pure copper compared to alloys with higher mechanical strengths. ... Danfoss Silicon Power Gmbh

Power module

A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate (40).. . ... Danfoss Silicon Power Gmbh

Power semiconductor module with short-circuit failure mode

A description is given of a power semiconductor module 10 which can be transferred from a normal operating mode to an explosion-free robust short-circuit failure mode. Said power semiconductor module 10 comprises a power semiconductor 1 having metallizations 3 which form potential areas and are separated by insulations and passivations on the top side 2 of said power semiconductor. ... Danfoss Silicon Power Gmbh

Cooling trough, cooler and power module assembly

The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. ... Danfoss Silicon Power Gmbh

Process and device for low-temperature pressure sintering

Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.. . ... Danfoss Silicon Power Gmbh

Sintering device

Sintering device (10) for sintering at least one electronic assembly (bg), having a lower die (20) and an upper die (30) which is slidable towards the lower die (20), or a lower die (20) which is slidable towards the upper die (30), wherein the lower die (20) forms a support for the assembly (bg) to be sintered and the upper die (30) comprises a receptacle which receives a pressure pad (32) for exerting pressure directed towards the lower die (20) and which comprises a delimitation wall (34) which laterally surrounds the pressure pad (32), and wherein the delimitation wall (34) has an outer delimitation wall (34a) and an inner delimitation wall (34b) which is surrounded in an adjacent manner by the outer delimitation wall (34a), and wherein the inner delimitation wall (34b) is mounted so as to be slidable towards the outer delimitation wall (34a) and, when pressure in the direction of the upper die (30) is exerted on the pressure pad (32), is mounted so as to be slid in the direction of the lower die (20), whereby, following the placing of the inner delimitation wall (34b) on the lower die (20), the pressure pad (32) is displaceable in the direction of the lower die (20).. . ... Danfoss Silicon Power Gmbh

Sintering tool for the lower die of a sintering device

Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).. . ... Danfoss Silicon Power Gmbh

Sintering tool and method for sintering an electronic subassembly

Sintering tool (10) with a cradle for receiving an electronic subassembly (bg) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (bg).. . ... Danfoss Silicon Power Gmbh








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