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Disco Corporation
Disco Corporation_20100107
Disco Corporation_20100121
Disco Corporation_20100114

Disco Corporation patents

Recent patent applications related to Disco Corporation. Disco Corporation is listed as an Agent/Assignee. Note: Disco Corporation may have other listings under different names/spellings. We're not affiliated with Disco Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Disco Corporation-related inventors

Date Disco Corporation patents (updated weekly) - BOOKMARK this page
12/14/17 new patent  Wafer processing system
12/14/17 new patent  Peeling apparatus
12/07/17Wafer producing method
12/07/17Expansion sheet, expansion sheet manufacturing method, and expansion sheet expanding method
12/07/17Leakage laser beam detecting method
11/30/17Laser processing apparatus and wafer producing method
11/30/17Constant temperature water supply system
11/30/17Cutting apparatus
11/30/17Processing apparatus and processing method
11/23/17Laser processing apparatus and laser processing method
11/23/17Method of evaluating gettering property
11/16/17Method of sorting chips
11/16/17Laser processing apparatus
11/16/17Wafer processing method
11/09/17Wafer processing apparatus
11/02/17Wafer processing method
11/02/17Wafer processing method
10/19/17Method of processing sic wafer
10/19/17Wafer processing method
10/19/17Wafer processing method
10/12/17Wafer producing method
10/12/17Wafer producing method and processing feed direction detecting method
10/12/17Method of processing bonded wafer
10/12/17Method of manufacturing packaged wafer
10/12/17Packaged wafer manufacturing chip manufacturing method
09/28/17Workpiece evaluating method
09/21/17Wafer processing method
09/14/17Laser processing apparatus
09/07/17Wafer processing method
09/07/17Baw device and baw device manufacturing method
08/31/17Wafer processing method
08/24/17Inspecting apparatus and laser processing apparatus
08/24/17Wafer processing method
08/24/17Workpiece processing method
08/17/17Resin composition and fixing plate-shaped workpiece
08/17/17Processing apparatus
08/17/17Apparatus having transfer control based on imaged image
08/17/17Semiconductor package and manufacturing semiconductor package
08/03/17Electric vehicle and equipment therefor
08/03/17Method of processing a substrate
08/03/17Packaged wafer processing method
07/27/17Jig and processing method using jig
07/27/17Exposure apparatus
07/27/17Wafer processing method
07/27/17Package wafer processing method
07/20/17Scanning mirror
07/20/17Wafer processing method
07/13/17Sic wafer producing method
07/13/17Wafer production method
06/29/17Chip accommodation tray
06/29/17Method of processing wafer
06/29/17Wafer processing method
06/29/17Wafer processing method
06/22/17Protective film detecting laser processing
06/15/17Human transporting drone
06/08/17Method of processing wafer
06/08/17Wafer processing method
06/08/17Wafer processing method
06/01/17Wafer producing method
06/01/17Cleaning method
05/18/17Sic substrate separating method
05/18/17Protective film forming method
05/18/17Wafer dividing method
05/11/17Wafer processing method
04/27/17Cutting aparatus
Patent Packs
04/27/17Processing method
04/27/17Wafer processing method
04/20/17Laser processing apparatus
04/13/17Fabrication semiconductor device
04/13/17Wafer processing method
04/13/17Processing optical device wafer
04/06/17Grinding method
04/06/17Optical device wafer processing method
03/30/17Laser processing apparatus
03/30/17Laser processing apparatus
03/23/17Grinding wheel and grinding method
03/16/17Workpiece support jig
03/16/17Method of processing a substrate
03/16/17Method of dividing plate-shaped workpieces
03/16/17Package substrate machining method
Patent Packs
03/09/17Laser processing apparatus
03/09/17Chuck table
03/09/17Wafer processing method
03/02/17Cutting blade
03/02/17Method of processing wafer
03/02/17Baw device and manufacturing baw device
02/23/17Wafer processing method
02/23/17Wafer processing method
02/23/17Wafer processing method
02/16/17Laser processing apparatus
02/16/17Wafer processing method and electronic device
02/16/17Support plate and forming support plate
02/09/17Adhesion detecting method
02/09/17Test wafer and using method therefor
02/02/17Wafer processing method
02/02/17Laser processing method
01/26/17Wafer processing method
01/26/17Wafer thinning method
01/26/17Wafer thinning method
01/19/17Polycrystalline sic wafer producing method
01/19/17Laser processing apparatus
01/19/17Wafer producing method
01/12/17Wafer processing method
12/29/16Small unmanned air vehicle repulsing apparatus
12/29/16Saw device manufacturing method
12/22/16Multi-wire saw
12/22/16Laser processing apparatus and forming through-hole
12/22/16Processing system
12/15/16Abrasive grindstone
12/15/16Wafer processing method
Social Network Patent Pack
12/08/16Wafer producing method
12/08/16Wafer producing method
12/01/16Processing system
11/24/16Cutting apparatus
11/24/16Plasma etching apparatus
11/24/16Processing apparatus
11/24/16Wafer processing method
11/17/16Laser processing apparatus
10/27/16Laser processing apparatus
10/27/16Cutting apparatus and cutting method
Patent Packs
10/27/16Wafer processing method
10/20/16Wafer producing method
10/20/16Thin plate separating method
10/20/16Workpiece cutting method
10/20/16Method of dividing wafer
10/13/16Method of forming cut groove
10/06/16Wafer producing method
10/06/16Wafer producing method
10/06/16Wafer producing method
10/06/16Method of dividing wafer
09/29/16Method for inspecting cutting blade
09/29/16Workpiece cutting method
09/22/16Cutting apparatus
09/22/16Decompression processing apparatus
09/22/16Method of dividing wafer
09/15/16Process fluid circulation type processing system
09/15/16Grinding wheel
09/15/16Protective film detecting method
09/15/16Method of processing single-crystal substrate
09/15/16Method of processing single-crystal substrate
09/08/16Grinding wheel, grinding apparatus, and grinding wafer
09/08/16Etching method
09/08/16Cutting apparatus and wafer cutting method
09/08/16Processing single-crystal substrate
09/01/16Wafer dividing method
08/25/16Wafer divider and wafer division method
08/18/16Abrasive grindstone
08/18/16Wafer processing system
08/18/16Chuck table of processing apparatus
08/11/16Wafer producing method
Patent Packs
08/11/16Wafer producing method
08/11/16Wafer producing method
08/04/16Alignment method
08/04/16Method of processing single-crystal member
07/28/16Cutting blade having cutting edge containing photocatalyst particles
07/21/16Laser machining apparatus
07/21/16Mount flange
07/14/16Laser processing apparatus
07/14/16Wafer processing method
07/14/16Conveying apparatus
07/07/16Wafer producing method
07/07/16Wafer producing method
07/07/16Human resources management system
06/30/16Laser processing plate-shaped workpiece
06/30/16Processing apparatus
06/30/16Method of dividing wafer into dies
06/23/16Wafer processing method
06/16/16Laser processing apparatus
06/16/16Wafer processing method
06/09/16Wafer producing method
Social Network Patent Pack
06/09/16Wafer producing method
06/09/16Wafer producing method
06/09/16Laser processing apparatus suitable for formation of laser processed hole
06/09/16Wafer producing method
06/09/16Wafer processing method
06/02/16Laser processing apparatus
06/02/16Detection transmission laser beam
05/26/16Package substrate dividing method
05/19/16Grinding workpieces
05/19/16Cutting apparatus
05/19/16Laser oscillation mechanism
05/12/16Grinding apparatus
05/12/16Polishing liquid and polishing sic substrate
05/12/16Laser oscillation mechanism
05/12/16Method of polishing sic substrate
05/05/16Protective film detecting apparatus and protective film detecting method
05/05/16Wafer processing method
04/21/16Wafer processing method
04/14/16Wafer processing method
04/07/16Laser processing apparatus
Social Network Patent Pack
04/07/16Wafer inspection method and wafer inspection apparatus
03/31/16Cutting apparatus
03/24/16Wafer processing method
03/17/16Laser processing apparatus
03/17/16Sic ingot slicing method
03/10/16Laser processing apparatus
03/10/16Laser machining apparatus
03/03/16Flange mechanism and cutting apparatus
03/03/16Wafer inspection method and grinding and polishing apparatus
03/03/16Wafer processing method
02/18/16Laser beam spot shape detection method
02/18/16Transfer unit
02/11/16Processing workpiece
02/11/16Wafer processing method
02/04/16Wafer processing method
01/28/16Wafer processing method
01/21/16Processing apparatus
01/14/16Lift-off method
01/07/16Chip spacing maintaining apparatus
12/31/15Evaluation device wafer
12/31/15Processing apparatus
12/24/15Gan substrate, and manufacturing gan substrate
12/17/15Wafer processing method
12/10/15Wafer processing method
12/10/15Wafer processing method
12/10/15Lighting apparatus and illumination management the same
12/03/15Chip manufacturing method
11/19/15Lift-off method
11/19/15Wafer processing method
11/19/15Wafer processing method
Social Network Patent Pack
11/19/15Method of processing wafer
11/19/15Wafer processing method
11/19/15Support plate and forming support plate
11/12/15Laser processing apparatus
11/12/15Wafer processing method
10/22/15Wafer processing method
10/15/15Height detecting apparatus
10/08/15Laser processing apparatus
10/08/15Grinding wheel and cleaning grinding chamber
10/08/15Unevenness detecting device
09/17/15Plate-shaped object processing method
09/17/15Workpiece processing method
09/17/15Cutting method
09/17/15Chip arranging method
09/10/15Mems device chip manufacturing method
09/10/15Plate-like object processing method
08/27/15Wafer processing method
08/20/15Semiconductor wafer and producing same
08/06/15Lift-off method
08/06/15Lift-off method
07/30/15Optical device and manufacturing method therefor
07/23/15Separation apparatus
07/23/15Optical device and manufacturing method therefor
07/16/15Mark detecting method
07/02/15Cutting apparatus
07/02/15Wafer processing method
06/25/15Packaging material
06/25/15Device wafer processing method
06/25/15Light emitting chip

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Disco Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Disco Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by