Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Disco Corporation patents


Recent patent applications related to Disco Corporation. Disco Corporation is listed as an Agent/Assignee. Note: Disco Corporation may have other listings under different names/spellings. We're not affiliated with Disco Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Disco Corporation-related inventors


 new patent  High energy cathodes for lithium ion batteries

An electrode formed from a material represented by li1−xmxco1−ym′yo2−d where 0<x≤0.2, 0≤y<1, and 0<d≤0.2. M and m′ each independently comprises a metal selected from the group consisting of transition metals, group i elements, and group ii elements.. ... Disco Corporation

 new patent  Device wafer processing method

Disclosed herein is a device wafer processing method including a protective film forming step of applying a water-soluble protective film material to the front side of a device wafer having devices separated by division lines and next exposing the division lines to form a protective film for protecting each device, an application time recording step of recording the time at which the water-soluble protective film material is applied to the device wafer, a determining step of determining whether or not a predetermined duration has elapsed from the time recorded in the application time recording step, an etching step of dry-etching the device wafer along the division lines after performing the determining step, and a protective film removing step of supplying a cleaning water to the protective film to thereby remove the protective film after performing the etching step. Only when it is determined in the determining step that the predetermined duration has not elapsed, the etching step is performed.. ... Disco Corporation

 new patent  Device chip package manufacturing method

Disclosed herein is a device chip package manufacturing method including a cutting step of forming cut grooves having a depth reaching a finished thickness of device chips by cutting a device wafer from a top surface of the device wafer along streets by a cutting blade, a cut groove inclination state detecting step of detecting an inclination state of the cut grooves, a sealing resin layer forming step of forming a sealing resin layer coating the top surface and the cut grooves of the device wafer by supplying a sealing resin to the top surface of the device wafer, and a laser processing step of dividing the device wafer into individual chips and forming device chip packages by applying a laser beam having a wavelength absorbable by the sealing resin layer along the cut grooves of the device wafer held by a chuck table.. . ... Disco Corporation

 new patent  Decompression processing apparatus

Disclosed herein is a decompression processing apparatus for processing a wafer in a decompressed state including a chamber having a decompressing unit configured to decompress the inside of the chamber, an opening and closing door configured to open and close a carrying-in-and-out opening for carrying the wafer into and out of the chamber, and an inert gas supply source configured to supply an inert gas to the inside of the chamber. The inside of the chamber is maintained in a dry state by continuing to supply the inert gas in a state in which the opening and closing door is opened.. ... Disco Corporation

 new patent  Upright and inverted microscope

A dual-configuration microscope is provided that may be converted into an upright or inverted microscope. The microscope includes a body having a plurality of planar surfaces, each planar surface configured to support the body on a working surface as the body is tilted between the upright and inverted configurations. ... Disco Corporation

 new patent  Method to detect activity of a polymerase

The present invention relates to methods for detection of nucleotide polymerase activity and methods of detecting compounds that modulate nucleotide polymerase activity, by detecting product formation of the nucleotide polymerase to be tested based on determination of close proximity of two labeled nucleotide probes able to bind the product of the nucleotide polymerase. It is preferred that proximity dependent energy transfer, such as forster resonance energy transfer, between said labeled nucleotide probes is determined. ... Disco Corporation

Floating-type humidifier

A floating-type humidifier according to an exemplary embodiment of the present invention includes: a floating body which floats in a reservoir that accommodates water; an ultrasonic wave generation unit which is installed by being inserted into the floating body, and atomizes the water, which is introduced into a lower side of the floating body, into a water particles state by means of ultrasonic vibration; a guide tube which is detachably coupled to the floating body, is installed above the ultrasonic wave generation unit, guides the water particles, and has a fan installation hole horizontally and penetratively formed in a lateral portion of the guide tube; a blower fan which is coupled in the fan installation hole, and injects air into the guide tube so as to discharge the water particles to an upper side of the guide tube; and a discharge groove which is formed in an upper surface of the floating body so as to communicate with the fan installation hole in which the blower fan is mounted.. . ... Disco Corporation

Protective film forming resin agent and laser processing method

Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. ... Disco Corporation

Package substrate cutting jig table

A package substrate cutting jig table for use in cutting a package substrate is provided. The jig table includes a jig base and a holding member adapted to be detachably mounted on the jig base. ... Disco Corporation

Wireless power transmission apparatus and method therefor

The present invention relates to a wireless power transmission apparatus and a method therefor. The present invention provides a wireless power transmission apparatus including: a power transmission module; a first communication module; a second communication module; and a controller for searching out a first wireless power reception device performing wireless power transmission/reception, transmitting a second magnetic field signal of a second frequency band through the power transmission module, sensing a second response signal to the second magnetic field signal through the second communication module, and searching out a second wireless power reception device performing wireless power transmission/reception by means of the second frequency band according to whether the second response signal is received.. ... Disco Corporation

Method of processing wafer

A wafer processing method includes a protective member laying step of placing a protective member on a face side of a wafer, a reverse side grinding step of grinding a reverse side of the wafer to thin the wafer, a cut groove forming step of positioning a cutting blade in alignment with projected dicing lines one at a time on the reverse side of the wafer, cutting the wafer with the cutting blade to form cut grooves in the wafer which terminate short of the face side thereof, and a cutting step of applying a laser beam to the wafer from the reverse side thereof along the cut grooves to completely sever the wafer along the projected dicing lines into individual device chips.. . ... Disco Corporation

Transfer apparatus, processing apparatus, and transfer method

A frame unit is transferred from a cassette to a predetermined position. The frame unit has a platelike workpiece, a tape attached to the workpiece, and a ring frame supporting a peripheral portion of the tape. ... Disco Corporation

Personnel management system

A personnel management system has an account storage unit configured to store a balance of a department account and a balance of a personal account of an employee belonging to and linked to the department. A controller is configured to manage the balance of each account, and a terminal for entering information. ... Disco Corporation

05/10/18 / #20180128814

Predicting human developmental toxicity of pharmaceuticals using human stem-like cells and metabolomic ratios

This present invention provides rapid, reproducible, biomarker-based screening methods for the developmental toxicity testing of compounds. The methods are designed to identify the exposure level at which a test compound perturbs metabolism in a manner predictive of developmental toxicity. ... Disco Corporation

05/03/18 / #the present invention provides, inter alia, a composition containing a compound of formula (i):

Biomed Valley Discoveries, Inc.

. . ... Disco Corporation

05/03/18 / #20180122700

Wafer processing method

A wafer processing method divides a wafer into individual device chips along division lines. The method includes attaching an adhesive tape to the front side of the wafer and attaching a peripheral portion of the adhesive tape to an annular frame having an inside opening for receiving the wafer, thereby supporting the wafer through the adhesive tape to the annular frame; grinding the back side of the wafer to reduce the thickness of the wafer; cutting the back side of the wafer along each division line by using a cutting blade to form a cut groove having a depth not reaching the front side of the wafer; and applying a laser beam to the bottom of the cut groove from the back side of the wafer along each division line to divide the wafer to obtain the individual device chips.. ... Disco Corporation

05/03/18 / #20180118745

Novel inhibitors of protein kinases

Protein kinases are regulators of cellular signaling and their functional dysregulation is common in carcinogenesis and many other disease states or disorders. The present invention relates to novel chemical entities that have biological activity to modulate mammalian protein kinase enzymes. ... Disco Corporation

05/03/18 / #20180118697

Triazole benzamide derivatives and the compositions and methods of treatment regarding the same

The present disclosure is directed to triazole benzamide compounds of formula (i) and formula (ii), pharmaceutical compositions thereof and methods for modulating or activating a parkin ligase the present disclosure is also directed to methods of treating and/or reducing the incidence of diseases or conditions related to the activation of parkin ligase. R1, r2, r3, m1, m2, m3, l1, l2, and l3 are as defined herein.. ... Disco Corporation

04/19/18 / #20180108583

Device chip, accommodating tray, and method of accommodating device chips

A device chip is shaped as an inverted frustum with a device formed on an upper surface thereof. An accommodating tray for accommodating a plurality of device chips each shaped as an inverted frustum with a device formed on an upper surface thereof, has a plurality of open recesses defined in an upper surface thereof, for accommodating device chips therein, each of the recesses having a bottom surface and a side surface which form an obtuse angle therebetween. ... Disco Corporation

04/19/18 / #20180108565

Method of laser-processing device wafer

There is provided a method of laser-processing a device wafer with a laser beam applied thereto. The device wafer has a face side having thereon a plurality of crossing projected dicing lines and devices formed in respective areas demarcated by the projected dicing lines. ... Disco Corporation

04/19/18 / #20180104228

Methods and compositions for treating non-erk mapk pathway inhibitor-resistant cancers

The present invention provides, inter alia, methods, pharmaceutical compositions, and kits for treating or ameliorating the effects of a cancer in a subject, which cancer is refractory or resistant to non-erk mapk pathway inhibitor therapy. Also provided are methods for identifying a subject having cancer who would benefit from therapy with an erk inhibitor and methods for inhibiting phosphorylation of rsk in a cancer cell that is refractory or resistant to a non-erk mapk pathway inhibitor.. ... Disco Corporation

04/19/18 / #20180104220

Imidazole compound

Disclosed is an imidazole compound, in particular, the compound as shown in formula (i) and a pharmaceutically acceptable salt or tautomer thereof are disclosed.. . ... Disco Corporation

04/12/18 / #20180103547

Manufacturing method for wiring board

A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a cmp process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.. . ... Disco Corporation

04/12/18 / #20180102288

Wafer processing method

A wafer processing method is provided. The wafer processing method includes a first laser processing step of forming a first modified layer inside the wafer by applying a laser beam at a wavelength which transmits the wafer along first projected division lines, a second laser processing step of forming a second modified layer inside the wafer excluding non-processed regions in intersecting regions where the first and second projected division lines intersect each other by applying a laser beam at a wavelength which transmits the wafer along the second projected division lines, and a grinding step of grinding a reverse side of the wafer to thin the wafer to a predetermined thickness and at the same time dividing the wafer into a plurality of chips starting from the first and second modified layers. ... Disco Corporation

04/12/18 / #20180102268

Processing apparatus

Disclosed herein is a processing apparatus including a wafer testing unit for testing whether or not a wafer carried from a cassette mount unit is a wafer corresponding to a processing condition. The wafer testing unit measures characteristics of the carried wafer by a measuring section, and a determining section of a control unit compares actual measurements of the wafer characteristics measured by the measuring section with setpoints of wafer characteristics corresponding to the processing condition, to thereby determine conformability of the carried wafer. ... Disco Corporation

04/12/18 / #20180099972

Compounds useful for inhibiting metastasis from cancer and methods using same

The present invention includes compositions that are useful in preventing or treating metastasis in a subject diagnosed with cancer. The present invention also includes methods of preventing or treating metastasis in a subject diagnosed with cancer, wherein the method comprises administering to the subject in need thereof an effective amount of a pharmaceutical formulation comprising at least one pharmaceutically acceptable carrier and at least one cx3cr1 or fractalkine antagonist.. ... Disco Corporation

04/12/18 / #20180099961

Protein kinase inhibitors

The present invention concerns novel deuterated and non-deuterated cyclic chemical compounds and their corresponding salts thereof active on protein kinases in general, and in particular as inhibitors of protein kinases. Additionally, methods of treating mammals with protein kinase-mediated diseases or conditions by administering a therapeutically effective amount of the novel deuterated or non-deuterated cyclic chemical compound and their corresponding salts thereof.. ... Disco Corporation

04/12/18 / #20180099960

Protein kinase inhibitors

The present invention concerns novel deuterated and non-deuterated cyclic chemical compounds and their corresponding salts thereof active on protein kinases in general, and in particular as inhibitors of protein kinases. Additionally, methods of treating mammals with protein kinase-mediated diseases or conditions by administering a therapeutically effective amount of the novel deuterated or non-deuterated cyclic chemical compound and their corresponding salts thereof.. ... Disco Corporation

04/12/18 / #20180099959

Protein kinase inhibitors

The present invention concerns novel deuterated and non-deuterated cyclic chemical compounds and their corresponding salts thereof active on protein kinases in general, and in particular as inhibitors of protein kinases. Additionally, methods of treating mammals with protein kinase-mediated diseases or conditions by administering a therapeutically effective amount of the novel deuterated or non-deuterated cyclic chemical compound and their corresponding salts thereof.. ... Disco Corporation

04/12/18 / #20180099377

Processing apparatus and processing method for workpiece

A processing apparatus includes a chuck table that holds a workpiece by a holding face, a processing unit that processes the workpiece with a grinding whetstone or a polishing pad, a movement unit for moving the chuck table and the processing unit parallel to the holding face, a processing feeding unit for moving the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit to inspect a process mark of the workpiece during processing, a dressing unit to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit. When a process mark of a size exceeding a threshold value is detected on the process face of the workpiece, the control unit stops processing of the workpiece, and after the grinding whetstone or the polishing pad is dressed, restarts processing.. ... Disco Corporation

04/12/18 / #20180099375

Frame fixing jig

A frame fixing jig for mounting on a chuck table has a chuck portion for holding a workpiece in an annular frame, and a body portion for supporting the chuck portion. A frame support member (fsm) supports the annular frame, and a ring presses the frame against the fsm. ... Disco Corporation

04/12/18 / #20180099373

Grinding apparatus and wafer processing method

A grinding apparatus includes a chuck table for holding a wafer having a modified layer near the front side or a groove on the front side, the groove having a depth not less than a finished thickness of the wafer, a grinding unit for grinding the back side of the wafer to divide the wafer into a plurality of chips, a die strength measuring unit for measuring the die strength of any one of the chips, and a control unit for controlling each component according to a measured value of die strength. The control unit determines that grinding is not to be performed on the remaining wafers stored in the cassette when the measured value is less than a threshold value, and determines that grinding is to be performed on the remaining wafers when the measured value is greater than or equal to the threshold value.. ... Disco Corporation

04/05/18 / #disclosed are compounds of formula (i):

Pgi Drug Discovery Llc

. . ... Disco Corporation

04/05/18 / #20180097564

Processing apparatus

A processing apparatus for processing a workpiece includes: a chuck table that holds the workpiece; a processing unit that processes the workpiece held by the chuck table; a controller that controls the chuck table and the processing unit; an input section that inputs a processing condition to the controller; a storage section that stores the processing condition inputted to the input section; and an infrared transmission/reception unit that transfers apparatus information between the processing apparatus and another processing apparatus by infrared radiation.. . ... Disco Corporation

04/05/18 / #20180096948

Method of manufacturing semiconductor package

A method of manufacturing a semiconductor package includes: bonding a plurality of semiconductor chips to a plurality of mounting regions on a wiring board partitioned by crossing streets; supplying a liquid resin to a front surface side of the wiring board onto which the plurality of semiconductor chips have been bonded, to seal the plurality of semiconductor chips in a collective manner, thereby forming a sealed board; cutting the sealed board along the regions corresponding to the streets, to individualize the sealed chips in such a manner that the sealed chips each have an upper surface and a lower surface larger than the upper surface, with a side surface inclined from the upper surface toward the lower surface; and forming a conductive shield layer on the upper surfaces and the side surfaces of the plurality of sealed chips.. . ... Disco Corporation

04/05/18 / #20180096892

Device wafer processing method

A device wafer processing method includes forming a mask patterned so as to cover plural devices formed on a front side of the wafer and expose streets between the devices, applying plasma through the mask to thereby form a groove along each street, the groove having a depth corresponding to a finished thickness of the devices and having a reverse tapering shape such that the distance between opposed side walls of the groove is increased with an increase in depth of the groove, removing the mask, attaching a protective member to the front side of the wafer, and then grinding a back side of the wafer until the bottom of the groove is exposed, thereby reducing the thickness of the wafer to the finished thickness to divide the wafer into a plurality of device chips.. . ... Disco Corporation

04/05/18 / #20180096112

Method for determining three-dimensional structures of dynamic molecules

The present invention relates to a method for determining three-dimensional structures of molecules, particularly, but not exclusively, dynamic organic molecules of biological interest such as peptides, carbohydrates, proteins and drug molecules. A first aspect of the present invention provides a method for generating data representing an ensemble of three-dimensional structures of a molecule, the molecule comprising first and second atoms linked by at least one bond, said bond having an associated angle, and the angle varying to generate a plurality of three-dimensional structures of said molecule, the method comprising: receiving data representing said molecule, said data comprising data indicating variability of said angle; and generating an ensemble of structures such that the angle has an associated value selected based upon said variability. ... Disco Corporation

04/05/18 / #20180094972

Method of detecting spot shape of pulsed laser beam

A method of detecting a spot shape of a pulsed laser beam, includes applying a pulsed laser beam having a wavelength absorbable by an inspection wafer held on a chuck table continuously to the inspection wafer with a focused point on an upper surface of the inspection wafer thereby to form a plurality of laser spots on the upper surface of the inspection wafer. An image of the laser spots is captured, and profiles of shapes of the laser spots are extracted from the captured image of the laser spots. ... Disco Corporation

04/05/18 / #20180093976

Pyridazinone compounds and methods for the treatment of cystic fibrosis

The invention relates to a compound of having the following formulae and methods of treating cystic fibrosis:. . ... Disco Corporation

04/05/18 / #20180093968

Quinoline derivatives as tam rtk inhibitors

The present invention relates to novel compounds which are inhibitors of tam (axl, mer and tyro 3) and/or met family receptor tyrosine kinases (rtks). These compounds are suitable for the treatment of disorders associated with, accompanied by, caused by or induced by a receptor of the tam family, in particular a hyperfunction thereof. ... Disco Corporation

04/05/18 / #20180093361

Processing apparatus

Disclosed herein is a carrying mechanism that carries a plate-shaped workpiece in which a substrate larger than a wafer in area is stacked on a lower surface of the wafer. The carrying mechanism includes a carrying pad for covering an upper surface of the wafer, holding sections for holding the substrate on outside of the outer periphery of the wafer, and a water supply source for supplying water to the wafer. ... Disco Corporation

04/05/18 / #20180092942

Hypochlorous acid-based hand sanitizer

A sanitizing formulation is disclosed for use as a hand sanitizer. The formulation may include hypochlorous acid, a silicone polymer or blend thereof, sodium phosphate, hydrochloric acid, and sodium magnesium silicate. ... Disco Corporation

03/29/18 / #the present invention relates to synthetic methods for 1,3,4-oxadiazole and 1,3,4-thiadiazole compounds. the general synthetic scheme is:

Aurigene Discovery Technologies Limited

. . ... Disco Corporation

03/29/18 / #20180085851

Sic wafer producing method

A sic wafer is produced from a single crystal sic ingot. A modified layer is formed by setting a focal point of a pulsed laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced. ... Disco Corporation

03/22/18 / #20180084248

Method for encoding/decoding an intra-picture prediction mode using two intra- prediction mode candidate, and apparatus using such a method

The method for decoding an intra-picture prediction mode includes the steps of: determining whether the intra-picture prediction mode of a current prediction unit is identical to a first intra-picture prediction mode candidate or a second intra-picture prediction mode candidate based on bit information; and when the intra-picture prediction mode of the current prediction unit is identical to the first intra-picture prediction mode candidate and/or to the second intra-picture prediction mode candidate, determining whether the first intra-picture prediction mode candidate or the second intra-picture prediction mode candidate is identical to the intra-picture prediction mode of the current prediction unit on the basis of additional bit information, and decoding the intra-picture prediction mode of the current prediction unit.. . ... Disco Corporation

03/22/18 / #20180082897

Processing method for wafer

A wafer has a front face that is partitioned by a plurality of streets crossing with each other into a plurality of regions in each of which a device is formed. A surface protective tape is adhered to the front face of the wafer. ... Disco Corporation

03/22/18 / #20180079731

Axially chiral isomers, and preparation methods therefor and pharmaceutical uses thereof

Disclosed are two axially chiral isomers and pharmaceutically available salts thereof, preparation method therefor, and pharmaceutical use of the two axially chiral isomers or pharmaceutical compositions thereof.. . ... Disco Corporation

03/22/18 / #20180079046

Grinding wheel and grinding apparatus

A grinding wheel for grinding a wafer held on a holding table includes: a first circular annular plate mounted to a mount of a grinding apparatus; a tubular body extending downward from an outer circumference of the first circular annular plate; a second circular annular plate connected to a lower end of the tubular body; a plurality of grindstones arranged in an annular pattern on a lower surface of the second circular annular plate; an annular ultrasonic oscillation section disposed on an upper surface of the second circular annular plate so as to surround an opening; and an ultrasonic reception section that receives an ultrasonic vibration transmitted from the ultrasonic oscillation section to the grindstones.. . ... Disco Corporation

03/22/18 / #20180078501

Methods of eye treatment using therapeutic compositions containing dipyridamole

A method comprising administering an effective amount of a topical dipyridamole to a subject in need thereof due to conjunctivitis.. . ... Disco Corporation

03/15/18 / #the present invention relates to synthetic methods for 1,2,4-oxadiazole compounds. the general synthetic scheme is:

Aurigene Discovery Technologies Limited

. . ... Disco Corporation

03/15/18 / #20180076784

Method of manufacturing surface acoustic wave device chips

A method of manufacturing surface acoustic wave device chips includes grinding a reverse side of a wafer with a surface acoustic wave device formed in each area demarcated by a plurality of crossing projected dicing lines on a face side of the wafer; before or after grinding, applying a laser beam to the reverse side of the wafer such that the laser beam is focused at a position within the wafer, the position being closer to the face side of the wafer than a position corresponding to a reverse side of each of the surface acoustic wave device chips to be produced from the wafer, thereby forming a modified layer for diffusing an acoustic wave; and after grinding and applying the laser beam, dividing the wafer along the projected dicing lines into a plurality of the surface acoustic wave device chips.. . ... Disco Corporation

03/15/18 / #20180076088

Method of processing wafer

A method of processing a wafer includes forming a mask on portions of a face side of the wafer which correspond to devices; performing plasma etching on the face side of the wafer through the mask to etch areas of streets other than areas thereof corresponding to metal components, thereby forming grooves in the areas of the streets to a depth corresponding to a finished thickness of device chips; bonding a protective member for protecting the face side of the wafer, holding the face side of the wafer on a chuck table through the protective member and grinding a reverse side of the wafer until bottoms of the grooves are exposed, to fragmentize the wafer into the device chips; and picking up the device chips from the protective member, leaving remaining regions of the substrate which correspond to the metal components on the protective member.. . ... Disco Corporation

03/15/18 / #20180076016

Wafer and method of processing wafer

A method of processing a wafer having on a face side thereof a device area with a plurality of devices formed therein and an outer circumferential excess area surrounding the device area includes a grinding step for grinding a reverse side of the wafer corresponding to the device area with a grinding wheel that is smaller in diameter than the wafer, thereby forming a first portion corresponding to the device area and an annular second portion surrounding the first portion, the annular second portion being thicker and more protrusive toward a reverse side thereof than the first portion. In the grinding step, the grinding wheel and the wafer are moved relatively to each other so that the angle formed between the reverse side of the first portion and an inner side surface of the annular second portion is larger than 45° and smaller than 75°.. ... Disco Corporation

03/15/18 / #20180072707

Substituted 2-hydrogen-pyrazole derivative serving as anticancer drug

Disclosed is a substituted 2h-pyrazole derivative serving as a selective cdk4/6 inhibitor. Specifically, disclosed is a compound of formula (i) or a pharmaceutically acceptable salt thereof which serves as a selective cdk4/6 inhibitor.. ... Disco Corporation

03/08/18 / #20180070208

Interaction tracking and organizing system

A server that cross-references a first user's device location with registered members in a spatial proximity of the first user's device and returns the results by disclosing personal user attributes including pictures and names of all members in the spatial proximity of the first user's device. The first user who initiated the inquiry may select from the results returned any discovered user he/she wishes to connect with and send a form of invitation to connect using network available tools such as email, sms, text or any customized invitation form. ... Disco Corporation

03/08/18 / #20180070079

Intra prediction mode mapping method and device using the method

The present invention relates to an intra prediction mode mapping method and a device using the method. The intra prediction mode includes: decoding flag information providing information regarding whether an intra prediction mode of a plurality of candidate intra prediction modes for the current block is the same as the intra prediction mode for the current block, and decoding a syntax component including information regarding the intra prediction mode for the current block in order to induce the intra prediction mode for the current block if the intra prediction mode from among the plurality of candidate intra prediction modes for the current block is not the same as the intra prediction mode for the current block. ... Disco Corporation

03/08/18 / #20180069265

Electrolyte formulations for electrochemical cells containing a silicon electrode

Additives to electrolytes that enable the formation of comparatively more robust sei films on silicon anodes. The sei films in these embodiments are seen to be more robust in part because the batteries containing these materials have higher coulombic efficiency and longer cycle life than comparable batteries without such additives.. ... Disco Corporation

03/08/18 / #20180068895

Method of processing a wafer

A method of processing a wafer having a metal film formed on a reverse side thereof includes removing a metal film on the reverse side of the wafer along an outer circumferential edge of the wafer, thereby exposing a substrate of the wafer along the outer circumferential edge thereof, detecting a projected dicing line on a face side of the wafer with an infrared camera through the substrate exposed along the outer circumferential edge of the wafer and performing alignment of the wafer based on the detected projected dicing line, removing the metal film on the reverse side of the wafer along the detected projected dicing line, and thereafter, forming dividing grooves in the substrate along the projected dicing lines by plasma etching, thereby dividing the wafer into individual device chips.. . ... Disco Corporation

03/08/18 / #20180065187

Chuck table and method of manufacturing suction plate of porous ceramics

A chuck table for holding a plate-shaped workpiece under suction includes a suction plate made of porous ceramics and having a plurality of open pores, and a frame covering a side surface and a reverse side, except an attractive suction surface, of the suction plate and having a plurality of suction grooves defined in an upper surface thereof and a fluid communication passage defined therein that holds the suction grooves in fluid communication with a suction source, the frame supporting the suction plate thereon. The suction plate has a porosity in the range from 60% to 70% by volume, and the open pores have diameters in the range from 10 μm to 25 μm.. ... Disco Corporation

03/01/18 / #the present invention provides substituted pyrazolo[1,5-a][1,3,5]triazine and pyrazolo[1,5-a]pyrimidine derivatives of formula (i), which are therapeutically useful, particularly as selective transcriptional cdk inhibitors including cdk7, cdk9, cdk12, cdk13 and cdk18, more particularly transcriptional cdk7 inhibitors

Aurigene Discovery Technologies Limited

. . ... Disco Corporation

03/01/18 / #disclosed are compounds of formula (i):

Pgi Drug Discovery Llc

. . ... Disco Corporation

03/01/18 / #20180062202

Electrolyte formulations for electrochemical cells containing a silicon electrode

Additives to electrolytes that enable the formation of comparatively more robust sei films on silicon anodes. The sei films in these embodiments are seen to be more robust in part because the batteries containing these materials have higher coulombic efficiency and longer cycle life than comparable batteries without such additives. ... Disco Corporation

03/01/18 / #20180062201

Electrolyte formulations for electrochemical cells containing a silicon electrode

Additives to electrolytes that enable the formation of comparatively more robust sei films on silicon anodes. The sei films in these embodiments are seen to be more robust in part because the batteries containing these materials have higher coulombic efficiency and longer cycle life than comparable batteries without such additives. ... Disco Corporation

03/01/18 / #20180061711

Processing method of package wafer

A processing method of a package wafer includes a mold resin removal step of exposing grooves filled with a mold resin of the package wafer in a peripheral surplus region, a holding step of holding the package wafer in such a manner that the grooves are exposed, an orientation adjustment step of causing the grooves to be parallel to a processing-feed direction in which processing feeding of a chuck table is carried out when dividing grooves are formed, a coordinate registration step of imaging both ends of the plural grooves exposed at a peripheral edge and registering coordinate information of both ends or a single side of the grooves from taken images, and a dividing groove forming step of calculating the positions of the dividing grooves to be formed along the grooves based on the registered coordinate information of the grooves and forming the dividing grooves along the grooves.. . ... Disco Corporation

03/01/18 / #20180056525

Plate-shaped workpiece transfer apparatus and processing apparatus

Apparatus transfers a plate-shaped workpiece to/from a holding surface of a chuck table. The apparatus includes a holding unit and a moving mechanism. ... Disco Corporation

03/01/18 / #20180056440

Method of producing sic wafer

An sic wafer is generated from an sic ingot by a peel-off plane generating step for generating a peel-off plane by forming a separation layer made up of a modified layer, and cracks extending from the modified layer along a c-plane, a plurality of times by indexing-feeding a focused point of a pulsed laser beam and the sic ingot relative to each other in a direction in which an off-angle is formed, thereby forming a plurality of separation layers to generate the peel-off plane. The peel-off plane generating step includes relatively moving the focused point from an end to an opposite end of the sic ingot in a forward stroke and relatively moving the focused point from the opposite end to the end of the sic ingot in a backward stroke to trace back the separation layer that has already been formed in the forward stroke.. ... Disco Corporation

02/22/18 / #20180053680

Peeling method and peeling apparatus

Disclosed is a method of peeling a protective member from a wafer, the protective member composed of a resin and a film, the film attached to one side of the wafer through the resin in a state in which a protruding portion is formed. The method includes: a step of holding the other side of the wafer, with the protective member on the lower side; an outer circumferential edge adhered resin peeling step of grasping the protruding portion of the protective member, and pulling the protruding portion to an outer side than an outer circumferential edge of the wafer, to peel the resin adhered to the outer circumferential edge of the wafer from the outer circumferential edge of the wafer; and a step of peeling, after the outer circumferential edge adhered resin peeling step, the whole body of the protective member from the wafer.. ... Disco Corporation

02/22/18 / #20180050436

Polishing apparatus

A polishing apparatus includes a slurry circulating unit for storing a slurry below a chuck table having a holding surface for holding a wafer, and circulating the slurry to a polishing surface of a polishing pad for polishing the wafer. The slurry circulating unit includes an annular cup-shaped receptacle that surrounds the chuck table and the polishing pad overhanging from the holding surface of the chuck table in a polishing position where the polishing surface is in contact with the wafer, an air blow opening formed through a bottom plate of the receptacle for blowing air to thereby spray the slurry stored in the receptacle toward the polishing pad, a pipe for connecting the air blow opening to an air source, an opening formed through a side wall of the pipe, and a valve for controlling the supply and stop of air from the air source to the pipe.. ... Disco Corporation

02/15/18 / #20180048977

Audio signal processing method

Disclosed is an audio signal processing method. The audio signal processing method according to the present invention comprises the steps of: receiving a bit-stream including at least one of a channel signal and an object signal; receiving a user's environment information; decoding at least one of the channel signal and the object signal on the basis of the received bit-stream; generating the user's reproducing channel information on the basis of the user's received environment information; and generating a reproducing signal through a flexible renderer on the basis of at least one of the channel signal and the object signal and the user's reproducing channel information.. ... Disco Corporation

02/15/18 / #20180045851

Determining apparatus for determining object stored in cassette

Apparatus determines whether a stored object is a wafer alone or a frame unit formed by uniting the wafer and a ring frame. The apparatus includes first and second detecting units, the second detecting unit being stored more shallowly than the first detecting unit. ... Disco Corporation

02/15/18 / #20180044330

Phthalazinone compounds and methods for the treatment of cystic fibrosis

The invention relates to a compound of formula i and methods of treating cftr (cystic fibrosis transmembrane conductance regulator) mediated diseases, in particular cystic fibrosis, comprising the step of administering a therapeutically effective amount of a compound of formula i to a patient in need thereof:. . ... Disco Corporation

02/15/18 / #20180044329

3-substituted-1,2,4-oxadiazole and thiadiazole compounds as immunomodulators

The present invention relates to 3-substituted-1,2,4-oxadiazole and thiadiazole compounds of formula (i) or formula (ii) and their use to inhibit the programmed cell death 1 (pd-1) signaling pathway and/or for treatment of disorders by inhibiting an immunosuppressive signal induced by pd-1, pd-l1 or pd-l2.. . ... Disco Corporation

02/15/18 / #20180044305

3-substituted 1,3,4-oxadiazole and thiadiazole compounds as immunomodulators

The present invention relates to 3-substituted 1,3,4-oxadiazole and thiadiazole compounds of formula (i) and their use to inhibit the programmed cell death 1 (pd-1) signaling pathway and/or for treatment of disorders by inhibiting an immunosuppressive signal induced by pd-1, pd-l1 or pd-l2.. . ... Disco Corporation

02/15/18 / #20180044304

1,3,4-oxadiazole and thiadiazole compounds as immunomodulators

The present invention relates to 1,3,4-oxadiazole and thiadiazole compounds of formula (i) and their use to inhibit the programmed cell death 1 (pd-1) signaling pathway and/or for treatment of disorders by inhibiting an immunosuppressive signal induced by pd-1, pd-l1 or pd-l2.. . ... Disco Corporation

02/15/18 / #20180043468

Sic wafer producing method

An sic wafer is produced from a single crystal sic ingot by a method that includes forming a plurality of breakable layers constituting a separation surface in the sic ingot, each breakable layer including a modified layer and cracks extending from the modified layer along a c-plane, and separating part of the sic ingot along the separation surface as an interface to thereby produce the sic wafer. In forming the separation surface, the energy density of a pulsed laser beam is set to an energy density not causing the formation of an upper damage layer above the breakable layer previously formed due to the reflection of the pulsed laser beam from the breakable layer and not causing the formation of a lower damage layer below the breakable layer previously formed due to the transmission of the pulsed laser beam through the breakable layer.. ... Disco Corporation

02/08/18 / #20180040513

Processing method for wafer

A wafer processing method of dividing along a plurality of projected dicing lines set on the wafer includes a placing step of placing the wafer on a heating table with a tape interposed therebetween, the wafer having modified layers, from which to start to divide the wafer, formed therein at positions aligned with the projected dicing lines, the tape being applied to one surface of the wafer, and a dividing step of dividing the wafer on the heating table by heating with the heating table and thereafter cooling an exposed opposite surface in its entirety of the wafer with a cooing unit whereby the wafer starts being ruptured from the modified layers along the projected dicing lines due to a thermal shock caused by a temperature difference developed between the heated and cooled surfaces of the wafer.. . ... Disco Corporation

02/01/18 / #20180029187

Grinding apparatus

A grinding apparatus includes a holding table for holding a wafer, a support table for supporting the holding table, a motor for rotating the support table, a frame member supporting the support table for rotation, and at least three support poles for supporting the frame member from the base. Each of the support poles has formed in the inside thereof a through-hole, a supply port which communicates the through-hole and an air supply source with each other, and an exhaust port which exhausts air having flowed through the through-hole toward the support table. ... Disco Corporation

01/25/18 / #the present invention provides methods for treating a cancer in a subject and for inhibiting tumor growth, metastasis or a dihydrorotate oxygenase enzyme activity of a tumor or cancer cell. at least one trisubstituted benzotriazole derivative with the formula (i)

Aurigene Discovery Technologies Limited

. . ... Disco Corporation

01/25/18 / #the present invention provides bicyclic heterocyclyl kinase enzyme inhibitor compounds of formula (i), which are therapeutically useful as kinase inhibitors, particularly irak4 inhibitors.

Aurigene Discovery Technologies Limited

. . ... Disco Corporation

01/25/18 / #20180025953

Inspecting method for inspecting influence of installation environment upon processing apparatus

A method for inspecting the influence of an installation environment upon a processing apparatus includes setting a mark for specifying a relative positional relation between a chuck table and a processing unit, imaging the mark plural times by using an imaging unit when a moving unit is at rest, and detecting the position of the mark from an image and then determining whether or not the influence of the installation environment upon the processing apparatus is present based on whether the change in position of the mark is less than or more than a threshold.. . ... Disco Corporation

01/25/18 / #20180025928

Hold checking method and unhold checking method for wafer

Disclosed herein is a hold checking method for checking whether or not a wafer is held by an electrostatic chuck in loading the wafer to the electrostatic chuck by operating a transfer unit holding the wafer. The hold checking method includes a connecting step of bringing the wafer held by a transfer pad into contact with the electrostatic chuck to thereby connect the transfer pad through the wafer to the electrostatic chuck, and a hold determining step of supplying electric power from a dc power source through first wiring to the electrostatic chuck after performing the connecting step, and next determining that the wafer is held by the electrostatic chuck when the voltage across a resistor inserted in the first wiring has reached a predetermined voltage value.. ... Disco Corporation

01/25/18 / #20180024223

Method and system for determining precise robotic position and orientation using near-simultaneous radio frequency measurements

A method and system for determining position and/or pose of an object. A robotic device moves throughout an environment and includes a master transceiver tag and, optionally, additional tags. ... Disco Corporation

01/25/18 / #20180021911

Grinding apparatus

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. ... Disco Corporation

01/18/18 / #20180019168

Electrostatic chuck table

An electrostatic chuck table for holding a workpiece includes: a plate-shaped base transmittable with respect to a laser beam having a predetermined wavelength allowing the laser beam to be transmitted through the workpiece, the plate-shaped base having a first surface and a second surface opposite the first surface; an electrostatic attraction electrode assembly transmittable with respect to the laser beam having the predetermined wavelength, the electrostatic attraction electrode assembly being formed on the first surface of the base; and a resin layer transmittable with respect to the laser beam having the predetermined wavelength, the resin layer covering the electrode assembly and providing a holding surface for holding the workpiece thereon. The electrostatic chuck table is used in forming a modified layer within the workpiece held on the holding surface with the laser beam that is applied to the workpiece from the side of the second surface of the base.. ... Disco Corporation

01/18/18 / #20180015638

Cutting apparatus

A controller of a cutting apparatus includes: a storage section configured to preliminarily store as a threshold an arbitrary value based on a load current value of a motor detected when a cutting blade is rotated at a predetermined rotational speed while supplying a predetermined quantity of cutting water in a state in which a cutting water supply nozzle is positioned in an appropriate position; and a judgment section configured to judge normality or abnormality according to the result of comparison between a load current value detected when the cutting blade is rotated at the predetermined rotational speed while supplying the predetermined quantity of cutting water and the threshold stored in the storage section.. . ... Disco Corporation

01/11/18 / #20180012804

Semiconductor device chip manufacturing method

Disclosed herein is a semiconductor device chip manufacturing method including a chipping prevention layer forming step of forming a chipping prevention layer at each intersection of a plurality of crossing division lines formed on the front side of a wafer, a modified layer forming step of applying a laser beam having a transmission wavelength to the wafer to the back side thereof along each division line in the condition where the focal point of the laser beam is set inside the wafer, thereby forming a modified layer inside the wafer along each division line, and a dividing step of grinding the back side of the wafer after performing the modified layer forming step, thereby reducing the thickness of the wafer and also dividing the wafer into individual semiconductor device chips along each division line where the modified layer is formed as a break start point.. . ... Disco Corporation

01/11/18 / #20180012169

Management system for supervising operator

A management system for supervising an operator within an operation area with a processing apparatus installed therein has an imaging camera for capturing an image of the operator, and a control unit. The control unit stores an area map that includes information about the processing apparatus and the positions of the processing apparatus, acquires identifying information regarding the operator on the basis of the image captured by the imaging camera, and extracts traffic lines of the operator. ... Disco Corporation

01/11/18 / #20180009112

Method and system for determining precise robotic position and orientation using near-simultaneous radio frequency measurements

A method and system for determining position and/or pose of an object. A robotic device moves throughout an environment and includes a master transceiver tag and, optionally, additional tags. ... Disco Corporation

01/04/18 / #20180006330

Electrolyte additives and electrode materials for high temperature and high voltage operation

A battery including an anode, a cathode, a separator, and a liquid electrolyte including a lithium salt, a non-aqueous solvent, and an additive compound including a functionalized matrix having a polymer or copolymer or silica. The cathode material can be an nmc or lco material. ... Disco Corporation

01/04/18 / #20180006328

Solid electrolyte compositions

A solid-state electrolyte including a polymer, which can be ion-conducting or non-conducting; an ion-conducting inorganic material; a lithium salt; an additive salt and optionally a coupling agent.. . ... Disco Corporation

01/04/18 / #20180006326

Electrode compositions for solid-state batteries

An electrode formulation including a polymer, which can be ion-conducting or non-conducting; an ion-conducting inorganic material; a lithium salt; and optionally an additive salt.. . ... Disco Corporation

12/28/17 / #20170372908

Cutting method for cutting processing-target object and cutting apparatus that cuts processing-target object

There is provided a cutting method for cutting a processing-target object by a cutting blade. The cutting method includes a holding step of holding the processing-target object by a holding table and a cutting step of cutting the processing-target object by the cutting blade by causing the cutting blade that rotates to cut into the processing-target object held by the holding table and causing the holding table and the cutting blade to relatively move after the holding step is carried out. ... Disco Corporation

12/28/17 / #20170370927

Method of measuring the affinity of biomolecules

The invention provides a method of measuring the affinity of first and second biomolecules in which a first biomolecule is tethered by a first tether portion having a first tether portion length and a second biomolecule is tethered by a second tether portion having a second tether portion length, the method comprising determining binding of adjacent first and second biomolecules to each other, varying at least one of the first and second tether lengths and determining binding of the first and second biomolecules. The invention also provides apparatus suitable for use in the method of the invention.. ... Disco Corporation

12/28/17 / #20170370856

Internal crack detecting method and internal crack detecting apparatus

A method for detecting an internal crack in a wafer includes a first image recording step of applying near infrared light having a transmission wavelength to a reference wafer having the same configuration as a target wafer to be subjected to the detection of the internal crack, thereby obtaining a first image of the reference wafer having no internal crack and then recording the first image, a processing step of processing the target wafer, a second image recording step of applying the near infrared light to the target wafer, thereby obtaining a second image of the processed target wafer and then recording the second image, and an internal crack detecting step of removing the same image information between the first image and the second image from the second image to obtain a residual image, thereby detecting the residual image as the internal crack in the target wafer.. . ... Disco Corporation

12/28/17 / #20170370845

Fluorescence detecting apparatus

A fluorescence detecting apparatus includes an excitation light applying section that applies excitation light to a protective film containing an absorbing agent. A photomultiplier tube detects fluorescence emitted from the absorbing agent due to absorption of the excitation light. ... Disco Corporation

12/28/17 / #20170369585

Anti-cd276 polypeptides, proteins, and chimeric antigen receptors

Polypeptides and proteins that specifically bind to and immunologically recognize cd276 are disclosed. Chimeric antigen receptors (cars), anti-cd276 binding moieties, nucleic acids, recombinant expression vectors, host cells, populations of cells, and pharmaceutical compositions relating to the polypeptides and proteins are also disclosed. ... Disco Corporation

12/28/17 / #20170368659

Processing apparatus

A processing apparatus includes a chuck table having a holding surface for holding a workpiece thereon, and a processing unit. The processing unit includes a spindle, a wheel mount coupled to an end of the spindle and facing the holding surface, a first tool detachably mounted on a mount surface of the wheel mount, the first tool having a first diameter, a second tool mount nonrotatably and axially movably mounted on the spindle over a rear surface of the wheel mount which is opposite the mount surface, the second tool mount having a storage region for the wheel mount and the first tool, a second tool mount member surrounding the storage region and having an inside diameter larger than the first diameter, and a second tool detachably mounted on the second tool mount and having an inside diameter larger than the first diameter.. ... Disco Corporation

12/28/17 / #20170368636

Protective film applying apparatus and protective film applying method

A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. ... Disco Corporation

12/21/17 / #20170365519

Method of processing a wafer and wafer processing system

A wafer has a device area on one side with a plurality of devices partitioned by a plurality of division lines. Either side of the wafer is attached to an adhesive tape supported by a first annular frame. ... Disco Corporation

12/14/17 / #20170358468

Peeling apparatus

A peeling apparatus peels a protective member off a wafer, the protective member including a resin and a film which is fixed to one surface of the wafer with the resin interposed therebetween. The film has a protrusive marginal side extending radially outwardly beyond an outer circumferential edge of the wafer. ... Disco Corporation

12/14/17 / #20170358465

Wafer processing system

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.. ... Disco Corporation

12/14/17 / #20170355765

Tem8 antibodies and their use in treatment and detection of tumors

Antibodies that specifically bind tem8 protein, conjugates thereof, and their use, are disclosed herein. In some examples the conjugates and antibodies are useful for methods of detecting and treating pathogenic angiogenesis. ... Disco Corporation

12/07/17 / #20170352627

Leakage laser beam detecting method

A leakage laser beam detecting method includes a coating step of coating the lower surface of a wafer with an oil marker, thereafter, a press-bonding step of press-bonding an adhesive tape to the lower surface of the wafer, thereafter, a modified layer forming step of applying a laser beam having a wavelength that can be transmitted through the wafer to the wafer from the upper surface thereof while making the laser beam be focused at a focused point within the wafer thereby to form modified layers in the wafer, thereafter, a peeling step of peeling off the press-bonded adhesive tape, and a leakage laser beam detecting step of detecting areas of the lower surface where the oil marker has been removed when the press-bonded adhesive tape is peeled off as areas marked by leakage laser beams.. . ... Disco Corporation

12/07/17 / #20170352588

Expansion sheet, expansion sheet manufacturing method, and expansion sheet expanding method

An expansion sheet is adapted to be held and expanded by an expanding apparatus when a platelike workpiece is attached to the expansion sheet. The expansion sheet has a peripheral area around the workpiece where the expansion sheet is adapted to be held by first, second, third, and fourth holding units that are moveable away from each other. ... Disco Corporation

12/07/17 / #20170348796

Wafer producing method

Disclosed herein is a wafer producing method for producing an sic wafer from a single crystal sic ingot. The wafer producing method includes a separation surface forming step of forming a separation surface composed of modified layers, cracks, and connection layers inside the ingot and a wafer separating step of separating a part of the ingot along the separation surface as an interface to thereby produce the wafer. ... Disco Corporation

11/30/17 / #20170343979

Processing apparatus and processing method

Disclosed herein is a processing apparatus including a processing unit, alignment unit, and controller. The controller includes a reference program storing section previously storing a reference program for use in processing a predetermined workpiece, a reference result recording section for rating the result of processing performed to the predetermined workpiece by the processing unit according to the reference program and then recording a resultant rating point as a processing reference result, and an actual result calculating section for rating the result of processing performed to substantially the same workpiece as the predetermined workpiece by the processing unit according to the reference program.. ... Disco Corporation

11/30/17 / #20170342094

Heteroaryl inhibitors of pde4

The present invention relates to compounds and methods useful as inhibitors of phosphodiesterase 4 (pde4) for the treatment or prevention of inflammatory diseases and other diseases involving elevated levels of cytokines and proinflammatory mediators.. . ... Disco Corporation

11/30/17 / #20170341254

Cutting apparatus

A cutting apparatus includes a chuck table for holding a workpiece, a cutting blade for cutting the workpiece which is held by the chuck table, and a blade cover disposed in covering relation to an outer circumference of the cutting blade. The workpiece is cut in a dry state by the cutting blade while cut dusts produced from the workpiece and rotating with the cutting blade are being discharged through a tubular member under suction by a cut dusts retrieving unit mounted on the blade cover.. ... Disco Corporation

11/30/17 / #20170341198

Constant temperature water supply system

A constant temperature water supply system that adjusts water from a water supply source to a constant temperature by a constant temperature water supply apparatus and supplies the water to a processing apparatus. The constant temperature water supply apparatus is provided with water temperature adjusting units that adjust processing water and cooling water to predetermined temperatures and temperature adjustment control units that reset predetermined temperatures of the water temperature adjusting units. ... Disco Corporation

11/30/17 / #20170341179

Laser processing apparatus and wafer producing method

A laser processing apparatus for producing a gan wafer from a gan ingot includes a laser beam irradiating unit configured to apply a laser beam having a wavelength capable of passing through the gan ingot held by a chuck table. The laser beam irradiating unit includes a laser oscillator configured to oscillate the laser beam. ... Disco Corporation

11/23/17 / #the present invention relates to novel compounds of formula (1):

Drug Discovery Research Centre

. . ... Disco Corporation

11/23/17 / #20170338158

Method of evaluating gettering property

A gettering property evaluating method for a wafer includes: a gettering layer forming step of polishing a back surface opposite to a front surface of a semiconductor wafer by use of a polishing wheel to form polishing marks on the back surface and to form a gettering layer inside the semiconductor wafer and beneath the polishing marks; an imaging step of imaging at least a unit region of the back surface formed with the polishing marks by imaging means; a counting step of counting the number of the polishing marks having a width of 10 to 500 nm present in the unit region imaged; and a comparing step of comparing the number of the polishing marks counted by the counting step with a predetermined value to determine whether or not the counted number is not less than the predetermined value.. . ... Disco Corporation

11/23/17 / #20170338118

Laser processing apparatus and laser processing method

A laser processing apparatus has a laser beam applying unit for applying a laser beam to a workpiece held on a chuck table. The laser beam applying unit includes an elliptical spot forming member for changing the spot shape of a pulsed laser beam into an elliptical shape and making the major axis of the elliptical beam spot parallel to a feeding direction, a diffractive optical element for branching the pulsed laser beam having the elliptical beam spot obtained by the elliptical spot forming member, into a plurality of pulsed laser beams each having an elliptical beam spot whose major axis extends in the feeding direction, and a condensing lens for condensing each of the pulsed laser beams branched by the diffractive optical element to the workpiece in such a manner that the major axes of the elliptical beam spots of the pulsed laser beams branched are partially overlapped.. ... Disco Corporation

11/23/17 / #20170333343

Lubricant formulations

A composition for lubricant formulations is disclosed. The composition may include hypochlorite, dimethicone, and an emulsifier for improvement of lubricity. ... Disco Corporation

11/16/17 / #20170331523

Wireless power transmission network and wireless power transmission method

The present invention relates to a wireless power transmission network and to a wireless power transmission method. In the wireless power transmission method according to one aspect of the present invention, a base station, which wirelessly transmits power using a magnetic field, performs in-band communication through the magnetic field used for wireless power transmission in order to determine whether an electronic device receiving power is in a charging area or in a communication area, and transmits wireless power accordingly.. ... Disco Corporation

11/16/17 / #20170330799

Wafer processing method

A wafer processing method includes a modified layer forming step of applying a laser beam so as to focus the laser beam inside the wafer, and form a modified layer along each division line, a wafer supporting step of attaching an expandable dicing tape to the back side of the wafer and mounting the peripheral portion of the dicing tape to an annular frame before or after performing the modified layer forming step, a tape expanding step of expanding the dicing tape attached to the back side of the wafer, and an air blowing step of blowing air against the wafer in the condition where the dicing tape is expanded, thereby dividing the wafer into individual device chips along each division line where the modified layer is formed and also increasing the spacing between any adjacent ones of the device chips.. . ... Disco Corporation

11/16/17 / #20170330774

Laser processing apparatus

A laser oscillator of a laser processing apparatus generates burst pulses each composed of a plurality of sub-pulses. The plurality of sub-pulses are generated in such a manner that the energy of the sub-pulse sequentially changes from a lower energy to a higher energy, and the burst pulses are applied to a wafer, whereby the wafer is formed therein with shield tunnels extending from the front surface to the back surface of the wafer and each being composed of a minute hole and an amorphous phase surrounding the minute hole.. ... Disco Corporation

11/16/17 / #20170328867

Method of sorting chips

A method of sorting chips divided from a plate-shaped workpiece into acceptable chips and defective chips includes an ultrasonic vibration applying step of applying ultrasonic vibrations to chips, a fracture confirming step of confirming whether the chips have been fractured in the ultrasonic vibration applying step or not, and a sorting step of sorting those chips which have been confirmed as not fractured in the fracture confirming step as acceptable chips. The ultrasonic vibrations applied to the chips in the ultrasonic vibration applying step are set to values that do not cause chips to be fractured if the chips are free of minute fractures and cause chips to be fractured if the chips contain minute fractures.. ... Disco Corporation

11/16/17 / #20170326149

Hydroxyl purine compounds and applications thereof

Hydroxyl purine compounds represented by formula (i), tautomers or pharmaceutically acceptable salts thereof, and applications thereof as pde2 or tnf-α inhibitors.. . ... Disco Corporation

11/09/17 / #the present invention provides a malonate salt of a compound of formula (i):

Biomed Valley Discoveries, Inc.

. . ... Disco Corporation

11/09/17 / #20170324963

Methods and apparatuses of encoding/decoding intra prediction mode using candidate intra prediction modes

A method and an apparatus of encoding/decoding intra prediction mode using a plurality of candidate intra prediction modes are disclosed. The method includes deriving three candidate intra prediction modes about a current block and deriving an intra prediction mode of the current block.. ... Disco Corporation

11/09/17 / #20170323774

Wafer processing apparatus

Disclosed herein is a laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. ... Disco Corporation

10/26/17 / #20170304235

Linear guanidine derivatives, methods of preparation and uses thereof

The present invention relates to linear guanidine derivatives, methods of preparation, uses and pharmaceutical compositions thereof. The compounds of formulas 1 or 2 exhibit high antimicrobial activity against gram positive and gram negative bacteria.. ... Disco Corporation

10/12/17 / #20170294364

Packaged wafer manufacturing method and device chip manufacturing method

Disclosed herein is a packaged wafer manufacturing method including the steps of forming a groove along each division line on the front side of a wafer, each groove having a depth greater than the finished thickness of the wafer, next removing a chamfered portion from the outer circumference of the wafer to thereby form a step portion having a depth greater than the depth of each groove, next setting a die of a molding apparatus on the bottom surface of the step portion of the wafer in the condition where a space is defined between the die and the wafer, and next filling a mold resin into this space. Accordingly, the device area of the wafer is covered with the mold resin and each groove of the wafer is filled with the mold resin to thereby obtain a packaged wafer.. ... Disco Corporation

10/12/17 / #20170294353

Method of manufacturing packaged wafer

Disclosed herein is a method of manufacturing a packaged wafer including a step of forming grooves in a face side of a wafer along projected dicing lines to a depth than a finished thickness of the wafer, a step of forming a ring-shaped groove in and along a boundary between a device area and an outer peripheral excess area of the wafer to a depth larger than the depth of the grooves, and a step of placing a recess mold of a molding apparatus in engagement with the wafer so that a side wall of the recess mold is placed on a bottom of the ring-shaped groove and filling a space between the recess mold and the wafer with a molding resin.. . ... Disco Corporation

10/12/17 / #20170294300

Method of processing bonded wafer

A wafer is bonded to a support plate by cutting off, with a cutting blade, an annular portion of the bonded wafer which extends from the outer peripheral edge of the bonded wafer to a position that is spaced radially inwardly toward the center of the bonded wafer by a predetermined distance. Bonding is done by a method that includes a captured image forming step of irradiating the outer peripheral edge of the bonded wafer with light emitted from an irradiating unit and passing through a through hole, and imaging the outer peripheral edge of the bonded wafer with an imaging camera disposed in facing relation to the irradiating unit with the bonded wafer interposed therebetween, thereby to capture an image, and an outer peripheral edge position detecting step of detecting an outer peripheral edge position of the bonded wafer on the basis of the captured image.. ... Disco Corporation

10/12/17 / #20170291897

Therapeutic compounds as inhibitors of the orexin-1 receptor

The present invention relates to compounds that are inhibitors of the orexin-1 receptor. The compounds have the structural formula i defined herein. ... Disco Corporation

10/12/17 / #20170291255

Wafer producing method and processing feed direction detecting method

A wafer is produced from an ingot by confirming whether or not an inclined c-axis of the ingot and a second orientation flat of the ingot are perpendicular to each other, and detecting a processing feed direction perpendicular to the direction in which the c-axis is inclined. The method includes performing sampling irradiation of the ingot with a laser beam, along a direction parallel to the second orientation flat and a plurality of directions inclined clockwise and counterclockwise by respective predetermined angles from the second orientation flat, thereby forming a plurality of sampled reduced strength areas in the ingot; measuring the number of nodes which exist per unit length on each of the sampled reduced strength areas, and determining a direction in which the sampled reduced strength area where the measured number of nodes is zero extends as a processing feed direction.. ... Disco Corporation

10/12/17 / #20170291254

Wafer producing method

An sic wafer is produced from an sic ingot by a method that includes a first modified layer forming step and a second modified layer forming step. In the first step, a first laser beam having a first power forms a plurality of discrete first modified layers at a first depth inside the ingot. ... Disco Corporation

10/05/17 / #20170288265

High voltage solid electrolyte compositions

An electrochemical cell having an anode, a solid electrolyte, and a cathode. The solid electrolyte includes a polymer gel formed from an ethylene oxide polymer combined with a liquid precursor. ... Disco Corporation

10/05/17 / #20170288264

Solid electrolyte compositions

A battery having an anode, a soft-solid electrolyte, and a cathode. The soft-solid electrolyte includes a polymer soft-solid material formed from polymer combined with a solvent such as butylene carbonate, butyl sulfoxide, n-methyl-2-pyrrolidone, or γ-caprolactone.. ... Disco Corporation

10/05/17 / #20170281670

Redox signaling gel formulation

Formulations containing reactive oxygen species (ros), processes for making these formulations, and methods of using these formulations are described. The formulations can include gels or hydrogels that contain at least one reactive oxygen species (ros). ... Disco Corporation

09/28/17 / #20170278759

Workpiece evaluating method

A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an area other than the light applied area, measuring the intensity of the microwaves reflected from the light applied area and from the area other than the light applied area, subtracting the intensity of the microwaves reflected from the area other than the light applied area from the intensity of the microwaves reflected from the light applied area to thereby obtain a differential signal, and determining the gettering property of the gettering layer according to the intensity of the differential signal obtained above.. ... Disco Corporation

09/28/17 / #20170273962

Inhibitors of hepatitis c virus polymerase

The present invention provides, among other things, compounds represented by the general formula i: and pharmaceutically acceptable salts thereof, wherein x, y, r2, and r3 are as defined in classes and subclasses herein and compositions (e.g., pharmaceutical compositions) comprising such compounds, which compounds are useful as inhibitors of hepatitis c virus polymerase, and thus are useful, for example, as medicaments for the treatment of hcv infection.. . ... Disco Corporation

09/21/17 / #20170271676

Lithium-ion battery materials with improved properties

A cobalt-containing phosphate material can comprise lithium (li) (or, alternatively or additionally other alkali metal(s)), cobalt (co), phosphate (po4), and at least two additional metals other than li and co (e.g., as dopants and/or metal oxides), and can have a molar ratio of co to a total amount of co and the additional metals (e.g., as dopants and/or metal oxides) of at least 0.2, at least 0.3, at least 0.5, at least 0.7, or at least about 0.75. The cobalt-containing phosphate material can have a molar ratio of co to a total amount of co and the additional metals (e.g., as dopants and/or metal oxides) ranging from 0.2 to 0.98, from 0.3 to 0.98, from 0.3 to 0.94, from 0.5 to 0.98, from 0.5 to 0.94, or alternatively from 0.5 to 0.9, from 0.7 to 0.9, or from 0.75 to 0.85.. ... Disco Corporation

09/21/17 / #20170271208

Wafer processing method

A wafer processing method for divides a wafer into individual device chips along a plurality of division lines. The method includes forming a dividing groove along each division line formed on the front side of the wafer, the dividing groove having a depth corresponding to the finished thickness of each device chip, thinning the wafer to expose the dividing groove to the back side of the wafer, thereby dividing the wafer into the individual device chips, applying a liquid resin for die bonding to the back side of the wafer and next solidifying the liquid resin applied to the back side of the wafer, thereby forming a die bonding resin film having a predetermined thickness on the back side of each device chip, and isolating each device chip from the wafer.. ... Disco Corporation

09/14/17 / #20170265235

Method and apparatus for separated connections of uplink and downlink

Provided is a method and an apparatus for uplink and downlink separated connections, wherein a terminal may establish a downlink cell association with a downlink base station, receive an identifier of an uplink base station providing an uplink from the downlink base station to the terminal through an established downlink, and establish an uplink cell association with the uplink base station using the identifier of the uplink base station, and the downlink base station may select the uplink base station from among base stations in a network based on an uplink reference signal and a bias factor.. . ... Disco Corporation

09/14/17 / #20170263473

Laser processing apparatus

A controller of a laser processing apparatus includes: a storage section that stores processing conditions for forming modified layers along division lines of a wafer; and a processing line calculation section that displays a position at which the modified layer is planned to be formed and which is stored as the processing condition, on a display panel as a processing line. The processing line calculation section displays the processing line on the display panel superimposed on a first division line, in a region in which a start point or end point of the first division line is connected to a second division line. ... Disco Corporation

09/14/17 / #20170260058

Substrate having at least one partially or entirely flat surface and use thereof

A method for preparing a thin or thick film, including the aligning non-spherical seed crystals on a flat portion of at least one surface of the substrate such that an a-axis, a b-axis, and/or a c-axis are oriented according to a certain rule; and exposing the aligned seed crystals to a solution for enabling the growth of the seed crystals to thereby form and grow a film from the seed crystals using a secondary growing technique.. . ... Disco Corporation

09/07/17 / #20170257075

Baw device and baw device manufacturing method

A baw device including a substrate, and a piezoelectric element formed on a front surface of the substrate is provided. The substrate is provided on a back surface side thereof with an acoustic wave diffusion region including a recess formed by partially melting a back surface of the substrate.. ... Disco Corporation

09/07/17 / #20170256454

Wafer processing method

Disclosed herein is a wafer processing method including a cover plate providing step of providing a cover plate on the front side of a wafer to thereby form a composite wafer, a welding step of applying a laser beam along each division line formed on the front side of the wafer in the condition where the focal point of the laser beam is set at the interface between the wafer and the cover plate on opposite sides of the lateral center of each division line, thereby forming two parallel welded lines for joining the wafer and the cover plate along each division line, and a dividing step of forming a cut line between the two parallel welded lines formed along each division line, thereby cutting the composite wafer along each division line to obtain individual device chips each covered with the cover plate.. . ... Disco Corporation

08/31/17 / #20170250102

Wafer processing method

In a wafer processing method, the back side of a wafer is attached to an adhesive tape supported at its peripheral portion by an annular frame having an inside opening. The wafer is set in the inside opening, thereby supporting the wafer through the adhesive tape to the annular frame. ... Disco Corporation

08/24/17 / #the invention relates to a compound of the general formula (i) or a physiologically functional derivative, solvate or salt thereof,

4sc Discovery Gmbh

. . ... Disco Corporation

08/24/17 / #20170244131

Electrolyte materials for batteries and methods for use

An electrolyte solution comprising an additive wherein the additive is not substantially consumed during charge and discharge cycles of the electrochemical cell. Additives include lewis acids, electron-rich transition metal complexes, and electron deficient pi-conjugated systems.. ... Disco Corporation

08/24/17 / #20170243787

Workpiece processing method

A processing method of processing a workpiece on which a plurality of intersecting planned dividing lines are set is provided. The processing method includes a holding step of holding the workpiece by a holding table, a dividing step of forming a plurality of chips by dividing the workpiece held by the holding table along the planned dividing lines, and a carrying-out step of, after the dividing step is performed, sucking the plurality of chips on the holding table by a suction unit including a suction head sucking the plurality of chips and a suction passage connected to the suction head, and carrying out the plurality of chips from the holding table via the suction passage.. ... Disco Corporation

08/24/17 / #20170243786

Wafer processing method

Disclosed herein is a wafer processing method for dividing a wafer into individual device chips along division lines. The wafer processing method includes a frame supporting step of attaching the wafer to an adhesive tape fixed at its peripheral portion to an annular frame, thereby supporting the wafer through the adhesive tape to the annular frame, a laser processing step of applying a laser beam to each division line to thereby form a strength reduced portion along each division line, and a dividing step of applying a radial tension to the adhesive tape and next applying an external force to the wafer in the condition where the radial tension is kept acting on the adhesive tape, thereby dividing the wafer into the individual device chips along the division lines.. ... Disco Corporation

08/24/17 / #20170243341

Inspecting apparatus and laser processing apparatus

Disclosed herein is an inspecting apparatus including an illuminating unit adapted to be positioned in the periphery of a transparent member for illuminating the transparent member from the outside of the circumference thereof, an imaging unit adapted to be opposed to the transparent member for imaging the transparent member illuminated by the illuminating unit, and a displaying monitor for displaying an image obtained by the imaging unit.. . ... Disco Corporation

08/24/17 / #20170240562

Pyridine compounds

The present invention relates to a compound or a pharmacologically acceptable salt thereof having excellent tissue non-specific alkaline phosphatase inhibitory activity. The present invention provides a compound represented by the formula (i): wherein r1 represents a hydrogen atom, an optionally substituted c1-6 alkyl group, or the like, r2 and r3 are the same or different and each represent a hydrogen atom, an optionally substituted c1-6 alkyl group, or the like, r4 and r5 are the same or different and each represent a hydrogen atom, an optionally substituted c1-6 alkyl group, or the like, r6 represents a hydrogen atom or the like, each r7 may be the same or different and may each represent an optionally substituted c1-6 alkoxy group or the like, x represents —ch═, —c(—r7)═, or —n═, and m represents 1 to 4, or a pharmacologically acceptable salt thereof.. ... Disco Corporation

08/24/17 / #20170240545

Novel inhibitors of protein kinases

Protein kinases are regulators of cellular signaling and their functional dysregulation is common in carcinogenesis and many other disease states or disorders. The present invention relates to novel chemical entities that have biological activity to modulate mammalian protein kinase enzymes. ... Disco Corporation








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Disco Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Disco Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###