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Disco Corporation
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Disco Corporation_20100121
Disco Corporation_20100114

Disco Corporation patents

Recent patent applications related to Disco Corporation. Disco Corporation is listed as an Agent/Assignee. Note: Disco Corporation may have other listings under different names/spellings. We're not affiliated with Disco Corporation, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Disco Corporation-related inventors

Date Disco Corporation patents (updated weekly) - BOOKMARK this page
04/20/17 new patent  Laser processing apparatus
04/13/17Fabrication semiconductor device
04/13/17Wafer processing method
04/13/17Processing optical device wafer
04/06/17Grinding method
04/06/17Optical device wafer processing method
03/30/17Laser processing apparatus
03/30/17Laser processing apparatus
03/23/17Grinding wheel and grinding method
03/16/17Workpiece support jig
03/16/17Method of processing a substrate
03/16/17Method of dividing plate-shaped workpieces
03/16/17Package substrate machining method
03/09/17Laser processing apparatus
03/09/17Chuck table
03/09/17Wafer processing method
03/02/17Cutting blade
03/02/17Method of processing wafer
03/02/17Baw device and manufacturing baw device
02/23/17Wafer processing method
02/23/17Wafer processing method
02/23/17Wafer processing method
02/16/17Laser processing apparatus
02/16/17Wafer processing method and electronic device
02/16/17Support plate and forming support plate
02/09/17Adhesion detecting method
02/09/17Test wafer and using method therefor
02/02/17Wafer processing method
02/02/17Laser processing method
01/26/17Wafer processing method
01/26/17Wafer thinning method
01/26/17Wafer thinning method
01/19/17Polycrystalline sic wafer producing method
01/19/17Laser processing apparatus
01/19/17Wafer producing method
01/12/17Wafer processing method
12/29/16Small unmanned air vehicle repulsing apparatus
12/29/16Saw device manufacturing method
12/22/16Multi-wire saw
12/22/16Laser processing apparatus and forming through-hole
12/22/16Processing system
12/15/16Abrasive grindstone
12/15/16Wafer processing method
12/08/16Wafer producing method
12/08/16Wafer producing method
12/01/16Processing system
11/24/16Cutting apparatus
11/24/16Plasma etching apparatus
11/24/16Processing apparatus
11/24/16Wafer processing method
11/17/16Laser processing apparatus
10/27/16Laser processing apparatus
10/27/16Cutting apparatus and cutting method
10/27/16Wafer processing method
10/20/16Wafer producing method
10/20/16Thin plate separating method
10/20/16Workpiece cutting method
10/20/16Method of dividing wafer
10/13/16Method of forming cut groove
10/06/16Wafer producing method
10/06/16Wafer producing method
10/06/16Wafer producing method
10/06/16Method of dividing wafer
09/29/16Method for inspecting cutting blade
09/29/16Workpiece cutting method
Patent Packs
09/22/16Cutting apparatus
09/22/16Decompression processing apparatus
09/22/16Method of dividing wafer
09/15/16Process fluid circulation type processing system
09/15/16Grinding wheel
09/15/16Protective film detecting method
09/15/16Method of processing single-crystal substrate
09/15/16Method of processing single-crystal substrate
09/08/16Grinding wheel, grinding apparatus, and grinding wafer
09/08/16Etching method
09/08/16Cutting apparatus and wafer cutting method
09/08/16Processing single-crystal substrate
09/01/16Wafer dividing method
08/25/16Wafer divider and wafer division method
08/18/16Abrasive grindstone
Patent Packs
08/18/16Wafer processing system
08/18/16Chuck table of processing apparatus
08/11/16Wafer producing method
08/11/16Wafer producing method
08/11/16Wafer producing method
08/04/16Alignment method
08/04/16Method of processing single-crystal member
07/28/16Cutting blade having cutting edge containing photocatalyst particles
07/21/16Laser machining apparatus
07/21/16Mount flange
07/14/16Laser processing apparatus
07/14/16Wafer processing method
07/14/16Conveying apparatus
07/07/16Wafer producing method
07/07/16Wafer producing method
07/07/16Human resources management system
06/30/16Laser processing plate-shaped workpiece
06/30/16Processing apparatus
06/30/16Method of dividing wafer into dies
06/23/16Wafer processing method
06/16/16Laser processing apparatus
06/16/16Wafer processing method
06/09/16Wafer producing method
06/09/16Wafer producing method
06/09/16Wafer producing method
06/09/16Laser processing apparatus suitable for formation of laser processed hole
06/09/16Wafer producing method
06/09/16Wafer processing method
06/02/16Laser processing apparatus
06/02/16Detection transmission laser beam
Social Network Patent Pack
05/26/16Package substrate dividing method
05/19/16Grinding workpieces
05/19/16Cutting apparatus
05/19/16Laser oscillation mechanism
05/12/16Grinding apparatus
05/12/16Polishing liquid and polishing sic substrate
05/12/16Laser oscillation mechanism
05/12/16Method of polishing sic substrate
05/05/16Protective film detecting apparatus and protective film detecting method
05/05/16Wafer processing method
Patent Packs
04/21/16Wafer processing method
04/14/16Wafer processing method
04/07/16Laser processing apparatus
04/07/16Wafer inspection method and wafer inspection apparatus
03/31/16Cutting apparatus
03/24/16Wafer processing method
03/17/16Laser processing apparatus
03/17/16Sic ingot slicing method
03/10/16Laser processing apparatus
03/10/16Laser machining apparatus
03/03/16Flange mechanism and cutting apparatus
03/03/16Wafer inspection method and grinding and polishing apparatus
03/03/16Wafer processing method
02/18/16Laser beam spot shape detection method
02/18/16Transfer unit
02/11/16Processing workpiece
02/11/16Wafer processing method
02/04/16Wafer processing method
01/28/16Wafer processing method
01/21/16Processing apparatus
01/14/16Lift-off method
01/07/16Chip spacing maintaining apparatus
12/31/15Evaluation device wafer
12/31/15Processing apparatus
12/24/15Gan substrate, and manufacturing gan substrate
12/17/15Wafer processing method
12/10/15Wafer processing method
12/10/15Wafer processing method
12/10/15Lighting apparatus and illumination management the same
12/03/15Chip manufacturing method
Patent Packs
11/19/15Lift-off method
11/19/15Wafer processing method
11/19/15Wafer processing method
11/19/15Method of processing wafer
11/19/15Wafer processing method
11/19/15Support plate and forming support plate
11/12/15Laser processing apparatus
11/12/15Wafer processing method
10/22/15Wafer processing method
10/15/15Height detecting apparatus
10/08/15Laser processing apparatus
10/08/15Grinding wheel and cleaning grinding chamber
10/08/15Unevenness detecting device
09/17/15Plate-shaped object processing method
09/17/15Workpiece processing method
09/17/15Cutting method
09/17/15Chip arranging method
09/10/15Mems device chip manufacturing method
09/10/15Plate-like object processing method
08/27/15Wafer processing method
Social Network Patent Pack
08/20/15Semiconductor wafer and producing same
08/06/15Lift-off method
08/06/15Lift-off method
07/30/15Optical device and manufacturing method therefor
07/23/15Separation apparatus
07/23/15Optical device and manufacturing method therefor
07/16/15Mark detecting method
07/02/15Cutting apparatus
07/02/15Wafer processing method
06/25/15Packaging material
06/25/15Device wafer processing method
06/25/15Light emitting chip
06/18/15Package board division method
06/18/15Device wafer processing method
06/11/15Grinding apparatus
06/11/15Processing optical device wafer
06/11/15Wafer processing apparatus
06/04/15Cleaning apparatus
06/04/15Processing apparatus
06/04/15Processing package substrate
Social Network Patent Pack
05/28/15Wafer processing method
05/21/15Workpiece processing method
05/21/15Wafer processing method
05/14/15Wafer processing method
05/07/15Laser processing method and laser processing apparatus
04/16/15Wafer processing method
04/16/15Wafer processing method
04/09/15Wafer processing method
04/09/15Wafer processing method
04/02/15Manufacturing photomask
04/02/15Wafer processing method
03/26/15Device wafer processing method
03/19/15Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element
03/12/15Wafer processing method
03/12/15Device wafer processing method
03/05/15Optical device and manufacturing method therefor
02/19/15Processing apparatus
02/12/15Optical device wafer processing method
02/12/15Dividing wafer
02/05/15Laser processing apparatus
02/05/15Laminated wafer processing method
02/05/15Processing apparatus including laser beam applying mechanism and separating means
01/29/15Crack and thickness detecting apparatus
01/29/15Accommodation cassette
01/22/15Cutting apparatus
01/22/15Cutting apparatus
01/22/15Cutting apparatus
01/22/15Cleaning apparatus
01/22/15Plasma etching apparatus
01/22/15Peeling apparatus and peeling method
Social Network Patent Pack
01/15/15Resin sheet attaching method
01/01/15Flow adjusting apparatus
01/01/15Light emitting chip
01/01/15Stress-resilient chip structure and dicing process
12/11/14Light emitting chip
12/04/14Light emitting chip
11/13/14Laser processing method
10/30/14Wafer processing method
10/23/14Cutting apparatus having blade cover
10/23/14Wafer processing method
10/16/14Processing plate-shaped workpiece
10/16/14Laser processing apparatus and laser processing method
10/16/14Laser processing apparatus
10/16/14Light emitting device
10/09/14Disk-shaped workpiece dividing method
10/09/14Cutting apparatus
10/09/14Laser machining apparatus
10/09/14Platelike workpiece with alignment mark
10/02/14Wafer processing method
10/02/14Sapphire substrate flattening method
09/11/14Light emitting diode
09/11/14Wafer processing method
09/04/14Wafer processing method
08/21/14Cassette assembly
07/31/14Vacuum processing apparatus
07/31/14Laser processing method
07/24/14Wafer processing method
07/17/14Separating apparatus
07/03/14Method for processing plate object

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Disco Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Disco Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by