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Disco Corporation
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Disco Corporation patents

Recent patent applications related to Disco Corporation. Disco Corporation is listed as an Agent/Assignee. Note: Disco Corporation may have other listings under different names/spellings. We're not affiliated with Disco Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Disco Corporation-related inventors




Date Disco Corporation patents (updated weekly) - BOOKMARK this page
08/17/17 new patent  Resin composition and fixing plate-shaped workpiece
08/17/17 new patent  Processing apparatus
08/17/17 new patent  Apparatus having transfer control based on imaged image
08/17/17 new patent  Semiconductor package and manufacturing semiconductor package
08/03/17Electric vehicle and equipment therefor
08/03/17Method of processing a substrate
08/03/17Packaged wafer processing method
07/27/17Jig and processing method using jig
07/27/17Exposure apparatus
07/27/17Wafer processing method
07/27/17Package wafer processing method
07/20/17Scanning mirror
07/20/17Wafer processing method
07/13/17Sic wafer producing method
07/13/17Wafer production method
06/29/17Chip accommodation tray
06/29/17Method of processing wafer
06/29/17Wafer processing method
06/29/17Wafer processing method
06/22/17Protective film detecting laser processing
06/15/17Human transporting drone
06/08/17Method of processing wafer
06/08/17Wafer processing method
06/08/17Wafer processing method
06/01/17Wafer producing method
06/01/17Cleaning method
05/18/17Sic substrate separating method
05/18/17Protective film forming method
05/18/17Wafer dividing method
05/11/17Wafer processing method
04/27/17Cutting aparatus
04/27/17Processing method
04/27/17Wafer processing method
04/20/17Laser processing apparatus
04/13/17Fabrication semiconductor device
04/13/17Wafer processing method
04/13/17Processing optical device wafer
04/06/17Grinding method
04/06/17Optical device wafer processing method
03/30/17Laser processing apparatus
03/30/17Laser processing apparatus
03/23/17Grinding wheel and grinding method
03/16/17Workpiece support jig
03/16/17Method of processing a substrate
03/16/17Method of dividing plate-shaped workpieces
03/16/17Package substrate machining method
03/09/17Laser processing apparatus
03/09/17Chuck table
03/09/17Wafer processing method
03/02/17Cutting blade
03/02/17Method of processing wafer
03/02/17Baw device and manufacturing baw device
02/23/17Wafer processing method
02/23/17Wafer processing method
02/23/17Wafer processing method
02/16/17Laser processing apparatus
02/16/17Wafer processing method and electronic device
02/16/17Support plate and forming support plate
02/09/17Adhesion detecting method
02/09/17Test wafer and using method therefor
02/02/17Wafer processing method
02/02/17Laser processing method
01/26/17Wafer processing method
01/26/17Wafer thinning method
01/26/17Wafer thinning method
Patent Packs
01/19/17Polycrystalline sic wafer producing method
01/19/17Laser processing apparatus
01/19/17Wafer producing method
01/12/17Wafer processing method
12/29/16Small unmanned air vehicle repulsing apparatus
12/29/16Saw device manufacturing method
12/22/16Multi-wire saw
12/22/16Laser processing apparatus and forming through-hole
12/22/16Processing system
12/15/16Abrasive grindstone
12/15/16Wafer processing method
12/08/16Wafer producing method
12/08/16Wafer producing method
12/01/16Processing system
11/24/16Cutting apparatus
Patent Packs
11/24/16Plasma etching apparatus
11/24/16Processing apparatus
11/24/16Wafer processing method
11/17/16Laser processing apparatus
10/27/16Laser processing apparatus
10/27/16Cutting apparatus and cutting method
10/27/16Wafer processing method
10/20/16Wafer producing method
10/20/16Thin plate separating method
10/20/16Workpiece cutting method
10/20/16Method of dividing wafer
10/13/16Method of forming cut groove
10/06/16Wafer producing method
10/06/16Wafer producing method
10/06/16Wafer producing method
10/06/16Method of dividing wafer
09/29/16Method for inspecting cutting blade
09/29/16Workpiece cutting method
09/22/16Cutting apparatus
09/22/16Decompression processing apparatus
09/22/16Method of dividing wafer
09/15/16Process fluid circulation type processing system
09/15/16Grinding wheel
09/15/16Protective film detecting method
09/15/16Method of processing single-crystal substrate
09/15/16Method of processing single-crystal substrate
09/08/16Grinding wheel, grinding apparatus, and grinding wafer
09/08/16Etching method
09/08/16Cutting apparatus and wafer cutting method
09/08/16Processing single-crystal substrate
Social Network Patent Pack
09/01/16Wafer dividing method
08/25/16Wafer divider and wafer division method
08/18/16Abrasive grindstone
08/18/16Wafer processing system
08/18/16Chuck table of processing apparatus
08/11/16Wafer producing method
08/11/16Wafer producing method
08/11/16Wafer producing method
08/04/16Alignment method
08/04/16Method of processing single-crystal member
Patent Packs
07/28/16Cutting blade having cutting edge containing photocatalyst particles
07/21/16Laser machining apparatus
07/21/16Mount flange
07/14/16Laser processing apparatus
07/14/16Wafer processing method
07/14/16Conveying apparatus
07/07/16Wafer producing method
07/07/16Wafer producing method
07/07/16Human resources management system
06/30/16Laser processing plate-shaped workpiece
06/30/16Processing apparatus
06/30/16Method of dividing wafer into dies
06/23/16Wafer processing method
06/16/16Laser processing apparatus
06/16/16Wafer processing method
06/09/16Wafer producing method
06/09/16Wafer producing method
06/09/16Wafer producing method
06/09/16Laser processing apparatus suitable for formation of laser processed hole
06/09/16Wafer producing method
06/09/16Wafer processing method
06/02/16Laser processing apparatus
06/02/16Detection transmission laser beam
05/26/16Package substrate dividing method
05/19/16Grinding workpieces
05/19/16Cutting apparatus
05/19/16Laser oscillation mechanism
05/12/16Grinding apparatus
05/12/16Polishing liquid and polishing sic substrate
05/12/16Laser oscillation mechanism
Patent Packs
05/12/16Method of polishing sic substrate
05/05/16Protective film detecting apparatus and protective film detecting method
05/05/16Wafer processing method
04/21/16Wafer processing method
04/14/16Wafer processing method
04/07/16Laser processing apparatus
04/07/16Wafer inspection method and wafer inspection apparatus
03/31/16Cutting apparatus
03/24/16Wafer processing method
03/17/16Laser processing apparatus
03/17/16Sic ingot slicing method
03/10/16Laser processing apparatus
03/10/16Laser machining apparatus
03/03/16Flange mechanism and cutting apparatus
03/03/16Wafer inspection method and grinding and polishing apparatus
03/03/16Wafer processing method
02/18/16Laser beam spot shape detection method
02/18/16Transfer unit
02/11/16Processing workpiece
02/11/16Wafer processing method
Social Network Patent Pack
02/04/16Wafer processing method
01/28/16Wafer processing method
01/21/16Processing apparatus
01/14/16Lift-off method
01/07/16Chip spacing maintaining apparatus
12/31/15Evaluation device wafer
12/31/15Processing apparatus
12/24/15Gan substrate, and manufacturing gan substrate
12/17/15Wafer processing method
12/10/15Wafer processing method
12/10/15Wafer processing method
12/10/15Lighting apparatus and illumination management the same
12/03/15Chip manufacturing method
11/19/15Lift-off method
11/19/15Wafer processing method
11/19/15Wafer processing method
11/19/15Method of processing wafer
11/19/15Wafer processing method
11/19/15Support plate and forming support plate
11/12/15Laser processing apparatus
Social Network Patent Pack
11/12/15Wafer processing method
10/22/15Wafer processing method
10/15/15Height detecting apparatus
10/08/15Laser processing apparatus
10/08/15Grinding wheel and cleaning grinding chamber
10/08/15Unevenness detecting device
09/17/15Plate-shaped object processing method
09/17/15Workpiece processing method
09/17/15Cutting method
09/17/15Chip arranging method
09/10/15Mems device chip manufacturing method
09/10/15Plate-like object processing method
08/27/15Wafer processing method
08/20/15Semiconductor wafer and producing same
08/06/15Lift-off method
08/06/15Lift-off method
07/30/15Optical device and manufacturing method therefor
07/23/15Separation apparatus
07/23/15Optical device and manufacturing method therefor
07/16/15Mark detecting method
07/02/15Cutting apparatus
07/02/15Wafer processing method
06/25/15Packaging material
06/25/15Device wafer processing method
06/25/15Light emitting chip
06/18/15Package board division method
06/18/15Device wafer processing method
06/11/15Grinding apparatus
06/11/15Processing optical device wafer
06/11/15Wafer processing apparatus
Social Network Patent Pack
06/04/15Cleaning apparatus
06/04/15Processing apparatus
06/04/15Processing package substrate
05/28/15Wafer processing method
05/21/15Workpiece processing method
05/21/15Wafer processing method
05/14/15Wafer processing method
05/07/15Laser processing method and laser processing apparatus
04/16/15Wafer processing method
04/16/15Wafer processing method
04/09/15Wafer processing method
04/09/15Wafer processing method
04/02/15Manufacturing photomask
04/02/15Wafer processing method
03/26/15Device wafer processing method
03/19/15Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element
03/12/15Wafer processing method
03/12/15Device wafer processing method
03/05/15Optical device and manufacturing method therefor
02/19/15Processing apparatus
02/12/15Optical device wafer processing method
02/12/15Dividing wafer
02/05/15Laser processing apparatus
02/05/15Laminated wafer processing method
02/05/15Processing apparatus including laser beam applying mechanism and separating means
01/29/15Crack and thickness detecting apparatus
01/29/15Accommodation cassette
01/22/15Cutting apparatus
01/22/15Cutting apparatus







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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