Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Dpix Llc patents


Recent patent applications related to Dpix Llc. Dpix Llc is listed as an Agent/Assignee. Note: Dpix Llc may have other listings under different names/spellings. We're not affiliated with Dpix Llc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "D" | Dpix Llc-related inventors


Flat panel array with the alignment marks in active area

Test structures and alignment marks enable accurate measurements of alignment in the active area of an image sensor device. The alignment marks are formed in the active area replacing pixels near the lithographic shot boundaries of the array. ... Dpix Llc

Electrostatic discharge (esd) protection for the metal oxide medical device products

An esd circuit includes a first metal oxide channel device having a drain coupled to a first node, a source coupled to a second node, and a gate coupled to the first node; a second metal oxide channel device having a source coupled to the first node, a drain coupled to the second node, and a gate coupled to the second node; a first capacitor coupled between the first and second nodes proximate to the first metal oxide channel device; and a second capacitor coupled between the first and second nodes proximate to the second metal oxide channel device. The esd circuit can further include a third capacitor coupled between the first and second nodes proximate to the first capacitor. ... Dpix Llc

Method of manufacturing a sensor array

A method of manufacturing a sensor array includes providing a carrier glass substrate, forming an amorphous silicon layer over the carrier glass substrate, forming a first heat buffer layer over the amorphous silicon layer; forming a mirror layer over the first heat buffer layer; forming a second heat buffer layer over the mirror layer; forming a flexible substrate over the second heat buffer layer; and forming an active device layer over the flexible substrate. The method of the present invention further comprises exposing the sensor array to light from a flash lamp and then detaching the carrier glass substrate from the sensor array. ... Dpix Llc

Method of optimizing an interface for processing of an organic semiconductor

A method of forming an organic semiconductor includes forming a thin film transistor (“tft”) backplane; forming a pixel well over the tft backplane using a photoresist; performing a first plasma etch of the pixel well; stripping the photoresist in the pixel well; performing a second plasma etch of the pixel well; performing a first wash of the pixel well; exposing the pixel well to ultraviolet light; performing a second wash of the pixel well; and forming an organic photodiode in the pixel well.. . ... Dpix Llc

Method of providing a high density test contact solution

A flexible probe card according to the present invention includes a compression layer; a transport layer coupled to the compression layer; and a contact layer coupled to the transport layer. The compression layer is formed of encapsulated closed cell polyurethane foam. ... Dpix Llc

Test structures for manufacturing process of organic photo diode imaging array

A test structure for characterizing an organic photodiode image sensor includes, on a common substrate, at least one of a cathode sheet resistance portion; a diode capacitance portion; an opd sheet resistance portion; a contact resistance portion; a step coverage portion; a quantum efficiency portion; a film adhesion portion; and an inkjet printing portion.. . ... Dpix Llc

Method of screen printing in manufacturing an image sensor device

A method of manufacturing an image sensor device includes providing a metalized thin film transistor layer on a glass substrate; forming an inter-layer dielectric layer on the metalized thin film transistor layer; forming a via through the inter-layer dielectric layer; forming a metal layer on the inter-layer dielectric for contacting the metalized thin film transistor layer; forming a bank layer on the metal layer and the inter-layer dielectric layer; forming a via through the bank layer; forming an electron transport layer on the bank layer and within the bank layer via for contacting an upper surface of the metal layer; forming a bulk hetero-junction layer on the electron transport layer; forming a hole transport layer on the bulk hetero-junction layer; and forming a top contact layer on the hole transport layer. The bulk hetero-junction layer and/or the top contact layer are applied using a screen printing technique.. ... Dpix Llc

Top gate metal oxide thin film transistor switching device for imaging applications

A method of manufacturing an image sensor device includes providing a substrate; forming a buffer layer on the substrate; forming a metal oxide channel on the buffer layer; forming a gate oxide layer on the buffer layer and the metal oxide channel; forming a gate metal layer on the gate oxide layer; forming a photodiode stack on the gate metal layer; patterning the gate oxide layer and the gate metal layer to form a first portion under the photodiode stack, and a second portion comprising a transistor; forming an interlayer dielectric layer over at least the photodiode stack and the transistor; forming a plurality of vias in the interlayer dielectric layer; and metalizing the vias to form contacts to the image sensor device.. . ... Dpix Llc

Method of manufacturing a semiconductor device

A method of manufacturing an image sensor device includes, in a first manufacturing facility, forming a first set of patterned silicon, metal, and insulating layers on a glass substrate, forming an electrical and mechanical protection layer over the first set of patterned silicon, metal, and insulating layers, and, in a second manufacturing facility, removing the electrical and mechanical protection layer, forming a second set of patterned silicon, metal, and insulating layers over the first set of patterned silicon, metal, and insulating layers, forming a plurality of photosensors in communication with at least the second set of patterned silicon, metal, and insulating layers to form an unpassivated image sensor device, and forming a passivation layer over the unpassivated image sensor device. The materials used in the first set of layers and second set of layers can be completely or partially different.. ... Dpix Llc

Method of manufacturing an image sensor device

A method of manufacturing an image sensor device includes providing a metalized thin film transistor layer on a glass substrate; forming an inter-layer dielectric layer on the metalized thin film transistor layer: forming a via through the inter-layer dielectric layer; forming a metal layer the inter-layer dielectric and within the inter-layer dielectric layer via for contacting the metalized thin film transistor layer; forming a bank layer on the metal layer and the inter-layer dielectric layer: forming a via through the bank layer; forming an electron transport layer on the bank layer and within the bank layer via for contacting an upper surface of the metal layer; forming a bulk heterojunction layer on the electron transport layer; forming a hole transport layer on the bulk heterojunction layer; and forming a top contact layer on the hole transport layer.. . ... Dpix Llc








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Dpix Llc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Dpix Llc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###