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Electro Scientific Industries, Inc. patents


      
Recent patent applications related to Electro Scientific Industries, Inc.. Electro Scientific Industries, Inc. is listed as an Agent/Assignee. Note: Electro Scientific Industries, Inc. may have other listings under different names/spellings. We're not affiliated with Electro Scientific Industries, Inc., we're just tracking patents.

ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Electro Scientific Industries, Inc.-related inventors



Search recent Press Releases: Electro Scientific Industries, Inc.-related press releases
Count Application # Date Electro Scientific Industries, Inc. patents (updated weekly) - BOOKMARK this page
12015000119401/01/15Laser processing beam dithering and skiving
22014034050711/20/14Method of measuring narrow recessed features using machine vision
32014031201310/23/14Laser emission-based control of beam positioner
42014028869309/25/14Image recognition base ablation pattern position recall
52014025965909/18/14Phased array steering for laser beam positioning systems
62014026320109/18/14Laser aod rout processing
72014026321209/18/14Coordination of beam angle and workpiece movement for taper control
82014026322309/18/14Laser aod tool settling for aod travel reduction
92014026813409/18/14Laser sampling methods for reducing thermal effects
102014025620509/11/14Systems and methods for providing polarization compensated multi-spectral laser repair of liquid crystal display panels
112014023139308/21/14Program controlled dicing of a substrate using a pulsed laser beam
122014022399108/14/14In-chamber fluid handling system and methods handling fluids using the same
132014022477508/14/14Laser ablation cell and injector system for a compositional analysis system
142014022777608/14/14Laser ablation cell and torch system for a compositional analysis system
152014019714007/17/14Laser pulse energy control systems and methods
162014019087507/10/14Systems and methods for handling electrical components
172014018278607/03/14Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
182014017506706/26/14Methods of forming images by laser micromachining
192014013872705/22/14Method and processing a workpiece and an article formed thereby
202014011692205/01/14Configurations of apertures in a miniature electronic component carrier mask
212014011038404/24/14Method and marking an article
222014009841004/10/14Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use
232014009106904/03/14Ultrashort laser pulse wafer scribing
242014009182004/03/14Probe out-of-position sensing for automated test equipment
252014009369304/03/14Method and separation of strengthened glass and articles produced thereby
262014009495404/03/14Method and system for adaptively controlling a laser-based material processing process and qualifying same
272014008398303/27/14Method and separation of workpieces and articles produced thereby
282014008398603/27/14Method and machining a workpiece
292014008403903/27/14Method and separating workpieces
302014008404003/27/14Method and separating workpieces
312014002635101/30/14Method and collecting material produced by processing workpieces
322014000306701/02/14Panel with occluded microholes
332013031998212/05/13Method and processing workpieces
342013024956609/26/13Kelvin sense probe calibration
352013025196009/26/13Method and reliably laser marking articles
362013023414909/12/13Sidewall texturing of light emitting diode structures
372013023703509/12/13Method and laser singulation of brittle materials
382013022105308/29/13Method and separation of strengthened glass and articles produced thereby
392013022304408/29/13Products with a patterned light-transmissive portion
402013022443308/29/13Method and machining strengthened glass and articles produced thereby
412013022443908/29/13Method and separation of strengthened glass and articles produced thereby
422013020807408/15/13Method and reliably laser marking articles
432013019361708/01/13Systems and methods for separating non-metallic materials
442013016854507/04/13Spectroscopy data display systems and methods
452013016151006/27/13Method and adjusting radiation spot size
462013016299106/27/13Apparatus and transporting an aerosol
472013015415906/20/13Drilling holes with minimal taper in cured silicone
482013014641806/13/13Sorting apparatus and sorting components
492013014301306/06/13Method and reliably laser marking articles
502013012794805/23/13Method and reliably laser marking articles
512013008970104/11/13Substrate containing aperture and methods of forming the same
522013008244804/04/13Controlled surface roughness in vacuum retention
532013004270302/21/13Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
542013003071701/31/13Method and characterizing objects and monitoring manufacturing processes
552012032924612/27/12Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
562012031863912/20/12Shallow angle vertical rotary loader for electronic device testing
572012031877612/20/12Method and machining a workpiece
582012031971212/20/12Probe module with interleaved serpentine test contacts for electronic device testing
592012027347211/01/12Laser processing beam dithering and skiving
602012026735010/25/12Method and laser drilling holes with gaussian pulses
612012026355910/18/12Electronic component handler having gap set device
622012026423810/18/12Program controlled dicing of a substrate using a pulsed laser beam
632012024807510/04/12Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
642012024917210/04/12Alignment system for electronic device testing
652012024917510/04/12Conveyor-mountable carrier for electronic device testing
662012025013410/04/12Adaptive optic beamshaping in laser processing systems
672012025070710/04/12Stabilization of pulsed mode seed lasers
682012021147708/23/12Method and improved laser scribing of opto-electric devices
692012020834908/16/12Support for wafer singulation
702012017565207/12/12Method and improved singulation of light emitting devices
712012016841207/05/12Apparatus and forming an aperture in a substrate
722012016907907/05/12Apparatus and handling a substrate
732012017100207/05/12Apparatus and transferring a substrate
742012016081406/28/12Methods and systems for link processing using laser pulses with optimized temporal power profiles and polarizations
752012015291806/21/12Reducing back-reflection in laser micromachining systems
762012015816906/21/12Closed-loop silicon etching control method and system
772012014568606/14/12On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
782012013262805/31/12Orthogonal integrated cleaving device
792012013262905/31/12Method and reducing taper of laser scribes
802012013338105/31/12Stackable semiconductor chip with edge features and methods of fabricating and processing same
812012010395305/03/12Laser machining of fired ceramic and other hard and/or thick materials
822012010034804/26/12Method and optimally laser marking articles
832012009275504/19/12Tandem photonic amplifier
842012006469503/15/12Dicing a semiconductor wafer
852012004985703/01/12Programmable gain trans-impedance amplifier overload recovery circuit
862012004330602/23/12Method and optimally laser marking articles
872011031566712/29/11Method and reliably laser marking articles
882011029815612/08/11Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
892011028760711/24/11Method and improved wafer singulation
902011027238811/10/11Photonic clock stabilized laser comb processing
912011027318411/10/11System and improved testing of electronic devices
922011026767111/03/11Combining multiple laser beams to form high repetition rate, high average power polarized laser beam
932011024061610/06/11Laser singulation of brittle materials
942011024083910/06/11Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
952011024171810/06/11Test plate for electronic component handler
962011024230710/06/11Touch screen interface for laser processing
972011024263910/06/11Method for accomplishing high-speed intensity variation of a polarized output laser beam
982011024316310/06/11Wedge-faceted nonlinear crystal for harmonic generation
992011023664509/29/11Method of manufacturing a panel with occluded microholes and products made thereby
1002011022059509/15/11High strength, high density carrier plate
1012011022229809/15/11Panel with micro-hole pattern in a structurally thin portion
1022011021010309/01/11Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
1032011020834308/25/11Tracking and marking specimens having defects formed during laser via drilling
1042011019392808/11/11Method and reliably laser marking articles
1052011019392908/11/11Method and reliably laser marking articles
1062011019457408/11/11Method and reliably laser marking articles
1072011017767407/21/11Processing of multilayer semiconductor wafers
1082011014706706/23/11Method and optically transparent via filling
1092011014734806/23/11Adaptive processing constraints for memory repair
1102011015104606/23/11Method and optically transparent via filling
1112011013180706/09/11Process for forming an isolated electrically conductive contact through a metal package
1122011008557404/14/11Methods and systems for generating pulse trains for material processing
1132011002912402/03/11Program controlled dicing of a substrate using a pulsed laser beam
1142010032149112/23/10Achieving convergent light rays emitted by planar array of light sources
1152010031020012/09/10Rotary flexure and air bearing support for rotary indexing system
1162010030102312/02/10Acousto-optic deflector applications in laser processing of dielectric or other materials
1172010030102412/02/10Laser processing systems using through-the-lens alignment of a laser beam with a target feature
1182010030102812/02/10Method and hybrid resolution feedback of a motion stage
1192010029896411/25/10Apparatus and non-contact sensing of transparent articles
1202010027640511/04/10Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
1212010025254010/07/10Method and brittle materials processing
1222010025295910/07/10Method for improved brittle materials processing
1232010025680210/07/10System and improved testing of electronic devices
1242010024361709/30/10Printed circuit board via drilling stage assembly
1252010024362209/30/10Force reaction compensation system
1262010024362509/30/10Minimizing thermal effect during material removal using a laser
1272010024362609/30/10Method and laser machining
1282010024661109/30/10Laser micromachining with tailored bursts of short laser pulses
1292010024661509/30/10Intracavity harmonic generation using a recycled intermediate harmonic
1302010020669308/19/10Long axis component loader
1312010020676908/19/10High strength, high density carrier plate
1322010019348108/05/10Laser constructed with multiple output couplers to generate multiple output beams
1332010018914507/29/10Laser with gain medium suppressing higher order modes to provide lasing output with high beam quality
1342010017779407/15/10Pulse temporal programmable ultrafast burst mode laser for micromachining
1352010017151207/08/10Self-testing, monitoring and diagnostics in grouped circuitry modules
1362010016430507/01/10Monolithic stage positioning system and method
1372010014781306/17/10Method for laser processing glass with a chamfered edge
1382010014023706/10/10Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
1392010013365106/03/10Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
1402010011889905/13/10Generating laser pulses of prescribed pulse shapes programmed through combination of separate electrical and optical modulators
1412010009923904/22/10Laser machining
1422010008988104/15/10Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
1432010008466204/08/10Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
1442010007841904/01/10Post-lens steering of a laser beam for micro-machining applications
1452010007841804/01/10Method of laser micro-machining stainless steel with high cosmetic quality
1462010005949003/11/10Adaptive optic beamshaping in laser processing systems
1472010006077303/11/10Apparatus and optically converting a three-dimensional object into a two-dimensional planar image
1482010004409202/25/10Method and optically transparent via filling
1492010004656102/25/10High energy pulse suppression method
1502010003241702/11/10Micromachining with short-pulsed, solid-state uv laser
1512009031475312/24/09Debris capture and removal for laser micromachining
1522009031475412/24/09Pre-process stress loading components for post-process warp control
1532009030885212/17/09Reducing back-reflections in laser processing systems
1542009030885312/17/09Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
1552009031285812/17/09Method for defining safe zones in laser machining systems
1562009031285912/17/09Modifying entry angles associated with circular tooling actions to improve throughput in part machining
1572009024252110/01/09On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
1582009024252210/01/09Photonic milling using dynamic beam arrays
1592009024252510/01/09Laser machining of fired ceramic and other hard and/or thick materials
1602009024252610/01/09Laser micromachining through a protective member
1612009024252810/01/09Method and laser drilling holes with gaussian pulses
1622009024253110/01/09Photonic clock stabilized laser comb processing
1632009024340310/01/09Recoilless voice coil actuator and method
1642009024363610/01/09Programmable gain trans-impedance amplifier overload recovery circuit
1652009024530010/01/09Systems and methods for laser pulse equalization
1662009024530210/01/09Methods and systems for dynamically generating tailored laser pulses
1672009024530410/01/09Multi-pass optical power amplifier
1682009024531710/01/09Laser with highly efficient gain medium
1692009024561410/01/09Method and detecting defects using structured light
1702009023632309/24/09Method and laser drilling holes with tailored laser pulses
1712009022478909/10/09Automated contact alignment tool
1722009022553909/10/09Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
1732009021951809/03/09Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
1742009017901707/16/09Process and system for quality management and analysis of via drilling
1752009017920107/16/09Laser chalcogenide phase change device
1762009016123806/25/09Flexure guide bearing for short stroke stage
1772009015593506/18/09Back side wafer dicing
1782009014711206/11/09Method and achieving panchromatic response from a color-mosaic imager
1792009014175006/04/09Systems and methods for link processing with ultrafast and nanosecond laser pulses
1802009012716905/21/09Electronic component handler test plate
1812009004583002/19/09Automated contact alignment tool


ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Electro Scientific Industries, Inc. in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Electro Scientific Industries, Inc. with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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