new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)


Popular
Companies


Web
Adobe patents
Amazon patents
Apple patents
Ebay patents
Facebook patents
Google patents
IBM patents
Linkedin patents
Microsoft patents
Oracle patents
Red Hat patents
Yahoo patents

Food/Health
Adidas
Nike patents
Pfizer patents
Monsanto patents
Medtronic patents
Kraft patents

Transportation
Boeing patents
Tesla Motors patents

Telecom
Qualcomm patents
Motorola patents
Nokia patents
RIMM patents

Industrial/Electronics
AMD
Applied Materials
Seagate patents
General Electric
Caterpillar patents
Samsung
Wal-mart patents

  

Electro Scientific Industries Inc patents


      
Recent patent applications related to Electro Scientific Industries Inc. Electro Scientific Industries Inc is listed as an Agent/Assignee. Note: Electro Scientific Industries Inc may have other listings under different names/spellings. We're not affiliated with Electro Scientific Industries Inc, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Electro Scientific Industries Inc-related inventors




Count Application # Date Electro Scientific Industries Inc patents (updated weekly) - BOOKMARK this page
12015027457410/01/15 Laser machining strengthened glass
22015024857009/03/15 Optical mark reader
32015024860209/03/15 Modified two-dimensional codes, and laser producing such codes
42015023906408/27/15 Methods and systems for laser processing continuously moving sheet material
52015020990207/30/15 Method and optimally laser marking articles
62015015811606/11/15 Method and internally marking a substrate having a rough surface
72015005046802/19/15 Laser internally marking thin layers, and articles produced thereby
82015000119401/01/15 Laser processing beam dithering and skiving
92014034050711/20/14 Method of measuring narrow recessed features using machine vision
102014031201310/23/14 Laser emission-based control of beam positioner
112014028869309/25/14 Image recognition base ablation pattern position recall
122014025965909/18/14 Phased array steering for laser beam positioning systems
132014026320109/18/14 Laser aod rout processing
142014026321209/18/14 Coordination of beam angle and workpiece movement for taper control
152014026322309/18/14 Laser aod tool settling for aod travel reduction
162014026813409/18/14 Laser sampling methods for reducing thermal effects
172014025620509/11/14 Systems and methods for providing polarization compensated multi-spectral laser repair of liquid crystal display panels
182014023139308/21/14 Program controlled dicing of a substrate using a pulsed laser beam
192014022399108/14/14 In-chamber fluid handling system and methods handling fluids using the same
202014022477508/14/14 Laser ablation cell and injector system for a compositional analysis system
212014022777608/14/14 Laser ablation cell and torch system for a compositional analysis system
222014019714007/17/14 Laser pulse energy control systems and methods
232014019087507/10/14 Systems and methods for handling electrical components
242014018278607/03/14 Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
252014017506706/26/14 Methods of forming images by laser micromachining
262014013872705/22/14 Method and processing a workpiece and an article formed thereby
272014011692205/01/14 Configurations of apertures in a miniature electronic component carrier mask
282014011038404/24/14 Method and marking an article
292014009841004/10/14 Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use
302014009106904/03/14 Ultrashort laser pulse wafer scribing
312014009182004/03/14 Probe out-of-position sensing for automated test equipment
322014009369304/03/14 Method and separation of strengthened glass and articles produced thereby
332014009495404/03/14 Method and system for adaptively controlling a laser-based material processing process and qualifying same
342014008398303/27/14 Method and separation of workpieces and articles produced thereby
352014008398603/27/14 Method and machining a workpiece
362014008403903/27/14 Method and separating workpieces
372014008404003/27/14 Method and separating workpieces
382014002635101/30/14 Method and collecting material produced by processing workpieces
392014000306701/02/14 Panel with occluded microholes
402013031998212/05/13 Method and processing workpieces
412013024956609/26/13 Kelvin sense probe calibration
422013025196009/26/13 Method and reliably laser marking articles
432013023414909/12/13 Sidewall texturing of light emitting diode structures
442013023703509/12/13 Method and laser singulation of brittle materials
452013022105308/29/13 Method and separation of strengthened glass and articles produced thereby
462013022304408/29/13 Products with a patterned light-transmissive portion
472013022443308/29/13 Method and machining strengthened glass and articles produced thereby
482013022443908/29/13 Method and separation of strengthened glass and articles produced thereby
492013020807408/15/13 Method and reliably laser marking articles
502013019361708/01/13 Systems and methods for separating non-metallic materials
512013016854507/04/13 Spectroscopy data display systems and methods
522013016151006/27/13 Method and adjusting radiation spot size
532013016299106/27/13 Apparatus and transporting an aerosol
542013015415906/20/13 Drilling holes with minimal taper in cured silicone
552013014641806/13/13 Sorting apparatus and sorting components
562013014301306/06/13 Method and reliably laser marking articles
572013012794805/23/13 Method and reliably laser marking articles
582013008970104/11/13 Substrate containing aperture and methods of forming the same
592013008244804/04/13 Controlled surface roughness in vacuum retention
602013004270302/21/13 Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
612013003071701/31/13 Method and characterizing objects and monitoring manufacturing processes
622012032924612/27/12 Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
632012031863912/20/12 Shallow angle vertical rotary loader for electronic device testing
642012031877612/20/12 Method and machining a workpiece
652012031971212/20/12 Probe module with interleaved serpentine test contacts for electronic device testing
662012027347211/01/12 Laser processing beam dithering and skiving
672012026735010/25/12 Method and laser drilling holes with gaussian pulses
682012026355910/18/12 Electronic component handler having gap set device
692012026423810/18/12 Program controlled dicing of a substrate using a pulsed laser beam
702012024807510/04/12 Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
712012024917210/04/12 Alignment system for electronic device testing
722012024917510/04/12 Conveyor-mountable carrier for electronic device testing
732012025013410/04/12 Adaptive optic beamshaping in laser processing systems
742012025070710/04/12 Stabilization of pulsed mode seed lasers
752012021147708/23/12 Method and improved laser scribing of opto-electric devices
762012020834908/16/12 Support for wafer singulation
772012017565207/12/12 Method and improved singulation of light emitting devices
782012016841207/05/12 Apparatus and forming an aperture in a substrate
792012016907907/05/12 Apparatus and handling a substrate
802012017100207/05/12 Apparatus and transferring a substrate
812012016081406/28/12 Methods and systems for link processing using laser pulses with optimized temporal power profiles and polarizations
822012015291806/21/12 Reducing back-reflection in laser micromachining systems
832012015816906/21/12 Closed-loop silicon etching control method and system
842012014568606/14/12 On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
852012013262805/31/12 Orthogonal integrated cleaving device
862012013262905/31/12 Method and reducing taper of laser scribes
872012013338105/31/12 Stackable semiconductor chip with edge features and methods of fabricating and processing same
882012010395305/03/12 Laser machining of fired ceramic and other hard and/or thick materials
892012010034804/26/12 Method and optimally laser marking articles
902012009275504/19/12 Tandem photonic amplifier
912012006469503/15/12 Dicing a semiconductor wafer
922012004985703/01/12 Programmable gain trans-impedance amplifier overload recovery circuit
932012004330602/23/12 Method and optimally laser marking articles
942011031566712/29/11 Method and reliably laser marking articles
952011029815612/08/11 Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
962011028760711/24/11 Method and improved wafer singulation
972011027238811/10/11 Photonic clock stabilized laser comb processing
982011027318411/10/11 System and improved testing of electronic devices
992011026767111/03/11 Combining multiple laser beams to form high repetition rate, high average power polarized laser beam
1002011024061610/06/11 Laser singulation of brittle materials
1012011024083910/06/11 Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
1022011024171810/06/11 Test plate for electronic component handler
1032011024230710/06/11 Touch screen interface for laser processing
1042011024263910/06/11 Method for accomplishing high-speed intensity variation of a polarized output laser beam
1052011024316310/06/11 Wedge-faceted nonlinear crystal for harmonic generation
1062011023664509/29/11 Method of manufacturing a panel with occluded microholes and products made thereby
1072011022059509/15/11 High strength, high density carrier plate
1082011022229809/15/11 Panel with micro-hole pattern in a structurally thin portion
1092011021010309/01/11 Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
1102011020834308/25/11 Tracking and marking specimens having defects formed during laser via drilling
1112011019392808/11/11 Method and reliably laser marking articles
1122011019392908/11/11 Method and reliably laser marking articles
1132011019457408/11/11 Method and reliably laser marking articles
1142011017767407/21/11 Processing of multilayer semiconductor wafers
1152011014706706/23/11 Method and optically transparent via filling
1162011014734806/23/11 Adaptive processing constraints for memory repair
1172011015104606/23/11 Method and optically transparent via filling
1182011013180706/09/11 Process for forming an isolated electrically conductive contact through a metal package
1192011008557404/14/11 Methods and systems for generating pulse trains for material processing
1202011002912402/03/11 Program controlled dicing of a substrate using a pulsed laser beam
1212010032149112/23/10 Achieving convergent light rays emitted by planar array of light sources
1222010031020012/09/10 Rotary flexure and air bearing support for rotary indexing system
1232010030102312/02/10 Acousto-optic deflector applications in laser processing of dielectric or other materials
1242010030102412/02/10 Laser processing systems using through-the-lens alignment of a laser beam with a target feature
1252010030102812/02/10 Method and hybrid resolution feedback of a motion stage
1262010029896411/25/10 Apparatus and non-contact sensing of transparent articles
1272010027640511/04/10 Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
1282010025254010/07/10 Method and brittle materials processing
1292010025295910/07/10 Method for improved brittle materials processing
1302010025680210/07/10 System and improved testing of electronic devices
1312010024361709/30/10 Printed circuit board via drilling stage assembly
1322010024362209/30/10 Force reaction compensation system
1332010024362509/30/10 Minimizing thermal effect during material removal using a laser
1342010024362609/30/10 Method and laser machining
1352010024661109/30/10 Laser micromachining with tailored bursts of short laser pulses
1362010024661509/30/10 Intracavity harmonic generation using a recycled intermediate harmonic
1372010020669308/19/10 Long axis component loader
1382010020676908/19/10 High strength, high density carrier plate
1392010019348108/05/10 Laser constructed with multiple output couplers to generate multiple output beams
1402010018914507/29/10 Laser with gain medium suppressing higher order modes to provide lasing output with high beam quality
1412010017779407/15/10 Pulse temporal programmable ultrafast burst mode laser for micromachining
1422010017151207/08/10 Self-testing, monitoring and diagnostics in grouped circuitry modules
1432010016430507/01/10 Monolithic stage positioning system and method
1442010014781306/17/10 Method for laser processing glass with a chamfered edge
1452010014023706/10/10 Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
1462010013365106/03/10 Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
1472010011889905/13/10 Generating laser pulses of prescribed pulse shapes programmed through combination of separate electrical and optical modulators
1482010009923904/22/10 Laser machining
1492010008988104/15/10 Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
1502010008466204/08/10 Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
1512010007841904/01/10 Post-lens steering of a laser beam for micro-machining applications
1522010007841804/01/10 Method of laser micro-machining stainless steel with high cosmetic quality
1532010005949003/11/10 Adaptive optic beamshaping in laser processing systems
1542010006077303/11/10 Apparatus and optically converting a three-dimensional object into a two-dimensional planar image
1552010004409202/25/10 Method and optically transparent via filling
1562010004656102/25/10 High energy pulse suppression method
1572010003241702/11/10 Micromachining with short-pulsed, solid-state uv laser
1582009031475312/24/09 Debris capture and removal for laser micromachining
1592009031475412/24/09 Pre-process stress loading components for post-process warp control
1602009030885212/17/09 Reducing back-reflections in laser processing systems
1612009030885312/17/09 Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
1622009031285812/17/09 Method for defining safe zones in laser machining systems
1632009031285912/17/09 Modifying entry angles associated with circular tooling actions to improve throughput in part machining
1642009024252110/01/09 On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
1652009024252210/01/09 Photonic milling using dynamic beam arrays
1662009024252510/01/09 Laser machining of fired ceramic and other hard and/or thick materials
1672009024252610/01/09 Laser micromachining through a protective member
1682009024252810/01/09 Method and laser drilling holes with gaussian pulses
1692009024253110/01/09 Photonic clock stabilized laser comb processing
1702009024340310/01/09 Recoilless voice coil actuator and method
1712009024363610/01/09 Programmable gain trans-impedance amplifier overload recovery circuit
1722009024530010/01/09 Systems and methods for laser pulse equalization
1732009024530210/01/09 Methods and systems for dynamically generating tailored laser pulses
1742009024530410/01/09 Multi-pass optical power amplifier
1752009024531710/01/09 Laser with highly efficient gain medium
1762009024561410/01/09 Method and detecting defects using structured light
1772009023632309/24/09 Method and laser drilling holes with tailored laser pulses
1782009022478909/10/09 Automated contact alignment tool
1792009022553909/10/09 Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
1802009021951809/03/09 Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
1812009017901707/16/09 Process and system for quality management and analysis of via drilling
1822009017920107/16/09 Laser chalcogenide phase change device
1832009016123806/25/09 Flexure guide bearing for short stroke stage
1842009015593506/18/09 Back side wafer dicing
1852009014711206/11/09 Method and achieving panchromatic response from a color-mosaic imager
1862009014175006/04/09 Systems and methods for link processing with ultrafast and nanosecond laser pulses
1872009012716905/21/09 Electronic component handler test plate
1882009004583002/19/09 Automated contact alignment tool



ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Electro Scientific Industries Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Electro Scientific Industries Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###