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Electro Scientific Industries, Inc. patents

Recent patent applications related to Electro Scientific Industries, Inc.. Electro Scientific Industries, Inc. is listed as an Agent/Assignee. Note: Electro Scientific Industries, Inc. may have other listings under different names/spellings. We're not affiliated with Electro Scientific Industries, Inc., we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Electro Scientific Industries, Inc.-related inventors

Search recent Press Releases: Electro Scientific Industries, Inc.-related press releases
Count Application # Date Electro Scientific Industries, Inc. patents (updated weekly) - BOOKMARK this page
12014034050711/20/14Method of measuring narrow recessed features using machine vision
22014031201310/23/14Laser emission-based control of beam positioner
32014028869309/25/14Image recognition base ablation pattern position recall
42014025965909/18/14Phased array steering for laser beam positioning systems
52014026320109/18/14Laser systems and methods for aod rout processing
62014026321209/18/14Coordination of beam angle and workpiece movement for taper control
72014026322309/18/14Laser systems and methods for aod tool settling for aod travel reduction
82014026813409/18/14Laser sampling methods for reducing thermal effects
92014025620509/11/14Providing polarization compensated multi-spectral laser repair of liquid crystal display panels
102014023139308/21/14Program controlled dicing of a substrate using a pulsed laser beam
112014022399108/14/14In-chamber fluid handling system and methods handling fluids using the same
122014022477508/14/14Laser ablation cell and injector system for a compositional analysis system
132014022777608/14/14Laser ablation cell and torch system for a compositional analysis system
142014019714007/17/14Laser pulse energy control systems and methods
152014019087507/10/14Handling electrical components
162014018278607/03/14Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
172014017506706/26/14Methods of forming images by laser micromachining
182014013872705/22/14Processing a workpiece and an article formed thereby
192014011692205/01/14Configurations of apertures in a miniature electronic component carrier mask
202014011038404/24/14Marking an article
212014009841004/10/14Providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use
222014009106904/03/14Ultrashort laser pulse wafer scribing
232014009182004/03/14Probe out-of-position sensing for automated test equipment
242014009369304/03/14Separation of strengthened glass and articles produced thereby
252014009495404/03/14Adaptively controlling a laser-based material processing process and method and system for qualifying same
262014008398303/27/14Separation of workpieces and articles produced thereby
272014008398603/27/14Machining a workpiece
282014008403903/27/14Separating workpieces
292014008404003/27/14Separating workpieces
302014002635101/30/14Collecting material produced by processing workpieces
312014000306701/02/14Panel with occluded microholes
322013031998212/05/13Processing workpieces
332013024956609/26/13Kelvin sense probe calibration
342013025196009/26/13Reliably laser marking articles
352013023414909/12/13Sidewall texturing of light emitting diode structures
362013023703509/12/13Laser singulation of brittle materials
372013022105308/29/13Separation of strengthened glass and articles produced thereby
382013022304408/29/13Products with a patterned light-transmissive portion
392013022443308/29/13Machining strengthened glass and articles produced thereby
402013022443908/29/13Separation of strengthened glass and articles produced thereby
412013020807408/15/13Reliably laser marking articles
422013019361708/01/13Separating non-metallic materials
432013016854507/04/13Spectroscopy data display systems and methods
442013016151006/27/13Adjusting radiation spot size
452013016299106/27/13Apparatus and method for transporting an aerosol
462013015415906/20/13Drilling holes with minimal taper in cured silicone
472013014641806/13/13Sorting apparatus and method of sorting components
482013014301306/06/13Reliably laser marking articles
492013012794805/23/13Reliably laser marking articles
502013008970104/11/13Substrate containing aperture and methods of forming the same
512013008244804/04/13Controlled surface roughness in vacuum retention
522013004270302/21/13Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
532013003071701/31/13Characterizing objects and monitoring manufacturing processes
542012032924612/27/12Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
552012031863912/20/12Shallow angle vertical rotary loader for electronic device testing
562012031877612/20/12Machining a workpiece
572012031971212/20/12Probe module with interleaved serpentine test contacts for electronic device testing
582012027347211/01/12Laser processing systems and methods for beam dithering and skiving
592012026735010/25/12Laser drilling holes with gaussian pulses
602012026355910/18/12Electronic component handler having gap set device
612012026423810/18/12Program controlled dicing of a substrate using a pulsed laser beam
622012024807510/04/12Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
632012024917210/04/12Alignment system for electronic device testing
642012024917510/04/12Conveyor-mountable carrier for electronic device testing
652012025013410/04/12Adaptive optic beamshaping in laser processing systems
662012025070710/04/12Stabilization of pulsed mode seed lasers
672012021147708/23/12Improved laser scribing of opto-electric devices
682012020834908/16/12Support for wafer singulation
692012017565207/12/12Improved singulation of light emitting devices
702012016841207/05/12Apparatus and method for forming an aperture in a substrate
712012016907907/05/12Apparatus and method for handling a substrate
722012017100207/05/12Apparatus and method for transferring a substrate
732012016081406/28/12Link processing using laser pulses with optimized temporal power profiles and polarizations
742012015291806/21/12Reducing back-reflection in laser micromachining systems
752012015816906/21/12Closed-loop silicon etching control method and system
762012014568606/14/12On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
772012013262805/31/12Orthogonal integrated cleaving device
782012013262905/31/12Reducing taper of laser scribes
792012013338105/31/12Stackable semiconductor chip with edge features and methods of fabricating and processing same
802012010395305/03/12Laser machining of fired ceramic and other hard and/or thick materials
812012010034804/26/12Optimally laser marking articles
822012009275504/19/12Tandem photonic amplifier
832012006469503/15/12Dicing a semiconductor wafer
842012004985703/01/12Programmable gain trans-impedance amplifier overload recovery circuit
852012004330602/23/12Optimally laser marking articles
862011031566712/29/11Reliably laser marking articles
872011029815612/08/11Laser processing a workpiece using a plurality of tailored laser pulse shapes
882011028760711/24/11Improved wafer singulation
892011027238811/10/11Photonic clock stabilized laser comb processing
902011027318411/10/11Improved testing of electronic devices
912011026767111/03/11Combining multiple laser beams to form high repetition rate, high average power polarized laser beam
922011024061610/06/11Method and apparatus for laser singulation of brittle materials
932011024083910/06/11Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
942011024171810/06/11Test plate for electronic component handler
952011024230710/06/11Touch screen interface for laser processing
962011024263910/06/11Method for accomplishing high-speed intensity variation of a polarized output laser beam
972011024316310/06/11Wedge-faceted nonlinear crystal for harmonic generation
982011023664509/29/11Method of manufacturing a panel with occluded microholes and products made thereby
992011022059509/15/11High strength, high density carrier plate
1002011022229809/15/11Panel with micro-hole pattern in a structurally thin portion
1012011021010309/01/11Processing semiconductor structures using laser pulses laterally distributed in a scanning window
1022011020834308/25/11Tracking and marking specimens having defects formed during laser via drilling
1032011019392808/11/11Reliably laser marking articles
1042011019392908/11/11Reliably laser marking articles
1052011019457408/11/11Reliably laser marking articles
1062011017767407/21/11Processing of multilayer semiconductor wafers
1072011014706706/23/11Optically transparent via filling
1082011014734806/23/11Adaptive processing constraints for memory repair
1092011015104606/23/11Optically transparent via filling
1102011013180706/09/11Process for forming an isolated electrically conductive contact through a metal package
1112011008557404/14/11Generating pulse trains for material processing
1122011002912402/03/11Program controlled dicing of a substrate using a pulsed laser beam
1132010032149112/23/10Achieving convergent light rays emitted by planar array of light sources
1142010031020012/09/10Rotary flexure and air bearing support for rotary indexing system
1152010030102312/02/10Acousto-optic deflector applications in laser processing of dielectric or other materials
1162010030102412/02/10Laser processing systems using through-the-lens alignment of a laser beam with a target feature
1172010030102812/02/10Hybrid resolution feedback of a motion stage
1182010029896411/25/10Apparatus and method for non-contact sensing of transparent articles
1192010027640511/04/10Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
1202010025254010/07/10Brittle materials processing
1212010025295910/07/10Method for improved brittle materials processing
1222010025680210/07/10Improved testing of electronic devices
1232010024361709/30/10Printed circuit board via drilling stage assembly
1242010024362209/30/10Force reaction compensation system
1252010024362509/30/10Minimizing thermal effect during material removal using a laser
1262010024362609/30/10Laser machining
1272010024661109/30/10Laser micromachining with tailored bursts of short laser pulses
1282010024661509/30/10Intracavity harmonic generation using a recycled intermediate harmonic
1292010020669308/19/10Long axis component loader
1302010020676908/19/10High strength, high density carrier plate
1312010019348108/05/10Laser constructed with multiple output couplers to generate multiple output beams
1322010018914507/29/10Laser with gain medium suppressing higher order modes to provide lasing output with high beam quality
1332010017779407/15/10Pulse temporal programmable ultrafast burst mode laser for micromachining
1342010017151207/08/10Self-testing, monitoring and diagnostics in grouped circuitry modules
1352010016430507/01/10Monolithic stage positioning system and method
1362010014781306/17/10Method for laser processing glass with a chamfered edge
1372010014023706/10/10Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
1382010013365106/03/10Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
1392010011889905/13/10Generating laser pulses of prescribed pulse shapes programmed through combination of separate electrical and optical modulators
1402010009923904/22/10Laser machining
1412010008988104/15/10Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
1422010008466204/08/10Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
1432010007841904/01/10Post-lens steering of a laser beam for micro-machining applications
1442010007841804/01/10Method of laser micro-machining stainless steel with high cosmetic quality
1452010005949003/11/10Adaptive optic beamshaping in laser processing systems
1462010006077303/11/10Apparatus and method for optically converting a three-dimensional object into a two-dimensional planar image
1472010004409202/25/10Optically transparent via filling
1482010004656102/25/10High energy pulse suppression method
1492010003241702/11/10Micromachining with short-pulsed, solid-state uv laser
1502009031475312/24/09Debris capture and removal for laser micromachining
1512009031475412/24/09Pre-process stress loading components for post-process warp control
1522009030885212/17/09Reducing back-reflections in laser processing systems
1532009030885312/17/09Eliminating head-to-head offsets along common chuck travel direction in multi-head laser machining systems
1542009031285812/17/09Method for defining safe zones in laser machining systems
1552009031285912/17/09Modifying entry angles associated with circular tooling actions to improve throughput in part machining
1562009024252110/01/09On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
1572009024252210/01/09Photonic milling using dynamic beam arrays
1582009024252510/01/09Laser machining of fired ceramic and other hard and/or thick materials
1592009024252610/01/09Laser micromachining through a protective member
1602009024252810/01/09Laser drilling holes with gaussian pulses
1612009024253110/01/09Photonic clock stabilized laser comb processing
1622009024340310/01/09Recoilless voice coil actuator and method
1632009024363610/01/09Programmable gain trans-impedance amplifier overload recovery circuit
1642009024530010/01/09Laser pulse equalization
1652009024530210/01/09Dynamically generating tailored laser pulses
1662009024530410/01/09Multi-pass optical power amplifier
1672009024531710/01/09Laser with highly efficient gain medium
1682009024561410/01/09Detecting defects using structured light
1692009023632309/24/09Laser drilling holes with tailored laser pulses
1702009022478909/10/09Automated contact alignment tool
1712009022553909/10/09Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
1722009021951809/03/09Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination
1732009017901707/16/09Process and system for quality management and analysis of via drilling
1742009017920107/16/09Laser chalcogenide phase change device
1752009016123806/25/09Flexure guide bearing for short stroke stage
1762009015593506/18/09Back side wafer dicing
1772009014711206/11/09Achieving panchromatic response from a color-mosaic imager
1782009014175006/04/09Link processing with ultrafast and nanosecond laser pulses
1792009012716905/21/09Electronic component handler test plate
1802009004583002/19/09Automated contact alignment tool

ARCHIVE: New 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Electro Scientific Industries, Inc. in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Electro Scientific Industries, Inc. with additional patents listed. Browse our Agent directory for other possible listings. Page by



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