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Endicott Interconnect Technologies Inc patents

Recent patent applications related to Endicott Interconnect Technologies Inc. Endicott Interconnect Technologies Inc is listed as an Agent/Assignee. Note: Endicott Interconnect Technologies Inc may have other listings under different names/spellings. We're not affiliated with Endicott Interconnect Technologies Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Endicott Interconnect Technologies Inc-related inventors

Date Endicott Interconnect Technologies Inc patents (updated weekly) - BOOKMARK this page
10/10/13Method of making a semiconductor radiation detector
02/07/13Liquid crystal polymer (lcp) surface layer adhesion enhancement
02/07/13Electrically conductive adhesive (eca) for multilayer device interconnects
01/31/13Thermal substrate
10/11/12Method of cavity forming on a buried resistor layer using a fusion bonding process
10/11/12Conductive metal micro-pillars for enhanced electrical interconnection
10/11/12Modular, detachable compute leaf for use with computing system
10/04/12Coreless layer laminated chip carrier having system in package structure
09/27/12Land grid array (lga) contact connector modification
09/27/12Conductive metal nub for enhanced electrical interconnection, and information handling system utilizing same
09/13/12Defective conductive surface pad repair for microelectronic circuit cards
09/13/12Circuitized substrate with internal thin film capacitor and making same
09/06/12Method of forming multilayer capacitors in a printed circuit substrate
08/09/12Electronic package with thermal interposer and making same
06/28/12Coreless layer buildup structure with lga
06/28/12Coreless layer buildup structure
06/28/12Electronic package and making same
06/21/12Circuitized substrate with dielectric interposer assembly and method
05/10/12High bandwidth semiconductor ball grid array package
03/22/12Anti-tamper microchip package based on thermal nanofluids or fluids
03/22/12Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
03/22/12Conducting paste for device level interconnects
02/09/12Coreless layer buildup structure with lga and joining layer
01/26/12Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and making said substrate
01/19/12Method of forming fibrous laminate chip carrier structures
01/19/12High density decal and attaching same
11/24/11Power core for use in circuitized substrate and making same
10/27/11Method for via plating in electronic packages containing fluoropolymer dielectric layers
08/18/11Spring actuated clamping mechanism
01/27/11Photosensitive dielectric film
12/30/10Circuitized substrates utilizing smooth-sided conductive layers as part thereof
12/23/10High density connector for interconnecting fine pitch circuit packaging structures
07/01/10Multi-layer embedded capacitance and resistance substrate core
03/11/10Mulit-layer embedded capacitance and resistance substrate core
12/31/09Spring actuated clamping mechanism
07/16/09Method of making circuitized substrates having film resistors as part thereof
07/16/09Method of making circuitized assembly including a plurality of circuitized substrates
04/30/09Circuitized substrate with internal cooling structure and electrical assembly utilizing same
04/09/09Method of making circuitized substrate with internal optical pathway
04/09/09Method of making circuitized substrate with internal optical pathway using photolithography
02/05/09Adhesive bleed prevention method and product produced from same

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Endicott Interconnect Technologies Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Endicott Interconnect Technologies Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by