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Ev Group E Thallner Gmbh
Ev Group E Thallner Gmbh_20131212

Ev Group E Thallner Gmbh patents

Recent patent applications related to Ev Group E Thallner Gmbh. Ev Group E Thallner Gmbh is listed as an Agent/Assignee. Note: Ev Group E Thallner Gmbh may have other listings under different names/spellings. We're not affiliated with Ev Group E Thallner Gmbh, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Ev Group E Thallner Gmbh-related inventors

Date Ev Group E Thallner Gmbh patents (updated weekly) - BOOKMARK this page
11/30/17Method and device for prefixing of substrates
11/02/17Substrate stack holder, container and parting a substrate stack
11/02/17Method and device for coating a product substrate
10/19/17Method for the production of an optical glass element
09/07/17Method for producing a conductive multiple substrate stack
08/10/17Receptacle device, device and handling substrate stacks
08/10/17Method for permanently bonding wafers
06/08/17Method for applying a bonding layer
05/25/17Method for application of a silicon dioxide layer
04/27/17Method for bonding substrates
04/20/17Method and device for leveling a substrate stack
04/06/17Method and device for surface treatment of substrates
03/09/17Method and device for the surface treatment of substrates
02/23/17Device and permanent bonding
02/16/17Novel preparing precipitated silicas, novel precipitated silicas and the uses of same, in particular for reinforcing polymers
02/16/17Method and device for plasma treatment of substrates
02/02/17Method and device for embossing structures
01/05/17Method and device for embossing of a nanostructure
12/15/16Method for coating cavities of semiconductor substrates
12/08/16Method for bonding substrates
11/17/16Method and device for bonding substrates
11/10/16Device and loosening a first substrate
11/03/16Device for alignment of two substrates
11/03/16Method for permanent connection of two metal surfaces
10/13/16Die with a die structure as well as its production
08/18/16Device and aligning substrates
08/04/16System and machining a workpiece
08/04/16Apparatus and bonding substrates
06/30/16Method for applying a bonding layer
06/16/16Measuring device and measuring layer thicknesses and defects in a wafer stack
05/26/16Device and aligning substrates
05/19/16Embossing compound for embossing lithography
05/05/16Method and device for treating a substrate surface
04/21/16Method for permanent bonding of wafers
04/14/16Measuring device and ascertaining a pressure map
03/24/16Device and coating a substrate
03/17/16Mould with a mould pattern, and device and producing same
03/10/16Method for bonding metallic contact areas with dissolution of a sacrificial layer applied on one of the contact areas in at least one of the contact areas
01/21/16Bendable carrier mount, device and releasing a carrier substrate
01/21/16Receptacle device, device and handling substrate stacks
12/10/15Receiving device for handling structured substrates
11/05/15Spray nozzle device and coating method
10/22/15Pressure transmitting device for bonding chips onto a substrate
10/15/15Method and device for producing a lens wafer
10/15/15Method for microcontact printing
10/01/15Device and bonding
09/17/15Semiconductor treating device and method
09/10/15Method for embossing of substrates
08/13/15Method and device for embossing
08/13/15Method for coating and bonding substrates
08/13/15Accommodating device for retaining wafers
08/06/15Structure stamp, device and embossing
07/30/15Device and bonding substrates
06/25/15Method for bonding substrates
06/18/15Method and device for permanent bonding of wafers
05/21/15Apparatus and ascertaining orientation errors
05/14/15Method and device for producing a plurality of microlenses
04/16/15Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
04/09/15Flexible substrate holder, device and detaching a first substrate
03/12/15Device and bonding substrates
02/19/15Pressure transfer plate for pressure transfer of a bonding pressure
02/19/15Method for applying a temporary bonding layer
12/25/14Method for the temporary connection of a product substrate to a carrier substrate
12/11/14Method and device for bonding of substrates
11/20/14Method for producing a polychromatizing layer and substrate and also light-emitting diode having a polychromatizing layer
Patent Packs
11/13/14Device and treating substrate surfaces
08/21/14Nanostructure die, embossing roll, device and continuous embossing of nanostructures
08/14/14Device for hot embossing of a polymer layer
08/14/14Device and coating of a carrier wafer
07/31/14Apparatus and bonding substrates
07/17/14Method and device for permanent bonding of wafers, as well as cutting tool
06/12/14Holding device for holding a patterned wafer
06/05/14Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
04/17/14Method and device for determining the pressure distribution for bonding
03/13/14Method for permanently bonding wafers
02/20/14Method for permanently bonding wafers
01/23/14Bendable carrier mount, device and releasing a carrier substrate
01/16/14Method for permanently bonding wafers
12/12/13Accommodating device for retaining wafers
11/21/13Method and device for producing individually coded read patterns
Patent Packs
11/14/13Method for permanent bonding of wafers
10/31/13Method for separating a product substrate from a carrier substrate
10/17/13Retaining system for retaining and holding a wafer
08/15/13Method for determining the position of a rotation axis
01/10/13Method for producing a wafer provided with chips
05/19/11Transport system for accommodating and transporting flexible substrates
02/24/11Device and hot embossing of a polymer layer
02/24/11Device for embossing of substrates
06/18/09System for uniform structuring of substrates
12/12/13Accommodating device for retaining wafers

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Ev Group E Thallner Gmbh in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Ev Group E Thallner Gmbh with additional patents listed. Browse our Agent directory for other possible listings. Page by