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Ev Group E Thallner Gmbh
Ev Group E Thallner Gmbh_20131212
  

Ev Group E Thallner Gmbh patents

Recent patent applications related to Ev Group E Thallner Gmbh. Ev Group E Thallner Gmbh is listed as an Agent/Assignee. Note: Ev Group E Thallner Gmbh may have other listings under different names/spellings. We're not affiliated with Ev Group E Thallner Gmbh, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "E" | Ev Group E Thallner Gmbh-related inventors




Date Ev Group E Thallner Gmbh patents (updated weekly) - BOOKMARK this page
03/09/17Method and device for the surface treatment of substrates
02/23/17Device and permanent bonding
02/16/17Novel preparing precipitated silicas, novel precipitated silicas and the uses of same, in particular for reinforcing polymers
02/16/17Method and device for plasma treatment of substrates
02/02/17Method and device for embossing structures
01/05/17Method and device for embossing of a nanostructure
12/15/16Method for coating cavities of semiconductor substrates
12/08/16Method for bonding substrates
11/17/16Method and device for bonding substrates
11/10/16Device and loosening a first substrate
11/03/16Device for alignment of two substrates
11/03/16Method for permanent connection of two metal surfaces
10/13/16Die with a die structure as well as its production
08/18/16Device and aligning substrates
08/04/16System and machining a workpiece
08/04/16Apparatus and bonding substrates
06/30/16Method for applying a bonding layer
06/16/16Measuring device and measuring layer thicknesses and defects in a wafer stack
05/26/16Device and aligning substrates
05/19/16Embossing compound for embossing lithography
05/05/16Method and device for treating a substrate surface
04/21/16Method for permanent bonding of wafers
04/14/16Measuring device and ascertaining a pressure map
03/24/16Device and coating a substrate
03/17/16Mould with a mould pattern, and device and producing same
03/10/16Method for bonding metallic contact areas with dissolution of a sacrificial layer applied on one of the contact areas in at least one of the contact areas
01/21/16Bendable carrier mount, device and releasing a carrier substrate
01/21/16Receptacle device, device and handling substrate stacks
12/10/15Receiving device for handling structured substrates
11/05/15Spray nozzle device and coating method
10/22/15Pressure transmitting device for bonding chips onto a substrate
10/15/15Method and device for producing a lens wafer
10/15/15Method for microcontact printing
10/01/15Device and bonding
09/17/15Semiconductor treating device and method
09/10/15Method for embossing of substrates
08/13/15Method and device for embossing
08/13/15Method for coating and bonding substrates
08/13/15Accommodating device for retaining wafers
08/06/15Structure stamp, device and embossing
07/30/15Device and bonding substrates
06/25/15Method for bonding substrates
06/18/15Method and device for permanent bonding of wafers
05/21/15Apparatus and ascertaining orientation errors
05/14/15Method and device for producing a plurality of microlenses
04/16/15Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
04/09/15Flexible substrate holder, device and detaching a first substrate
03/12/15Device and bonding substrates
02/19/15Pressure transfer plate for pressure transfer of a bonding pressure
02/19/15Method for applying a temporary bonding layer
12/25/14Method for the temporary connection of a product substrate to a carrier substrate
12/11/14Method and device for bonding of substrates
11/20/14Method for producing a polychromatizing layer and substrate and also light-emitting diode having a polychromatizing layer
11/13/14Device and treating substrate surfaces
08/21/14Nanostructure die, embossing roll, device and continuous embossing of nanostructures
08/14/14Device for hot embossing of a polymer layer
08/14/14Device and coating of a carrier wafer
07/31/14Apparatus and bonding substrates
07/17/14Method and device for permanent bonding of wafers, as well as cutting tool
06/12/14Holding device for holding a patterned wafer
06/05/14Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
04/17/14Method and device for determining the pressure distribution for bonding
03/13/14Method for permanently bonding wafers
02/20/14Method for permanently bonding wafers
01/23/14Bendable carrier mount, device and releasing a carrier substrate
Patent Packs
01/16/14Method for permanently bonding wafers
12/12/13Accommodating device for retaining wafers
11/21/13Method and device for producing individually coded read patterns
11/14/13Method for permanent bonding of wafers
10/31/13Method for separating a product substrate from a carrier substrate
10/17/13Retaining system for retaining and holding a wafer
08/15/13Method for determining the position of a rotation axis
01/10/13Method for producing a wafer provided with chips
05/19/11Transport system for accommodating and transporting flexible substrates
02/24/11Device and hot embossing of a polymer layer
02/24/11Device for embossing of substrates
06/18/09System for uniform structuring of substrates
12/12/13Accommodating device for retaining wafers







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