RealTimeTouch.com RealTimeTouch.com Patent US9639150 RealTimeTouch.com message RealTimeTouch.com RealTimeTouch.com



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




RealTimeTouch.com RealTimeTouch.com Patent US9639150 RealTimeTouch.com message RealTimeTouch.com RealTimeTouch.com

Similar
Filing Names

Formfactor Inc
Formfactor Inc_20100107
Formfactor Inc_20100114
Formfactor Inc_20100121
Formfactor Inc_20100128
  

Formfactor Inc patents

Recent patent applications related to Formfactor Inc. Formfactor Inc is listed as an Agent/Assignee. Note: Formfactor Inc may have other listings under different names/spellings. We're not affiliated with Formfactor Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "F" | Formfactor Inc-related inventors




Date Formfactor Inc patents (updated weekly) - BOOKMARK this page
05/25/17Floating nest for a test socket
03/09/17Wiring substrate with filled vias to accommodate custom terminals
07/09/15Multiple contact probes
04/02/15Probe retention arrangement
01/15/15Multipath electrical probe and probe assemblies with signal paths through secondary paths between electrically conductive guide plates
11/20/14Automated attaching and detaching of an interchangeable probe head
11/06/14Probe card assembly for testing electronic devices
05/22/14Contactor devices with carbon nanotube probes embedded in a flexible film and processes of making such
05/01/14Probes with spring mechanisms for impeding unwanted movement in guide holes
02/13/14Vertical probes for multi-pitch full grid contact array
02/13/14Probe fabrication using combined laser and micro-fabrication technologies
10/17/13Wiring substrate with filled vias to accommodate custom terminals
07/04/13Probes with programmable motion
06/06/13Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
05/30/13Hybrid electrical contactor
04/25/13Methods and apparatuses for dynamic probe adjustment
04/18/13Vertical probe array arranged to provide space transformation
04/18/13Method and designing a custom test system
04/04/13Probe with cantilevered beam having solid and hollow sections
09/27/12Non-linear vertical leaf spring
09/20/12Wireless probe card verification system and method
06/14/12Probe card stiffener with decoupling
04/12/12Elastic encapsulated carbon nanotube based electrical contacts
01/12/12Testing techniques for through-device vias
11/03/11Method and testing devices using serially controlled intelligent switches
09/08/11Wiring substrate with customization layers
08/11/11Methods for planarizing a semiconductor contactor
08/04/11Fuel cell using carbon nanotubes
07/14/11Probe element having a substantially zero stiffness and applications thereof
07/14/11Segmented contactor
06/30/11Test testing electronic devices
06/30/11Wafer test cassette system
06/02/11Stiffener assembly for use with testing devices
05/19/11Integrated circuit tester with high bandwidth probe assembly
03/24/11Attachment of an electrical element to an electronic device using a conductive material
03/10/11Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
03/03/11Method and multilayer support substrate
02/24/11Wafer level contactor
02/24/11Method and providing active compliance in a probe card assembly
02/03/11High performance probe system
12/30/10Method and thermally conditioning probe cards
12/23/10Sharpened, oriented contact tip structures
12/16/10Single support structure probe group with staggered mounting pattern
11/25/10Electrical contactor, especially wafer level contactor, using fluid pressure
10/28/10Method and probe card alignment in a test system
10/21/10Methods for planarizing a semiconductor contactor
10/21/10Closed-grid bus architecture for wafer interconnect structure
10/21/10Flexure band and use thereof in a probe card assembly
10/07/10Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
10/07/10Method and terminating a test signal applied to multiple semiconductor loads under test
10/07/10Anchoring carbon nanotube columns
09/30/10Apparatus and testing singulated dies
09/09/10Method to build robust mechanical structures on substrate surfaces
09/09/10Probing apparatus with guarded signal traces
07/01/10Biased gap-closing actuator
06/24/10Printed solar panel
06/10/10Process for manufacturing contact elements for probe card assembles
06/10/10Microspring array having reduced pitch contact elements
06/03/10Mechanical decoupling of a probe card assembly to improve thermal response
06/03/10Thermocentric alignment of elements on parts of an apparatus
06/03/10Mechanical decoupling of a probe card assembly to improve thermal response
05/13/10Wafer level interposer
05/06/10Printing of redistribution traces on electronic component
05/06/10Carbon nanotube contact structures
04/29/10Apparatus and making and using a tooling die
Patent Packs
04/15/10Lithographic contact elements
04/15/10Microelectronic contact structure and making same
04/08/10Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
04/01/10Process of positioning groups of contact structures
04/01/10Method and providing a tester integrated circuit for testing a semiconductor device under test
03/18/10Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
03/18/10Alignment features in a probing device
03/04/10Probe card cooling assembly with direct cooling of active electronic components
02/25/10Segmented contactor
02/25/10Electromagnetically coupled interconnect system architecture
02/25/10Remote test facility with wireless interface to local test facilities
02/25/10Method and testing semiconductor devices with autonomous expected value generation
02/18/10Probe head controlling mechanism for probe card assemblies
02/18/10Voltage fault detection and protection
01/28/10Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer
Patent Packs
01/21/10Dc test resource sharing for electronic device testing
01/21/10Method and calibrating and/or deskewing communications channels
01/14/10Method and system for designing a probe card
01/07/10Apparatus and managing thermally induced motion of a probe card assembly
11/26/09Probe card thermal conditioning system
11/26/09Probe card assembly and kit, and methods of making same
11/19/09Microelectronic contact structures, and methods of making same
11/05/09Method and enhanced probe card architecture
10/29/09Method of expanding tester drive and measurement capability
10/22/09Switch for use in microelectromechanical systems (mems) and mems devices incorporating same
10/22/09Self-monitoring switch
10/22/09Multi-stage spring system
10/22/09Spring interconnect structures
10/08/09Self-referencing voltage regulator
10/08/09Wireless test cassette
09/17/09Increasing thermal isolation of a probe card assembly
09/17/09Method and processing failures during semiconductor device testing
09/10/09Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
09/10/09Method and designing a custom test system
08/27/09Method of estimating channel bandwidth from a time domain reflectometer (tdr) measurement
08/20/09Apparatus and adjusting thermally induced movement of electro-mechanical assemblies
08/06/09Carbon nanotube spring contact structures with mechanical and electrical components
07/16/09Closed-grid bus architecture for wafer interconnect structure
06/25/09Method and adjusting a multi-substrate probe structure
06/25/09Probe card assembly with an interchangeable probe insert
06/25/09Method and making a determination relating to resistance of probes
06/25/09Method and managing test result data generated by a semiconductor test system
06/04/09Apparatuses and methods for cleaning test probes
06/04/09Probe array and its manufacture
06/04/09Method to build a wirebond probe card in a many at a time fashion
Social Network Patent Pack
05/28/09High performance probe system
05/28/09Apparatus and limiting over travel in a probe card assembly
05/28/09System for measuring signal path resistance for an integrated circuit tester interconnect structure
05/21/09Method and remotely buffering test channels
04/30/09Stiffener assembly for use with testing devices
04/23/09Contactless interfacing of test signals with a device under test
04/02/09Method and testing devices using serially controlled intelligent switches
04/02/09Probing a device
03/26/09Method and testing devices using serially controlled resources
03/26/09Component assembly and alignment
Patent Packs
03/26/09Reduced scrub contact element
03/19/09Electrical contactor, especially wafer level contactor, using fluid pressure
03/12/09Making and using carbon nanotube probes
02/26/09Air bridge structures and methods of making and using air bridge structures
02/26/09Process and adjusting traces
02/05/09Electronic package with direct cooling of active electronic components
02/05/09Interconnect assemblies and methods
01/28/10Configuration of shared tester channels to avoid electrical connections across die area boundary on a wafer
01/21/10Method and calibrating and/or deskewing communications channels
01/14/10Method and system for designing a probe card
01/07/10Apparatus and managing thermally induced motion of a probe card assembly







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Formfactor Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Formfactor Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###




';