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Formfactor Inc
Formfactor Inc_20100107
Formfactor Inc_20100114
Formfactor Inc_20100121
Formfactor Inc_20100128

Formfactor Inc patents

Recent patent applications related to Formfactor Inc. Formfactor Inc is listed as an Agent/Assignee. Note: Formfactor Inc may have other listings under different names/spellings. We're not affiliated with Formfactor Inc, we're just tracking patents.

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Wiring substrate with filled vias to accommodate custom terminals

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. ... Formfactor Inc

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Formfactor Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Formfactor Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by