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Freescale Semiconductor Inc
Freescale Semiconductor Inc A Corporation
Freescale Semiconductor Inc formerly Known As Sigmatel Inc
Freescale Semiconductor Inc Austin Texas
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Freescale Semiconductor Inc patents


      
Recent patent applications related to Freescale Semiconductor Inc. Freescale Semiconductor Inc is listed as an Agent/Assignee. Note: Freescale Semiconductor Inc may have other listings under different names/spellings. We're not affiliated with Freescale Semiconductor Inc, we're just tracking patents.

ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009 | Company Directory "F" | Freescale Semiconductor Inc-related inventors


Display controller with blending stage

Freescale Semiconductor

Display controller with blending stage

Cut through packet forwarding device

Freescale Semiconductor

Cut through packet forwarding device

Search recent Press Releases: Freescale Semiconductor Inc-related press releases
Count Application # Date Freescale Semiconductor Inc patents (updated weekly) - BOOKMARK this page
12015010862504/23/15 new patent  Semiconductor device with heat spreader
22015010893604/23/15 new patent  Method and charging a bootstrap charge storage device
32015010905404/23/15 new patent  Ready-flag circuitry for differential amplifiers
42015010933004/23/15 new patent  Display controller with blending stage
52015011012604/23/15 new patent  Cut through packet forwarding device
62015010238404/16/15Esd protection with asymmetrical bipolar-based device
72015010243704/16/15Mems sensor device with multi-stimulus sensing and fabrication
82015010283904/16/15Low power inverter circuit
92015010488604/16/15Semiconductor device arrangement, a analysing a performance of a functional circuit on a semiconductor device and a device analysis system
102015010641504/16/15True random number generator with repeatedly activated oscillator
112015010667104/16/15Memory device retention mode based on error information
122015009816004/09/15Protection circuit and a gate driving circuitry
132015009723804/09/15Mergeable semiconductor device with improved reliability
142015009726504/09/15Semiconductor device with buried conduction path
152015009727804/09/15Surface mount semiconductor device with additional bottom face contacts
162015009728004/09/15Heat conductive substrate for integrated circuit package
172015009755604/09/15Variable reluctance sensor interfaces and methods of their operation
182015009755704/09/15Variable reluctance sensor interfaces with signal pre-processing and methods of their operation
192015009762304/09/15Power amplifiers with signal conditioning
202015009854004/09/15Clock distribution module, synchronous digital system and method therefor
212015010079204/09/15Semiconductor device and a manufacturing a semiconductor device
222015009005204/02/15Pressure sensor having multiple pressure cells and sensitivity estimation methodology
232015009107904/02/15Non-volatile memory (nvm) and high-k and metal gate integration using gate-first methodology
242015009116004/02/153d device packaging using through-substrate posts
252015009117804/02/153d device packaging using through-substrate pillars
262015009118704/02/153d device packaging using through-substrate posts
272015009160704/02/15Sequential logic circuit and providing setup timing violation tolerance therefor
282015009162204/02/15System and enabling maximum performance operation within an extended ambient temperature range
292015009386404/02/15Non-volatile memory (nvm) and high-k and metal gate integration using gate-last methodology
302015009539304/02/15Method and device for generating floating-point values
312015009552504/02/15Integrated circuit comprising an io buffer driver and method therefor
322015008413803/26/15Integrated circuit having varying substrate depth and forming same
332015008419903/26/15Copper ball bond features and structure
342015008441703/26/15Electronic device and operating a power switch
352015008465703/26/15Heating system and testing a semiconductor device using a heating system
362015008468403/26/15Temperature dependent biasing for leakage power reduction
372015008930503/26/15Interrupt supervision system, processing interrupt supervison
382015007540103/19/15Squib driver diagnostic circuit and method
392015007655603/19/15Integrated circuit device and a providing esd protection
402015007716303/19/15Dynamic frequency divider circuit
412015008200503/19/15Processing system and instruction set encoding space utilization
422015008201703/19/15Electronic device having a pin for setting its mode of operation and method to set a mode of operation for an electronic device having a pin
432015008228403/19/15Method and system for generating a memory trace of a program code executable on a programmable target
442015006952403/12/15Method of forming different voltage devices with high-k metal gate
452015006962403/12/15Recessed semiconductor die stack
462015007431903/12/15Universal spi (serial peripheral interface)
472015006175003/05/15Method and circuit for controlling turnoff of a semiconductor switching element
482015005947303/05/15Multiple sense axis mems gyroscope having a single drive mode
492015006104403/05/15Sequential wafer bonding
502015006109703/05/15Edge coupling of semiconductor dies
512015006110603/05/15Cavity-type semiconductor package and packaging same
522015006157703/05/15Wireless power transmitters with wide input voltage range and methods of their operation
532015006161203/05/15Switch mode power supply
542015006163703/05/15Negative voltage measurement
552015006172803/05/15Electronic device and maintaining functionality of an integrated circuit during electrical aggressions
562015006178003/05/15Oscillator circuit, a semiconductor device and an apparatus
572015006727903/05/15Data processing operating a data processing system
582015006742803/05/15System-on-chip, manufacture thereof and communicating diagnostic data
592015006742903/05/15Wafer-level gate stress testing
602015006766203/05/15Computer system and a generating an optimized program code
612015005404402/26/15Method to form a polysilicon nanocrystal thin film storage bitcell within a high k metal gate platform technology using a gate last process to form transistor gates
622015005409602/26/15Reducing mems stiction by introduction of a carbon barrier
632015005447702/26/15Power switch with current limitation and zero direct current (dc) power consumption
642015005448702/26/15Reference voltage source and providing a curvature-compensated reference voltage
652015005456202/26/15Level shifter with static precharge circuit
662015004846202/19/15Sensor package and forming same
672015004884802/19/15Test structure and methodology for estimating sensitivity of pressure sensors
682015004940602/19/15Electrostatic discharge protection circuit arrangement, electronic circuit and esd protection method
692015004192702/12/15Mems device with differential vertical sense electrodes
702015004665802/12/15Cache organization and method
712015004675302/12/15Embedded software debug system with partial hardware acceleration
722015004689302/12/15Techniques for electromigration stress mitigation in interconnects of an integrated circuit design
732015003515102/05/15Capping layer interface interruption for stress migration mitigation
742015003560402/05/15Coupler with distributed feeding and compensation
752015003795802/05/15Methods of making multi-state non-volatile memory cells
762015004009202/05/15Stress migration mitigation
772015002719801/29/15Mems parameter identification using modulated waveforms
782015002776701/29/15System and lead frame package degating
792015002894801/29/15Switch-mode amplifier
802015002901301/29/15Method and system for facilitating viewing of information in a machine
812015002137601/22/15Wire bonding capillary with working tip protrusion
822015002174601/22/15Backscattering for localized annealing
832015002453501/22/15Semiconductor sensor device with footed lid
842015002641001/22/15Least recently used (lru) cache replacement implementation using a fifo
852015002652301/22/15Debugging method and computer program product
862015001524001/15/15Method of detecting irregular current flow in an integrated circuit device and apparatus therefor
872015001105301/08/15Semiconductor device and assembling same
882015000211601/01/15Dc to dc converter and method to operate a dc to dc converter
892015000218301/01/15Semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods
902015000221801/01/15Device and compensating for voltage drops
912015000222601/01/15Semiconductor package having wire bond wall to reduce coupling
922015000222901/01/15Semiconductor packages having wire bond wall to reduce coupling
932015000474701/01/15Reram device structure
942015000476801/01/15Drain-end drift diminution in semiconductor devices
952015000682701/01/15Method for detecting bank collision at a memory and device therefor
962015000686301/01/15Debug for providing indexed trace messages
972015000686901/01/15Debug for handling exceptions and interrupts
982014038025812/25/14Method and performing integrated circuit layout verification
992014037484912/25/14Angular rate sensor with quadrature error compensation
1002014037485112/25/14Mems device and fabricating mems devices
1012014037534112/25/14Die fracture detection and humidity protection with double guard ring arrangement
1022014037631712/25/14Reducing the power consumption of memory devices
1032014037658612/25/14Multi-chip device with temperature control element for temperature calibration
1042014038001712/25/14Memory management and allocation using free-list
1052014036723912/18/14Capacitive keypad position sensor with low cross-interference
1062014036783012/18/14Esd protection device
1072014036785912/18/14Tin-based wirebond structures
1082014036901512/18/14Warp compensated electronic assemblies
1092014035240012/04/14Transducer-including devices, and methods and their calibration
1102014035383012/04/14Semiconductor devices with multilayer flex interconnect structures
1112014035436212/04/14Amplifier calibration
1122014035536712/04/14Multiple data rate memory with read timing information
1132014035702312/04/14Semiconductor device package with cap element
1142014034511711/27/14Semiconductor device with thermal dissipation lead frame
1152014035157011/27/14Programming interface and method
1162014035178111/27/14Method for placing operational cells in a semiconductor device
1172014033965611/20/14Mems pressure transducer assembly
1182014034121411/20/14Method and detecting one or more predetermined tones transmitted over a communication network
1192014034251811/20/14Power mosfet structure and method
1202014033290111/13/14Semiconductor device with notched gate
1212014033294111/13/14System, leadless surface mounted semiconductor package
1222014033332711/13/14On-die capacitance measurement module and measuring an on-die capacitive load
1232014033336711/13/14Metal-oxide-semiconductor (mos) voltage divider with dynamic impedance control
1242014033405311/13/14Over-current protection device
1252014033785911/13/14Processing load with normal or fast operation mode
1262014032934411/06/14Testing an electrical connection of a device cap
1272014031959710/30/14Methods and systems for gate dimension control in multi-gate structures for semiconductor devices
1282014032121210/30/14Non-volatile memory (nvm) with variable verify operations
1292014032305010/30/14System for monitoring and controlling the power of a radio frequency (rf) signal in a short-range rf transmitter
1302014032307410/30/14Power management for a battery-powered handheld audio device
1312014032518310/30/14Integrated circuit device, asymmetric multi-core processing module, electronic device and managing execution of computer program code therefor
1322014032546310/30/14Integrated circuit design verification through forced clock glitches
1332014031124310/23/14Estimation of sidewall skew angles of a structure
1342014031243510/23/14Mems device with stress isolation and fabrication
1352014031245710/23/14Integrated circuit chip with discontinuous guard ring
1362014031287510/23/14Startup circuits with native transistors
1372014031297510/23/14Amplifier using nonlinear drivers
1382014031297610/23/14Amplfiers and related integrated circuits
1392014031739510/23/14Microprocessor, and managing reset events therefor
1402014030674510/16/14Flip-flop having shared feedback and operation
1412014030877910/16/14Integrated circuit package with voltage distributor
1422014030264110/09/14Stiffened semiconductor die package
1432014029993510/09/14Shallow trench isolation for soi structures combining sidewall spacer and bottom liner
1442014030019310/09/14Power safety circuit, integrated circuit device and safety critical system
1452014030061510/09/14Memory access controller, data processing system, and managing data flow between a memory unit and a processing unit
1462014030380410/09/14Method of controlling a thermal budget of an integrated circuit device, an integrated circuit, a thermal control module and an electronic device therefor
1472014029225210/02/14Circuit and speed monitoring of an electric motor
1482014029563910/02/14Field focusing features in a reram cell
1492014029800510/02/14Microprocessor device, and managing reset events therefor
1502014029811110/02/14Controller, sata system and operation therefor
1512014028471609/25/14Ldmos device with minority carrier shunt region
1522014028517509/25/14Reference voltage generating circuit, integrated circuit and voltage or current sensing device
1532014028523909/25/14Power monitoring circuitry
1542014028754709/25/14Inhibiting propagation of surface cracks in a mems device
1552014028755409/25/14Method for plating a semiconductor package lead
1562014028935709/25/14Data processing system and controlling access to a shared memory unit
1572014026638509/18/14Dual supply level shifter circuits
1582014028129109/18/14Method and memory array access
1592014028260309/18/14Method and detecting a collision between multiple threads of execution for accessing a memory array
1602014026050809/18/14Compensation and calibration for mems devices
1612014026060809/18/14Angular rate sensor having multiple axis sensing capability
1622014026061009/18/14Multiple axis rate sensor
1632014026061609/18/14Mems device having variable gap width and manufacture
1642014026472409/18/14Deep trench isolation
1652014026472809/18/14Active tiling placement for improved latch-up immunity
1662014026624609/18/14Mcu-based compensation and calibration for mems devices
1672014026636609/18/14Compensated hysteresis circuit
1682014026647409/18/14System and improved mems oscillator startup
1692014026900809/18/14Non-volatile memory using bi-directional resistive elements
1702014027335209/18/14Semiconductor device
1712014027339109/18/14Inductive element with interrupter region and forming
1722014027794909/18/14Airbag apparatus
1732014028139009/18/14System and ordering packet transfers in a data processor
1742014028234009/18/14Method for provisioning decoupling capacitance in an integrated circuit
1752014025097009/11/14System and monitoring a gyroscope
1762014025097109/11/14System and monitoring an accelerometer
1772014025100909/11/14System and reducing offset variation in multifunction sensor devices
1782014025246709/11/14Laterally diffused metal oxide semiconductor transistors for radio frequency power amplifiers
1792014025247009/11/14Semiconductor device with integrated electrostatic discharge (esd) clamp
1802014025247209/11/14Semiconductor device with increased safe operating area
1812014025248709/11/14Gate security feature
1822014025257009/11/14Lead-frame circuit package
1832014025258609/11/14Semiconductor devices that include a die bonded to a substrate with a gold interface layer
1842014025320409/11/14Clock signal generator module, integrated circuit, electronic device and method therefor
1852014025324809/11/14Phase shift and attenuation circuits for use with multiple-path amplifiers
1862014025325809/11/14System for reducing electromagnetic induction interference
1872014025463609/11/14System and demodulating an incoming signal
1882014025463709/11/14Direct sequence spread spectrum signal receiving device and method
1892014025609109/11/14Methods for bonding a die and a substrate
1902014025858209/11/14Semiconductor device with vias on a bridge connecting two buses
1912014025879809/11/14Test control point insertion and x-bounding for logic built-in self-test (lbist) using observation circuitry
1922014024708009/04/14Multi-level clock signal distribution network and integrated circuit
1932014024708109/04/14Combinatorial circuit and operation of such a combinatorial circuit
1942014023848308/28/14Three-dimensional solar cell having increased efficiency
1952014023934608/28/14Mishfet and schottky device integration
1962014023992708/28/14Transition control for a hybrid switched-mode power supply (smps)
1972014024276208/28/14Tunable schottky diode with depleted conduction path
1982014024489508/28/14Robust sector id scheme for tracking dead sectors to automate search and copydown
1992014023054908/21/14Spring system for mems device
2002014023201708/21/14Identification mechanism for semiconductor device die
2012014023234408/21/14Circuit and voltage equalization in large batteries
2022014023234708/21/14Circuit and battery equalization
2032014023257908/21/14Low power quantizer for analog to digital converter
2042014023258908/21/14Receiver circuit, phased-array receiver and radar system
2052014023337208/21/14Real-time distributed network module, real-time distributed network and method therefor
2062014022515608/14/14Esd protection with integrated ldmos triggering junction
2072014022517608/14/14Embedded nvm in a hkmg process
2082014022645908/14/14Real-time distributed network slave device, real-time distributed network and method therefor
2092014022073808/07/14Lead frame array package with flip chip die attach
2102014022091708/07/14Multimode rake receiver, cellular base station and cellular communication device
2112014022312808/07/14Memory device and organizing a homogeneous memory
2122014020998807/31/14Nonvolatile memory bitcell
2132014021001607/31/14Implant for performance enhancement of selected transistors in an integrated circuit
2142014021056507/31/14Amplitude loop control for oscillators
2152014021305007/31/14Method of making a die with recessed aluminum die pads
2162014020335807/24/14Semiconductor device with enhanced 3d resurf
2172014020341007/24/14Die edge sealing structures and related fabrication methods
2182014020385707/24/14Variable delay and setup time flip-flop
2192014020410307/24/14Data processing task scheduling in a data processing system
2202014020509207/24/14Secure provisioning in an untrusted environment
2212014020612407/24/14Pressure sensor and packaging same
2222014020797907/24/14Dma-assisted irregular sampling sequences
2232014019754107/17/14Microelectronic assembly having a heat spreader for a plurality of die
2242014019780707/17/14Reducing output voltage ripple of power supplies
2252014019797307/17/14Digital to analog converter with current steering source for reduced glitch energy error
2262014020147907/17/14Integrated circuit device, memory interface module, data processing providing data access control
2272014020159707/17/14Error correction with extended cam
2282014019137707/10/14Integrated circuit package
2292014019138307/10/14Power device and packaging same
2302014018372907/03/14Sensor packages having semiconductor dies of differing sizes
2312014018701207/03/14Customized shield plate for a field effect transistor
2322014018701407/03/14Methods for forming bipolar transistors
2332014018946207/03/14Error correcting device, monitoring an error correcting device and data processing system
2342014017622006/26/14Integrated circuit device, voltage regulator module and compensating a voltage signal
2352014016949506/19/14Signalling circuit, processing device and safety critical system
2362014016710206/19/14Semiconductor device with single-event latch-up prevention circuitry
2372014016785506/19/14Rf power transistor circuits
2382014016786306/19/14Rf power transistor circuits
2392014017324706/19/14Processing apparatus and synchronizing a first processing unit and a second processing unit
2402014017335306/19/14Integrated circuit device and identifying a presence of a broken connection within an external signal path
2412014016086206/12/14Reducing the power consumption of memory devices
2422014016086906/12/14Built-in self trim for non-volatile memory reference current
2432014016477906/12/14Secure provisioning in an untrusted environment
2442014015724006/05/14Method and enabling an executed control flow path through computer program code to be determined
2452014015248106/05/14Integrated circuit device and dynamically modifying at least one characteristic within a digital to analogue converter module
2462014015359006/05/14Method and transmitting data
2472014015502706/05/14Electronic device and a computer program product
2482014014423105/29/14Inertial sensor and levitation effect compensation
2492014014533905/29/14Encapsulant for a semiconductor device



ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009



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