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Freescale Semiconductor Inc
Freescale Semiconductor Inc A Corporation
Freescale Semiconductor Inc formerly Known As Sigmatel Inc
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Freescale Semiconductor Inc patents


      
Recent patent applications related to Freescale Semiconductor Inc. Freescale Semiconductor Inc is listed as an Agent/Assignee. Note: Freescale Semiconductor Inc may have other listings under different names/spellings. We're not affiliated with Freescale Semiconductor Inc, we're just tracking patents.

ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009 | Company Directory "F" | Freescale Semiconductor Inc-related inventors


Heating system and  testing a semiconductor device using a heating system

Freescale Semiconductor

Heating system and testing a semiconductor device using a heating system

Copper ball bond features and structure

Freescale Semiconductor

Copper ball bond features and structure

Search recent Press Releases: Freescale Semiconductor Inc-related press releases
Count Application # Date Freescale Semiconductor Inc patents (updated weekly) - BOOKMARK this page
12015008413803/26/15 new patent  Integrated circuit having varying substrate depth and forming same
22015008419903/26/15 new patent  Copper ball bond features and structure
32015008441703/26/15 new patent  Electronic device and operating a power switch
42015008465703/26/15 new patent  Heating system and testing a semiconductor device using a heating system
52015008468403/26/15 new patent  Temperature dependent biasing for leakage power reduction
62015008930503/26/15 new patent  Interrupt supervision system, processing interrupt supervison
72015007540103/19/15Squib driver diagnostic circuit and method
82015007655603/19/15Integrated circuit device and a providing esd protection
92015007716303/19/15Dynamic frequency divider circuit
102015008200503/19/15Processing system and instruction set encoding space utilization
112015008201703/19/15Electronic device having a pin for setting its mode of operation and method to set a mode of operation for an electronic device having a pin
122015008228403/19/15Method and system for generating a memory trace of a program code executable on a programmable target
132015006952403/12/15Method of forming different voltage devices with high-k metal gate
142015006962403/12/15Recessed semiconductor die stack
152015007431903/12/15Universal spi (serial peripheral interface)
162015006175003/05/15Method and circuit for controlling turnoff of a semiconductor switching element
172015005947303/05/15Multiple sense axis mems gyroscope having a single drive mode
182015006104403/05/15Sequential wafer bonding
192015006109703/05/15Edge coupling of semiconductor dies
202015006110603/05/15Cavity-type semiconductor package and packaging same
212015006157703/05/15Wireless power transmitters with wide input voltage range and methods of their operation
222015006161203/05/15Switch mode power supply
232015006163703/05/15Negative voltage measurement
242015006172803/05/15Electronic device and maintaining functionality of an integrated circuit during electrical aggressions
252015006178003/05/15Oscillator circuit, a semiconductor device and an apparatus
262015006727903/05/15Data processing operating a data processing system
272015006742803/05/15System-on-chip, manufacture thereof and communicating diagnostic data
282015006742903/05/15Wafer-level gate stress testing
292015006766203/05/15Computer system and a generating an optimized program code
302015005404402/26/15Method to form a polysilicon nanocrystal thin film storage bitcell within a high k metal gate platform technology using a gate last process to form transistor gates
312015005409602/26/15Reducing mems stiction by introduction of a carbon barrier
322015005447702/26/15Power switch with current limitation and zero direct current (dc) power consumption
332015005448702/26/15Reference voltage source and providing a curvature-compensated reference voltage
342015005456202/26/15Level shifter with static precharge circuit
352015004846202/19/15Sensor package and forming same
362015004884802/19/15Test structure and methodology for estimating sensitivity of pressure sensors
372015004940602/19/15Electrostatic discharge protection circuit arrangement, electronic circuit and esd protection method
382015004192702/12/15Mems device with differential vertical sense electrodes
392015004665802/12/15Cache organization and method
402015004675302/12/15Embedded software debug system with partial hardware acceleration
412015004689302/12/15Techniques for electromigration stress mitigation in interconnects of an integrated circuit design
422015003515102/05/15Capping layer interface interruption for stress migration mitigation
432015003560402/05/15Coupler with distributed feeding and compensation
442015003795802/05/15Methods of making multi-state non-volatile memory cells
452015004009202/05/15Stress migration mitigation
462015002719801/29/15Mems parameter identification using modulated waveforms
472015002776701/29/15System and lead frame package degating
482015002894801/29/15Switch-mode amplifier
492015002901301/29/15Method and system for facilitating viewing of information in a machine
502015002137601/22/15Wire bonding capillary with working tip protrusion
512015002174601/22/15Backscattering for localized annealing
522015002453501/22/15Semiconductor sensor device with footed lid
532015002641001/22/15Least recently used (lru) cache replacement implementation using a fifo
542015002652301/22/15Debugging method and computer program product
552015001524001/15/15Method of detecting irregular current flow in an integrated circuit device and apparatus therefor
562015001105301/08/15Semiconductor device and assembling same
572015000211601/01/15Dc to dc converter and method to operate a dc to dc converter
582015000218301/01/15Semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods
592015000221801/01/15Device and compensating for voltage drops
602015000222601/01/15Semiconductor package having wire bond wall to reduce coupling
612015000222901/01/15Semiconductor packages having wire bond wall to reduce coupling
622015000474701/01/15Reram device structure
632015000476801/01/15Drain-end drift diminution in semiconductor devices
642015000682701/01/15Method for detecting bank collision at a memory and device therefor
652015000686301/01/15Debug for providing indexed trace messages
662015000686901/01/15Debug for handling exceptions and interrupts
672014038025812/25/14Method and performing integrated circuit layout verification
682014037484912/25/14Angular rate sensor with quadrature error compensation
692014037485112/25/14Mems device and fabricating mems devices
702014037534112/25/14Die fracture detection and humidity protection with double guard ring arrangement
712014037631712/25/14Reducing the power consumption of memory devices
722014037658612/25/14Multi-chip device with temperature control element for temperature calibration
732014038001712/25/14Memory management and allocation using free-list
742014036723912/18/14Capacitive keypad position sensor with low cross-interference
752014036783012/18/14Esd protection device
762014036785912/18/14Tin-based wirebond structures
772014036901512/18/14Warp compensated electronic assemblies
782014035240012/04/14Transducer-including devices, and methods and their calibration
792014035383012/04/14Semiconductor devices with multilayer flex interconnect structures
802014035436212/04/14Amplifier calibration
812014035536712/04/14Multiple data rate memory with read timing information
822014035702312/04/14Semiconductor device package with cap element
832014034511711/27/14Semiconductor device with thermal dissipation lead frame
842014035157011/27/14Programming interface and method
852014035178111/27/14Method for placing operational cells in a semiconductor device
862014033965611/20/14Mems pressure transducer assembly
872014034121411/20/14Method and detecting one or more predetermined tones transmitted over a communication network
882014034251811/20/14Power mosfet structure and method
892014033290111/13/14Semiconductor device with notched gate
902014033294111/13/14System, leadless surface mounted semiconductor package
912014033332711/13/14On-die capacitance measurement module and measuring an on-die capacitive load
922014033336711/13/14Metal-oxide-semiconductor (mos) voltage divider with dynamic impedance control
932014033405311/13/14Over-current protection device
942014033785911/13/14Processing load with normal or fast operation mode
952014032934411/06/14Testing an electrical connection of a device cap
962014031959710/30/14Methods and systems for gate dimension control in multi-gate structures for semiconductor devices
972014032121210/30/14Non-volatile memory (nvm) with variable verify operations
982014032305010/30/14System for monitoring and controlling the power of a radio frequency (rf) signal in a short-range rf transmitter
992014032307410/30/14Power management for a battery-powered handheld audio device
1002014032518310/30/14Integrated circuit device, asymmetric multi-core processing module, electronic device and managing execution of computer program code therefor
1012014032546310/30/14Integrated circuit design verification through forced clock glitches
1022014031124310/23/14Estimation of sidewall skew angles of a structure
1032014031243510/23/14Mems device with stress isolation and fabrication
1042014031245710/23/14Integrated circuit chip with discontinuous guard ring
1052014031287510/23/14Startup circuits with native transistors
1062014031297510/23/14Amplifier using nonlinear drivers
1072014031297610/23/14Amplfiers and related integrated circuits
1082014031739510/23/14Microprocessor, and managing reset events therefor
1092014030674510/16/14Flip-flop having shared feedback and operation
1102014030877910/16/14Integrated circuit package with voltage distributor
1112014030264110/09/14Stiffened semiconductor die package
1122014029993510/09/14Shallow trench isolation for soi structures combining sidewall spacer and bottom liner
1132014030019310/09/14Power safety circuit, integrated circuit device and safety critical system
1142014030061510/09/14Memory access controller, data processing system, and managing data flow between a memory unit and a processing unit
1152014030380410/09/14Method of controlling a thermal budget of an integrated circuit device, an integrated circuit, a thermal control module and an electronic device therefor
1162014029225210/02/14Circuit and speed monitoring of an electric motor
1172014029563910/02/14Field focusing features in a reram cell
1182014029800510/02/14Microprocessor device, and managing reset events therefor
1192014029811110/02/14Controller, sata system and operation therefor
1202014028471609/25/14Ldmos device with minority carrier shunt region
1212014028517509/25/14Reference voltage generating circuit, integrated circuit and voltage or current sensing device
1222014028523909/25/14Power monitoring circuitry
1232014028754709/25/14Inhibiting propagation of surface cracks in a mems device
1242014028755409/25/14Method for plating a semiconductor package lead
1252014028935709/25/14Data processing system and controlling access to a shared memory unit
1262014026638509/18/14Dual supply level shifter circuits
1272014028129109/18/14Method and memory array access
1282014028260309/18/14Method and detecting a collision between multiple threads of execution for accessing a memory array
1292014026050809/18/14Compensation and calibration for mems devices
1302014026060809/18/14Angular rate sensor having multiple axis sensing capability
1312014026061009/18/14Multiple axis rate sensor
1322014026061609/18/14Mems device having variable gap width and manufacture
1332014026472409/18/14Deep trench isolation
1342014026472809/18/14Active tiling placement for improved latch-up immunity
1352014026624609/18/14Mcu-based compensation and calibration for mems devices
1362014026636609/18/14Compensated hysteresis circuit
1372014026647409/18/14System and improved mems oscillator startup
1382014026900809/18/14Non-volatile memory using bi-directional resistive elements
1392014027335209/18/14Semiconductor device
1402014027339109/18/14Inductive element with interrupter region and forming
1412014027794909/18/14Airbag apparatus
1422014028139009/18/14System and ordering packet transfers in a data processor
1432014028234009/18/14Method for provisioning decoupling capacitance in an integrated circuit
1442014025097009/11/14System and monitoring a gyroscope
1452014025097109/11/14System and monitoring an accelerometer
1462014025100909/11/14System and reducing offset variation in multifunction sensor devices
1472014025246709/11/14Laterally diffused metal oxide semiconductor transistors for radio frequency power amplifiers
1482014025247009/11/14Semiconductor device with integrated electrostatic discharge (esd) clamp
1492014025247209/11/14Semiconductor device with increased safe operating area
1502014025248709/11/14Gate security feature
1512014025257009/11/14Lead-frame circuit package
1522014025258609/11/14Semiconductor devices that include a die bonded to a substrate with a gold interface layer
1532014025320409/11/14Clock signal generator module, integrated circuit, electronic device and method therefor
1542014025324809/11/14Phase shift and attenuation circuits for use with multiple-path amplifiers
1552014025325809/11/14System for reducing electromagnetic induction interference
1562014025463609/11/14System and demodulating an incoming signal
1572014025463709/11/14Direct sequence spread spectrum signal receiving device and method
1582014025609109/11/14Methods for bonding a die and a substrate
1592014025858209/11/14Semiconductor device with vias on a bridge connecting two buses
1602014025879809/11/14Test control point insertion and x-bounding for logic built-in self-test (lbist) using observation circuitry
1612014024708009/04/14Multi-level clock signal distribution network and integrated circuit
1622014024708109/04/14Combinatorial circuit and operation of such a combinatorial circuit
1632014023848308/28/14Three-dimensional solar cell having increased efficiency
1642014023934608/28/14Mishfet and schottky device integration
1652014023992708/28/14Transition control for a hybrid switched-mode power supply (smps)
1662014024276208/28/14Tunable schottky diode with depleted conduction path
1672014024489508/28/14Robust sector id scheme for tracking dead sectors to automate search and copydown
1682014023054908/21/14Spring system for mems device
1692014023201708/21/14Identification mechanism for semiconductor device die
1702014023234408/21/14Circuit and voltage equalization in large batteries
1712014023234708/21/14Circuit and battery equalization
1722014023257908/21/14Low power quantizer for analog to digital converter
1732014023258908/21/14Receiver circuit, phased-array receiver and radar system
1742014023337208/21/14Real-time distributed network module, real-time distributed network and method therefor
1752014022515608/14/14Esd protection with integrated ldmos triggering junction
1762014022517608/14/14Embedded nvm in a hkmg process
1772014022645908/14/14Real-time distributed network slave device, real-time distributed network and method therefor
1782014022073808/07/14Lead frame array package with flip chip die attach
1792014022091708/07/14Multimode rake receiver, cellular base station and cellular communication device
1802014022312808/07/14Memory device and organizing a homogeneous memory
1812014020998807/31/14Nonvolatile memory bitcell
1822014021001607/31/14Implant for performance enhancement of selected transistors in an integrated circuit
1832014021056507/31/14Amplitude loop control for oscillators
1842014021305007/31/14Method of making a die with recessed aluminum die pads
1852014020335807/24/14Semiconductor device with enhanced 3d resurf
1862014020341007/24/14Die edge sealing structures and related fabrication methods
1872014020385707/24/14Variable delay and setup time flip-flop
1882014020410307/24/14Data processing task scheduling in a data processing system
1892014020509207/24/14Secure provisioning in an untrusted environment
1902014020612407/24/14Pressure sensor and packaging same
1912014020797907/24/14Dma-assisted irregular sampling sequences
1922014019754107/17/14Microelectronic assembly having a heat spreader for a plurality of die
1932014019780707/17/14Reducing output voltage ripple of power supplies
1942014019797307/17/14Digital to analog converter with current steering source for reduced glitch energy error
1952014020147907/17/14Integrated circuit device, memory interface module, data processing providing data access control
1962014020159707/17/14Error correction with extended cam
1972014019137707/10/14Integrated circuit package
1982014019138307/10/14Power device and packaging same
1992014018372907/03/14Sensor packages having semiconductor dies of differing sizes
2002014018701207/03/14Customized shield plate for a field effect transistor
2012014018701407/03/14Methods for forming bipolar transistors
2022014018946207/03/14Error correcting device, monitoring an error correcting device and data processing system
2032014017622006/26/14Integrated circuit device, voltage regulator module and compensating a voltage signal
2042014016949506/19/14Signalling circuit, processing device and safety critical system
2052014016710206/19/14Semiconductor device with single-event latch-up prevention circuitry
2062014016785506/19/14Rf power transistor circuits
2072014016786306/19/14Rf power transistor circuits
2082014017324706/19/14Processing apparatus and synchronizing a first processing unit and a second processing unit
2092014017335306/19/14Integrated circuit device and identifying a presence of a broken connection within an external signal path
2102014016086206/12/14Reducing the power consumption of memory devices
2112014016086906/12/14Built-in self trim for non-volatile memory reference current
2122014016477906/12/14Secure provisioning in an untrusted environment
2132014015724006/05/14Method and enabling an executed control flow path through computer program code to be determined
2142014015248106/05/14Integrated circuit device and dynamically modifying at least one characteristic within a digital to analogue converter module
2152014015359006/05/14Method and transmitting data
2162014015502706/05/14Electronic device and a computer program product
2172014014423105/29/14Inertial sensor and levitation effect compensation
2182014014533905/29/14Encapsulant for a semiconductor device
2192014014534005/29/14Flip chip interconnection structure
2202014014576505/29/14Voltage ramp-up protection
2212014014798505/29/14Methods for the fabrication of semiconductor devices including sub-isolation buried layers
2222014013920105/22/14Low-power voltage tamper detection
2232014013178805/15/14Semiconductor devices with non-volatile memory cells
2242014013229305/15/14Integrated circuit with degradation monitoring
2252014013355205/15/14Method and encoding an image
2262014013479905/15/14Wettable lead ends on a flat-pack no-lead microelectronic package
2272014012495805/08/14Sensor packaging method and sensor packages
2282014012540905/08/14Amplifier calibration
2292014012609105/08/14Protection device and related fabrication methods
2302014012988305/08/14Hardware-based memory initialization
2312014011746805/01/14Methods and integrated circuit package for sensing fluid properties
2322014011752105/01/14Semiconductor device with thermal dissipation lead frame
2332014011795305/01/14Method and a tunable driver circuit
2342014011887405/01/14Gate driver with desaturation detection and active clamping
2352014011913105/01/14Memory device redundancy management system
2362014011940505/01/14Production-test die temperature measurement
2372014012201005/01/14Lcd driver verification system
2382014012273505/01/14System and assigning a message
2392014012277505/01/14Memory controller for memory device
2402014011081504/24/14High voltage diode
2412014011127804/24/14Dynamically biased output structure
2422014011246404/24/14Conference call system, method, and computer program product
2432014011528004/24/14Flexible control mechanism for store gathering in a write buffer
2442014011535804/24/14Integrated circuit device and controlling an operating mode of an on-die memory
2452014011554904/24/14Method for verifying digital to analog converter design
2462014010343104/17/14Laterally double diffused metal oxide semiconductor transistors having a reduced surface field structures
2472014010510104/17/14Method and system for low power transmission and data alignment
2482014010518504/17/14Timing event generation circuit for mobile communication device
2492014010887604/17/14Processor switchable between test and debug modes



ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009



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