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Patent Pack (PDFs)
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Patent Pack (PDFs)
Research new robot inventions
Patent Pack (PDFs)
Research the latest gaming inventions
Patent Pack (PDFs)
Research new Social Network inventions
Patent Pack (PDFs)
Research new Drone inventions
Patent Pack (PDFs)
Research the latest Electric Vehicle inventions
Patent Pack (PDFs)
Research latest Smartphone inventions
Multi-chip package and manufacturing method
Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip,... Ge Embedded Electronics Oy
Rigid-flex module and manufacturing method
Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone... Ge Embedded Electronics Oy
Circuit board structure and manufacturing a circuit board structure
The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in... Ge Embedded Electronics Oy