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Global Circuit Innovations Inc patents


Recent patent applications related to Global Circuit Innovations Inc. Global Circuit Innovations Inc is listed as an Agent/Assignee. Note: Global Circuit Innovations Inc may have other listings under different names/spellings. We're not affiliated with Global Circuit Innovations Inc, we're just tracking patents.

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Method for remapping a packaged extracted die

A method for remapping an extracted die is provided. The method includes one or more of removing an extracted die from a previous integrated circuit package, the extracted die including a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and bonding an interposer to the extracted die. ... Global Circuit Innovations Inc

3d printed hermetic package assembly and method

A method is provided. The method includes one or more of removing existing ball bonds from an extracted die, placing the extracted die into a recess of a hermetic substrate, the extracted die having a centered orientation in the recess, and applying a side fill compound into the recess between the extracted die and the hermetic substrate. ... Global Circuit Innovations Inc

Method for remapping a packaged extracted die with 3d printed bond connections

A method is provided. The method includes removing an extracted die including an original ball bond from a previous packaged integrated circuit, bonding the extracted die to an interposer to create a remapped extracted die, 3d printing one or more first bond connections between one or more original bond pads of the extracted die and one or more first bond pads of the interposer, securing the remapped extracted die to a package base, and 3d printing one or more second bond connections between one or more second bond pads of the interposer and one or more package leads or downbonds of the package base. ... Global Circuit Innovations Inc

Remapped packaged extracted die

A remapped extracted die is provided. The remapped extracted die includes an extracted die removed from a previous integrated circuit package. ... Global Circuit Innovations Inc

Remapped packaged extracted die with 3d printed bond connections

An integrated circuit is provided. The integrated circuit includes a package base including package leads, an extracted die removed from a previous packaged integrated circuit, and an an interposer bonded to the extracted die and the package base. ... Global Circuit Innovations Inc

Repackaged integrated circuit assembly method

A method is provided. The method includes one or more of extracting a die from an original packaged integrated circuit, modifying the extracted die, reconditioning the modified extracted die, placing the reconditioned die into a cavity of a hermetic package base, bonding a plurality of bond wires between reconditioned die pads of the reconditioned die to leads of the hermetic package base or downbonds to create an assembled hermetic package base, and sealing a hermetic package lid to the assembled hermetic package base to create a new packaged integrated circuit. ... Global Circuit Innovations Inc








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