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Harima Chemicals Incorporated patents

Recent patent applications related to Harima Chemicals Incorporated. Harima Chemicals Incorporated is listed as an Agent/Assignee. Note: Harima Chemicals Incorporated may have other listings under different names/spellings. We're not affiliated with Harima Chemicals Incorporated, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "H" | Harima Chemicals Incorporated-related inventors

Solder alloy, solder paste and electronic circuit board

A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt. Relative to a total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the copper content is 0.3 mass % or more and 1 mass %... Harima Chemicals Incorporated

Solder alloy, solder paste, and electronic circuit board

In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less;... Harima Chemicals Incorporated

Polyacrylamide resin, papermaking additive, and paper

(In the above-described formula (5), R4 represents a hydrogen atom or a methyl group and R5 represents a hydrogen atom, an alkali metal ion, or an ammonium ion.)... Harima Chemicals Incorporated

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Harima Chemicals Incorporated in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Harima Chemicals Incorporated with additional patents listed. Browse our Agent directory for other possible listings. Page by