Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch
  

Harvatek Corporation patents

Recent patent applications related to Harvatek Corporation. Harvatek Corporation is listed as an Agent/Assignee. Note: Harvatek Corporation may have other listings under different names/spellings. We're not affiliated with Harvatek Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "H" | Harvatek Corporation-related inventors




Date Harvatek Corporation patents (updated weekly) - BOOKMARK this page
03/30/17System and recovering metal from metal-containing waste liquid
02/09/17Display device and light-emitting array module thereof
02/02/17Portable light-emitting device without pre-stored power sources and led package structure thereof
12/22/16Display panel and composite display panel using the same
06/02/16Light emitting diode device and light emitting device using the same
10/01/15Display structure
03/05/15Package of light emitting diode chips
07/31/14White light emitting diodes package containing plural blue light-emitting diodes
02/20/14Novel compound for carrier transport, element and electronic device using the same
05/17/12Led package structure with a deposited-type phosphor layer and making the same
05/17/12White light-emitting diode package structure for simplifying package process and making the same
05/03/12Led package structure
04/26/12Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a manufacturing the same
04/19/12Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and manufacturing the same
03/22/12Lamp head assembly and lighting lamp tube
03/01/12Led chip package structure with a high-efficiency heat-dissipating substrate and making the same
02/16/12Led package structure and making the same
01/19/12Simple detachable illumination structure and lamp tube
01/12/12Wafer level led package structure for increase light-emitting efficiency and making the same
01/12/12Method of manufacturing a led chip package structure
01/05/12Led chip package structure
01/05/12Led chip package structure using sedimentation and making the same
12/15/11Wafer level diode package structure
12/08/11Package for a light emitting diode and fabricating the same
09/22/11Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and making the same
09/08/11Led package structure and manufacturing the same
08/04/11Led chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and making the same
06/30/11Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a manufacturing the same
06/30/11Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
06/30/11Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
06/30/11Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
06/30/11Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof
06/23/11Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and manufacturing the same
01/27/11Semiconductor chip package structure for achieving electrical connection without using wire-bonding process and making the same
01/27/11Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and making the same
01/27/11Led chip package structure with high-efficiency light emission by rough surfaces and making the same
01/06/11Led chip package structure with an embedded esd function and manufacturing the same
01/06/11Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and making the same
12/02/10Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and manufacturing the same
10/28/10Light-guiding structure with phosphor material layers
04/01/10Illumination device with a fire-fighting function
02/11/10Wafer level led package structure for increasing conductive area and heat-dissipating area and making the same
12/24/09Led chip package structure with an embedded esd function and manufacturing the same
11/19/09Semiconductor chip package structure for achieving face-down electrical connection without using a wire-bonding process and making the same
11/12/09Semiconductor chip package structure without substrates for achieving face-up electrical connection without using a wire-bonding process and making the same
10/22/09Led chip package structure using a substrate as a lampshade and making the same
09/17/09Semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process and making the same
08/20/09Semiconductor chip package structure for achieving electrical connection without using a wire-bonding process and making the same







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Harvatek Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Harvatek Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###




';