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Henkel Corporation patents

Recent patent applications related to Henkel Corporation. Henkel Corporation is listed as an Agent/Assignee. Note: Henkel Corporation may have other listings under different names/spellings. We're not affiliated with Henkel Corporation, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "H" | Henkel Corporation-related inventors

Date Henkel Corporation patents (updated weekly) - BOOKMARK this page
06/16/16Photocrosslinkable block copolymers for hot-melt adhesives
08/27/15Dispense for applying an adhesive to a remote surface
03/26/15Triply curable optically clear adhesive
09/18/14Prepreg curing process for preparing composites having superior surface finish and high fiber consolidation
09/18/14Anaerobic curable compositions
09/18/14Oxetane-containing compounds and compositions thereof
09/18/14Thermosetting resin compositions with low coefficient of thermal expansion
09/18/14Electronic devices assembled with heat absorbing and/or thermally insulating composition
09/18/14Adhesive compostions with wide service temperature window and use thereof
09/18/14Adhesive compostions with wide service temperature window and use thereof
09/18/14Prepreg curing process for preparing composites having superior surface finish and high fiber consolidation
09/18/14Methods and controlled single electron transfer living radical polymerization
08/28/14Hot melt adhesive comprising cyanoacrylate curing compounds
08/21/14Elastic attachment adhesive and use thereof
08/14/14Wafer back side coating as dicing tape adhesive
08/07/14Thiol-ene cured oil-resistant polyacrylate sealants for in-place gasketing applications
07/10/14Photocurable elastomer compositions
05/22/14Hot melt assist waterborne adhesives and use thereof
05/08/14Molding and overmolding compositions for electronic devices
04/17/14Controlled radical polymerization of (meth)acrylate monomers
03/27/14Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
03/20/14Adhesive compositions and use thereof
01/30/14Reactive hot melt adhesive
01/30/14Silver sintering compositions with fluxing or reducing agents for metal adhesion
01/23/14Moisture-curable hot melt adhesive
01/09/14Liquid compression molding encapsulants
01/09/14Radiation curable temporary laminating adhesive for use in high temperature applications
01/02/14Accelerators for two step adhesive systems
01/02/14Accelerators for curable compositions
01/02/14Accelerators for two part curable compositions
01/02/14Accelerator/oxidant/proton source combinations for two part curable compositions
11/28/13Process for preparing flowable amorphous poly-alpha olefin adhesive pellets
11/21/13Chain extended epoxy to improve adhesion of conductive die attach film
11/21/13Integral hot melt adhesive packaging films and use thereof
11/21/13Temporary lining
10/31/13Curable elastomer compositions with low temperature sealing capability
08/15/13Composite film for board level emi shielding
08/15/13Pre-cut wafer applied underfill film
08/08/13Low temperature hot melt adhesives for disposable articles with high creep resistance
08/08/13Stretch film lamination adhesive
08/01/13Pre-cut wafer applied underfill film on dicing tape
08/01/13B-stageable and skip-curable wafer back side coating adhesives
08/01/13Self-aligned graphene polymer nanocomposites
07/25/13Adhesive compositions
07/18/13Adhesive compositions and use thereof
07/11/13Photocurable dicing die bonding tape
07/04/13Methods for measuring degree of cure or soldification of a composition
06/27/13Adhesive having insulative properties
06/27/13One component epoxy resin composition
06/20/13Low application tempearature amorphous poly-a-olefin adhesive
05/30/13Adhesive recycling during spin coating
04/25/13Chemical vapor resistant epoxy composition
04/25/13Wafer backside coating process with pulsed uv light source
04/25/13Wafer backside coating containing reactive sulfur compound
04/25/13Dual cure adhesives
03/28/13Controlled cure aliphatic laminating adhesive using non-migrating blocking agents for organometallic catalysts
03/28/13Adhesive compositions for use in die attach applications
03/21/13Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts
03/14/13Injection molding process and compositions with improved sealing characteristics for mold-in-place gaskets
02/07/13Curable compositions, processes for using such compositions to prepare composites and processes for preparing composites having superior surface finish and high fiber consolidation
01/31/13Methods for making aqueous polyurethane dispersions of aromatic polyisocyanate mixtures and compositions
01/24/13Silane moisture curable hot melts
01/24/13Epoxy resin composition with reduced toxicity
01/17/13Macro-photoinitiators and curable compositions thereof
01/10/13Coating adhesives onto dicing before grinding and micro-fabricated wafers
Patent Packs
01/10/13Silicone-acrylic copolymer
12/20/12Moisture cure hot melt adhesives
11/22/12Dispensing gun for a collapsible adhesive-filled container
11/15/12Dual cartridge pneumatic dispenser integrated with disposable anti-drip valve for precision dispensing
11/08/12Bulk packaged material and methods of packaging and dispensing material
11/08/12Moisture-curable hot melt adhesive
10/11/12Method and system for regulating adhesive application
09/13/12Anaerobically curable compositions
07/26/12Connection systems for refrigeration filter dryer units and methods for their manufacture
07/19/12Primer compositions to toughen adhesive bonds
06/21/12Cure accelerators for anaerobic curable compositions
05/24/12Robust adhesives for laminating flexible packaging material
05/10/12Curable silicone compositions containing reactive non-siloxane-containing resins
05/10/12Anaerobic adhesive and sealant compositions in film form, film spool assemblies containing such compositions in film form and preapplied versions thereof on matable parts
04/05/12Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds
Patent Packs
03/22/12Moisture curable polydisulfides
03/01/12Curable compositions with moisture-curable functionality clusters near the chain ends
02/23/12Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
02/02/12Extremely high temperature wearing compound
01/26/12Method for connecting electrodes and bonding composition used therefor
12/01/11Hydrogen peroxide complexes and their use in the cure system of anaerobic adhesives
11/17/11Encapsulant for inkjet print head
11/10/11Fast,curing two part anaerobic adhesive composition
11/10/11Moisture-curable hot melt adhesive
11/03/11Thermally decomposable polymer coated metal powders
09/22/11Photo-curable resin composition for ultraviolet light-led irradiation
09/01/11Self adhering window flashing tape with multi-directional drainage plane
07/21/11Dry-to-the-touch-moisture-curable compositions and products made therefrom
07/21/11Shear- and/or pressure-resistant microspheres
07/21/11Nonflammable hollow polymeric microspheres
07/14/11Cyanoacrylate compositions in non-flowable forms
06/16/11Method of preparing a mold sealer, mold sealer assembly and compositions thereof
06/09/11Low temperature curing compositions
06/09/11Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
06/09/11Injection molding process, apparatus and material for forming cured-in-place gaskets
06/02/11Silver-coated boron nitride particulate materials and formulations containing same
05/26/11Moisture curable polyamides and methods for using the same
05/19/11Mold assembly and attenuated light process for fabricating molded parts
03/24/11Compositions with improved sealing characteristics for mold-in-place gaskets
03/10/11Apparatus and methods for controlled radical polymerization
01/20/11Liquid polyurethane prepolymers useful in solvent-free adhesives
12/30/10Ultrafast heat/room temperature adhesive composition for bonding applications
12/16/10Hand held peristaltic pump for dispensing fluid from a rigid container
11/25/10Anti-seize composition with nano-sized lubricating solid particles
Social Network Patent Pack
10/14/10Curable compositions for advanced processes, and products made therefrom
10/07/10Compositions and processes for assembling appliances
09/16/10Surface attachment device
08/26/10Photocurable elastomer compositions
08/19/10Liquid moisture curable polyurethane adhesives for lamination and assembly
08/19/10Curable benzoxazine macromonomers, their preparation and cured products
08/12/10Curable benzoxazine-based compositions, their preparation and cured products thereof
08/12/10Curable compositions containing isocyanate-based tougheners
07/15/10Lubricious anaerobic curable compositions
07/08/10Two-component high gloss semi-permanent water based release agent for polyester substrates
Patent Packs
06/17/10Primer compositions for adhesive bonding systems
06/10/10Low modulus, humidity resistant silicone rtv compositions and preparing same
06/10/10Benzoxazine containing compositions of matter and curable compositions made therewith
05/06/10Waterborne adhesive compositions for use in bonding to fire retardant treated wood and wood composites
04/29/10Acrylic adhesives
04/29/10Liquid stable thiol-acrylate/vinyl ether compositions
04/08/10Room temperature curing adhesive composition having high temperature properties
04/08/10Thermally resistant anaerobically curable compositions
03/18/10Flowable non-sagging adhesive compositions
03/11/10Dry-to-the-touch anaerobically curable compositions and products made therefrom
01/28/10Adhesive tape dispenser and applicator
01/14/10Anaerobically curable compositions
01/14/10Low ratio rtv compositions and methods for making same
12/17/09Next generation, highly toughened two part structural epoxy adhesive compositions
12/03/09Cyanoacrylate compositions containing dispersions of core shell rubbers in (meth)acrylates
12/03/09(meth)acrylates compositions containing dispersions of core shell rubbers in (meth)acrylates
11/19/09Acrylic-based adhesives for polyvinylidene surfaces
11/12/09Cure accelerators for anaerobic curable compositions
11/12/09Cure accelerators for anaerobic curable compositions
11/12/09Cure accelerators for anaerobic curable compositions
10/22/09Components comprising polyisobutylene compositions
08/20/09Toughened binder compositions for use in advanced processes
07/30/09High pressure connection their manufacture
07/16/09Adhesive tape dispenser and applicator
07/02/09Curable silicone compositions incorporating a fluorescent detection system
06/25/09Polyisobutylene compositions with improved reactivity and properties for bonding and sealing fuel cell components
06/04/09Polysiloxanes grafted with radically curable and/or moisture curable groups
05/14/09Deformable soft molding compositions
05/07/09Retractable sealant dispensing squeeze tube
03/05/09Led assembly with led-reflector interconnect
Patent Packs
02/05/09Acid inhibitor compositions for metal cleaning and/or pickling

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Henkel Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Henkel Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by