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Henkel Ip & Holding Gmbh patents

Recent patent applications related to Henkel Ip & Holding Gmbh. Henkel Ip & Holding Gmbh is listed as an Agent/Assignee. Note: Henkel Ip & Holding Gmbh may have other listings under different names/spellings. We're not affiliated with Henkel Ip & Holding Gmbh, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "H" | Henkel Ip & Holding Gmbh-related inventors

Date Henkel Ip & Holding Gmbh patents (updated weekly) - BOOKMARK this page
04/20/17Alkoxysilane-functionalized hydrocarbon compounds, intermediates thereof and methods of preparation thereof
03/23/171k uv and thermal cure high temperature debondable adhesive
03/09/17Preparation of novel fluorocompounds, methods of preparation and compositions made therefrom
02/23/17Apparatus and applying multi-component adhesives using jetting valves
02/23/17Toughened cyanoacrylate compositions
02/16/17Anaerobic curable compositions containing blocked (meth)acrylate acid compounds
02/16/17Anaerobic curable compositions containing blocked (meth)acrylic acid compounds
02/16/17Anaerobic curable compositions containing blocked dicarboxylic acid compounds
02/02/17Curable adhesive compositions and use thereof
01/19/17Sinterable metal particles and the use thereof in electronics applications
12/15/16Cyanoacrylate compositions in non-flowable forms
11/24/16Thermally conductive pre-applied underfill formulations and uses thereof
11/17/16Reactive hot melt adhesives with improved adhesion
11/17/16Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
11/03/16Thermally resistant anaerobically curable compositions
10/27/16Pre-applied underfill film containing nano-particulate filler for 3dic applications, compositions useful for the preparation thereof, and uses thereof
10/20/16Cooling module with multiple parallel blowers
09/15/16Adhesive for insulative articles
09/08/16Process for preparing flowable amorphous poly-alpha olefin adhesive pellets
07/07/16Pyrolized organic layers and conductive prepregs made therewith
06/30/16Adhesive for electronic component
06/16/16Method of coating and protecting coal tip burner with colloidal silica based high temperature and abrasion resistant putty
06/09/16Submicron silver particle ink compositions, process and applications
06/09/16Bonding or vulcanisation compositions
06/02/16Metal sintering film compositions
06/02/16High molecular weight polymers having high olefin content
06/02/16Alkoxysilane-functionalized polyacrylate compositions and preparation thereof
05/26/16Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof
05/19/16Integral hot melt adhesive packaging films and use thereof
04/21/16Chemical vapor resistant epoxy composition
04/14/16Adhesive compositions and the use thereof
03/24/16Functional polyisobutylene-containing oligomers and polymers
03/17/16Electron deficient olefins
03/17/16Primer compositions for injection molding
03/17/16Methods to control wafer warpage upon compression molding thereof and articles useful therefor
03/10/16Multi-layer barrier adhesive film
03/10/16High temperature debondable adhesive
03/03/16Nanoparticle ink compositions, process and applications
02/25/16Dispense tip cleaning apparatus
02/04/16Molding and overmolding compositions for electronic devices
02/04/16Low application temperature amorphous poly-a-olefin adhesive
01/28/16Optical transparent dual cure adhesives composition
01/21/16Cyanoacrylate compositions
01/14/16Curable compositions, processes for using such compositions to prepare composites and processes for preparing composites having superior surface finish and high fiber consolidation
01/07/16Curable acrylate or methacrylate compositions
01/07/16Diene/dienophile couples and thermosetting resin compositions having reworkability
11/26/15Synthesis of functional polyisobutylene-containing oligomers and polymers
11/12/15Flexible conductive ink
11/12/15Foamable hot melt adhesive compositions and use thereof
11/12/15Low application temperature hot melt adhesive
11/12/15Underfill composition and packaging process using the same
11/12/15Reactive hot melt adhesive
10/01/15Process of controlled radical polymerization of branched polyacrylates
09/24/15Silicone-compatible photoiniators
08/13/15Adhesive compositions and use thereof
07/09/15Electron deficient olefins
07/02/15Bonding composition comprising a sulfur impregnated particulate solid
06/18/15Low application temperature amorphous poly-a-olefin adhesive
06/18/15Liquid optically clear photo-curable adhesive for display application
06/11/15Low temperature hot melt adhesives for disposable articles with high creep resistance
06/04/15Thermally insulative composition and electronic devices assembled therewith
04/23/15Article comprising a film on a carrier or release substrate
03/26/15Vinyl carbosiloxane resins
11/06/14Two part-cyanoacrylate/free radically curable adjesive systems
07/03/14Di- or poly-functional electron deficient olefins coated metal powders for solder paste
Patent Packs
07/03/14Aqueous-based composition suitable for use in threadlocking applications
06/26/14Conductive material and process
06/05/14Adhesive systems using imines and salts thereof, precursors to electron deficient olefins and coreactants therefor

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Henkel Ip & Holding Gmbh in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Henkel Ip & Holding Gmbh with additional patents listed. Browse our Agent directory for other possible listings. Page by