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Heraeus Deutschland Gmbh & Co Kg patents

Recent patent applications related to Heraeus Deutschland Gmbh & Co Kg. Heraeus Deutschland Gmbh & Co Kg is listed as an Agent/Assignee. Note: Heraeus Deutschland Gmbh & Co Kg may have other listings under different names/spellings. We're not affiliated with Heraeus Deutschland Gmbh & Co Kg, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "H" | Heraeus Deutschland Gmbh & Co Kg-related inventors




Date Heraeus Deutschland Gmbh & Co Kg patents (updated weekly) - BOOKMARK this page
08/17/17 new patent  Two or polyfunctional compounds as adhesion primers for conductive polymers
08/03/17Metal paste and use thereof for the connecting of components
08/03/17Method for producing a silver sintering agent having silver oxide surfaces and use of said agent in methods for joining components by pressure sintering
07/20/17Multi-layered structure and method
07/20/17Directly integrated feedthrough for an implantable medical device housing using a gold alloy
07/20/17Directly integrated feedthrough to implantable medical device housing
07/13/17Formulations comprising metal nanowires and pedot
07/13/17Process for manufacturing of a thick copper wire for bonding applications
07/06/17Method for applying dried metal sintering compound by means of a transfer substrate onto a carrier for electronic components, corresponding carrier, and the use thereof for sintered connection to electronic components
06/29/17Process for electrically contacting a coated lead with a particle
06/29/17Process for electrically contacting a coated lead with a layer
06/22/17Cr, ni, mo and co alloy for use in medical devices
06/15/17Silver-alloy based sputtering target
06/15/17Method for producing a bondable coating on a carrier strip
06/01/17Method for producing a component from an amorphous-phase metal alloy
06/01/17Copper bonding wire with angstrom (Å) thick surface oxide layer
05/25/17Processes for producing a sleeve for an electrode for medical applications
05/18/17Wireless cardiac pacemaker with cermet electrode
05/18/17Metal preparation for connecting components
05/18/17Catalyst support and producing porous graphitizied carbon material covered with metal nanoparticles
05/11/17Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
05/11/17Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and producing a substrate
05/04/17Cermet bearing, in particular for an implantable medical device
04/27/17Electrode structure and producing
04/27/17Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
04/20/17Support and/or clip for semiconductor elements, semiconductor component, and production method
04/13/17Pump housing made from at least three different sinterable materials
03/16/17Direct integration of feedthrough to implantable medical device housing with ultrasonic welding
03/02/17Cusn, cuzn and cu2znsn sputter targets
03/02/17Implantable sensor
02/16/17Method of manufacturing a ceramic bushing for an implantable medical device
02/16/17Process for the production of electrolyte capacitors of high nominal voltage
01/26/17Method for preparing catalyst composition for exhaust gas after-treatment
01/19/17Method of producing a cermet-containing bushing for an implantable medical device
01/05/17Process for the production of a pgm-enriched alloy
12/22/16Pump housing made of a magnetic and a non-magnetic material
12/22/16Pump housing of two different sinterable materials
12/22/16Pump housing with hard inner layer and weldable outer layer
11/17/16Feedthrough with integrated brazeless ferrule
10/27/16Solder paste with oxalic acid and amine component
10/27/16Method for mounting a component on a substrate
10/06/16Coated wire for bonding applications
10/06/16Method for processing a dispersion-hardened platinum composition
09/29/16Electro-conductive pastes comprising a metal compound
09/22/16Security feature based on a polymer layer comprising a first area and a further area
09/08/16Metal oxide target and producing said metal oxide target
09/08/16Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
09/01/16Probe pin and producing a probe pin
08/18/16Process for producing a shiny laminate structure at low temperatures
08/04/16Electro-conductive paste with silver oxide and organic additive
06/30/16Electro-conductive paste comprising ag particles with a multimodal diameter distribution in the preparation of electrodes in mwt solar cells
06/23/16Method of forming a multi-layered structure of alternating conducting and non-conducting layers
06/09/16Patterning of a composition comprising silver nanowires
05/05/16Multi-layered structure
05/05/16Welded feedthrough
05/05/16Ceramic feedthrough brazed to an implantable medical device housing
04/14/16Copper coloured paint, a process for making it and its application
03/24/16Sinter paste with partially oxidized metal particles
03/24/16Lead connector with distal frame
03/10/16Light-absorbing layer and layer system containing the layer, producing the layer system and a sputter target suited therefor
03/03/16Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinter
02/25/16Non-polar solvents as an adhesion promoter additive in pedot/pss dispersions
02/18/16Particles comprising al, si and mg in electro-conductive pastes and solar cell preparation
02/18/16Particles comprising al and ag in electro-conductive pastes and solar cell preparation
02/11/16Layered structure with conductive polymer for recognition of manipulation and process for the production thereof
Patent Packs
02/04/16Production of a decorative layer on ceramic surfaces
01/14/16Electro-conductive paste with characteristic weight loss for high temperature application
01/14/16Electro-conductive paste with characteristic weight loss for high temperature application
12/31/15Catalyst having a three-dimensional dent structure in the form of a hexagon
12/17/15Coated wire for bonding applications
12/10/15Electro-conductive paste comprising a vanadium containing compound in the preparation of electrodes in mwt solar cells
12/10/15Binary glass frits used in n-type solar cell production
12/10/15Electro-conductive paste comprising a vanadium containing compound in the preparation of electrodes in mwt solar cells
12/10/15Binary glass frits used in n-type solar cell production
12/03/15Thin metal membrane with support
12/03/15An electro-conductive paste comprising a vanadium containing compound and a phosphorous containing material in the preparation of electrodes in mwt solar cells
10/22/15Aluminum alloy wire for bonding applications
10/08/15Sputtering target with optimized performance characteristics







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