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Heraeus Materials Technology Gmbh & Co Kg patents

Recent patent applications related to Heraeus Materials Technology Gmbh & Co Kg. Heraeus Materials Technology Gmbh & Co Kg is listed as an Agent/Assignee. Note: Heraeus Materials Technology Gmbh & Co Kg may have other listings under different names/spellings. We're not affiliated with Heraeus Materials Technology Gmbh & Co Kg, we're just tracking patents.

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Date Heraeus Materials Technology Gmbh & Co Kg patents (updated weekly) - BOOKMARK this page
03/03/16Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinter
10/22/15Aluminum alloy wire for bonding applications
06/04/15Aluminum coated copper bond wire and making the same
05/21/15Aluminum coated copper ribbon
04/09/15Aluminum coated copper bond wire and making the same
02/26/15Zirconium-based alloy metallic glass and forming a zirconium-based alloy metallic glass
02/05/15Flat structure, particularly textile, containing precious metal wire
01/22/15Method of joining components using metal paste with oxidizing agents
05/01/14Wire for sliding contacts, and sliding contacts
03/06/14Silver alloy wire for bonding applications
01/30/14Catalyst
01/30/14Catalyst
11/28/13Method for partial lamination of flexible substrates
10/10/13Planar or tubular sputtering target and the production thereof
08/29/13Chip-integrated through-plating of multi-layer substrates
08/22/13Core-jacket bonding wire
08/22/13Laminate with integrated electronic component
07/25/13Reduction of the evaporation rate out of platinum and pt alloys
07/25/13Contact piece containing precious metal on a spring support having a rotationally symmetrical bending moment
06/06/13Secondary alloyed 1n copper wires for bonding in microelectronics devices
06/06/13Alloyed 2n copper wires for bonding in microelectronics devices
06/06/13Doped 4n copper wires for bonding in microelectronics devices
06/06/133n copper wires with trace additions for bonding in microelectronics devices
05/23/13Bonding wire for semiconductor devices
03/21/13Paste and connecting electronic component to substrate
02/14/13Non-woven material or netting of metal fibers
10/25/12Method for manufacturing a partially coated carrier structure
10/04/12Nitrogen oxide and hydrocyanic acid production method
08/23/12Tube-shaped sputtering target
06/21/12Metal paste with oxidizing agents
06/21/12Metal paste with co-precursors
06/14/12Thin film transistor (tft) having copper electrodes
05/17/12Lead-free high temperature compound
04/12/12Sputtering target having amorphous and microcrystalline portions and producing same
03/08/12Use of aliphatic hydrocarbons and paraffins as solvents for silver sinter pastes
03/08/12Contacting means and contacting electrical components
01/05/12Treatment of boron-containing, platinum group metal-based alloys







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