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Ibiden Co Ltd
Ibiden Co Ltd_20100107
Ibiden Co Ltd_20100114
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Ibiden Co Ltd patents


Recent patent applications related to Ibiden Co Ltd. Ibiden Co Ltd is listed as an Agent/Assignee. Note: Ibiden Co Ltd may have other listings under different names/spellings. We're not affiliated with Ibiden Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Ibiden Co Ltd-related inventors


 new patent  Printed wiring board

A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central insulating layer, a first resin insulating layer formed on first surface side of the central insulating layer, a second resin insulating layer formed on second surface side of the central insulating layer, via... Ibiden Co Ltd

Printed wiring board

A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central resin insulating layer, a first resin insulating layer formed on a first surface side of the central resin insulating layer, and a second resin insulating layer formed on a second surface side of... Ibiden Co Ltd

Wiring board and manufacturing the same

A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive... Ibiden Co Ltd

Coil substrate and manufacturing the same

A coil substrate includes insulating layers, and conductive layers laminated on the insulating layers in a plate thickness direction of the insulating layers, respectively. The conductive layers include three or more conductive layers and a set of conductive layers such that the set of conductive layers includes a first outermost... Ibiden Co Ltd

Wiring board

A wiring board includes conductor layers, core layers including a first core layer and a second core layer formed such that each of the first and second core layers includes a core material, an intermediate insulating layer formed between the first core layer and second core layer such that the... Ibiden Co Ltd

Printed wiring board and manufacturing same

A printed wiring board includes a base substrate, a first insulative resin layer laminated on first surface of the base substrate, and a first conductive layer laminated on the first insulative resin layer. The base substrate includes conductive layers and insulative resin layers, the base substrate, first insulative resin layer... Ibiden Co Ltd

Solder resist and printed wiring board

A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer... Ibiden Co Ltd

Metal member with coat layer

The present invention provides a coated metal member including a metal base and a coat layer made of an amorphous inorganic material formed on the metal base, the coat layer containing pores and carbon particles.... Ibiden Co Ltd

Sic-coated carbon composite material

Provided is a SiC-coated carbon composite material including a graphite base material and a CVD-SiC coating covering the graphite base material. A porosity of a core part of the graphite base material is 12 to 20%, and a SiC-infiltrated layer extending from the CVD-SiC coating is included in a periphery... Ibiden Co Ltd

Method for manufacturing wiring board

A method for manufacturing a wiring board includes forming on a first support plate a first laminated wiring portion including conductor and insulating layers such that the first portion has a first surface on first support plate side and a second surface, separating the first portion from the first plate,... Ibiden Co Ltd

Composite wiring board and manufacturing composite wiring board

A composite wiring board includes a first wiring board including a first insulating layer, a first conductor layer formed on the first insulating layer, and metal elements penetrating the first insulating layer and the first conductor layer such that the metal elements are electrically connected to each other by the... Ibiden Co Ltd

Production nuclear reactor structure

A nuclear reactor structure configuring a pebble accommodating space of a pebble bed type nuclear reactor includes a core material including graphite and a ceramic/ceramic composition material covering a surface of the core material. According to a core material processing step (A) of processing the core material including graphite into... Ibiden Co Ltd

Inductor component and manufacturing inductor component

An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors... Ibiden Co Ltd

Method for manufacturing wiring board

A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more... Ibiden Co Ltd

Honeycomb catalyst

This honeycomb catalyst is provided with a honeycomb unit in which a plurality of through holes are arranged in parallel in a longitudinal direction with being separated by partition walls, wherein the honeycomb unit contains a zeolite and an inorganic binder, the zeolite satisfies all of conditions (A) to (D):... Ibiden Co Ltd

Fluid flow straightening member

There is provided a manufacturing method of a fluid flow straightening member having a structure in which disturbance of an air flow does not easily arise. In at least one of outermost layers of an outer circumferential surface or an inner circumferential surface which configures a tubular portion of the... Ibiden Co Ltd

Printed wiring board and manufacturing the same

A printed wiring board includes a support plate, and a build-up wiring layer including resin insulating layers and conductor layers and having a first surface and a second surface on the opposite side with respect to the first surface such that the support plate is positioned on the first surface... Ibiden Co Ltd

Interposer and manufacturing interposer

An interposer includes an insulating layer, conductor circuits formed in grooves formed on a first surface of the insulating layer respectively, and metal posts formed in openings extending from the grooves to a second surface of the insulating layer on the opposite side with respect to the first surface such... Ibiden Co Ltd

Honeycomb catalyst

Provided is a honeycomb catalyst in which a plurality of through holes are provided in proximity to each other in a row arrangement in the lengthwise direction, and are set apart by partitions. A honeycomb unit contains at least two types of inorganic particles and an inorganic binder. The inorganic... Ibiden Co Ltd

Printed wiring board and manufacturing the same

A printed wiring board includes a laminated base material including a surface conductor layer, a conductor layer, an interlayer insulating layer interposed between the surface conductor layer and the conductor layer, and an internal bonding layer interposed between the interlayer insulating layer and the surface conductor layer and/or conductor layer,... Ibiden Co Ltd

Printed wiring board and manufacturing the same

A printed wiring board includes a laminated base material including an insulating layer and a conductor layer formed on the insulating layer, and a solder resist layer laminated on the laminated material and including photosensitive resin. The resist layer has surface portion and portion in contact with the laminated material,... Ibiden Co Ltd

Electronic component built-in substrate and manufacturing the same

An electronic component built-in substrate includes an insulating substrate having a through hole and an inner wall surrounding the through hole, an electronic component accommodated in the through hole of the substrate, a sealing member filling the through hole such that the sealing member is covering the electronic component in... Ibiden Co Ltd

Wiring board and manufacturing the same

A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed... Ibiden Co Ltd

Method for manufacturing electronic component attached wiring board

A method for manufacturing an electronic component attached board includes preparing a first support plate, forming aggregate wiring boards on the first plate such that the aggregate boards each including wiring board side by side are formed in connected state on surface of the first plate, separating the first plate... Ibiden Co Ltd

Wiring substrate and manufacturing the same

A wiring substrate includes insulating layers including a first insulating layer such that the first insulating layer is positioned at one end of the insulating layers in lamination direction and has an accommodating portion through the first insulating layer, conductive layers laminated on the insulating layers and including a first... Ibiden Co Ltd

Wiring substrate and manufacturing the same

A wiring substrate includes insulating layers including a first insulating layer and an outermost insulating layer such that the first insulating layer is positioned at one end of the insulating layers in a lamination direction and that the outermost insulating layer is positioned at the opposite end of the insulating... Ibiden Co Ltd

Electronic component built-in substrate and manufacturing the same

An electronic component built-in substrate includes a first core layer having opening, a second core layer formed on the first core layer, a third core layer formed on the second core layer and having opening, a first electronic component accommodated in the opening of the first core layer, a second... Ibiden Co Ltd

Printed wiring board and manufacturing the same

A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward... Ibiden Co Ltd

Light-emitting element mounting substrate and manufacturing light-emitting element mounting substrate

A light-emitting element mounting substrate includes a substrate including an insulating resin material, a first conductor layer formed on a first main surface of the substrate, a second conductor layer formed on a second main surface of the substrate on the opposite side to the first main surface, metal blocks... Ibiden Co Ltd

Flexible printed wiring board, electronic device having flexible printed wiring board, and manufacturing electronic device having flexible printed wiring board

A flexible printed wiring board includes a flexible insulating layer, a conductor layer formed on a surface of the flexible insulating layer, and a metal block including a welding base material and positioned such that the metal block is penetrating through the flexible insulating layer and the conductor layer.... Ibiden Co Ltd

Printed wiring board

A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on first surface of the lowermost layer, a conductor post having upper surface facing the first surface of the lowermost layer, a metal post formed such that the metal post is protruding from second surface... Ibiden Co Ltd

Printed wiring board and manufacturing printed wiring board

A printed wiring board includes a conductor layer including a conductor circuit, a resin insulating layer formed on the conductor layer and having a via opening reaching to the conductor circuit of the conductor layer, and a via conductor formed in the via opening of the resin insulating layer such... Ibiden Co Ltd

Honeycomb filter

The present invention provides a honeycomb filter including a honeycomb fired body including porous cell partition walls, exhaust gas introduction cells each having an open end at an exhaust gas inlet side and a plugged end at an exhaust gas outlet side, exhaust gas emission cells each having an open... Ibiden Co Ltd

Honeycomb filter

The present invention provides a honeycomb filter including a honeycomb fired body including porous cell partition walls, exhaust gas introduction cells each having an open end at an exhaust gas inlet side and a plugged end at an exhaust gas outlet side, exhaust gas emission cells each having an open... Ibiden Co Ltd

Honeycomb filter

Area based on the hydraulic diameter=π×(Hydraulic diameter/2)2  (2).... Ibiden Co Ltd

07/06/17 / #20170196084

Printed wiring board

A printed wiring board includes a first insulating layer, a second conductor layer including first and second circuits, a second insulating layer covering the second conductor layer on the first insulating layer, a third conductor layer including first and second circuits, a third insulating layer covering the third conductor layer... Ibiden Co Ltd

07/06/17 / #20170196096

Printed wiring board and manufacturing printed wiring board

A printed wiring board includes a resin insulating layer, a projecting conductor layer formed on a surface of the resin insulating layer such that the projecting conductor layer is projecting from the surface of the resin insulating layer, and an integral conductor structure formed in the resin insulating layer and... Ibiden Co Ltd

06/22/17 / #20170173574

Honeycomb fired body, honeycomb filter, and producing honeycomb fired body

Provided is a honeycomb fired body in which the pressure loss in the initial state where PM has not accumulated is sufficiently low, the strength is sufficiently high, and the heat capacity is not small. The honeycomb fired body of the present invention is a honeycomb fired body including a... Ibiden Co Ltd

06/15/17 / #20170171974

Wiring board and manufacturing the same

A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating... Ibiden Co Ltd

06/01/17 / #20170154871

Printed wiring board

A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on a first surface of the lowermost resin insulating layer, a conductor post formed in the lowermost resin insulating layer such that the conductor post has an upper surface facing the first surface and a... Ibiden Co Ltd

05/11/17 / #20170130626

Honeycomb filter

A honeycomb filter includes a plurality of cells and porous cell walls. Exhaust gas is to flow through the plurality of cells. The plurality of cells include exhaust gas introduction cells and exhaust gas emission cells. The honeycomb filter has a round cross sectional shape. Each of the exhaust gas... Ibiden Co Ltd

05/04/17 / #20170127517

Printed wiring board and manufacturing the same

A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors... Ibiden Co Ltd

03/02/17 / #20170064825

Printed wiring board and manufacturing printed wiring board

A printed wiring board includes a first circuit substrate having first and second surfaces, and a second circuit substrate having third and fourth surfaces such that the first substrate is laminated on the third surface and that the first and third surfaces are opposing each other. The second substrate includes... Ibiden Co Ltd

03/02/17 / #20170064835

Printed wiring board and manufacturing printed wiring board

A printed wiring board includes a first circuit substrate having a first surface and a second surface on the opposite side, and a second circuit substrate having a third surface and a fourth surface on the opposite side such that the first circuit substrate is laminated on the third surface... Ibiden Co Ltd

02/23/17 / #20170053878

Printed wiring board and semiconductor package

A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer... Ibiden Co Ltd

02/02/17 / #20170033036

Printed wiring board, semiconductor package, and manufacturing printed wiring board

A printed wiring board includes a buildup wiring layer including resin insulation layers and conductive layers such that the conductive layers are laminated on the resin insulation layers, respectively, first pads formed in a center portion of a first surface of the buildup wiring layer and positioned to connect an... Ibiden Co Ltd

01/26/17 / #20170027057

Method for manufacturing printed wiring board and printed wiring board

A method for manufacturing a printed wiring board includes forming, on a surface of an insulating layer, a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film... Ibiden Co Ltd

01/19/17 / #20170018494

Interposer and circuit substrate

An interposer includes an insulating plate including insulating layers and having first, second, third and fourth surfaces such that the second surface is on the opposite side of the first surface, the third surface is perpendicular to the first surface, the fourth surface is on the opposite side of the... Ibiden Co Ltd








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