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Ibis Innotech Inc patents

Recent patent applications related to Ibis Innotech Inc. Ibis Innotech Inc is listed as an Agent/Assignee. Note: Ibis Innotech Inc may have other listings under different names/spellings. We're not affiliated with Ibis Innotech Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Ibis Innotech Inc-related inventors

Package structure

A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads,... Ibis Innotech Inc

Package structure and manufacturing package structure

A package structure includes a substrate, an insulator, a plurality of pads and a patterned circuit layer. The substrate includes a plurality of through holes. The insulator covers the substrate and is filled in the through hole. The conductive vias are located in the through holes and penetrate the insulator... Ibis Innotech Inc

Semiconductor structure

A semiconductor structure includes an insulating layer, a plurality of stepped conductive vias and a patterned circuit layer. The insulating layer includes a top surface and a bottom surface opposite to the top surface. The stepped conductive vias are disposed at the insulating layer to electrically connect the top surface... Ibis Innotech Inc

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Ibis Innotech Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Ibis Innotech Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by