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Indium Corporation
Indium Corporation Of America

Indium Corporation patents


Recent patent applications related to Indium Corporation. Indium Corporation is listed as an Agent/Assignee. Note: Indium Corporation may have other listings under different names/spellings. We're not affiliated with Indium Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Indium Corporation-related inventors


Hybrid lead-free solder wire

A braided solder wire rope includes a first alloy including Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy including Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the second alloy controls an interface reaction chemistry with various metallization surface finish materials without interfering with... Indium Corporation

Tin-indium based low temperature solder alloy

A lead-free solder alloy having a low melting temperature and low yield strength is disclosed. The solder alloy includes 5.0-20.0 wt. % of indium (In), 1.0-5.0 wt. % of silver (Ag), 0.25-2.0 wt. % of copper (Cu), 0.1-0.5 wt. % of zinc (Zn), and a remainder of tin (Sn). In... Indium Corporation

Nanomicrocrystallite paste for pressureless sintering

A sintering paste includes solvent and nanomicrocrystallite (NMC) particles. Each NMC particle is a single crystallite having at least one dimension in the range of 1 nm to 100 nm and at least one dimension in the range of 0.1 μm to 1000 μm. The sintering paste may be used... Indium Corporation

Hybrid lead-free solder wire

A lead—free solder wire includes a core wire with a first alloy and a shell coating layer with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb... Indium Corporation

Spacer particles for bond line thickness control in sintering pastes

Methods and compositions are described for controlling bond line thickness of a joint formed during sintering. Spacer particles of a predetermined particle type and size are added in a predetermined concentration to a sintering paste to form a sintering paste mixture prior to sintering to achieve a targeted bond line... Indium Corporation

Capillary block

A capillary block can be provided in any of a number of different geometries for soldering and brazing. The capillary block can be configured to be positioned adjacent a joint to be formed prior to heating. Heat can then be applied to melt the capillary block and cause it to... Indium Corporation

Capillary block

A capillary block can be provided in any of a number of different geometries for soldering and brazing. The capillary block can be configured to be positioned adjacent a joint to be formed prior to heating. Heat can then be applied to melt the capillary block and cause it to... Indium Corporation








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Indium Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Indium Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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