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Infineon Technologies Ag patents

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Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors

Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
02/26/09Adaptive capacitance for transistor
02/19/09Bipolar transistor finfet technology
10/20/16 new patent  Connector for dielectric waveguides
10/20/16 new patent  Ion implantation apparatus with ion beam directing unit
10/20/16 new patent  Method of manufacturing a silicon wafer
10/20/16 new patent  System and a mems sensor
10/20/16 new patent  System and a packaged mems device
10/20/16 new patent  System and a mems sensor
10/20/16 new patent  System and a capacitive sensor
10/20/16 new patent  Magnetoresistive devices
10/20/16 new patent  Rf system with an rfic and antenna system
10/20/16 new patent  Marker programming in non-volatile memories
10/20/16 new patent  Method and controlling current in an array cell
10/20/16 new patent  Method for processing a carrier and an electronic component
10/20/16 new patent  Semiconductor device and manufacturing method
10/20/16 new patent  Processing of thick metal pads
10/20/16 new patent  Semiconductor device including a diode at least partly arranged in a trench
10/20/16 new patent  Semiconductor component arrangement comprising a trench transistor
10/20/16 new patent  Semiconductor device comprising a transistor including a body contact portion and manufacturing the semiconductor device
10/20/16 new patent  Semiconductor device, integrated circuit and manufacturing the semiconductor device
10/20/16 new patent  Semiconductor device comprising a transistor
10/20/16 new patent  Magnetoresistive devices and methods for manufacturing magnetoresistive devices
10/20/16 new patent  Wideband doherty amplifier circuit with integrated transformer line balun
10/20/16 new patent  Analog-to-digital conversion
10/13/16Single wire interface
10/13/16Device security
10/13/16Semiconductor device including a cavity lid
10/13/16Method of manufacturing a semiconductor device having a rear-side insert structure
10/13/16Protection devices with trigger devices and methods of formation thereof
10/13/16Method of manufacturing a semiconductor device with a polysilicon-filled trench
10/13/16Semiconductor device with rear-side insert structure
10/13/16Semiconductor device having a channel separation trench
10/13/16Semiconductor device with cell trench structures and a contact structure
10/13/16Communicating between galvanically isolated devices using waveguides
10/13/16Phase current estimation for switching power converters
10/06/16Systems and methods using a reference marker
10/06/16Sensing a physical quantity in relation to a sensor
10/06/16Current sensor, system and method
10/06/16Spectral shaping of pseudorandom binary sequence
10/06/16Semiconductor processing system
10/06/16Printed circuit board including a leadframe with inserted packaged semiconductor chips
10/06/16Semiconductor packages and methods of forming the same
10/06/16Semiconductor device with channelstopper and producing the same
10/06/16Semiconductor wafer and manufacturing method
10/06/16Semiconductor device comprising auxiliary trench structures and integrated circuit
10/06/16Multi-cavity package having single metal flange
10/06/16Serial capacitance tuner
10/06/16Electronic drive circuit and method
10/06/16Chip and detecting a change of a stored data vector
09/29/16Method and device for processing radar signals
09/29/16Molded semiconductor package having enhanced local adhesion characteristics
09/29/16Gas sensor
09/29/16Verification of gate driver protection logic
09/29/16Integrated circuits and methods of design and manufacture thereof
09/29/16Automatic storage scheme by simultaneous id recognition
09/29/16Method for processing a die
09/29/16Electronic device and production
09/29/16Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material
09/29/16Field effect semiconductor component and producing it
09/29/16Bipolar transistor device with an emitter having two types of emitter regions
09/29/16Method for producing a controllable semiconductor component having trenches with different widths and depths
09/29/16Semiconductor devices having insulating substrates and methods of formation thereof
09/22/16Circuits, methods, and computer programs to detect mechanical stress and to monitor a system
09/22/16Semiconductor device
09/22/16Power switch device
09/22/16Systems and methods having omnipolar comparators for magnetic switches
09/22/16System and high-speed analog beamforming
09/22/16Spc sensor interface with partial parity protection
09/22/16Frequency ramp generation
09/22/16System and an acoustic transducer and environmental sensor package
09/15/16Method and device for handling safety critical errors
09/15/16System and a phase detector
09/15/16Testing of semiconductor devices and devices, and designs thereof
09/15/16Xmr sensors with serial segment strip configurations
09/15/16Sensor for a semiconductor device
09/15/16Method of manufacturing a semiconductor device
09/15/16Method of manufacturing a semiconductor device
09/15/16Semiconductor device, integrated circuit and manufacturing a semiconductor device
09/15/16Method for doping an active hall effect region of a hall effect device and hall effect device having a doped active hall effect region
09/08/16Off-axis magnetic field angle sensors
09/08/16Plastic cooler for semiconductor modules
09/08/16Source down semiconductor devices and methods of formation thereof
09/08/16Semiconductor devices with trench gate structures in a semiconductor body with hexagonal crystal lattice
09/08/16Power semiconductor device including trench gate structures with longitudinal axes tilted to a main crystal direction
09/08/16Method of manufacturing an integrated circuit having field effect transistors including a peak in a body dopant concentration
09/08/16Semiconductor device with trench gate structure including a gate electrode and a contact structure for a diode region
09/01/16Low noise zero crossing detection for indirect tire pressure monitoring
09/01/16Magnetic field sensor
09/01/16Random number generator
09/01/16Method for detecting a crack in a semiconductor body of a semiconductor component
09/01/16Electronic device
08/25/16Detection compensation of mechanical stresses
08/25/16Shaft-integrated angle sensing device
08/25/16Circuitry and instruction stream protection
08/25/16Semiconductor element and methods for manufacturing the same
08/25/16Resistive element
08/25/16Systems and methods for cascading radar chips having a low leakage buffer
08/25/16Partitioning of a chip supporting a sw-control architecture for inductive loads
08/25/16Arrangement and checking the entropy of a random number sequence
08/25/16Semiconductor substrate arrangements and a forming a semiconductor substrate arrangement
08/25/16Bonded system and a adhesively bonding a hygroscopic material
08/25/16Method of manufacturing a semiconductor package having an integrated microwave component
08/25/16System and a fault protection circuit
08/25/16System and a low noise amplifier module
08/25/16Communication device and calibrating an oscillator
08/18/16Fluid sensor chip and manufacturing the same
08/18/16Offset voltage compensation
08/18/16System reference with compensation of electrical and mechanical stress and life-time drift effects
08/18/16Dynamically adapting device operations to handle changes in power quality
08/18/16Chip card reading arrangement
08/18/16Processing of semiconductor devices
08/18/16Dielectric structures with negative taper and methods of formation thereof
08/18/16Method for electrophoretically depositing a film on an electronic assembly
08/18/16Integrated antennas in wafer level package
08/18/16Electrical device and manufacturing same
08/18/16Semiconductor devices and a forming a semiconductor device
08/18/16Semiconductor devices and a forming a semiconductor device
08/18/16High-frequency switching circuit
08/18/16Stress compensated oscillator circuitry and integrated circuit using the same
08/18/16Rf switch
08/18/16Semiconductor chip
08/18/16System and a transducer interface
08/18/16Surface mountable microphone package, a microphone arrangement, a mobile phone and a recording microphone signals
08/11/16Sensor self-diagnostics using multiple signal paths
08/11/16System and error detection of executed program code employing compressed instruction signatures
08/11/16Sensor network supporting self-calibration of pressure sensors
08/11/16Bias drift compensation
08/11/16Sic-based superjunction semiconductor device
08/11/16Semiconductor device and producing same
08/11/16Gated diode in a press-fit housing and an alternator assembly having a gated diode arranged in a load path
08/11/16System and a low noise amplifier
08/11/16Inductively coupled transformer with tunable impedance match network
08/11/16Cross-coupled input voltage sampling and driver amplifier flicker noise cancellation in a switched capacitor analog-to-digital converter
08/11/16Rf receiver with testing capability
08/11/16Sound transducer with interdigitated first and second sets of comb fingers
08/04/16Method and use in signal processing
08/04/16Implantable vessel fluid sensor
08/04/16System and an integrated transducer and temperature sensor
08/04/16Detection of a rotational position of a shaft
08/04/16Sensor bus system and unit with internal event verification
08/04/16System and a wind speed meter
08/04/16Sensor system and method
08/04/16Apparatus for determining distance information, a time of flight light source and a docking station
08/04/16Circuit arrangement and a operating a circuit arrangement
08/04/16Method for producing a semiconductor
08/04/16Device including a metallization layer and manufacturing a device
08/04/16Method for producing a connecting medium on an assembly partner, producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods
08/04/16Semiconductor device having a chip under package
08/04/16Composite wafer having a sic-based functional layer
08/04/16Method of triggering avalanche breakdown in a semiconductor device
08/04/16Communicating with power switching devices
08/04/16Automatic short led detection for light emitting diode (led) array load
08/04/16Method of operating a reverse conducting igbt
08/04/16Method and providing a joint error correction code for a combined data frame comprising first data of a first data channel and second data of a second data channel and sensor system
07/28/16On-axis magnetic field angle sensors, systems and method
07/28/16Sensor arrangement, circuit arrangement and manufacturing a sensor arrangement
07/28/16Rotary encoder with shielded magnet
07/28/16Intermediate layer for copper structuring and methods of formation thereof
07/28/16Method for handling a product substrate, a bonded substrate system and a temporary adhesive
07/28/16Device comprising a ductile layer and making the same
07/28/16Method of thinning and packaging a semiconductor chip
07/28/16Circuit arrangement having charge storage units
07/28/16Sensor signal transmission
07/28/16Walsh encoding for peripheral sensor interface 5
07/28/16Sensor interface that provides a long package crc to improve functional safety
07/28/16Power semiconductor module arrangement
07/21/16Bias field generation for a magneto sensor
07/21/16Generating of random numbers
07/21/16Current sensor positioning error correction using auxiliary hall cells
07/21/16Method for processing a semiconductor surface
07/21/16Tank switch and monitoring a fluid rate
07/21/16Method of dicing a wafer and semiconductor chip
07/21/16Method of processing a semiconductor substrate and semiconductor chip
07/21/16Chip carrier laminate with high frequency dielectric and thermomechanical buffer
07/21/16Integrated circuit and manufacturing an integrated circuit
07/21/16Semiconductor device including a protection structure
07/21/16Semiconductor substrate arrangement, a semiconductor device, and a processing a semiconductor substrate
07/21/16Semiconductor device with a semiconductor body containing hydrogen-related donors
07/21/16Semiconductor device with surge current protection
07/21/16Asynchronous output protocol
07/14/16Sensor structure for sensing pressure waves and ambient pressure
07/14/16Magnetic field sensor and magnetic field sensing method
07/14/16Magnetic field strength and magnetic field angle detection system in magnetoresistive sensors
07/14/16Semiconductor arrangement including buried anodic oxide and manufacturing method
07/14/16Semiconductor chip and processing a semiconductor chip
07/14/16Semiconductor device having overload current carrying capability
07/14/16Power switch device
07/14/16Device comprising chip and integrated circuit
07/14/16System and a voltage controlled oscillator
07/14/16Protected switching element
07/14/16System and synchronizing multiple oscillators using reduced frequency signaling
07/07/16Intelligent field shaping for magnetic speed sensors
07/07/16System and a low emission network
07/07/16Baseplate for an electronic module and manufacturing the same
07/07/16Device and stopping an etching process
07/07/16Semiconductor device having contact trenches extending from opposite sides of a semiconductor body
07/07/16Method of producing a semiconductor arrangement
07/07/16Sensor with switching matrix switch
06/30/16Booster antenna structure for a chip card
06/30/16Chip card
06/30/16Semiconductor device having a metal-semiconductor junction and manufacturing therefor
06/30/16Semiconductor device having areas with different conductivity types and different doping
06/30/16Chip package and a wafer level package
06/30/16Semiconductor device with transistor cells and enhancement cells
06/30/16Semiconductor device including an isolation structure and manufacturing a semiconductor device
06/30/16Transistor structure with reduced parasitic side wall characteristics
06/30/16Semiconductor device including a transistor with a gate dielectric having a variable thickness
06/30/16Semiconductor device with stripe-shaped trench gate structures, transistor mesas and diode mesas
06/30/16Method of forming a graphene structure
06/30/16Commmunication systems and methods having reduced frame duration
06/30/16Capacitive microphone with insulated conductive plate
06/23/16Supply circuit
06/23/16Method, apparatus and computer program for digital transmission of messages
06/23/16Sensor circuit, a sensor device and a forming a sensor circuit
06/23/16Fail-safe operation of an angle sensor with mixed bridges having separate power supplies
06/23/16Rf system with an rfic and antenna system
06/23/16Method for forming a semiconductor device and a semiconductor substrate
06/23/16Method of manufacturing a semiconductor component and semiconductor component
06/23/16Semiconductor device with multi-layer metallization
06/23/16Method for manufacturing a semiconductor device comprising a metal nitride layer and semiconductor device
06/23/16Semiconductor device with stripe-shaped trench gate structures and gate connector structure
06/23/16Transistor device with field-electrode
06/23/16Temperature sensor
06/23/16Digital modulator non-linearity correction
06/23/16System and a programmable voltage source
06/16/16Magnetic field current sensors
06/16/16Microphone module and manufacturing thereof
06/16/16Electrolyte, forming a copper layer and forming a chip
06/16/16Pressure sensor module having a sensor chip and passive devices within a housing
06/16/16Magnetic field sensor
06/16/16Method and device for radar applications
06/16/16Nonvolitile memory refresh
06/16/16Bonding clip, carrier and manufacturing a bonding clip
06/16/16Power semiconductor device with improved stability and producing the same
06/16/16Method of manufacturing semiconductor devices using light ion implantation and semiconductor device
06/16/16Method of forming a silicon-carbide device with a shielded gate
06/16/16Esd/eos detection
06/16/16Integrated hall-controlled switch devices
06/16/16Method and data processing device for determining an error vector in a data word
06/09/16Soft switching of magnetization in a magnetoresistive sensor
06/09/16Processing data on smartcard
06/09/16Reuse of electrical charge at a semiconductor memory device
06/09/16Heat spreader, electronic module comprising a heat spreader and fabrication thereof
06/09/16Method of packaging integrated circuits
06/09/16Semiconductor devices with transistor cells and thermoresistive element
06/09/16Semiconductor device with a trench electrode
06/09/16Circuit and measuring a current
06/02/16Photonic crystal sensor structure and a manufacturing the same

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Infineon Technologies Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by