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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121

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Infineon Technologies Ag patents


      
Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors



Rfid-tag, a tpms device, a tire, a receiver device and a method for providing information related to identification of a…

Infineon Technologies Ag

Rfid-tag, a tpms device, a tire, a receiver device and a method for providing information related to identification of a…

Method for manufacturing a semiconductor device having a channel region in a trench

Infineon Technologies Ag

Method for manufacturing a semiconductor device having a channel region in a trench

Method for manufacturing a semiconductor device having a channel region in a trench

Infineon Technologies Ag

Sensing element for semiconductor

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014036701512/18/14 new patent  Separating semiconductor devices from a wafer
42014036803712/18/14 new patent  Circuit arrangement and method for controlling the operation of a plurality of components requiring a supply in a circuit arrangement
52014036823112/18/14 new patent  Power semiconductor module comprising a power electronics circuit and an arrangement for measuring and transferring measurement data
62014036825812/18/14 new patent  Sensing element for semiconductor
72014036826712/18/14 new patent  Chopped circuit with ac and dc ripple error feedback loops
82014036832712/18/14 new patent  Rfid-tag, a tpms device, a tire, a receiver device and a method for providing information related to identification of a tire
92014036851412/18/14 new patent  Device, method and system for processing an image data stream
102014036938012/18/14 new patent  Sensors, systems and methods for compensating for thermal emf
112014036943312/18/14 new patent  Circuit arrangement and method for bidirectional data transmission
122014037066312/18/14 new patent  Method for producing a semiconductor module
132014037069312/18/14 new patent  Method for manufacturing a semiconductor device having a channel region in a trench
142014037200612/18/14 new patent  Indirect tire pressure monitoring systems and methods using multidimensional resonance frequency analysis
152014037205612/18/14 new patent  Method and device for determining a parameter of a model of a technical installation
162014037281412/18/14 new patent  Method for testing a memory and memory system
172014035338412/04/14Smart card module, smart card and method for producing a smart card module
182014035705512/04/14Method for processing a semiconductor workpiece
192014035832012/04/14Wheel speed sensor and interface systems and methods
202014034623611/27/14Smart card
212014034711911/27/14Circuit arrangement
222014034010011/20/14Techniques for determining a resistance value
232014034018111/20/14A switchable capacitance
242014034085311/20/14Safety device
252014034132711/20/14Transponder unit, system and method for contactless data transmission
262014033293611/13/14Package arrangement and method of forming the same
272014033295311/13/14Chip arrangement, and method for forming a chip arrangement
282014033324111/13/14Optimized control for synchronous motors
292014033346411/13/14Apparatus and method for the characterization of analog-to-digital converters
302014033565411/13/14Semiconductor device fabrication using a reconstituted wafer
312014033569911/13/14Application of fluids to substrates
322014032705311/06/14Semiconductor device including trench transistor cell array and manufacturing method
332014032707111/06/14Method of manufacturing a semiconductor device
342014032712811/06/14Cooling system for molded modules and corresponding manufacturing methods
352014032752011/06/14Radio identification arrangement and method for indicating the position of a physical object
362014032774111/06/143d camera and method of image processing 3d images
372014032803211/06/14Chip arrangement, chip card arrangement and method for manufacturing a chip arrangement
382014031922810/30/14Smart card
392014031922910/30/14Radio communication processor arrangement
402014031962710/30/14Chip package and a method of manufacturing the same
412014031223310/23/14Time of flight illumination circuit
422014031248510/23/14Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
432014031249710/23/14Molding material and method for packaging semiconductor chips
442014031309210/23/14Antenna arrangement, communication appliance and antenna structure
452014031423510/23/14Apparatus for generating trusted image data, an apparatus for authentication of an image and a method for generating trusted image data
462014031536210/23/14Cmos transistor with dual high-k gate dielectric
472014030618410/16/14Two-dimensional material containing electronic components
482014030632710/16/14Semiconductor device and method of manufacturing thereof
492014030635610/16/14Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
502014030670110/16/14Vertical hall sensor circuit comprising stress compensation circuit
512014030739110/16/14Three dimensional packaging
522014029169510/02/14Silicon carbide device and a method for manufacturing a silicon carbide device
532014029169710/02/14Silicon carbide device and a method for forming a silicon carbide device
542014029178810/02/14Magnetoresistive devices and methods for manufacturing magnetoresistive devices
552014029182410/02/14Leadframe, semiconductor package including a leadframe and method for producing a leadframe
562014029183210/02/14Integrated cooling modules of power semiconductor device
572014028462409/25/14Semiconductor component, semiconductor module and methods for producing a semiconductor component and a semiconductor module
582014028466309/25/14Method of manufacturing an imager and imager device
592014028518709/25/14Angle measurement system including magnet with substantially square face for through-shaft applications
602014028527409/25/14Wien-bridge oscillator and circuit arrangement for regulating a detuning
612014028888309/25/14Method for determining an angle of a magnetic pole of a rotating object
622014026054509/18/14Sensor and sensing method
632014026366309/18/14Smart card module arrangement
642014026425509/18/14Method for making a sensor device using a graphene layer
652014026437409/18/14Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device
662014026465109/18/14Semiconductor devices and methods of forming thereof
672014026467709/18/14Chip package with isolated pin, isolated pad or isolated chip carrier and method of making the same
682014026476409/18/14Layer arrangement
692014026481409/18/14Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device
702014026486509/18/14Semiconductor device and manufacturing method thereof
712014026495009/18/14Chip arrangement and a method of manufacturing a chip arrangement
722014026509809/18/14Lift pin for substrate processing
732014026557009/18/14Multi-load drive circuit
742014026617809/18/14Current sensor
752014026617909/18/14Magnetic-field sensor
762014026618009/18/14Sensors, systems and methods for residual current detection
772014026626009/18/14Apparatus and a method for generating a sensor signal indicating information on a capacitance of a variable capacitor comprising a variable capacitance
782014026626309/18/14Apparatus and method for determining the sensitivity of a capacitive sensing device
792014026626909/18/14Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal
802014026682709/18/14Adc with noise-shaping sar
812014026684109/18/14Circuit arrangement and method for operating an analog-to-digital converter
822014026844209/18/14Circuit arrangement and method for evaluating a signal
832014026890309/18/14A switched-mode power converter
842014026912609/18/14Circuit arrangement and method for operating a circuit arrangement
852014027270509/18/14Photoresist application
862014027339409/18/14Capacitors in integrated circuits and methods of fabrication thereof
872014027382509/18/14Semiconductor chip configuration with a coupler
882014028109809/18/14Conditional links for direct memory access controllers
892014025140809/11/14Manufacturing a temperature difference sensor
902014025249809/11/14Method for fabricating a field effect transistor, and field effect transistor
912014025254009/11/14Semiconductor device and method of manufacturing thereof
922014025258309/11/14Power semiconductor assembly and module
932014025310609/11/14Off-center angle measurement system
942014025314209/11/14Method for testing components and measuring arrangement
952014025422409/11/14Rectifier circuit
962014025485009/11/14Acoustic sensor package
972014025868409/11/14System and method to increase lockstep core availability
982014025878409/11/14Machine and methods for reassign positions of a software program based on a fail/pass performance
992014024650309/04/14Booster antenna, contactless chip arrangement, antenna structure and chip arrangement
1002014024717709/04/14Data conversion with redundant split-capacitor arrangement
1012014025033609/04/14Machine and methods for evaluating failing software programs
1022014025054009/04/14Dynamic resource sharing
1032014023849408/28/14Current driving system for a solenoid
1042014023941108/28/14Through vias and methods of formation thereof
1052014023942808/28/14Chip arrangement and a method for manufacturing a chip arrangement
1062014023943808/28/14Semiconductor device
1072014023947408/28/14Chip arrangement and a method for manufacturing a chip arrangement
1082014023998708/28/14Determining operational robustness of a system on a chip
1092014023999808/28/14Turret handlers and methods of operations thereof
1102014024105508/28/14Reducing the complexity of electronically programmable nonvolatile memory
1112014024237408/28/14Porous metal coating
1122014024420608/28/14Sensor systems and methods having emulated line adaptation
1132014023189508/21/14One-time programming device and a semiconductor device
1142014023197008/21/14Method for processing a carrier, a carrier, an electronic device and a lithographic mask
1152014023197108/21/14Chip arrangement and a method of manufacturing a chip arrangement
1162014023197408/21/14Module and method of manufacturing a module
1172014023200108/21/14Device bond pads over process control monitor structures in a semiconductor die
1182014023201508/21/14Semiconductor modules and methods of formation thereof
1192014023258608/21/14Method and device for radar applications
1202014023320008/21/14Method for manufacturing an integrated circuit and an integrated circuit
1212014023326208/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
1222014023326408/21/14Single stage pfc power supply
1232014023328908/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
1242014023503508/21/14Methods of forming semiconductor devices
1252014023503908/21/14Method for producing a protective structure
1262014022512508/14/14Composite wafer and a method for manufacturing same
1272014022523308/14/14Layer arrangement
1282014022565408/14/14Phase-lock loop
1292014022677008/14/14Transmitter, receiver, method for transmitting and method for receiving
1302014022714708/14/14Microfluidic device and method
1312014022781808/14/14Semiconductor structure with lamella defined by singulation trench
1322014021667708/07/14Method of processing a substrate
1332014021706208/07/14Porous metal etching
1342014021746308/07/14Bipolar semiconductor switch and a manufacturing method therefor
1352014021750008/07/14Semiconductor device with low on resistance and high breakdown voltage
1362014021757708/07/14Semiconductor device and method for manufacturing a semiconductor device
1372014021801908/07/14Sensor package and method for producing a sensor package
1382014021939408/07/14Receiver and transmitter receiver system
1392014022025708/07/14Method of processing a substrate
1402014022074208/07/14Method for forming a thin semiconductor device
1412014022077008/07/14Methods of fabricating semiconductor devices and structures thereof
1422014022304808/07/14Communication network and method for communicating in a communication network
1432014022305008/07/14Receiver architecture
1442014022340508/07/14Providing a layout defining a structure to be patterned onto a substrate
1452014022356908/07/14System on chip with embedded security module
1462014021152607/31/14Active power factor corrector circuit
1472014020985207/31/14Semiconductor device including a phase change material
1482014020990407/31/14Integrated test circuit and method for manufacturing an integrated test circuit
1492014020990507/31/14Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
1502014021002007/31/14Mems device and method of manufacturing a mems device
1512014021005407/31/14Semiconductor devices and methods of producing these
1522014021045807/31/14Offset reduction in sensor devices and systems
1532014021046107/31/14Vertical hall device with highly conductive opposite face node for electrically connecting first and second hall effect regions
1542014021064107/31/14Signal generator, decoder, method for generating a transmit signal and method for determining speed data
1552014021151007/31/14Voltage sensing in a voltage converter
1562014021512407/31/14Adaptive bit rate programming of a memory device
1572014021521907/31/14Method for verifying an electronic signature and data processing device
1582014020327807/24/14Chip package having terminal pads of different form factors
1592014020334907/24/14Method of producing a high-voltage-resistant semiconductor component having vertically conductive semiconductor body areas and a trench structure
1602014020336607/24/14Semiconductor devices and methods of manufacture thereof
1612014020338007/24/14Chip package comprising a microphone structure and a method of manufacturing the same
1622014020345507/24/14Feature patterning methods and structures thereof
1632014020384607/24/14Method for driving a load
1642014020435507/24/14Method for exposing an area on a substrate to a beam and photolithographic system
1652014020512807/24/14Chip arrangement and a method for manufacturing the same
1662014020523307/24/14Integrated circuit including non-planar structure and waveguide
1672014020610907/24/14Method of manufacturing and testing a chip package
1682014020616307/24/14Electronic component, a semiconductor wafer and a method for producing an electronic component
1692014019713007/17/14Method for manufacturing a plurality of nanowires
1702014019750107/17/14Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
1712014019750207/17/14Comb mems device and method of making a comb mems device
1722014019750307/17/14Sensor package
1732014019752307/17/14Chip arrangement and a method for forming a chip arrangement
1742014019752707/17/14Chip arrangement and a method for manufacturing a chip arrangement
1752014019753907/17/14Bonded system with coated copper conductor
1762014019755107/17/14Method for fabricating a semiconductor chip panel
1772014019755207/17/14Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
1782014019782707/17/14Xmr-sensor and method for manufacturing the xmr-sensor
1792014019858307/17/14Reducing the size of nonvolatile memories
1802014019880407/17/14Variable load driver with power message transfer
1812014019883307/17/14Self synchronizing data communication method and device
1822014020078507/17/14Tire localization systems and methods in tire pressure monitoring systems
1832014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
1842014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
1852014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
1862014018371107/03/14Semiconductor device and method of making a semiconductor device
1872014018717007/03/14Testing a radio frequency integrated circuit
1882014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
1892014018943707/03/14Multi-tier trace
1902014017420106/26/14Torque sensor
1912014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
1922014017555806/26/14Transistor device and method of manufacture thereof
1932014017559306/26/14Super junction semiconductor device
1942014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
1952014017562506/26/14Semiconductor device including at least one element
1962014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
1972014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
1982014016709006/19/14Optoelectronic transmission system and method
1992014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
2002014016715406/19/14Transistor cell array including semiconductor diode
2012014016718406/19/14Dummy structures and methods
2022014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
2032014016721506/19/14Electronic circuit arrangement
2042014016722406/19/14Semiconductor device and method of producing the same
2052014016722506/19/14Crack stop barrier and method of manufacturing thereof
2062014016722606/19/14Wafer and a method of dicing a wafer
2072014016726606/19/14Semiconductor device having peripheral polymer structures
2082014016727006/19/14Method of fabricating a layer stack
2092014016727206/19/14Semiconductor device having an identification mark
2102014016765406/19/14Circuit arrangements and methods for operating an electrical machine
2112014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
2122014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
2132014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
2142014017044606/19/14Sensor module and battery elements
2152014017083606/19/14Chip comprising a fill structure
2162014017234306/19/14Emulation system and method
2172014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
2182014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
2192014015919606/12/14Through substrate features in semiconductor substrates
2202014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
2212014015922006/12/14Semiconductor device and method of manufacture thereof
2222014015994306/12/14Compensating slowly varying if dc offsets in receivers
2232014016483206/12/14Test circuit and method for processing a test routine
2242014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
2252014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
2262014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
2272014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
2282014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
2292014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
2302014015185406/05/14Method for separating a layer and a chip formed on a layer
2312014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
2322014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
2332014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
2342014015190506/05/14Devices and methods for providing an electrical connection
2352014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
2362014015298906/05/14Selectivity by polarization
2372014015334806/05/14Operation scheme for non-volatile memory
2382014015613706/05/14Lightweight trace based measurement systems and methods
2392014015703506/05/14Bit-timing symmetrization
2402014014530505/29/14Capacitor and method of forming a capacitor
2412014014531805/29/14Semiconductor packages and methods of formation thereof
2422014014533305/29/14Device comprising a ductile layer and method of making the same
2432014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
2442014014566405/29/14Power inverter including sic jfets
2452014014568605/29/14Charge conservation in pixels
2462014014577205/29/14Storage circuit
2472014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
2482014014974805/29/14Securely transferring embedded code and/or data designed for a device to a customer
2492014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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