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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121

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Infineon Technologies Ag patents


      
Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors



Infineon Technologies Ag

Transmitter, receiver, method for transmitting and method for receiving

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014022512508/14/14 new patent  Composite wafer and a method for manufacturing same
42014022523308/14/14 new patent  Layer arrangement
52014022565408/14/14 new patent  Phase-lock loop
62014022677008/14/14 new patent  Transmitter, receiver, method for transmitting and method for receiving
72014022714708/14/14 new patent  Microfluidic device and method
82014022781808/14/14 new patent  Semiconductor structure with lamella defined by singulation trench
92014021667708/07/14Method of processing a substrate
102014021706208/07/14Porous metal etching
112014021746308/07/14Bipolar semiconductor switch and a manufacturing method therefor
122014021750008/07/14Semiconductor device with low on resistance and high breakdown voltage
132014021757708/07/14Semiconductor device and method for manufacturing a semiconductor device
142014021801908/07/14Sensor package and method for producing a sensor package
152014021939408/07/14Receiver and transmitter receiver system
162014022025708/07/14Method of processing a substrate
172014022074208/07/14Method for forming a thin semiconductor device
182014022077008/07/14Methods of fabricating semiconductor devices and structures thereof
192014022304808/07/14Communication network and method for communicating in a communication network
202014022305008/07/14Receiver architecture
212014022340508/07/14Method and apparatus for providing a layout defining a structure to be patterned onto a substrate
222014022356908/07/14System on chip with embedded security module
232014021152607/31/14Active power factor corrector circuit
242014020985207/31/14Semiconductor device including a phase change material
252014020990407/31/14Integrated test circuit and method for manufacturing an integrated test circuit
262014020990507/31/14Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
272014021002007/31/14Mems device and method of manufacturing a mems device
282014021005407/31/14Semiconductor devices and methods of producing these
292014021045807/31/14Systems and methods for offset reduction in sensor devices and systems
302014021046107/31/14Vertical hall device with highly conductive opposite face node for electrically connecting first and second hall effect regions
312014021064107/31/14Signal generator, decoder, method for generating a transmit signal and method for determining speed data
322014021151007/31/14Voltage sensing in a voltage converter
332014021512407/31/14System and method for adaptive bit rate programming of a memory device
342014021521907/31/14Method for verifying an electronic signature and data processing device
352014020327807/24/14Chip package having terminal pads of different form factors
362014020334907/24/14Method of producing a high-voltage-resistant semiconductor component having vertically conductive semiconductor body areas and a trench structure
372014020336607/24/14Semiconductor devices and methods of manufacture thereof
382014020338007/24/14Chip package comprising a microphone structure and a method of manufacturing the same
392014020345507/24/14Feature patterning methods and structures thereof
402014020384607/24/14Method for driving a load
412014020435507/24/14Method for exposing an area on a substrate to a beam and photolithographic system
422014020512807/24/14Chip arrangement and a method for manufacturing the same
432014020523307/24/14Integrated circuit including non-planar structure and waveguide
442014020610907/24/14Method of manufacturing and testing a chip package
452014020616307/24/14Electronic component, a semiconductor wafer and a method for producing an electronic component
462014019713007/17/14Method for manufacturing a plurality of nanowires
472014019750107/17/14Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
482014019750207/17/14Comb mems device and method of making a comb mems device
492014019750307/17/14Sensor package
502014019752307/17/14Chip arrangement and a method for forming a chip arrangement
512014019752707/17/14Chip arrangement and a method for manufacturing a chip arrangement
522014019753907/17/14Bonded system with coated copper conductor
532014019755107/17/14Method for fabricating a semiconductor chip panel
542014019755207/17/14Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
552014019782707/17/14Xmr-sensor and method for manufacturing the xmr-sensor
562014019858307/17/14Method and system for reducing the size of nonvolatile memories
572014019880407/17/14Variable load driver with power message transfer
582014019883307/17/14Self synchronizing data communication method and device
592014020078507/17/14Tire localization systems and methods in tire pressure monitoring systems
602014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
612014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
622014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
632014018371107/03/14Semiconductor device and method of making a semiconductor device
642014018717007/03/14System and method for testing a radio frequency integrated circuit
652014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
662014018943707/03/14Multi-tier trace
672014017420106/26/14Torque sensor
682014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
692014017555806/26/14Transistor device and method of manufacture thereof
702014017559306/26/14Super junction semiconductor device
712014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
722014017562506/26/14Semiconductor device including at least one element
732014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
742014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
752014016709006/19/14Optoelectronic transmission system and method
762014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
772014016715406/19/14Transistor cell array including semiconductor diode
782014016718406/19/14Dummy structures and methods
792014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
802014016721506/19/14Electronic circuit arrangement
812014016722406/19/14Semiconductor device and method of producing the same
822014016722506/19/14Crack stop barrier and method of manufacturing thereof
832014016722606/19/14Wafer and a method of dicing a wafer
842014016726606/19/14Semiconductor device having peripheral polymer structures
852014016727006/19/14Method of fabricating a layer stack
862014016727206/19/14Semiconductor device having an identification mark
872014016765406/19/14Circuit arrangements and methods for operating an electrical machine
882014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
892014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
902014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
912014017044606/19/14Sensor module and battery elements
922014017083606/19/14Chip comprising a fill structure
932014017234306/19/14Emulation system and method
942014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
952014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
962014015919606/12/14Through substrate features in semiconductor substrates
972014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
982014015922006/12/14Semiconductor device and method of manufacture thereof
992014015994306/12/14Compensating slowly varying if dc offsets in receivers
1002014016483206/12/14Test circuit and method for processing a test routine
1012014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
1022014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
1032014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
1042014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
1052014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
1062014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
1072014015185406/05/14Method for separating a layer and a chip formed on a layer
1082014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
1092014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
1102014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
1112014015190506/05/14Devices and methods for providing an electrical connection
1122014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
1132014015298906/05/14Selectivity by polarization
1142014015334806/05/14Operation scheme for non-volatile memory
1152014015613706/05/14Lightweight trace based measurement systems and methods
1162014015703506/05/14Bit-timing symmetrization
1172014014530505/29/14Capacitor and method of forming a capacitor
1182014014531805/29/14Semiconductor packages and methods of formation thereof
1192014014533305/29/14Device comprising a ductile layer and method of making the same
1202014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
1212014014566405/29/14Power inverter including sic jfets
1222014014568605/29/14Charge conservation in pixels
1232014014577205/29/14Storage circuit
1242014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
1252014014974805/29/14Methods and systems for securely transferring embedded code and/or data designed for a device to a customer
1262014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
1272014013881305/22/14Method for manufacturing an electronic component
1282014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
1292014013884305/22/14Method for fabricating an electronic component
1302014013923005/22/14Method and apparatus for determining a charge state
1312014013926805/22/14Driver circuit with tight control of gate voltage
1322014013928505/22/14Chopper amplifier
1332014013928905/22/14Sensor signal processing using translinear mesh
1342014013929605/22/14Pulse modulation control in a dc-dc converter circuit
1352014013963105/22/14Dynamic conservation of imaging power
1362014014053805/22/14System and method for high input capacitive signal amplifier
1372014014159205/22/14Method for stress reduced manufacturing semiconductor devices
1382014014160805/22/14Semiconductor component and methods for producing a semiconductor component
1392014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
1402014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
1412014013881305/22/14Method for manufacturing an electronic component
1422014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
1432014013884305/22/14Method for fabricating an electronic component
1442014013923005/22/14Method and apparatus for determining a charge state
1452014013926805/22/14Driver circuit with tight control of gate voltage
1462014013928505/22/14Chopper amplifier
1472014013928905/22/14Sensor signal processing using translinear mesh
1482014013929605/22/14Pulse modulation control in a dc-dc converter circuit
1492014013963105/22/14Dynamic conservation of imaging power
1502014014053805/22/14System and method for high input capacitive signal amplifier
1512014014159205/22/14Method for stress reduced manufacturing semiconductor devices
1522014014160805/22/14Semiconductor component and methods for producing a semiconductor component
1532014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
1542014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1552014013176605/15/14Inhomogenous power semiconductor devices
1562014013181505/15/14Semiconductor device
1572014013184405/15/14System and method for an electronic package with a fail-open mechanism
1582014013234705/15/14Linearized high-ohmic resistor
1592014013236305/15/14System and method for generating a pulse-width modulated signal
1602014013239105/15/14Relay attack prevention using rssipplx
1612014013243305/15/14Analog-to-digital converter arrangement
1622014013325005/15/14Current sense amplifier with replica bias scheme
1632014013482905/15/14Process tools and methods of forming devices using process tools
1642014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1652014013176605/15/14Inhomogenous power semiconductor devices
1662014013181505/15/14Semiconductor device
1672014013184405/15/14System and method for an electronic package with a fail-open mechanism
1682014013234705/15/14Linearized high-ohmic resistor
1692014013236305/15/14System and method for generating a pulse-width modulated signal
1702014013239105/15/14Relay attack prevention using rssipplx
1712014013243305/15/14Analog-to-digital converter arrangement
1722014013325005/15/14Current sense amplifier with replica bias scheme
1732014013482905/15/14Process tools and methods of forming devices using process tools
1742014012345405/08/14Adjustable pick-up head and method for manufacturing a device
1752014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
1762014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
1772014012489305/08/14Varactor diode, electrical device and method for manufacturing same
1782014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
1792014012987105/08/14Fail safe code functionality
1802014012345405/08/14Adjustable pick-up head and method for manufacturing a device
1812014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
1822014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
1832014012489305/08/14Varactor diode, electrical device and method for manufacturing same
1842014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
1852014012987105/08/14Fail safe code functionality
1862014011614905/01/14Sensor with masking
1872014011741205/01/14Heterojunction transistor and manufacturing method therefor
1882014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
1892014011750505/01/14Chip having backside metal and method for manufacturing same
1902014011750905/01/14Metal deposition with reduced stress
1912014011751105/01/14Passivation layer and method of making a passivation layer
1922014011751505/01/14Integrated antennas in wafer level package
1932014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
1942014011756505/01/14Laminate electronic device
1952014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
1962014011805105/01/14Semiconductor device arrangement and method
1972014011895905/01/14Chip-housing module and a method for forming a chip-housing module
1982014011898205/01/14Switch arrangements and battery arrangements
1992014011947605/01/14Polar transmitter suitable for monolithic integration in socs
2002014011957305/01/14System and method for capacitive signal source amplifier
2012014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
2022014012288105/01/14Method and system for controlling a device
2032014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
2042014012296705/01/14Circuitry and method for multi-bit correction
2052014011614905/01/14Sensor with masking
2062014011741205/01/14Heterojunction transistor and manufacturing method therefor
2072014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
2082014011750505/01/14Chip having backside metal and method for manufacturing same
2092014011750905/01/14Metal deposition with reduced stress
2102014011751105/01/14Passivation layer and method of making a passivation layer
2112014011751505/01/14Integrated antennas in wafer level package
2122014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
2132014011756505/01/14Laminate electronic device
2142014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
2152014011805105/01/14Semiconductor device arrangement and method
2162014011895905/01/14Chip-housing module and a method for forming a chip-housing module
2172014011898205/01/14Switch arrangements and battery arrangements
2182014011947605/01/14Polar transmitter suitable for monolithic integration in socs
2192014011957305/01/14System and method for capacitive signal source amplifier
2202014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
2212014012288105/01/14Method and system for controlling a device
2222014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
2232014012296705/01/14Circuitry and method for multi-bit correction
2242014011025404/24/14Backing plate for a sputter target, sputter target, and sputter device
2252014011037404/24/14Method for removing a dielectric layer from a bottom of a trench
2262014011082904/24/14Module comprising a semiconductor chip
2272014011083504/24/14Bump package and methods of formation thereof
2282014011083804/24/14Semiconductor devices and processing methods
2292014011084004/24/14Semiconductor packages with integrated antenna and method of forming thereof
2302014011084104/24/14Semiconductor packages with integrated antenna and methods of forming thereof
2312014011085804/24/14Embedded chip packages and methods for manufacturing an embedded chip package
2322014011086404/24/14Chip arrangement and a method for forming a chip arrangement
2332014011123404/24/14Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
2342014011202804/24/14Method and a circuit arrangement for determining a demagnetization zero current time
2352014011203004/24/14Method and a controller for determining a demagnetization zero current time for a switched mode power supply
2362014011342304/24/14Methods for manufacturing a semiconductor device
2372014011530704/24/14Method and system for resetting a soc
2382014011025404/24/14Backing plate for a sputter target, sputter target, and sputter device
2392014011037404/24/14Method for removing a dielectric layer from a bottom of a trench
2402014011082904/24/14Module comprising a semiconductor chip
2412014011083504/24/14Bump package and methods of formation thereof
2422014011083804/24/14Semiconductor devices and processing methods
2432014011084004/24/14Semiconductor packages with integrated antenna and method of forming thereof
2442014011084104/24/14Semiconductor packages with integrated antenna and methods of forming thereof
2452014011085804/24/14Embedded chip packages and methods for manufacturing an embedded chip package
2462014011086404/24/14Chip arrangement and a method for forming a chip arrangement
2472014011123404/24/14Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
2482014011202804/24/14Method and a circuit arrangement for determining a demagnetization zero current time
2492014011203004/24/14Method and a controller for determining a demagnetization zero current time for a switched mode power supply


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Infineon Technologies Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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