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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121

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Infineon Technologies Ag patents


      
Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors



Infineon Technologies Ag

Chip package comprising a microphone structure and a method of manufacturing the same

Infineon Technologies Ag

Feature patterning methods and structures thereof

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014020327807/24/14 new patent  Chip package having terminal pads of different form factors
42014020334907/24/14 new patent  Method of producing a high-voltage-resistant semiconductor component having vertically conductive semiconductor body areas and a trench structure
52014020336607/24/14 new patent  Semiconductor devices and methods of manufacture thereof
62014020338007/24/14 new patent  Chip package comprising a microphone structure and a method of manufacturing the same
72014020345507/24/14 new patent  Feature patterning methods and structures thereof
82014020384607/24/14 new patent  Method for driving a load
92014020435507/24/14 new patent  Method for exposing an area on a substrate to a beam and photolithographic system
102014020512807/24/14 new patent  Chip arrangement and a method for manufacturing the same
112014020523307/24/14 new patent  Integrated circuit including non-planar structure and waveguide
122014020610907/24/14 new patent  Method of manufacturing and testing a chip package
132014020616307/24/14 new patent  Electronic component, a semiconductor wafer and a method for producing an electronic component
142014019713007/17/14Method for manufacturing a plurality of nanowires
152014019750107/17/14Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
162014019750207/17/14Comb mems device and method of making a comb mems device
172014019750307/17/14Sensor package
182014019752307/17/14Chip arrangement and a method for forming a chip arrangement
192014019752707/17/14Chip arrangement and a method for manufacturing a chip arrangement
202014019753907/17/14Bonded system with coated copper conductor
212014019755107/17/14Method for fabricating a semiconductor chip panel
222014019755207/17/14Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
232014019782707/17/14Xmr-sensor and method for manufacturing the xmr-sensor
242014019858307/17/14Method and system for reducing the size of nonvolatile memories
252014019880407/17/14Variable load driver with power message transfer
262014019883307/17/14Self synchronizing data communication method and device
272014020078507/17/14Tire localization systems and methods in tire pressure monitoring systems
282014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
292014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
302014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
312014018371107/03/14Semiconductor device and method of making a semiconductor device
322014018717007/03/14System and method for testing a radio frequency integrated circuit
332014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
342014018943707/03/14Multi-tier trace
352014017420106/26/14Torque sensor
362014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
372014017555806/26/14Transistor device and method of manufacture thereof
382014017559306/26/14Super junction semiconductor device
392014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
402014017562506/26/14Semiconductor device including at least one element
412014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
422014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
432014016709006/19/14Optoelectronic transmission system and method
442014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
452014016715406/19/14Transistor cell array including semiconductor diode
462014016718406/19/14Dummy structures and methods
472014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
482014016721506/19/14Electronic circuit arrangement
492014016722406/19/14Semiconductor device and method of producing the same
502014016722506/19/14Crack stop barrier and method of manufacturing thereof
512014016722606/19/14Wafer and a method of dicing a wafer
522014016726606/19/14Semiconductor device having peripheral polymer structures
532014016727006/19/14Method of fabricating a layer stack
542014016727206/19/14Semiconductor device having an identification mark
552014016765406/19/14Circuit arrangements and methods for operating an electrical machine
562014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
572014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
582014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
592014017044606/19/14Sensor module and battery elements
602014017083606/19/14Chip comprising a fill structure
612014017234306/19/14Emulation system and method
622014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
632014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
642014015919606/12/14Through substrate features in semiconductor substrates
652014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
662014015922006/12/14Semiconductor device and method of manufacture thereof
672014015994306/12/14Compensating slowly varying if dc offsets in receivers
682014016483206/12/14Test circuit and method for processing a test routine
692014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
702014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
712014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
722014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
732014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
742014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
752014015185406/05/14Method for separating a layer and a chip formed on a layer
762014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
772014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
782014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
792014015190506/05/14Devices and methods for providing an electrical connection
802014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
812014015298906/05/14Selectivity by polarization
822014015334806/05/14Operation scheme for non-volatile memory
832014015613706/05/14Lightweight trace based measurement systems and methods
842014015703506/05/14Bit-timing symmetrization
852014014530505/29/14Capacitor and method of forming a capacitor
862014014531805/29/14Semiconductor packages and methods of formation thereof
872014014533305/29/14Device comprising a ductile layer and method of making the same
882014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
892014014566405/29/14Power inverter including sic jfets
902014014568605/29/14Charge conservation in pixels
912014014577205/29/14Storage circuit
922014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
932014014974805/29/14Methods and systems for securely transferring embedded code and/or data designed for a device to a customer
942014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
952014013881305/22/14Method for manufacturing an electronic component
962014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
972014013884305/22/14Method for fabricating an electronic component
982014013923005/22/14Method and apparatus for determining a charge state
992014013926805/22/14Driver circuit with tight control of gate voltage
1002014013928505/22/14Chopper amplifier
1012014013928905/22/14Sensor signal processing using translinear mesh
1022014013929605/22/14Pulse modulation control in a dc-dc converter circuit
1032014013963105/22/14Dynamic conservation of imaging power
1042014014053805/22/14System and method for high input capacitive signal amplifier
1052014014159205/22/14Method for stress reduced manufacturing semiconductor devices
1062014014160805/22/14Semiconductor component and methods for producing a semiconductor component
1072014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
1082014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
1092014013881305/22/14Method for manufacturing an electronic component
1102014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
1112014013884305/22/14Method for fabricating an electronic component
1122014013923005/22/14Method and apparatus for determining a charge state
1132014013926805/22/14Driver circuit with tight control of gate voltage
1142014013928505/22/14Chopper amplifier
1152014013928905/22/14Sensor signal processing using translinear mesh
1162014013929605/22/14Pulse modulation control in a dc-dc converter circuit
1172014013963105/22/14Dynamic conservation of imaging power
1182014014053805/22/14System and method for high input capacitive signal amplifier
1192014014159205/22/14Method for stress reduced manufacturing semiconductor devices
1202014014160805/22/14Semiconductor component and methods for producing a semiconductor component
1212014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
1222014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1232014013176605/15/14Inhomogenous power semiconductor devices
1242014013181505/15/14Semiconductor device
1252014013184405/15/14System and method for an electronic package with a fail-open mechanism
1262014013234705/15/14Linearized high-ohmic resistor
1272014013236305/15/14System and method for generating a pulse-width modulated signal
1282014013239105/15/14Relay attack prevention using rssipplx
1292014013243305/15/14Analog-to-digital converter arrangement
1302014013325005/15/14Current sense amplifier with replica bias scheme
1312014013482905/15/14Process tools and methods of forming devices using process tools
1322014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1332014013176605/15/14Inhomogenous power semiconductor devices
1342014013181505/15/14Semiconductor device
1352014013184405/15/14System and method for an electronic package with a fail-open mechanism
1362014013234705/15/14Linearized high-ohmic resistor
1372014013236305/15/14System and method for generating a pulse-width modulated signal
1382014013239105/15/14Relay attack prevention using rssipplx
1392014013243305/15/14Analog-to-digital converter arrangement
1402014013325005/15/14Current sense amplifier with replica bias scheme
1412014013482905/15/14Process tools and methods of forming devices using process tools
1422014012345405/08/14Adjustable pick-up head and method for manufacturing a device
1432014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
1442014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
1452014012489305/08/14Varactor diode, electrical device and method for manufacturing same
1462014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
1472014012987105/08/14Fail safe code functionality
1482014012345405/08/14Adjustable pick-up head and method for manufacturing a device
1492014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
1502014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
1512014012489305/08/14Varactor diode, electrical device and method for manufacturing same
1522014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
1532014012987105/08/14Fail safe code functionality
1542014011614905/01/14Sensor with masking
1552014011741205/01/14Heterojunction transistor and manufacturing method therefor
1562014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
1572014011750505/01/14Chip having backside metal and method for manufacturing same
1582014011750905/01/14Metal deposition with reduced stress
1592014011751105/01/14Passivation layer and method of making a passivation layer
1602014011751505/01/14Integrated antennas in wafer level package
1612014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
1622014011756505/01/14Laminate electronic device
1632014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
1642014011805105/01/14Semiconductor device arrangement and method
1652014011895905/01/14Chip-housing module and a method for forming a chip-housing module
1662014011898205/01/14Switch arrangements and battery arrangements
1672014011947605/01/14Polar transmitter suitable for monolithic integration in socs
1682014011957305/01/14System and method for capacitive signal source amplifier
1692014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
1702014012288105/01/14Method and system for controlling a device
1712014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
1722014012296705/01/14Circuitry and method for multi-bit correction
1732014011614905/01/14Sensor with masking
1742014011741205/01/14Heterojunction transistor and manufacturing method therefor
1752014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
1762014011750505/01/14Chip having backside metal and method for manufacturing same
1772014011750905/01/14Metal deposition with reduced stress
1782014011751105/01/14Passivation layer and method of making a passivation layer
1792014011751505/01/14Integrated antennas in wafer level package
1802014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
1812014011756505/01/14Laminate electronic device
1822014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
1832014011805105/01/14Semiconductor device arrangement and method
1842014011895905/01/14Chip-housing module and a method for forming a chip-housing module
1852014011898205/01/14Switch arrangements and battery arrangements
1862014011947605/01/14Polar transmitter suitable for monolithic integration in socs
1872014011957305/01/14System and method for capacitive signal source amplifier
1882014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
1892014012288105/01/14Method and system for controlling a device
1902014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
1912014012296705/01/14Circuitry and method for multi-bit correction
1922014011025404/24/14Backing plate for a sputter target, sputter target, and sputter device
1932014011037404/24/14Method for removing a dielectric layer from a bottom of a trench
1942014011082904/24/14Module comprising a semiconductor chip
1952014011083504/24/14Bump package and methods of formation thereof
1962014011083804/24/14Semiconductor devices and processing methods
1972014011084004/24/14Semiconductor packages with integrated antenna and method of forming thereof
1982014011084104/24/14Semiconductor packages with integrated antenna and methods of forming thereof
1992014011085804/24/14Embedded chip packages and methods for manufacturing an embedded chip package
2002014011086404/24/14Chip arrangement and a method for forming a chip arrangement
2012014011123404/24/14Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
2022014011202804/24/14Method and a circuit arrangement for determining a demagnetization zero current time
2032014011203004/24/14Method and a controller for determining a demagnetization zero current time for a switched mode power supply
2042014011342304/24/14Methods for manufacturing a semiconductor device
2052014011530704/24/14Method and system for resetting a soc
2062014011025404/24/14Backing plate for a sputter target, sputter target, and sputter device
2072014011037404/24/14Method for removing a dielectric layer from a bottom of a trench
2082014011082904/24/14Module comprising a semiconductor chip
2092014011083504/24/14Bump package and methods of formation thereof
2102014011083804/24/14Semiconductor devices and processing methods
2112014011084004/24/14Semiconductor packages with integrated antenna and method of forming thereof
2122014011084104/24/14Semiconductor packages with integrated antenna and methods of forming thereof
2132014011085804/24/14Embedded chip packages and methods for manufacturing an embedded chip package
2142014011086404/24/14Chip arrangement and a method for forming a chip arrangement
2152014011123404/24/14Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
2162014011202804/24/14Method and a circuit arrangement for determining a demagnetization zero current time
2172014011203004/24/14Method and a controller for determining a demagnetization zero current time for a switched mode power supply
2182014011342304/24/14Methods for manufacturing a semiconductor device
2192014011530704/24/14Method and system for resetting a soc
2202014010346004/17/14Mems device and method of manufacturing a mems device
2212014010349504/17/14Wafer and method for processing a wafer
2222014010386104/17/14Active power factor corrector circuit
2232014010390204/17/14Semiconductor device having sensing functionality
2242014010391504/17/14Intelligent field shaping for magnetic speed sensors
2252014010397604/17/14Multi-output phase detector
2262014010408904/17/14Analog-to-digital conversion with multiple kernels
2272014010413204/17/14Impedance matching network with improved quality factor and method for matching an impedance
2282014010622904/17/14Battery electrode, battery, and method for manufacturing a battery electrode
2292014010626404/17/14Photolithography mask, photolithography mask arrangement, and method for exposing a wafer
2302014010655504/17/14Method for forming a semiconductor device
2312014010784504/17/14Method of fabricating semiconductor cleaners
2322014010794604/17/14System and method for determining the mileage and wear of a tire
2332014010886904/17/14Dma integrity checker
2342014010887304/17/14Systems and methods for storing information
2352014010346004/17/14Mems device and method of manufacturing a mems device
2362014010349504/17/14Wafer and method for processing a wafer
2372014010386104/17/14Active power factor corrector circuit
2382014010390204/17/14Semiconductor device having sensing functionality
2392014010391504/17/14Intelligent field shaping for magnetic speed sensors
2402014010397604/17/14Multi-output phase detector
2412014010408904/17/14Analog-to-digital conversion with multiple kernels
2422014010413204/17/14Impedance matching network with improved quality factor and method for matching an impedance
2432014010622904/17/14Battery electrode, battery, and method for manufacturing a battery electrode
2442014010626404/17/14Photolithography mask, photolithography mask arrangement, and method for exposing a wafer
2452014010655504/17/14Method for forming a semiconductor device
2462014010784504/17/14Method of fabricating semiconductor cleaners
2472014010794604/17/14System and method for determining the mileage and wear of a tire
2482014010886904/17/14Dma integrity checker
2492014010887304/17/14Systems and methods for storing information


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Infineon Technologies Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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