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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121

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Infineon Technologies Ag patents


      
Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors



Infineon Technologies Ag

Variable load driver with power message transfer

Infineon Technologies Ag

Sensor package

Infineon Technologies Ag

Comb mems device and method of making a comb mems device

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014019713007/17/14 new patent  Method for manufacturing a plurality of nanowires
42014019750107/17/14 new patent  Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
52014019750207/17/14 new patent  Comb mems device and method of making a comb mems device
62014019750307/17/14 new patent  Sensor package
72014019752307/17/14 new patent  Chip arrangement and a method for forming a chip arrangement
82014019752707/17/14 new patent  Chip arrangement and a method for manufacturing a chip arrangement
92014019753907/17/14 new patent  Bonded system with coated copper conductor
102014019755107/17/14 new patent  Method for fabricating a semiconductor chip panel
112014019755207/17/14 new patent  Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
122014019782707/17/14 new patent  Xmr-sensor and method for manufacturing the xmr-sensor
132014019858307/17/14 new patent  Method and system for reducing the size of nonvolatile memories
142014019880407/17/14 new patent  Variable load driver with power message transfer
152014019883307/17/14 new patent  Self synchronizing data communication method and device
162014020078507/17/14 new patent  Tire localization systems and methods in tire pressure monitoring systems
172014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
182014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
192014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
202014018371107/03/14Semiconductor device and method of making a semiconductor device
212014018717007/03/14System and method for testing a radio frequency integrated circuit
222014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
232014018943707/03/14Multi-tier trace
242014017420106/26/14Torque sensor
252014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
262014017555806/26/14Transistor device and method of manufacture thereof
272014017559306/26/14Super junction semiconductor device
282014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
292014017562506/26/14Semiconductor device including at least one element
302014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
312014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
322014016709006/19/14Optoelectronic transmission system and method
332014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
342014016715406/19/14Transistor cell array including semiconductor diode
352014016718406/19/14Dummy structures and methods
362014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
372014016721506/19/14Electronic circuit arrangement
382014016722406/19/14Semiconductor device and method of producing the same
392014016722506/19/14Crack stop barrier and method of manufacturing thereof
402014016722606/19/14Wafer and a method of dicing a wafer
412014016726606/19/14Semiconductor device having peripheral polymer structures
422014016727006/19/14Method of fabricating a layer stack
432014016727206/19/14Semiconductor device having an identification mark
442014016765406/19/14Circuit arrangements and methods for operating an electrical machine
452014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
462014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
472014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
482014017044606/19/14Sensor module and battery elements
492014017083606/19/14Chip comprising a fill structure
502014017234306/19/14Emulation system and method
512014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
522014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
532014015919606/12/14Through substrate features in semiconductor substrates
542014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
552014015922006/12/14Semiconductor device and method of manufacture thereof
562014015994306/12/14Compensating slowly varying if dc offsets in receivers
572014016483206/12/14Test circuit and method for processing a test routine
582014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
592014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
602014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
612014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
622014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
632014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
642014015185406/05/14Method for separating a layer and a chip formed on a layer
652014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
662014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
672014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
682014015190506/05/14Devices and methods for providing an electrical connection
692014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
702014015298906/05/14Selectivity by polarization
712014015334806/05/14Operation scheme for non-volatile memory
722014015613706/05/14Lightweight trace based measurement systems and methods
732014015703506/05/14Bit-timing symmetrization
742014014530505/29/14Capacitor and method of forming a capacitor
752014014531805/29/14Semiconductor packages and methods of formation thereof
762014014533305/29/14Device comprising a ductile layer and method of making the same
772014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
782014014566405/29/14Power inverter including sic jfets
792014014568605/29/14Charge conservation in pixels
802014014577205/29/14Storage circuit
812014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
822014014974805/29/14Methods and systems for securely transferring embedded code and/or data designed for a device to a customer
832014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
842014013881305/22/14Method for manufacturing an electronic component
852014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
862014013884305/22/14Method for fabricating an electronic component
872014013923005/22/14Method and apparatus for determining a charge state
882014013926805/22/14Driver circuit with tight control of gate voltage
892014013928505/22/14Chopper amplifier
902014013928905/22/14Sensor signal processing using translinear mesh
912014013929605/22/14Pulse modulation control in a dc-dc converter circuit
922014013963105/22/14Dynamic conservation of imaging power
932014014053805/22/14System and method for high input capacitive signal amplifier
942014014159205/22/14Method for stress reduced manufacturing semiconductor devices
952014014160805/22/14Semiconductor component and methods for producing a semiconductor component
962014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
972014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
982014013881305/22/14Method for manufacturing an electronic component
992014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
1002014013884305/22/14Method for fabricating an electronic component
1012014013923005/22/14Method and apparatus for determining a charge state
1022014013926805/22/14Driver circuit with tight control of gate voltage
1032014013928505/22/14Chopper amplifier
1042014013928905/22/14Sensor signal processing using translinear mesh
1052014013929605/22/14Pulse modulation control in a dc-dc converter circuit
1062014013963105/22/14Dynamic conservation of imaging power
1072014014053805/22/14System and method for high input capacitive signal amplifier
1082014014159205/22/14Method for stress reduced manufacturing semiconductor devices
1092014014160805/22/14Semiconductor component and methods for producing a semiconductor component
1102014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
1112014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1122014013176605/15/14Inhomogenous power semiconductor devices
1132014013181505/15/14Semiconductor device
1142014013184405/15/14System and method for an electronic package with a fail-open mechanism
1152014013234705/15/14Linearized high-ohmic resistor
1162014013236305/15/14System and method for generating a pulse-width modulated signal
1172014013239105/15/14Relay attack prevention using rssipplx
1182014013243305/15/14Analog-to-digital converter arrangement
1192014013325005/15/14Current sense amplifier with replica bias scheme
1202014013482905/15/14Process tools and methods of forming devices using process tools
1212014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1222014013176605/15/14Inhomogenous power semiconductor devices
1232014013181505/15/14Semiconductor device
1242014013184405/15/14System and method for an electronic package with a fail-open mechanism
1252014013234705/15/14Linearized high-ohmic resistor
1262014013236305/15/14System and method for generating a pulse-width modulated signal
1272014013239105/15/14Relay attack prevention using rssipplx
1282014013243305/15/14Analog-to-digital converter arrangement
1292014013325005/15/14Current sense amplifier with replica bias scheme
1302014013482905/15/14Process tools and methods of forming devices using process tools
1312014012345405/08/14Adjustable pick-up head and method for manufacturing a device
1322014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
1332014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
1342014012489305/08/14Varactor diode, electrical device and method for manufacturing same
1352014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
1362014012987105/08/14Fail safe code functionality
1372014012345405/08/14Adjustable pick-up head and method for manufacturing a device
1382014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
1392014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
1402014012489305/08/14Varactor diode, electrical device and method for manufacturing same
1412014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
1422014012987105/08/14Fail safe code functionality
1432014011614905/01/14Sensor with masking
1442014011741205/01/14Heterojunction transistor and manufacturing method therefor
1452014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
1462014011750505/01/14Chip having backside metal and method for manufacturing same
1472014011750905/01/14Metal deposition with reduced stress
1482014011751105/01/14Passivation layer and method of making a passivation layer
1492014011751505/01/14Integrated antennas in wafer level package
1502014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
1512014011756505/01/14Laminate electronic device
1522014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
1532014011805105/01/14Semiconductor device arrangement and method
1542014011895905/01/14Chip-housing module and a method for forming a chip-housing module
1552014011898205/01/14Switch arrangements and battery arrangements
1562014011947605/01/14Polar transmitter suitable for monolithic integration in socs
1572014011957305/01/14System and method for capacitive signal source amplifier
1582014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
1592014012288105/01/14Method and system for controlling a device
1602014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
1612014012296705/01/14Circuitry and method for multi-bit correction
1622014011614905/01/14Sensor with masking
1632014011741205/01/14Heterojunction transistor and manufacturing method therefor
1642014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
1652014011750505/01/14Chip having backside metal and method for manufacturing same
1662014011750905/01/14Metal deposition with reduced stress
1672014011751105/01/14Passivation layer and method of making a passivation layer
1682014011751505/01/14Integrated antennas in wafer level package
1692014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
1702014011756505/01/14Laminate electronic device
1712014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
1722014011805105/01/14Semiconductor device arrangement and method
1732014011895905/01/14Chip-housing module and a method for forming a chip-housing module
1742014011898205/01/14Switch arrangements and battery arrangements
1752014011947605/01/14Polar transmitter suitable for monolithic integration in socs
1762014011957305/01/14System and method for capacitive signal source amplifier
1772014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
1782014012288105/01/14Method and system for controlling a device
1792014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
1802014012296705/01/14Circuitry and method for multi-bit correction
1812014011025404/24/14Backing plate for a sputter target, sputter target, and sputter device
1822014011037404/24/14Method for removing a dielectric layer from a bottom of a trench
1832014011082904/24/14Module comprising a semiconductor chip
1842014011083504/24/14Bump package and methods of formation thereof
1852014011083804/24/14Semiconductor devices and processing methods
1862014011084004/24/14Semiconductor packages with integrated antenna and method of forming thereof
1872014011084104/24/14Semiconductor packages with integrated antenna and methods of forming thereof
1882014011085804/24/14Embedded chip packages and methods for manufacturing an embedded chip package
1892014011086404/24/14Chip arrangement and a method for forming a chip arrangement
1902014011123404/24/14Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
1912014011202804/24/14Method and a circuit arrangement for determining a demagnetization zero current time
1922014011203004/24/14Method and a controller for determining a demagnetization zero current time for a switched mode power supply
1932014011342304/24/14Methods for manufacturing a semiconductor device
1942014011530704/24/14Method and system for resetting a soc
1952014011025404/24/14Backing plate for a sputter target, sputter target, and sputter device
1962014011037404/24/14Method for removing a dielectric layer from a bottom of a trench
1972014011082904/24/14Module comprising a semiconductor chip
1982014011083504/24/14Bump package and methods of formation thereof
1992014011083804/24/14Semiconductor devices and processing methods
2002014011084004/24/14Semiconductor packages with integrated antenna and method of forming thereof
2012014011084104/24/14Semiconductor packages with integrated antenna and methods of forming thereof
2022014011085804/24/14Embedded chip packages and methods for manufacturing an embedded chip package
2032014011086404/24/14Chip arrangement and a method for forming a chip arrangement
2042014011123404/24/14Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
2052014011202804/24/14Method and a circuit arrangement for determining a demagnetization zero current time
2062014011203004/24/14Method and a controller for determining a demagnetization zero current time for a switched mode power supply
2072014011342304/24/14Methods for manufacturing a semiconductor device
2082014011530704/24/14Method and system for resetting a soc
2092014010346004/17/14Mems device and method of manufacturing a mems device
2102014010349504/17/14Wafer and method for processing a wafer
2112014010386104/17/14Active power factor corrector circuit
2122014010390204/17/14Semiconductor device having sensing functionality
2132014010391504/17/14Intelligent field shaping for magnetic speed sensors
2142014010397604/17/14Multi-output phase detector
2152014010408904/17/14Analog-to-digital conversion with multiple kernels
2162014010413204/17/14Impedance matching network with improved quality factor and method for matching an impedance
2172014010622904/17/14Battery electrode, battery, and method for manufacturing a battery electrode
2182014010626404/17/14Photolithography mask, photolithography mask arrangement, and method for exposing a wafer
2192014010655504/17/14Method for forming a semiconductor device
2202014010784504/17/14Method of fabricating semiconductor cleaners
2212014010794604/17/14System and method for determining the mileage and wear of a tire
2222014010886904/17/14Dma integrity checker
2232014010887304/17/14Systems and methods for storing information
2242014010346004/17/14Mems device and method of manufacturing a mems device
2252014010349504/17/14Wafer and method for processing a wafer
2262014010386104/17/14Active power factor corrector circuit
2272014010390204/17/14Semiconductor device having sensing functionality
2282014010391504/17/14Intelligent field shaping for magnetic speed sensors
2292014010397604/17/14Multi-output phase detector
2302014010408904/17/14Analog-to-digital conversion with multiple kernels
2312014010413204/17/14Impedance matching network with improved quality factor and method for matching an impedance
2322014010622904/17/14Battery electrode, battery, and method for manufacturing a battery electrode
2332014010626404/17/14Photolithography mask, photolithography mask arrangement, and method for exposing a wafer
2342014010655504/17/14Method for forming a semiconductor device
2352014010784504/17/14Method of fabricating semiconductor cleaners
2362014010794604/17/14System and method for determining the mileage and wear of a tire
2372014010886904/17/14Dma integrity checker
2382014010887304/17/14Systems and methods for storing information
2392014009699804/10/14Electrical contact pad
2402014009743104/10/14Semiconductor devices and processing methods
2412014009748004/10/14Method for manufacturing a memory cell, a method for manufacturing a memory cell arrangement, and a memory cell
2422014009751404/10/14Semiconductor package and method for fabricating the same
2432014009752804/10/14Chip arrangements, a chip package and a method for manufacturing a chip arrangement
2442014009786304/10/14Test method and test arrangement
2452014009786404/10/14Semiconductor device test structures and methods
2462014009977704/10/14Singulation processes
2472014009979904/10/14Lithography masks, systems, and manufacturing methods
2482014009699804/10/14Electrical contact pad
2492014009743104/10/14Semiconductor devices and processing methods


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Infineon Technologies Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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