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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121

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Infineon Technologies Ag patents


      
Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors



Radio communication processor arrangement

Infineon Technologies Ag

Radio communication processor arrangement

Infineon Technologies Ag

Chip package and a method of manufacturing the same

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014031922810/30/14 new patent  Smart card
42014031922910/30/14 new patent  Radio communication processor arrangement
52014031962710/30/14 new patent  Chip package and a method of manufacturing the same
62014031223310/23/14Time of flight illumination circuit
72014031248510/23/14Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
82014031249710/23/14Molding material and method for packaging semiconductor chips
92014031309210/23/14Antenna arrangement, communication appliance and antenna structure
102014031423510/23/14Apparatus for generating trusted image data, an apparatus for authentication of an image and a method for generating trusted image data
112014031536210/23/14Cmos transistor with dual high-k gate dielectric
122014030618410/16/14Two-dimensional material containing electronic components
132014030632710/16/14Semiconductor device and method of manufacturing thereof
142014030635610/16/14Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
152014030670110/16/14Vertical hall sensor circuit comprising stress compensation circuit
162014030739110/16/14Three dimensional packaging
172014029169510/02/14Silicon carbide device and a method for manufacturing a silicon carbide device
182014029169710/02/14Silicon carbide device and a method for forming a silicon carbide device
192014029178810/02/14Magnetoresistive devices and methods for manufacturing magnetoresistive devices
202014029182410/02/14Leadframe, semiconductor package including a leadframe and method for producing a leadframe
212014029183210/02/14Integrated cooling modules of power semiconductor device
222014028462409/25/14Semiconductor component, semiconductor module and methods for producing a semiconductor component and a semiconductor module
232014028466309/25/14Method of manufacturing an imager and imager device
242014028518709/25/14Angle measurement system including magnet with substantially square face for through-shaft applications
252014028527409/25/14Wien-bridge oscillator and circuit arrangement for regulating a detuning
262014028888309/25/14Method for determining an angle of a magnetic pole of a rotating object
272014026054509/18/14Sensor and sensing method
282014026366309/18/14Smart card module arrangement
292014026425509/18/14Method for making a sensor device using a graphene layer
302014026437409/18/14Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device
312014026465109/18/14Semiconductor devices and methods of forming thereof
322014026467709/18/14Chip package with isolated pin, isolated pad or isolated chip carrier and method of making the same
332014026476409/18/14Layer arrangement
342014026481409/18/14Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device
352014026486509/18/14Semiconductor device and manufacturing method thereof
362014026495009/18/14Chip arrangement and a method of manufacturing a chip arrangement
372014026509809/18/14Lift pin for substrate processing
382014026557009/18/14Multi-load drive circuit
392014026617809/18/14Current sensor
402014026617909/18/14Magnetic-field sensor
412014026618009/18/14Sensors, systems and methods for residual current detection
422014026626009/18/14Apparatus and a method for generating a sensor signal indicating information on a capacitance of a variable capacitor comprising a variable capacitance
432014026626309/18/14Apparatus and method for determining the sensitivity of a capacitive sensing device
442014026626909/18/14Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal
452014026682709/18/14Adc with noise-shaping sar
462014026684109/18/14Circuit arrangement and method for operating an analog-to-digital converter
472014026844209/18/14Circuit arrangement and method for evaluating a signal
482014026890309/18/14System and method for a switched-mode power converter
492014026912609/18/14Circuit arrangement and method for operating a circuit arrangement
502014027270509/18/14Photoresist application
512014027339409/18/14Capacitors in integrated circuits and methods of fabrication thereof
522014027382509/18/14Semiconductor chip configuration with a coupler
532014028109809/18/14Conditional links for direct memory access controllers
542014025140809/11/14System and method for manufacturing a temperature difference sensor
552014025249809/11/14Method for fabricating a field effect transistor, and field effect transistor
562014025254009/11/14Semiconductor device and method of manufacturing thereof
572014025258309/11/14Power semiconductor assembly and module
582014025310609/11/14Off-center angle measurement system
592014025314209/11/14Method for testing components and measuring arrangement
602014025422409/11/14Rectifier circuit
612014025485009/11/14Acoustic sensor package
622014025868409/11/14System and method to increase lockstep core availability
632014025878409/11/14Machine and methods for reassign positions of a software program based on a fail/pass performance
642014024650309/04/14Booster antenna, contactless chip arrangement, antenna structure and chip arrangement
652014024717709/04/14Data conversion with redundant split-capacitor arrangement
662014025033609/04/14Machine and methods for evaluating failing software programs
672014025054009/04/14Dynamic resource sharing
682014023849408/28/14Current driving system for a solenoid
692014023941108/28/14Through vias and methods of formation thereof
702014023942808/28/14Chip arrangement and a method for manufacturing a chip arrangement
712014023943808/28/14Semiconductor device
722014023947408/28/14Chip arrangement and a method for manufacturing a chip arrangement
732014023998708/28/14System and method for determining operational robustness of a system on a chip
742014023999808/28/14Turret handlers and methods of operations thereof
752014024105508/28/14Method and system for reducing the complexity of electronically programmable nonvolatile memory
762014024237408/28/14Porous metal coating
772014024420608/28/14Sensor systems and methods having emulated line adaptation
782014023189508/21/14One-time programming device and a semiconductor device
792014023197008/21/14Method for processing a carrier, a carrier, an electronic device and a lithographic mask
802014023197108/21/14Chip arrangement and a method of manufacturing a chip arrangement
812014023197408/21/14Module and method of manufacturing a module
822014023200108/21/14Device bond pads over process control monitor structures in a semiconductor die
832014023201508/21/14Semiconductor modules and methods of formation thereof
842014023258608/21/14Method and device for radar applications
852014023320008/21/14Method for manufacturing an integrated circuit and an integrated circuit
862014023326208/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
872014023326408/21/14Single stage pfc power supply
882014023328908/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
892014023503508/21/14Methods of forming semiconductor devices
902014023503908/21/14Method for producing a protective structure
912014022512508/14/14Composite wafer and a method for manufacturing same
922014022523308/14/14Layer arrangement
932014022565408/14/14Phase-lock loop
942014022677008/14/14Transmitter, receiver, method for transmitting and method for receiving
952014022714708/14/14Microfluidic device and method
962014022781808/14/14Semiconductor structure with lamella defined by singulation trench
972014021667708/07/14Method of processing a substrate
982014021706208/07/14Porous metal etching
992014021746308/07/14Bipolar semiconductor switch and a manufacturing method therefor
1002014021750008/07/14Semiconductor device with low on resistance and high breakdown voltage
1012014021757708/07/14Semiconductor device and method for manufacturing a semiconductor device
1022014021801908/07/14Sensor package and method for producing a sensor package
1032014021939408/07/14Receiver and transmitter receiver system
1042014022025708/07/14Method of processing a substrate
1052014022074208/07/14Method for forming a thin semiconductor device
1062014022077008/07/14Methods of fabricating semiconductor devices and structures thereof
1072014022304808/07/14Communication network and method for communicating in a communication network
1082014022305008/07/14Receiver architecture
1092014022340508/07/14Method and apparatus for providing a layout defining a structure to be patterned onto a substrate
1102014022356908/07/14System on chip with embedded security module
1112014021152607/31/14Active power factor corrector circuit
1122014020985207/31/14Semiconductor device including a phase change material
1132014020990407/31/14Integrated test circuit and method for manufacturing an integrated test circuit
1142014020990507/31/14Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
1152014021002007/31/14Mems device and method of manufacturing a mems device
1162014021005407/31/14Semiconductor devices and methods of producing these
1172014021045807/31/14Systems and methods for offset reduction in sensor devices and systems
1182014021046107/31/14Vertical hall device with highly conductive opposite face node for electrically connecting first and second hall effect regions
1192014021064107/31/14Signal generator, decoder, method for generating a transmit signal and method for determining speed data
1202014021151007/31/14Voltage sensing in a voltage converter
1212014021512407/31/14System and method for adaptive bit rate programming of a memory device
1222014021521907/31/14Method for verifying an electronic signature and data processing device
1232014020327807/24/14Chip package having terminal pads of different form factors
1242014020334907/24/14Method of producing a high-voltage-resistant semiconductor component having vertically conductive semiconductor body areas and a trench structure
1252014020336607/24/14Semiconductor devices and methods of manufacture thereof
1262014020338007/24/14Chip package comprising a microphone structure and a method of manufacturing the same
1272014020345507/24/14Feature patterning methods and structures thereof
1282014020384607/24/14Method for driving a load
1292014020435507/24/14Method for exposing an area on a substrate to a beam and photolithographic system
1302014020512807/24/14Chip arrangement and a method for manufacturing the same
1312014020523307/24/14Integrated circuit including non-planar structure and waveguide
1322014020610907/24/14Method of manufacturing and testing a chip package
1332014020616307/24/14Electronic component, a semiconductor wafer and a method for producing an electronic component
1342014019713007/17/14Method for manufacturing a plurality of nanowires
1352014019750107/17/14Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
1362014019750207/17/14Comb mems device and method of making a comb mems device
1372014019750307/17/14Sensor package
1382014019752307/17/14Chip arrangement and a method for forming a chip arrangement
1392014019752707/17/14Chip arrangement and a method for manufacturing a chip arrangement
1402014019753907/17/14Bonded system with coated copper conductor
1412014019755107/17/14Method for fabricating a semiconductor chip panel
1422014019755207/17/14Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
1432014019782707/17/14Xmr-sensor and method for manufacturing the xmr-sensor
1442014019858307/17/14Method and system for reducing the size of nonvolatile memories
1452014019880407/17/14Variable load driver with power message transfer
1462014019883307/17/14Self synchronizing data communication method and device
1472014020078507/17/14Tire localization systems and methods in tire pressure monitoring systems
1482014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
1492014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
1502014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
1512014018371107/03/14Semiconductor device and method of making a semiconductor device
1522014018717007/03/14System and method for testing a radio frequency integrated circuit
1532014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
1542014018943707/03/14Multi-tier trace
1552014017420106/26/14Torque sensor
1562014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
1572014017555806/26/14Transistor device and method of manufacture thereof
1582014017559306/26/14Super junction semiconductor device
1592014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
1602014017562506/26/14Semiconductor device including at least one element
1612014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
1622014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
1632014016709006/19/14Optoelectronic transmission system and method
1642014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
1652014016715406/19/14Transistor cell array including semiconductor diode
1662014016718406/19/14Dummy structures and methods
1672014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
1682014016721506/19/14Electronic circuit arrangement
1692014016722406/19/14Semiconductor device and method of producing the same
1702014016722506/19/14Crack stop barrier and method of manufacturing thereof
1712014016722606/19/14Wafer and a method of dicing a wafer
1722014016726606/19/14Semiconductor device having peripheral polymer structures
1732014016727006/19/14Method of fabricating a layer stack
1742014016727206/19/14Semiconductor device having an identification mark
1752014016765406/19/14Circuit arrangements and methods for operating an electrical machine
1762014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
1772014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
1782014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
1792014017044606/19/14Sensor module and battery elements
1802014017083606/19/14Chip comprising a fill structure
1812014017234306/19/14Emulation system and method
1822014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
1832014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
1842014015919606/12/14Through substrate features in semiconductor substrates
1852014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
1862014015922006/12/14Semiconductor device and method of manufacture thereof
1872014015994306/12/14Compensating slowly varying if dc offsets in receivers
1882014016483206/12/14Test circuit and method for processing a test routine
1892014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
1902014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
1912014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
1922014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
1932014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
1942014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
1952014015185406/05/14Method for separating a layer and a chip formed on a layer
1962014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
1972014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
1982014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
1992014015190506/05/14Devices and methods for providing an electrical connection
2002014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
2012014015298906/05/14Selectivity by polarization
2022014015334806/05/14Operation scheme for non-volatile memory
2032014015613706/05/14Lightweight trace based measurement systems and methods
2042014015703506/05/14Bit-timing symmetrization
2052014014530505/29/14Capacitor and method of forming a capacitor
2062014014531805/29/14Semiconductor packages and methods of formation thereof
2072014014533305/29/14Device comprising a ductile layer and method of making the same
2082014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
2092014014566405/29/14Power inverter including sic jfets
2102014014568605/29/14Charge conservation in pixels
2112014014577205/29/14Storage circuit
2122014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
2132014014974805/29/14Methods and systems for securely transferring embedded code and/or data designed for a device to a customer
2142014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
2152014013881305/22/14Method for manufacturing an electronic component
2162014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
2172014013884305/22/14Method for fabricating an electronic component
2182014013923005/22/14Method and apparatus for determining a charge state
2192014013926805/22/14Driver circuit with tight control of gate voltage
2202014013928505/22/14Chopper amplifier
2212014013928905/22/14Sensor signal processing using translinear mesh
2222014013929605/22/14Pulse modulation control in a dc-dc converter circuit
2232014013963105/22/14Dynamic conservation of imaging power
2242014014053805/22/14System and method for high input capacitive signal amplifier
2252014014159205/22/14Method for stress reduced manufacturing semiconductor devices
2262014014160805/22/14Semiconductor component and methods for producing a semiconductor component
2272014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
2282014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
2292014013881305/22/14Method for manufacturing an electronic component
2302014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
2312014013884305/22/14Method for fabricating an electronic component
2322014013923005/22/14Method and apparatus for determining a charge state
2332014013926805/22/14Driver circuit with tight control of gate voltage
2342014013928505/22/14Chopper amplifier
2352014013928905/22/14Sensor signal processing using translinear mesh
2362014013929605/22/14Pulse modulation control in a dc-dc converter circuit
2372014013963105/22/14Dynamic conservation of imaging power
2382014014053805/22/14System and method for high input capacitive signal amplifier
2392014014159205/22/14Method for stress reduced manufacturing semiconductor devices
2402014014160805/22/14Semiconductor component and methods for producing a semiconductor component
2412014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
2422014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
2432014013176605/15/14Inhomogenous power semiconductor devices
2442014013181505/15/14Semiconductor device
2452014013184405/15/14System and method for an electronic package with a fail-open mechanism
2462014013234705/15/14Linearized high-ohmic resistor
2472014013236305/15/14System and method for generating a pulse-width modulated signal
2482014013239105/15/14Relay attack prevention using rssipplx
2492014013243305/15/14Analog-to-digital converter arrangement


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Infineon Technologies Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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