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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121

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Infineon Technologies Ag patents


      
Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors



Arrangement having a plurality of chips and a chip carrier, and a processing arrangement

Infineon Technologies Ag

Arrangement having a plurality of chips and a chip carrier, and a processing arrangement

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014030618410/16/14 new patent  Two-dimensional material containing electronic components
42014030632710/16/14 new patent  Semiconductor device and method of manufacturing thereof
52014030635610/16/14 new patent  Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
62014030670110/16/14 new patent  Vertical hall sensor circuit comprising stress compensation circuit
72014030739110/16/14 new patent  Three dimensional packaging
82014029169510/02/14Silicon carbide device and a method for manufacturing a silicon carbide device
92014029169710/02/14Silicon carbide device and a method for forming a silicon carbide device
102014029178810/02/14Magnetoresistive devices and methods for manufacturing magnetoresistive devices
112014029182410/02/14Leadframe, semiconductor package including a leadframe and method for producing a leadframe
122014029183210/02/14Integrated cooling modules of power semiconductor device
132014028462409/25/14Semiconductor component, semiconductor module and methods for producing a semiconductor component and a semiconductor module
142014028466309/25/14Method of manufacturing an imager and imager device
152014028518709/25/14Angle measurement system including magnet with substantially square face for through-shaft applications
162014028527409/25/14Wien-bridge oscillator and circuit arrangement for regulating a detuning
172014028888309/25/14Method for determining an angle of a magnetic pole of a rotating object
182014026054509/18/14Sensor and sensing method
192014026366309/18/14Smart card module arrangement
202014026425509/18/14Method for making a sensor device using a graphene layer
212014026437409/18/14Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device
222014026465109/18/14Semiconductor devices and methods of forming thereof
232014026467709/18/14Chip package with isolated pin, isolated pad or isolated chip carrier and method of making the same
242014026476409/18/14Layer arrangement
252014026481409/18/14Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device
262014026486509/18/14Semiconductor device and manufacturing method thereof
272014026495009/18/14Chip arrangement and a method of manufacturing a chip arrangement
282014026509809/18/14Lift pin for substrate processing
292014026557009/18/14Multi-load drive circuit
302014026617809/18/14Current sensor
312014026617909/18/14Magnetic-field sensor
322014026618009/18/14Sensors, systems and methods for residual current detection
332014026626009/18/14Apparatus and a method for generating a sensor signal indicating information on a capacitance of a variable capacitor comprising a variable capacitance
342014026626309/18/14Apparatus and method for determining the sensitivity of a capacitive sensing device
352014026626909/18/14Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal
362014026682709/18/14Adc with noise-shaping sar
372014026684109/18/14Circuit arrangement and method for operating an analog-to-digital converter
382014026844209/18/14Circuit arrangement and method for evaluating a signal
392014026890309/18/14System and method for a switched-mode power converter
402014026912609/18/14Circuit arrangement and method for operating a circuit arrangement
412014027270509/18/14Photoresist application
422014027339409/18/14Capacitors in integrated circuits and methods of fabrication thereof
432014027382509/18/14Semiconductor chip configuration with a coupler
442014028109809/18/14Conditional links for direct memory access controllers
452014025140809/11/14System and method for manufacturing a temperature difference sensor
462014025249809/11/14Method for fabricating a field effect transistor, and field effect transistor
472014025254009/11/14Semiconductor device and method of manufacturing thereof
482014025258309/11/14Power semiconductor assembly and module
492014025310609/11/14Off-center angle measurement system
502014025314209/11/14Method for testing components and measuring arrangement
512014025422409/11/14Rectifier circuit
522014025485009/11/14Acoustic sensor package
532014025868409/11/14System and method to increase lockstep core availability
542014025878409/11/14Machine and methods for reassign positions of a software program based on a fail/pass performance
552014024650309/04/14Booster antenna, contactless chip arrangement, antenna structure and chip arrangement
562014024717709/04/14Data conversion with redundant split-capacitor arrangement
572014025033609/04/14Machine and methods for evaluating failing software programs
582014025054009/04/14Dynamic resource sharing
592014023849408/28/14Current driving system for a solenoid
602014023941108/28/14Through vias and methods of formation thereof
612014023942808/28/14Chip arrangement and a method for manufacturing a chip arrangement
622014023943808/28/14Semiconductor device
632014023947408/28/14Chip arrangement and a method for manufacturing a chip arrangement
642014023998708/28/14System and method for determining operational robustness of a system on a chip
652014023999808/28/14Turret handlers and methods of operations thereof
662014024105508/28/14Method and system for reducing the complexity of electronically programmable nonvolatile memory
672014024237408/28/14Porous metal coating
682014024420608/28/14Sensor systems and methods having emulated line adaptation
692014023189508/21/14One-time programming device and a semiconductor device
702014023197008/21/14Method for processing a carrier, a carrier, an electronic device and a lithographic mask
712014023197108/21/14Chip arrangement and a method of manufacturing a chip arrangement
722014023197408/21/14Module and method of manufacturing a module
732014023200108/21/14Device bond pads over process control monitor structures in a semiconductor die
742014023201508/21/14Semiconductor modules and methods of formation thereof
752014023258608/21/14Method and device for radar applications
762014023320008/21/14Method for manufacturing an integrated circuit and an integrated circuit
772014023326208/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
782014023326408/21/14Single stage pfc power supply
792014023328908/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
802014023503508/21/14Methods of forming semiconductor devices
812014023503908/21/14Method for producing a protective structure
822014022512508/14/14Composite wafer and a method for manufacturing same
832014022523308/14/14Layer arrangement
842014022565408/14/14Phase-lock loop
852014022677008/14/14Transmitter, receiver, method for transmitting and method for receiving
862014022714708/14/14Microfluidic device and method
872014022781808/14/14Semiconductor structure with lamella defined by singulation trench
882014021667708/07/14Method of processing a substrate
892014021706208/07/14Porous metal etching
902014021746308/07/14Bipolar semiconductor switch and a manufacturing method therefor
912014021750008/07/14Semiconductor device with low on resistance and high breakdown voltage
922014021757708/07/14Semiconductor device and method for manufacturing a semiconductor device
932014021801908/07/14Sensor package and method for producing a sensor package
942014021939408/07/14Receiver and transmitter receiver system
952014022025708/07/14Method of processing a substrate
962014022074208/07/14Method for forming a thin semiconductor device
972014022077008/07/14Methods of fabricating semiconductor devices and structures thereof
982014022304808/07/14Communication network and method for communicating in a communication network
992014022305008/07/14Receiver architecture
1002014022340508/07/14Method and apparatus for providing a layout defining a structure to be patterned onto a substrate
1012014022356908/07/14System on chip with embedded security module
1022014021152607/31/14Active power factor corrector circuit
1032014020985207/31/14Semiconductor device including a phase change material
1042014020990407/31/14Integrated test circuit and method for manufacturing an integrated test circuit
1052014020990507/31/14Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
1062014021002007/31/14Mems device and method of manufacturing a mems device
1072014021005407/31/14Semiconductor devices and methods of producing these
1082014021045807/31/14Systems and methods for offset reduction in sensor devices and systems
1092014021046107/31/14Vertical hall device with highly conductive opposite face node for electrically connecting first and second hall effect regions
1102014021064107/31/14Signal generator, decoder, method for generating a transmit signal and method for determining speed data
1112014021151007/31/14Voltage sensing in a voltage converter
1122014021512407/31/14System and method for adaptive bit rate programming of a memory device
1132014021521907/31/14Method for verifying an electronic signature and data processing device
1142014020327807/24/14Chip package having terminal pads of different form factors
1152014020334907/24/14Method of producing a high-voltage-resistant semiconductor component having vertically conductive semiconductor body areas and a trench structure
1162014020336607/24/14Semiconductor devices and methods of manufacture thereof
1172014020338007/24/14Chip package comprising a microphone structure and a method of manufacturing the same
1182014020345507/24/14Feature patterning methods and structures thereof
1192014020384607/24/14Method for driving a load
1202014020435507/24/14Method for exposing an area on a substrate to a beam and photolithographic system
1212014020512807/24/14Chip arrangement and a method for manufacturing the same
1222014020523307/24/14Integrated circuit including non-planar structure and waveguide
1232014020610907/24/14Method of manufacturing and testing a chip package
1242014020616307/24/14Electronic component, a semiconductor wafer and a method for producing an electronic component
1252014019713007/17/14Method for manufacturing a plurality of nanowires
1262014019750107/17/14Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
1272014019750207/17/14Comb mems device and method of making a comb mems device
1282014019750307/17/14Sensor package
1292014019752307/17/14Chip arrangement and a method for forming a chip arrangement
1302014019752707/17/14Chip arrangement and a method for manufacturing a chip arrangement
1312014019753907/17/14Bonded system with coated copper conductor
1322014019755107/17/14Method for fabricating a semiconductor chip panel
1332014019755207/17/14Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
1342014019782707/17/14Xmr-sensor and method for manufacturing the xmr-sensor
1352014019858307/17/14Method and system for reducing the size of nonvolatile memories
1362014019880407/17/14Variable load driver with power message transfer
1372014019883307/17/14Self synchronizing data communication method and device
1382014020078507/17/14Tire localization systems and methods in tire pressure monitoring systems
1392014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
1402014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
1412014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
1422014018371107/03/14Semiconductor device and method of making a semiconductor device
1432014018717007/03/14System and method for testing a radio frequency integrated circuit
1442014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
1452014018943707/03/14Multi-tier trace
1462014017420106/26/14Torque sensor
1472014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
1482014017555806/26/14Transistor device and method of manufacture thereof
1492014017559306/26/14Super junction semiconductor device
1502014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
1512014017562506/26/14Semiconductor device including at least one element
1522014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
1532014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
1542014016709006/19/14Optoelectronic transmission system and method
1552014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
1562014016715406/19/14Transistor cell array including semiconductor diode
1572014016718406/19/14Dummy structures and methods
1582014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
1592014016721506/19/14Electronic circuit arrangement
1602014016722406/19/14Semiconductor device and method of producing the same
1612014016722506/19/14Crack stop barrier and method of manufacturing thereof
1622014016722606/19/14Wafer and a method of dicing a wafer
1632014016726606/19/14Semiconductor device having peripheral polymer structures
1642014016727006/19/14Method of fabricating a layer stack
1652014016727206/19/14Semiconductor device having an identification mark
1662014016765406/19/14Circuit arrangements and methods for operating an electrical machine
1672014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
1682014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
1692014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
1702014017044606/19/14Sensor module and battery elements
1712014017083606/19/14Chip comprising a fill structure
1722014017234306/19/14Emulation system and method
1732014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
1742014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
1752014015919606/12/14Through substrate features in semiconductor substrates
1762014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
1772014015922006/12/14Semiconductor device and method of manufacture thereof
1782014015994306/12/14Compensating slowly varying if dc offsets in receivers
1792014016483206/12/14Test circuit and method for processing a test routine
1802014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
1812014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
1822014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
1832014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
1842014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
1852014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
1862014015185406/05/14Method for separating a layer and a chip formed on a layer
1872014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
1882014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
1892014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
1902014015190506/05/14Devices and methods for providing an electrical connection
1912014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
1922014015298906/05/14Selectivity by polarization
1932014015334806/05/14Operation scheme for non-volatile memory
1942014015613706/05/14Lightweight trace based measurement systems and methods
1952014015703506/05/14Bit-timing symmetrization
1962014014530505/29/14Capacitor and method of forming a capacitor
1972014014531805/29/14Semiconductor packages and methods of formation thereof
1982014014533305/29/14Device comprising a ductile layer and method of making the same
1992014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
2002014014566405/29/14Power inverter including sic jfets
2012014014568605/29/14Charge conservation in pixels
2022014014577205/29/14Storage circuit
2032014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
2042014014974805/29/14Methods and systems for securely transferring embedded code and/or data designed for a device to a customer
2052014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
2062014013881305/22/14Method for manufacturing an electronic component
2072014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
2082014013884305/22/14Method for fabricating an electronic component
2092014013923005/22/14Method and apparatus for determining a charge state
2102014013926805/22/14Driver circuit with tight control of gate voltage
2112014013928505/22/14Chopper amplifier
2122014013928905/22/14Sensor signal processing using translinear mesh
2132014013929605/22/14Pulse modulation control in a dc-dc converter circuit
2142014013963105/22/14Dynamic conservation of imaging power
2152014014053805/22/14System and method for high input capacitive signal amplifier
2162014014159205/22/14Method for stress reduced manufacturing semiconductor devices
2172014014160805/22/14Semiconductor component and methods for producing a semiconductor component
2182014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
2192014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
2202014013881305/22/14Method for manufacturing an electronic component
2212014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
2222014013884305/22/14Method for fabricating an electronic component
2232014013923005/22/14Method and apparatus for determining a charge state
2242014013926805/22/14Driver circuit with tight control of gate voltage
2252014013928505/22/14Chopper amplifier
2262014013928905/22/14Sensor signal processing using translinear mesh
2272014013929605/22/14Pulse modulation control in a dc-dc converter circuit
2282014013963105/22/14Dynamic conservation of imaging power
2292014014053805/22/14System and method for high input capacitive signal amplifier
2302014014159205/22/14Method for stress reduced manufacturing semiconductor devices
2312014014160805/22/14Semiconductor component and methods for producing a semiconductor component
2322014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
2332014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
2342014013176605/15/14Inhomogenous power semiconductor devices
2352014013181505/15/14Semiconductor device
2362014013184405/15/14System and method for an electronic package with a fail-open mechanism
2372014013234705/15/14Linearized high-ohmic resistor
2382014013236305/15/14System and method for generating a pulse-width modulated signal
2392014013239105/15/14Relay attack prevention using rssipplx
2402014013243305/15/14Analog-to-digital converter arrangement
2412014013325005/15/14Current sense amplifier with replica bias scheme
2422014013482905/15/14Process tools and methods of forming devices using process tools
2432014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
2442014013176605/15/14Inhomogenous power semiconductor devices
2452014013181505/15/14Semiconductor device
2462014013184405/15/14System and method for an electronic package with a fail-open mechanism
2472014013234705/15/14Linearized high-ohmic resistor
2482014013236305/15/14System and method for generating a pulse-width modulated signal
2492014013239105/15/14Relay attack prevention using rssipplx


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Infineon Technologies Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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