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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121

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Infineon Technologies Ag patents


      
Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors



Infineon Technologies Ag

Method and system for reducing the complexity of electronically programmable nonvolatile memory

Infineon Technologies Ag

Chip arrangement and a method for manufacturing a chip arrangement

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014023849408/28/14 new patent  Current driving system for a solenoid
42014023941108/28/14 new patent  Through vias and methods of formation thereof
52014023942808/28/14 new patent  Chip arrangement and a method for manufacturing a chip arrangement
62014023943808/28/14 new patent  Semiconductor device
72014023947408/28/14 new patent  Chip arrangement and a method for manufacturing a chip arrangement
82014023998708/28/14 new patent  System and method for determining operational robustness of a system on a chip
92014023999808/28/14 new patent  Turret handlers and methods of operations thereof
102014024105508/28/14 new patent  Method and system for reducing the complexity of electronically programmable nonvolatile memory
112014024237408/28/14 new patent  Porous metal coating
122014024420608/28/14 new patent  Sensor systems and methods having emulated line adaptation
132014023189508/21/14One-time programming device and a semiconductor device
142014023197008/21/14Method for processing a carrier, a carrier, an electronic device and a lithographic mask
152014023197108/21/14Chip arrangement and a method of manufacturing a chip arrangement
162014023197408/21/14Module and method of manufacturing a module
172014023200108/21/14Device bond pads over process control monitor structures in a semiconductor die
182014023201508/21/14Semiconductor modules and methods of formation thereof
192014023258608/21/14Method and device for radar applications
202014023320008/21/14Method for manufacturing an integrated circuit and an integrated circuit
212014023326208/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
222014023326408/21/14Single stage pfc power supply
232014023328908/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
242014023503508/21/14Methods of forming semiconductor devices
252014023503908/21/14Method for producing a protective structure
262014022512508/14/14Composite wafer and a method for manufacturing same
272014022523308/14/14Layer arrangement
282014022565408/14/14Phase-lock loop
292014022677008/14/14Transmitter, receiver, method for transmitting and method for receiving
302014022714708/14/14Microfluidic device and method
312014022781808/14/14Semiconductor structure with lamella defined by singulation trench
322014021667708/07/14Method of processing a substrate
332014021706208/07/14Porous metal etching
342014021746308/07/14Bipolar semiconductor switch and a manufacturing method therefor
352014021750008/07/14Semiconductor device with low on resistance and high breakdown voltage
362014021757708/07/14Semiconductor device and method for manufacturing a semiconductor device
372014021801908/07/14Sensor package and method for producing a sensor package
382014021939408/07/14Receiver and transmitter receiver system
392014022025708/07/14Method of processing a substrate
402014022074208/07/14Method for forming a thin semiconductor device
412014022077008/07/14Methods of fabricating semiconductor devices and structures thereof
422014022304808/07/14Communication network and method for communicating in a communication network
432014022305008/07/14Receiver architecture
442014022340508/07/14Method and apparatus for providing a layout defining a structure to be patterned onto a substrate
452014022356908/07/14System on chip with embedded security module
462014021152607/31/14Active power factor corrector circuit
472014020985207/31/14Semiconductor device including a phase change material
482014020990407/31/14Integrated test circuit and method for manufacturing an integrated test circuit
492014020990507/31/14Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
502014021002007/31/14Mems device and method of manufacturing a mems device
512014021005407/31/14Semiconductor devices and methods of producing these
522014021045807/31/14Systems and methods for offset reduction in sensor devices and systems
532014021046107/31/14Vertical hall device with highly conductive opposite face node for electrically connecting first and second hall effect regions
542014021064107/31/14Signal generator, decoder, method for generating a transmit signal and method for determining speed data
552014021151007/31/14Voltage sensing in a voltage converter
562014021512407/31/14System and method for adaptive bit rate programming of a memory device
572014021521907/31/14Method for verifying an electronic signature and data processing device
582014020327807/24/14Chip package having terminal pads of different form factors
592014020334907/24/14Method of producing a high-voltage-resistant semiconductor component having vertically conductive semiconductor body areas and a trench structure
602014020336607/24/14Semiconductor devices and methods of manufacture thereof
612014020338007/24/14Chip package comprising a microphone structure and a method of manufacturing the same
622014020345507/24/14Feature patterning methods and structures thereof
632014020384607/24/14Method for driving a load
642014020435507/24/14Method for exposing an area on a substrate to a beam and photolithographic system
652014020512807/24/14Chip arrangement and a method for manufacturing the same
662014020523307/24/14Integrated circuit including non-planar structure and waveguide
672014020610907/24/14Method of manufacturing and testing a chip package
682014020616307/24/14Electronic component, a semiconductor wafer and a method for producing an electronic component
692014019713007/17/14Method for manufacturing a plurality of nanowires
702014019750107/17/14Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
712014019750207/17/14Comb mems device and method of making a comb mems device
722014019750307/17/14Sensor package
732014019752307/17/14Chip arrangement and a method for forming a chip arrangement
742014019752707/17/14Chip arrangement and a method for manufacturing a chip arrangement
752014019753907/17/14Bonded system with coated copper conductor
762014019755107/17/14Method for fabricating a semiconductor chip panel
772014019755207/17/14Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
782014019782707/17/14Xmr-sensor and method for manufacturing the xmr-sensor
792014019858307/17/14Method and system for reducing the size of nonvolatile memories
802014019880407/17/14Variable load driver with power message transfer
812014019883307/17/14Self synchronizing data communication method and device
822014020078507/17/14Tire localization systems and methods in tire pressure monitoring systems
832014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
842014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
852014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
862014018371107/03/14Semiconductor device and method of making a semiconductor device
872014018717007/03/14System and method for testing a radio frequency integrated circuit
882014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
892014018943707/03/14Multi-tier trace
902014017420106/26/14Torque sensor
912014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
922014017555806/26/14Transistor device and method of manufacture thereof
932014017559306/26/14Super junction semiconductor device
942014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
952014017562506/26/14Semiconductor device including at least one element
962014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
972014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
982014016709006/19/14Optoelectronic transmission system and method
992014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
1002014016715406/19/14Transistor cell array including semiconductor diode
1012014016718406/19/14Dummy structures and methods
1022014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
1032014016721506/19/14Electronic circuit arrangement
1042014016722406/19/14Semiconductor device and method of producing the same
1052014016722506/19/14Crack stop barrier and method of manufacturing thereof
1062014016722606/19/14Wafer and a method of dicing a wafer
1072014016726606/19/14Semiconductor device having peripheral polymer structures
1082014016727006/19/14Method of fabricating a layer stack
1092014016727206/19/14Semiconductor device having an identification mark
1102014016765406/19/14Circuit arrangements and methods for operating an electrical machine
1112014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
1122014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
1132014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
1142014017044606/19/14Sensor module and battery elements
1152014017083606/19/14Chip comprising a fill structure
1162014017234306/19/14Emulation system and method
1172014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
1182014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
1192014015919606/12/14Through substrate features in semiconductor substrates
1202014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
1212014015922006/12/14Semiconductor device and method of manufacture thereof
1222014015994306/12/14Compensating slowly varying if dc offsets in receivers
1232014016483206/12/14Test circuit and method for processing a test routine
1242014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
1252014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
1262014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
1272014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
1282014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
1292014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
1302014015185406/05/14Method for separating a layer and a chip formed on a layer
1312014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
1322014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
1332014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
1342014015190506/05/14Devices and methods for providing an electrical connection
1352014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
1362014015298906/05/14Selectivity by polarization
1372014015334806/05/14Operation scheme for non-volatile memory
1382014015613706/05/14Lightweight trace based measurement systems and methods
1392014015703506/05/14Bit-timing symmetrization
1402014014530505/29/14Capacitor and method of forming a capacitor
1412014014531805/29/14Semiconductor packages and methods of formation thereof
1422014014533305/29/14Device comprising a ductile layer and method of making the same
1432014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
1442014014566405/29/14Power inverter including sic jfets
1452014014568605/29/14Charge conservation in pixels
1462014014577205/29/14Storage circuit
1472014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
1482014014974805/29/14Methods and systems for securely transferring embedded code and/or data designed for a device to a customer
1492014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
1502014013881305/22/14Method for manufacturing an electronic component
1512014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
1522014013884305/22/14Method for fabricating an electronic component
1532014013923005/22/14Method and apparatus for determining a charge state
1542014013926805/22/14Driver circuit with tight control of gate voltage
1552014013928505/22/14Chopper amplifier
1562014013928905/22/14Sensor signal processing using translinear mesh
1572014013929605/22/14Pulse modulation control in a dc-dc converter circuit
1582014013963105/22/14Dynamic conservation of imaging power
1592014014053805/22/14System and method for high input capacitive signal amplifier
1602014014159205/22/14Method for stress reduced manufacturing semiconductor devices
1612014014160805/22/14Semiconductor component and methods for producing a semiconductor component
1622014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
1632014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
1642014013881305/22/14Method for manufacturing an electronic component
1652014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
1662014013884305/22/14Method for fabricating an electronic component
1672014013923005/22/14Method and apparatus for determining a charge state
1682014013926805/22/14Driver circuit with tight control of gate voltage
1692014013928505/22/14Chopper amplifier
1702014013928905/22/14Sensor signal processing using translinear mesh
1712014013929605/22/14Pulse modulation control in a dc-dc converter circuit
1722014013963105/22/14Dynamic conservation of imaging power
1732014014053805/22/14System and method for high input capacitive signal amplifier
1742014014159205/22/14Method for stress reduced manufacturing semiconductor devices
1752014014160805/22/14Semiconductor component and methods for producing a semiconductor component
1762014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
1772014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1782014013176605/15/14Inhomogenous power semiconductor devices
1792014013181505/15/14Semiconductor device
1802014013184405/15/14System and method for an electronic package with a fail-open mechanism
1812014013234705/15/14Linearized high-ohmic resistor
1822014013236305/15/14System and method for generating a pulse-width modulated signal
1832014013239105/15/14Relay attack prevention using rssipplx
1842014013243305/15/14Analog-to-digital converter arrangement
1852014013325005/15/14Current sense amplifier with replica bias scheme
1862014013482905/15/14Process tools and methods of forming devices using process tools
1872014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
1882014013176605/15/14Inhomogenous power semiconductor devices
1892014013181505/15/14Semiconductor device
1902014013184405/15/14System and method for an electronic package with a fail-open mechanism
1912014013234705/15/14Linearized high-ohmic resistor
1922014013236305/15/14System and method for generating a pulse-width modulated signal
1932014013239105/15/14Relay attack prevention using rssipplx
1942014013243305/15/14Analog-to-digital converter arrangement
1952014013325005/15/14Current sense amplifier with replica bias scheme
1962014013482905/15/14Process tools and methods of forming devices using process tools
1972014012345405/08/14Adjustable pick-up head and method for manufacturing a device
1982014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
1992014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
2002014012489305/08/14Varactor diode, electrical device and method for manufacturing same
2012014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
2022014012987105/08/14Fail safe code functionality
2032014012345405/08/14Adjustable pick-up head and method for manufacturing a device
2042014012457105/08/14Chip card arrangement, chip card, apparatus for contactless interaction with a chip card arrangement or a chip card, and method for operating and method for producing a chip card arrangement or chip card
2052014012482705/08/14Integrated circuit arrangement comprising a field effect transistor, especially a tunnel field effect transistor
2062014012489305/08/14Varactor diode, electrical device and method for manufacturing same
2072014012789505/08/14Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device
2082014012987105/08/14Fail safe code functionality
2092014011614905/01/14Sensor with masking
2102014011741205/01/14Heterojunction transistor and manufacturing method therefor
2112014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
2122014011750505/01/14Chip having backside metal and method for manufacturing same
2132014011750905/01/14Metal deposition with reduced stress
2142014011751105/01/14Passivation layer and method of making a passivation layer
2152014011751505/01/14Integrated antennas in wafer level package
2162014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
2172014011756505/01/14Laminate electronic device
2182014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
2192014011805105/01/14Semiconductor device arrangement and method
2202014011895905/01/14Chip-housing module and a method for forming a chip-housing module
2212014011898205/01/14Switch arrangements and battery arrangements
2222014011947605/01/14Polar transmitter suitable for monolithic integration in socs
2232014011957305/01/14System and method for capacitive signal source amplifier
2242014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
2252014012288105/01/14Method and system for controlling a device
2262014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
2272014012296705/01/14Circuitry and method for multi-bit correction
2282014011614905/01/14Sensor with masking
2292014011741205/01/14Heterojunction transistor and manufacturing method therefor
2302014011750205/01/14Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device
2312014011750505/01/14Chip having backside metal and method for manufacturing same
2322014011750905/01/14Metal deposition with reduced stress
2332014011751105/01/14Passivation layer and method of making a passivation layer
2342014011751505/01/14Integrated antennas in wafer level package
2352014011753005/01/14Semiconductor devices and methods for manufacturing semiconductor devices
2362014011756505/01/14Laminate electronic device
2372014011795905/01/14High resolution control for a multimode smps converter and high resolution slope generator
2382014011805105/01/14Semiconductor device arrangement and method
2392014011895905/01/14Chip-housing module and a method for forming a chip-housing module
2402014011898205/01/14Switch arrangements and battery arrangements
2412014011947605/01/14Polar transmitter suitable for monolithic integration in socs
2422014011957305/01/14System and method for capacitive signal source amplifier
2432014012067305/01/14Integrated circuit having field effect transistors and manufacturing method
2442014012288105/01/14Method and system for controlling a device
2452014012294205/01/14Error signal handling unit, device and method for outputting an error condition signal
2462014012296705/01/14Circuitry and method for multi-bit correction
2472014011025404/24/14Backing plate for a sputter target, sputter target, and sputter device
2482014011037404/24/14Method for removing a dielectric layer from a bottom of a trench
2492014011082904/24/14Module comprising a semiconductor chip


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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