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Infineon Technologies Ag
Infineon Technologies Agam Campeon
Infineon Technologies Ag_20100107
Infineon Technologies Ag_20100114
Infineon Technologies Ag_20100128
Infineon Technologies Ag_20131212
Infineon Technologies Ag_20100121


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Infineon Technologies Ag patents

Recent patent applications related to Infineon Technologies Ag. Infineon Technologies Ag is listed as an Agent/Assignee. Note: Infineon Technologies Ag may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Ag, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Ag-related inventors

Search recent Press Releases: Infineon Technologies Ag-related press releases
Count Application # Date Infineon Technologies Ag patents (updated weekly) - BOOKMARK this page
12009005140502/26/09Adaptive capacitance for transistor
22009004546702/19/09Bipolar transistor finfet technology
32014034010011/20/14 new patent  Techniques for determining a resistance value
42014034018111/20/14 new patent  A switchable capacitance
52014034085311/20/14 new patent  Safety device
62014034132711/20/14 new patent  Transponder unit, system and method for contactless data transmission
72014033293611/13/14Package arrangement and method of forming the same
82014033295311/13/14Chip arrangement, and method for forming a chip arrangement
92014033324111/13/14Optimized control for synchronous motors
102014033346411/13/14Apparatus and method for the characterization of analog-to-digital converters
112014033565411/13/14Semiconductor device fabrication using a reconstituted wafer
122014033569911/13/14Application of fluids to substrates
132014032705311/06/14Semiconductor device including trench transistor cell array and manufacturing method
142014032707111/06/14Method of manufacturing a semiconductor device
152014032712811/06/14Cooling system for molded modules and corresponding manufacturing methods
162014032752011/06/14Radio identification arrangement and method for indicating the position of a physical object
172014032774111/06/143d camera and method of image processing 3d images
182014032803211/06/14Chip arrangement, chip card arrangement and method for manufacturing a chip arrangement
192014031922810/30/14Smart card
202014031922910/30/14Radio communication processor arrangement
212014031962710/30/14Chip package and a method of manufacturing the same
222014031223310/23/14Time of flight illumination circuit
232014031248510/23/14Semiconductor module system, semiconductor module arrangement and method for mounting a semiconductor module on a heat sink
242014031249710/23/14Molding material and method for packaging semiconductor chips
252014031309210/23/14Antenna arrangement, communication appliance and antenna structure
262014031423510/23/14Apparatus for generating trusted image data, an apparatus for authentication of an image and a method for generating trusted image data
272014031536210/23/14Cmos transistor with dual high-k gate dielectric
282014030618410/16/14Two-dimensional material containing electronic components
292014030632710/16/14Semiconductor device and method of manufacturing thereof
302014030635610/16/14Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
312014030670110/16/14Vertical hall sensor circuit comprising stress compensation circuit
322014030739110/16/14Three dimensional packaging
332014029169510/02/14Silicon carbide device and a method for manufacturing a silicon carbide device
342014029169710/02/14Silicon carbide device and a method for forming a silicon carbide device
352014029178810/02/14Magnetoresistive devices and methods for manufacturing magnetoresistive devices
362014029182410/02/14Leadframe, semiconductor package including a leadframe and method for producing a leadframe
372014029183210/02/14Integrated cooling modules of power semiconductor device
382014028462409/25/14Semiconductor component, semiconductor module and methods for producing a semiconductor component and a semiconductor module
392014028466309/25/14Method of manufacturing an imager and imager device
402014028518709/25/14Angle measurement system including magnet with substantially square face for through-shaft applications
412014028527409/25/14Wien-bridge oscillator and circuit arrangement for regulating a detuning
422014028888309/25/14Method for determining an angle of a magnetic pole of a rotating object
432014026054509/18/14Sensor and sensing method
442014026366309/18/14Smart card module arrangement
452014026425509/18/14Method for making a sensor device using a graphene layer
462014026437409/18/14Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device
472014026465109/18/14Semiconductor devices and methods of forming thereof
482014026467709/18/14Chip package with isolated pin, isolated pad or isolated chip carrier and method of making the same
492014026476409/18/14Layer arrangement
502014026481409/18/14Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device
512014026486509/18/14Semiconductor device and manufacturing method thereof
522014026495009/18/14Chip arrangement and a method of manufacturing a chip arrangement
532014026509809/18/14Lift pin for substrate processing
542014026557009/18/14Multi-load drive circuit
552014026617809/18/14Current sensor
562014026617909/18/14Magnetic-field sensor
572014026618009/18/14Sensors, systems and methods for residual current detection
582014026626009/18/14Apparatus and a method for generating a sensor signal indicating information on a capacitance of a variable capacitor comprising a variable capacitance
592014026626309/18/14Apparatus and method for determining the sensitivity of a capacitive sensing device
602014026626909/18/14Multiple current sensor device, a multiple current shunt device and a method for providing a sensor signal
612014026682709/18/14Adc with noise-shaping sar
622014026684109/18/14Circuit arrangement and method for operating an analog-to-digital converter
632014026844209/18/14Circuit arrangement and method for evaluating a signal
642014026890309/18/14A switched-mode power converter
652014026912609/18/14Circuit arrangement and method for operating a circuit arrangement
662014027270509/18/14Photoresist application
672014027339409/18/14Capacitors in integrated circuits and methods of fabrication thereof
682014027382509/18/14Semiconductor chip configuration with a coupler
692014028109809/18/14Conditional links for direct memory access controllers
702014025140809/11/14Manufacturing a temperature difference sensor
712014025249809/11/14Method for fabricating a field effect transistor, and field effect transistor
722014025254009/11/14Semiconductor device and method of manufacturing thereof
732014025258309/11/14Power semiconductor assembly and module
742014025310609/11/14Off-center angle measurement system
752014025314209/11/14Method for testing components and measuring arrangement
762014025422409/11/14Rectifier circuit
772014025485009/11/14Acoustic sensor package
782014025868409/11/14System and method to increase lockstep core availability
792014025878409/11/14Machine and methods for reassign positions of a software program based on a fail/pass performance
802014024650309/04/14Booster antenna, contactless chip arrangement, antenna structure and chip arrangement
812014024717709/04/14Data conversion with redundant split-capacitor arrangement
822014025033609/04/14Machine and methods for evaluating failing software programs
832014025054009/04/14Dynamic resource sharing
842014023849408/28/14Current driving system for a solenoid
852014023941108/28/14Through vias and methods of formation thereof
862014023942808/28/14Chip arrangement and a method for manufacturing a chip arrangement
872014023943808/28/14Semiconductor device
882014023947408/28/14Chip arrangement and a method for manufacturing a chip arrangement
892014023998708/28/14Determining operational robustness of a system on a chip
902014023999808/28/14Turret handlers and methods of operations thereof
912014024105508/28/14Reducing the complexity of electronically programmable nonvolatile memory
922014024237408/28/14Porous metal coating
932014024420608/28/14Sensor systems and methods having emulated line adaptation
942014023189508/21/14One-time programming device and a semiconductor device
952014023197008/21/14Method for processing a carrier, a carrier, an electronic device and a lithographic mask
962014023197108/21/14Chip arrangement and a method of manufacturing a chip arrangement
972014023197408/21/14Module and method of manufacturing a module
982014023200108/21/14Device bond pads over process control monitor structures in a semiconductor die
992014023201508/21/14Semiconductor modules and methods of formation thereof
1002014023258608/21/14Method and device for radar applications
1012014023320008/21/14Method for manufacturing an integrated circuit and an integrated circuit
1022014023326208/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
1032014023326408/21/14Single stage pfc power supply
1042014023328908/21/14Pseudo zero vectors for space vector modulation and enhanced space vector modulation
1052014023503508/21/14Methods of forming semiconductor devices
1062014023503908/21/14Method for producing a protective structure
1072014022512508/14/14Composite wafer and a method for manufacturing same
1082014022523308/14/14Layer arrangement
1092014022565408/14/14Phase-lock loop
1102014022677008/14/14Transmitter, receiver, method for transmitting and method for receiving
1112014022714708/14/14Microfluidic device and method
1122014022781808/14/14Semiconductor structure with lamella defined by singulation trench
1132014021667708/07/14Method of processing a substrate
1142014021706208/07/14Porous metal etching
1152014021746308/07/14Bipolar semiconductor switch and a manufacturing method therefor
1162014021750008/07/14Semiconductor device with low on resistance and high breakdown voltage
1172014021757708/07/14Semiconductor device and method for manufacturing a semiconductor device
1182014021801908/07/14Sensor package and method for producing a sensor package
1192014021939408/07/14Receiver and transmitter receiver system
1202014022025708/07/14Method of processing a substrate
1212014022074208/07/14Method for forming a thin semiconductor device
1222014022077008/07/14Methods of fabricating semiconductor devices and structures thereof
1232014022304808/07/14Communication network and method for communicating in a communication network
1242014022305008/07/14Receiver architecture
1252014022340508/07/14Providing a layout defining a structure to be patterned onto a substrate
1262014022356908/07/14System on chip with embedded security module
1272014021152607/31/14Active power factor corrector circuit
1282014020985207/31/14Semiconductor device including a phase change material
1292014020990407/31/14Integrated test circuit and method for manufacturing an integrated test circuit
1302014020990507/31/14Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
1312014021002007/31/14Mems device and method of manufacturing a mems device
1322014021005407/31/14Semiconductor devices and methods of producing these
1332014021045807/31/14Offset reduction in sensor devices and systems
1342014021046107/31/14Vertical hall device with highly conductive opposite face node for electrically connecting first and second hall effect regions
1352014021064107/31/14Signal generator, decoder, method for generating a transmit signal and method for determining speed data
1362014021151007/31/14Voltage sensing in a voltage converter
1372014021512407/31/14Adaptive bit rate programming of a memory device
1382014021521907/31/14Method for verifying an electronic signature and data processing device
1392014020327807/24/14Chip package having terminal pads of different form factors
1402014020334907/24/14Method of producing a high-voltage-resistant semiconductor component having vertically conductive semiconductor body areas and a trench structure
1412014020336607/24/14Semiconductor devices and methods of manufacture thereof
1422014020338007/24/14Chip package comprising a microphone structure and a method of manufacturing the same
1432014020345507/24/14Feature patterning methods and structures thereof
1442014020384607/24/14Method for driving a load
1452014020435507/24/14Method for exposing an area on a substrate to a beam and photolithographic system
1462014020512807/24/14Chip arrangement and a method for manufacturing the same
1472014020523307/24/14Integrated circuit including non-planar structure and waveguide
1482014020610907/24/14Method of manufacturing and testing a chip package
1492014020616307/24/14Electronic component, a semiconductor wafer and a method for producing an electronic component
1502014019713007/17/14Method for manufacturing a plurality of nanowires
1512014019750107/17/14Mems device with polymer layer, system of a mems device with a polymer layer, method of making a mems device with a polymer layer
1522014019750207/17/14Comb mems device and method of making a comb mems device
1532014019750307/17/14Sensor package
1542014019752307/17/14Chip arrangement and a method for forming a chip arrangement
1552014019752707/17/14Chip arrangement and a method for manufacturing a chip arrangement
1562014019753907/17/14Bonded system with coated copper conductor
1572014019755107/17/14Method for fabricating a semiconductor chip panel
1582014019755207/17/14Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
1592014019782707/17/14Xmr-sensor and method for manufacturing the xmr-sensor
1602014019858307/17/14Reducing the size of nonvolatile memories
1612014019880407/17/14Variable load driver with power message transfer
1622014019883307/17/14Self synchronizing data communication method and device
1632014020078507/17/14Tire localization systems and methods in tire pressure monitoring systems
1642014019250007/10/14Method of electrophoretic depositing (epd) a film on an exposed conductive surface and an electric component thereof
1652014019510407/10/14Wheel speed sensor with support for indirect tire pressure monitoring
1662014019510707/10/14Wheel localizer, wheel localization device, system, method and computer program for locating a position of a wheel
1672014018371107/03/14Semiconductor device and method of making a semiconductor device
1682014018717007/03/14Testing a radio frequency integrated circuit
1692014018917607/03/14Processor arrangements and a method for transmitting a data bit sequence
1702014018943707/03/14Multi-tier trace
1712014017420106/26/14Torque sensor
1722014017465206/26/14Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up head
1732014017555806/26/14Transistor device and method of manufacture thereof
1742014017559306/26/14Super junction semiconductor device
1752014017562406/26/14Method for manufacturing a chip arrangement, and chip arrangement
1762014017562506/26/14Semiconductor device including at least one element
1772014016704306/19/14Semiconductor device and method for manufacturing a semiconductor device
1782014016704406/19/14Semiconductor device and method for manufacturing a semiconductor device
1792014016709006/19/14Optoelectronic transmission system and method
1802014016714306/19/14Semiconductor device with step-shaped edge termination, and method for manufacturing a semiconductor device
1812014016715406/19/14Transistor cell array including semiconductor diode
1822014016718406/19/14Dummy structures and methods
1832014016719206/19/14Semiconductor devices having insulating substrates and methods of formation thereof
1842014016721506/19/14Electronic circuit arrangement
1852014016722406/19/14Semiconductor device and method of producing the same
1862014016722506/19/14Crack stop barrier and method of manufacturing thereof
1872014016722606/19/14Wafer and a method of dicing a wafer
1882014016726606/19/14Semiconductor device having peripheral polymer structures
1892014016727006/19/14Method of fabricating a layer stack
1902014016727206/19/14Semiconductor device having an identification mark
1912014016765406/19/14Circuit arrangements and methods for operating an electrical machine
1922014016780006/19/14Method for testing semiconductor chips or semiconductor chip modules
1932014016799006/19/14Accurate and cost efficient linear hall sensor with digital output
1942014016942306/19/14Sensor that transmits signals responsive to a request signal and receives information
1952014017044606/19/14Sensor module and battery elements
1962014017083606/19/14Chip comprising a fill structure
1972014017234306/19/14Emulation system and method
1982014017338606/19/14Circuitry and method for correcting 3-bit errors containing adjacent 2-bit error
1992014015877506/12/14Booster antenna for a chip arrangement, contactless smart card module arrangement and chip arrangement
2002014015919606/12/14Through substrate features in semiconductor substrates
2012014015920706/12/14Esd protection structure, integrated circuit and semiconductor device
2022014015922006/12/14Semiconductor device and method of manufacture thereof
2032014015994306/12/14Compensating slowly varying if dc offsets in receivers
2042014016483206/12/14Test circuit and method for processing a test routine
2052014015169706/05/14Semiconductor packages, systems, and methods of formation thereof
2062014015170106/05/14Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
2072014015171706/05/14Packaged vertical power device comprising compressive stress and method of making a packaged vertical power device
2082014015175806/05/14Semiconductor device and method of manufacturing a semiconductor device
2092014015178906/05/14Semiconductor device including trenches and method of manufacturing a semiconductor device
2102014015179806/05/14Semiconductor device and method of manufacturing a semiconductor device
2112014015185406/05/14Method for separating a layer and a chip formed on a layer
2122014015185606/05/14Chip module, an insulation material and a method for fabricating a chip module
2132014015186206/05/14Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
2142014015186606/05/14Packaged semiconductor device with tensile stress and method of making a packaged semiconductor device with tensile stress
2152014015190506/05/14Devices and methods for providing an electrical connection
2162014015248506/05/14Symbol decoder, threshold estimation and correlation systems and methods
2172014015298906/05/14Selectivity by polarization
2182014015334806/05/14Operation scheme for non-volatile memory
2192014015613706/05/14Lightweight trace based measurement systems and methods
2202014015703506/05/14Bit-timing symmetrization
2212014014530505/29/14Capacitor and method of forming a capacitor
2222014014531805/29/14Semiconductor packages and methods of formation thereof
2232014014533305/29/14Device comprising a ductile layer and method of making the same
2242014014534505/29/14Method of forming a semiconductor structure, and a semiconductor structure
2252014014566405/29/14Power inverter including sic jfets
2262014014568605/29/14Charge conservation in pixels
2272014014577205/29/14Storage circuit
2282014014661805/29/14Circuit arrangement and method for operating a circuit arrangement
2292014014974805/29/14Securely transferring embedded code and/or data designed for a device to a customer
2302014013880305/22/14Chip arrangements and methods for manufacturing a chip arrangement
2312014013881305/22/14Method for manufacturing an electronic component
2322014013884105/22/14Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
2332014013884305/22/14Method for fabricating an electronic component
2342014013923005/22/14Determining a charge state
2352014013926805/22/14Driver circuit with tight control of gate voltage
2362014013928505/22/14Chopper amplifier
2372014013928905/22/14Sensor signal processing using translinear mesh
2382014013929605/22/14Pulse modulation control in a dc-dc converter circuit
2392014013963105/22/14Dynamic conservation of imaging power
2402014014053805/22/14High input capacitive signal amplifier
2412014014159205/22/14Method for stress reduced manufacturing semiconductor devices
2422014014160805/22/14Semiconductor component and methods for producing a semiconductor component
2432014014385805/22/14Processing arrangement and a method for processing information in a machine-to-human communications interface
2442014013122405/15/14Sensor device, a method and a sensor to determine a relative concentration of a first kind of ions with respect to a second kind of ions solute in a drop of liquid
2452014013176605/15/14Inhomogenous power semiconductor devices
2462014013181505/15/14Semiconductor device
2472014013184405/15/14An electronic package with a fail-open mechanism
2482014013234705/15/14Linearized high-ohmic resistor
2492014013236305/15/14Generating a pulse-width modulated signal

ARCHIVE: New 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Infineon Technologies Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by



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