new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)


Infineon Technologies Americas Corp patents

Recent patent applications related to Infineon Technologies Americas Corp. Infineon Technologies Americas Corp is listed as an Agent/Assignee. Note: Infineon Technologies Americas Corp may have other listings under different names/spellings. We're not affiliated with Infineon Technologies Americas Corp, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies Americas Corp-related inventors

Date Infineon Technologies Americas Corp patents (updated weekly) - BOOKMARK this page
05/25/17 new patent  Semiconductor package including a semiconductor die having redistributed pads
05/18/17Group iii-v device structure having a selectively reduced impurity concentration
05/11/17Methods and circuitry to trim common mode transient control circuitry
04/27/17Semiconductor package with integrated die paddles for power stage
03/30/17Porous metallic film as die attach and interconnect
03/16/17Method of fabricating iii-nitride semiconductor dies
03/09/17Ultra-thin semiconductor component fabrication using a dielectric skeleton structure
03/02/17Semiconductor package with integrated semiconductor devices and passive component
03/02/17Power supply circuitry and adaptive transient control
03/02/17Power converter package with integrated output inductor
02/16/17Method of fabricating an electrical contact for use on a semiconductor device
02/16/17Semiconductor material having a compositionally-graded transition layer
02/02/17Method for cleaning hermetic semiconductor packages
01/26/17Robust high performance semiconductor package
01/12/17Voltage converter with vcc-less rdson current sensing circuit
12/29/16Iii-nitride power semiconductor device
12/29/16Iii-nitride power semiconductor device
12/15/16Semiconductor package with embedded output inductor
12/01/16Connect/disconnect module for use with a battery pack
11/24/16Current balancing in a multi-phase power supply
10/20/16Electrical connectivity for circuit applications
10/13/16Semiconductor package with conductive clip
10/06/16Method of manufacturing a trench fet having a merged gate dielectric
09/29/16Semiconductor package with integrated output inductor on a printed circuit board
09/29/16Semiconductor package with integrated output inductor using conductive clips
09/22/16Forming highly conductive source/drain contacts in iii-nitride transistors
09/08/16Stacked half-bridge package
09/08/16Igbt having an inter-trench superjunction structure
09/08/16Bipolar semiconductor device having a deep charge-balanced structure
09/08/16Igbt having a deep superjunction structure
09/01/16Semiconductor package having a multi-layered base
08/18/16Semiconductor package with multi-section conductive carrier
08/11/16Power semiconductor device with a double metal contact and related method
08/11/16Group iii-v semiconductor device with strain-relieving layers
07/21/16Iii-nitride transistor with solderable front metal
07/21/16Integrated power device
07/14/16Igbt having deep gate trench
06/16/16Integrated power assembly with reduced form factor and enhanced thermal dissipation
06/16/16Power semiconductor package having reduced form factor and increased current carrying capability
06/16/16Integrated power assembly with stacked individually packaged power devices
06/16/16Power fet having reduced gate resistance
06/16/16Iii-nitride switching device with an emulated diode
06/16/16Reliable and robust electrical contact
06/16/16Vertical fet having reduced on-resistance
06/02/16Fabricating a semiconductor package with conductive carrier
06/02/16Igbt with buried emitter electrode
05/05/16Packaged assembly for high density power applications
05/05/16Iii-nitride semiconductor structure with intermediate and transition layers
03/17/16Preventing delamination and cracks in fabrication of group iii-v devices
03/10/16Method for preventing delamination and cracks in group iii-v wafers
02/11/16Dual power converter package
02/11/16Power converter package using driver ic
02/04/16Power semiconductor package having vertically stacked driver ic
01/28/16Fabrication of semiconductor device using alternating high and low temperature layers
01/28/16Method for fabricating a power semiconductor package including vertically stacked driver ic

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Infineon Technologies Americas Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies Americas Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by