new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)





Similar
Filing Names

Infineon Technologies North America Corp
Infineon Technologies North America Corporation
Infineon Technologies North America Corp_20100107
  

Infineon Technologies North America Corp patents

Recent patent applications related to Infineon Technologies North America Corp. Infineon Technologies North America Corp is listed as an Agent/Assignee. Note: Infineon Technologies North America Corp may have other listings under different names/spellings. We're not affiliated with Infineon Technologies North America Corp, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Infineon Technologies North America Corp-related inventors




Date Infineon Technologies North America Corp patents (updated weekly) - BOOKMARK this page
02/18/10Meef reduction by elongation of square shapes
07/30/09Contact level mask layouts by introducing anisotropic sub-resolution assist features
06/11/09Integrated circuit system employing diffused source/drain extensions
06/11/09Metal ion transistor and related methods
04/23/09Methods of forming field effect transistors having stress-inducing sidewall insulating spacers thereon and devices formed thereby
07/07/16System and llc converter design
04/21/16System and vehicle messaging using a public key infrastructure
11/19/15Standby power for led drivers
11/05/15Device and accessory pairing
10/01/15Circuit for common mode removal for dc-coupled front-end circuits
05/07/15Transformer input matched transistor
07/10/14Active transient response for dc-dc converters
06/19/14Method and circuit for led driver dimming
06/05/14Buck-flyback converter
05/08/14Switching regulator control with nonlinear feed-forward correction
05/01/14Doherty amplifier circuit with phase-controlled load modulation
01/02/14Switching regulator cycle-by-cycle current estimation
10/03/13Pcb based rf-power package window frame
09/19/13Impedance spreading wideband doherty amplifier circuit with peaking impedance absorption
08/01/13Half bridge flyback and forward
08/01/13Cascode switch with robust turn on and turn off
12/20/12Wideband doherty amplifier circuit having a constant impedance combiner
07/12/12System and semiconductor device fabrication using modeling
06/21/12Method for defining a separating structure within a semiconductor device
03/22/12Integrated circuit package with reduced parasitic loop inductance
03/22/12Di/dt current sensing
12/08/11Through bias pole for igmr speed sensing
12/01/11Audio communication device and method using fixed echo cancellation filter coefficients
06/23/11Flange for semiconductor die
05/26/11Angle measurement system
04/21/11Open cavity leadless surface mountable package for high power rf applications
03/24/11Multi-level cell programming of pcm by varying the reset amplitude
02/10/11Method for manufacturing a semiconductor device having doped and undoped polysilicon layers
01/20/11Air cavity package with copper heat sink and ceramic window frame
12/23/10Transmission mask with differential attenuation to improve iso-dense proximity
11/18/10Threshold voltage improvement employing fluorine implantation and adjustment oxide layer
11/11/10High power ceramic on copper package
10/28/10Method of forming a pattern of an array of shapes including a blocked region
09/30/10Network retransmission protocols using a proxy node
08/19/10Voltage level converter with mixed signal controller
08/12/10Power transistor package with integrated bus bar
07/08/10Methodology of placing printing assist feature for random mask layout
07/08/10Adjustment of mask shapes for improving printability of dense integrated circuit layout
06/17/10Thermally enhanced electronic package
04/22/10Stripline balun
04/22/10Methods of forming integrated circuit contact pads using electroless plating of diffusion barrier layers
04/08/10Methods of fabricating three-dimensional capacitor structures having planar metal-insulator-metal and vertical capacitors therein
04/01/10Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation
04/01/10Secure manufacturing of programmable devices
04/01/10Secure partitioning of programmable devices
04/01/10Secure operation of programmable devices
02/04/10Method and system for transferring information to a device
01/07/10Calibration and verificataion structures for use in optical proximity correction
12/03/09Methods and systems for magnetic sensing
12/03/09Methods and systems for magnetic field sensing
12/03/09Key management for communication networks
10/22/09Wafer for electrically characterizing tunnel junction film stacks with little or no processing
09/24/09Methods of forming field effect transistors having silicided source/drain contacts with low contact resistance
09/10/09Networks having plurality of nodes
07/23/09Semiconductor power device with bias circuit
07/02/09Method and system for transferring information to a device
07/02/09Method and system for controlling a device
06/18/09Multi-carrier communication via sub-carrier groups
05/07/09Method and system for transferring information to a device
01/07/10Calibration and verificataion structures for use in optical proximity correction
Patent Packs







ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Infineon Technologies North America Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Infineon Technologies North America Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###




';