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Innovative Micro Technology patents


Recent patent applications related to Innovative Micro Technology. Innovative Micro Technology is listed as an Agent/Assignee. Note: Innovative Micro Technology may have other listings under different names/spellings. We're not affiliated with Innovative Micro Technology, we're just tracking patents.

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Rf interconnect

We describe below a structure and process that uses through-silicon-vias and wafer-to-wafer bonding to create transmission lines. The method may require one electroplating step, 3 etch steps, 4 lithography steps, one grind and polish step, and one wafer bonding step, totaling ten process steps per transmission line layer.. ... Innovative Micro Technology

Mems device with offset electrode

Systems and methods for forming an electrostatic mems switch that is used to switch a source of current or voltage. At least one surface of the mems switch may be rotated on approach to another substrate, such that when the surfaces are separated, the forces are shearing forces rather than static frictional forces.. ... Innovative Micro Technology

Contact surface for mems device

Systems and methods for forming an electrostatic mems switch that is used to hot switch a source of current or voltage. At least one surface of the mems switch is treated with an ion milling machine to reduce surface roughness to less than about 10 nm rms.. ... Innovative Micro Technology

Microfabricated fluid pump

A microfabricated fluid pump is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied. ... Innovative Micro Technology

Thermocompression bonding with raised feature

A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. ... Innovative Micro Technology

Microfabricated pressure transducer

A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.. ... Innovative Micro Technology

Microfabricated optical apparatus

A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. ... Innovative Micro Technology

Through substrate vias using solder bumps

A through substrate via is formed by disposing a quantity of solder material at the top of a through hole formed in a substrate, coating the hole with a wetting layer, and melting the solder material such that it flows into the hole. The solder material may alloy with the wetting layer, freezing upon formation of the alloy. ... Innovative Micro Technology

Microfabricated optical apparatus

A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.. . ... Innovative Micro Technology

Device with separation limiting standoff

An mems device, having two substantially parallel surfaces are separated by an initial distance. At least one of the surfaces includes a raised feature that limits the gap between the surfaces to less than the initial distance when an actuating voltage is applied. ... Innovative Micro Technology

Mems reed switch device

A mems device, having two flexible, permeable members which are manufactured to have sub-millimeter dimensions using mems fabrication procedures. The flexible, permeable members may form a reed switch, which closes an electrical connection in the presence of a magnetic field, and opens the connection otherwise. ... Innovative Micro Technology








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