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Inpaq Technology Co Ltd patents


Recent patent applications related to Inpaq Technology Co Ltd. Inpaq Technology Co Ltd is listed as an Agent/Assignee. Note: Inpaq Technology Co Ltd may have other listings under different names/spellings. We're not affiliated with Inpaq Technology Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Inpaq Technology Co Ltd-related inventors


Multi-layer electric shock protection emi filter device and manufacturing method thereof

Disclosed is a multi-layer electric shock protection EMI filter device and a manufacturing method thereof. The multi-layer electric shock protection EMI filter device is formed by cofiring a laminated ceramic dielectric material layer, and includes: a lower capacitor, an electric shock protection device, and a upper capacitor; wherein the electric... Inpaq Technology Co Ltd

Mobile charging module of wearable electronic device

A mobile charging module of a wearable electronic device is disclosed. The wearable electronic device includes a main body portion and a lacing portion that can be assembled to or disassembled from the main body portion, wherein the main body portion includes a host, a host battery and a Rx... Inpaq Technology Co Ltd

Customized smd power inductor and manufacturing the same

A customized SMD power inductor includes a magnetic substrate, a coil structure, a magnetic coating structure, and a terminal electrode structure. The coil structure is disposed on the magnetic substrate. The magnetic coating structure is disposed on the magnetic substrate to cover the coil structure. The magnetic coating structure includes... Inpaq Technology Co Ltd

Metal base high efficiency antenna

A metal base high efficiency antenna, it is preferably formed as a ceramic fine peace, and suitable for installed to the connector inside an electronic appliance, such that the connector has functions of antenna, in addition, since the connector is mostly arranged at a space near the surface of electronic... Inpaq Technology Co Ltd

Semiconductor package structure and the same

The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second... Inpaq Technology Co Ltd

Semiconductor package structure and the same

The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second... Inpaq Technology Co Ltd

Semiconductor package structure and the same

The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second... Inpaq Technology Co Ltd








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Inpaq Technology Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Inpaq Technology Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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