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Intermolecular Inc patents

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Recent patent applications related to Intermolecular Inc. Intermolecular Inc is listed as an Agent/Assignee. Note: Intermolecular Inc may have other listings under different names/spellings. We're not affiliated with Intermolecular Inc, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Intermolecular Inc-related inventors




Date Intermolecular Inc patents (updated weekly) - BOOKMARK this page
10/20/16Methods and chemical solutions for cleaning photomasks using quaternary ammonium hydroxides
08/11/16Solid-state batteries utilizing template layers for electrode formation and methods for forming the same
06/23/16Particle removal with minimal etching of silicon-germanium
06/23/16Semiconductor device metal-insulator-semiconductor contacts with interface layers and methods for forming the same
06/23/16Igzo devices with metallic contacts and methods for forming the same
06/23/16Methods for forming ferroelectric phases in materials and devices utilizing the same
06/23/16Variable composition transparent conductive oxide layer and methods of forming thereof
06/23/16Solid-state batteries with improved performance and reduced manufacturing costs and methods for forming the same
06/09/16Doped ternary nitride embedded resistors for resistive random access memory cells
06/02/16Solid-state batteries with electrodes infused with ionically conductive material and methods for forming the same
05/26/16Two stage forming of resistive random access memory cells
05/26/16Simultaneous carbon and nitrogen doping of si in msm stack as a selector device for non-volatile memory application
05/26/16Diamond like carbon (dlc) as a thermal sink in a selector stack for non-volatile memory application
05/26/16Using metal silicides as electrodes for msm stack in selector for non-volatile memory application
05/19/16Diamond like carbon (dlc) in a semiconductor stack as a selector for non-volatile memory application
05/12/16Low-temperature deposition of metal silicon nitrides from silicon halide precursors
05/12/16Dram mimcap stack with moo2 electrode
05/12/16Fluorine containing low loss dielectric layers for superconducting circuits
05/05/16Low-e panels and methods of forming the same
04/28/16Minimal contact wet processing systems and methods
04/28/16Photo-induced msm stack
04/21/16Systems and methods for wet processing substrates with rotating splash shield
04/21/16Sic-si3n4 nanolaminates as a semiconductor for msm snapback selector devices
04/21/16Indium zinc oxide for transparent conductive oxide layer and methods of forming thereof
04/14/16Low-e panels and methods for forming the same
04/07/16Transparent resistive random access memory cells
04/07/16Doped electrode for dram capacitor stack
04/07/16Monx as a top electrode for tiox based dram applications
04/07/16Solid-state batteries and methods for forming the same
04/07/16Solid-state batteries with improved electrode conductivity and methods for forming the same
03/31/16Tantalum carbide metal gate stack for mid-gap work function applications
03/31/16Method to improve dram performance
03/31/16Methods for reducing interface contact resistivity
02/11/16Molecular self-assembly in substrate processing
02/04/16Atomic layer deposition of hfalc as a metal gate workfunction material in mos devices
01/28/16Shaping reram conductive filaments by controlling grain-boundary density
01/28/16Reram cells with diffusion-resistant metal silicon oxide layers
01/21/16Resistive switching by breaking and re-forming covalent bonds
01/21/16Current-limiting electrodes
01/14/16Oxides with thin metallic layers as transparent ohmic contacts for p-type and n-type gallium nitride
12/31/15Metal-insulator-semiconductor (mis) contact with controlled defect density
12/24/15Low-e panels and methods for forming the same
12/24/15Solution based etching of titanium carbide and titanium nitride structures
12/17/15Low-e panels utilizing high-entropy alloys and combinatorial methods and systems for developing the same
12/03/15Seed layer for low-e applications
12/03/15Method to etch cu/ta/tan selectively using dilute aqueous hf/hcl solution
11/26/15Barrier layers for silver reflective coatings and hpc workflows for rapid screening of materials for such barrier layers
11/26/15Combinatorial screening of metallic diffusion barriers
11/12/15Embedded nonvolatile memory elements having resistive switching characteristics
11/12/15Silver based conductive layer for flexible electronics
11/05/15Low-temperature fabrication of transparent conductive contacts for p-gan and n-gan
10/29/15Multi-level memory array having resistive elements for multi-bit data storage
10/29/15Resistive random access memory cells having shared electrodes with transistor devices
10/29/15Zinc stannate ohmic contacts for p-type gallium nitride
10/29/15Superconducting circuits with reduced microwave absorption
10/22/15Methods for fabricating integrated circuits including fluorine incorporation
10/15/15Low emissivity glass incorporating phosphorescent rare earth compounds
10/15/15Low emissivity glass incorporating phosphorescent rare earth compounds
10/08/15Methods for discretized processing and process sequence integration of regions of a substrate
10/01/15Novel method to grow in-situ crystalline igzo
10/01/15Caac igzo deposited at room temperature
09/17/15Methods of manufacturing embedded bipolar switching resistive memory
09/10/15Method to etch cu/ta/tan selectively using dilute aqueous hf/hcl solution
09/10/15Non-volatile resistive-switching memories
09/10/15Ultra-low resistivity contacts
Patent Packs
08/20/15Low-e glazing performance by seed structure optimization
08/20/15Low-e panels with ternary metal oxide dielectric layer and forming the same
08/20/15Creating an embedded reram memory from a high-k metal gate transistor structure
08/20/15Modular flow cell and adjustment system
08/13/15Methods for etching copper during the fabrication of integrated circuits
08/13/15Methods to improve electrical performance of zro2 based high-k dielectric materials for dram applications
07/16/15Transition metal oxide bilayers
07/09/15Titanium nickel niobium alloy barrier for low-emissivity coatings
07/09/15Low-e panels and methods for forming the same
07/02/15Ternary metal nitride formation by annealing constituent layers
07/02/15X-ray fluorescence analysis of thin-film coverage defects
07/02/15Igzo with intra-layer variations and methods for forming the same
07/02/15Wet etching of silicon containing antireflective coatings
07/02/15High productivity combinatorial testing of multiple work function materials on the same semiconductor substrate
07/02/15Method of forming current-programmable inline resistor
Patent Packs
07/02/15Igzo devices with increased drive current and methods for forming the same
07/02/15Igzo devices with reduced electrode contact resistivity and methods for forming the same
07/02/15Embedded resistors with oxygen gettering layers
07/02/15Embedded resistors for resistive random access memory cells
07/02/15Embedded resistors for resistive random access memory cells
07/02/15Stacked bi-layer as the low power switchable rram
07/02/15Methods, systems, and improving thin film resistor reliability
07/02/15Diffusion barrier layer for resistive random access memory cells
07/02/15Voltage controlling assemblies including variable resistance devices
07/02/15Hydrogenated amorphous silicon dielectric for superconducting devices
07/02/15Systems and methods for parallel combinatorial vapor deposition processing
07/02/15Methods and combinatorial pecvd or peald
07/02/15Capacitors including inner and outer electrodes
07/02/15Zinc blende cadmium-manganese-telluride with reduced hole compensation effects and methods for forming the same
06/25/15Low-temperature growth of complex compound films
06/25/15Systems, methods, and integrated glass units having adjustable solar heat gains
06/25/15Methods of forming nitrides at low substrate temperatures
06/25/15Plasma densification of dielectrics for improved dielectric loss tangent
06/25/15Methods for forming crystalline igzo with a seed layer
06/25/15Tantalum-based copper barriers and methods for forming the same
06/25/15Contact layers for photovoltaic devices
06/25/15Annealed dielectrics and heat-tolerant conductors for superconducting electronics
06/25/15Atomic layer deposition of metal-oxide tunnel barriers using optimized oxidants
06/25/15Plasma cleaning of superconducting layers
06/25/15Schottky barriers for resistive random access memory cells
06/25/15Atomic layer deposition of metal oxides for memory applications
06/25/15Metal organic chemical vapor deposition of embedded resistors for reram cells
06/25/15Interchangeable sputter gun head
06/25/15Methods for rapid generation of ald saturation curves using segmented spatial ald
06/25/15Methods and systems for evaluating igzo with respect to nbis
Social Network Patent Pack
06/25/15Systems, methods, and integrated glass units having adjustable transmissivities
06/25/15Gate stacks and ohmic contacts for sic devices
06/25/15Methods for forming crystalline igzo through power supply mode optimization
06/25/15Methods for forming crystalline igzo through processing condition optimization
06/25/15Methods for forming crystalline igzo through annealing
06/25/15Multipurpose combinatorial vapor phase deposition chamber
06/25/15Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region
06/25/15Plasma treatment of low-k surface to improve barrier deposition
06/25/15High productivity combinatorial material screening for metal oxide films
06/25/15High productivity combinatorial material screening for stable, high-mobility non-silicon thin film transistors
Patent Packs
06/25/15Zro-based high k dielectric stack for logic decoupling capacitor or embedded dram
06/25/15Graphene as a ge surface passivation layer to control metal-semiconductor junction resistivity
06/25/15Igzo devices with reduced threshhold voltage shift and methods for forming the same
06/25/15Quantum well igzo devices and methods for forming the same
06/25/15Fluorine passivation of dielectric for superconducting electronics
06/25/15Fluorine passivation during deposition of dielectrics for superconducting electronics
06/25/15Catalytic growth of josephson junction tunnel barrier
06/25/15Tiox based selector element
06/25/15Zrox/sto/zrox based selector element
06/18/15Anti-glare coatings with ultraviolet-absorbing particles and methods for forming the same
06/18/15Resistive switching sample and hold
06/18/15One-way valves for controlling flow into deposition chamber
06/18/15Low resistivity nitrogen-doped zinc telluride and methods for forming the same
06/18/15Resistive random access memory cell having three or more resistive states
06/18/15Dielectric k value tuning of hah stack for improved tddb performance of logic decoupling capacitor or embedded dram
06/18/15Systems and methods for forming semiconductor devices
06/18/15Feature size reduction in semiconductor devices by selective wet etching
06/18/15Memory arrays for both good data retention and low power operation
06/18/15Igzo devices with composite channel layers and methods for forming the same
06/11/15Simplified protection layer for abrasion resistant glass coatings and methods for forming the same
06/11/15Morphology control of ultra-thin meox layer
06/11/15Nonvolatile memory device having a current limiting element
06/11/15Transparent conductive films and methods for forming the same
06/04/15Nonvolatile resistive memory element with an oxygen-gettering layer
06/04/15Amorphous silicon thin-film transistors with reduced electrode contact resistivity and methods for forming the same
06/04/15Resistive-switching memory elements having improved switching characteristics
05/28/15Ald dielectric films with leakage-reducing impurity layers
05/28/15Combinatorial plasma enhanced deposition techniques
05/28/15Resistive-switching memory elements having improved switching characteristics
05/28/15Resistive-switching memory element
Patent Packs
05/21/15Mimcaps with quantum wells as selector elements for crossbar memory arrays
05/21/15Reduction of forming voltage in semiconductor devices
05/21/15Method for fabricating a bipolar transistor having self-aligned emitter contact
05/21/15Al2o3 surface nucleation preparation with remote oxygen plasma
05/21/15Two step deposition of high-k gate dielectric materials
05/21/15Dram mim capacitor using non-noble electrodes
05/21/15Combinatorial solid source doping process development
05/21/15Selector device using low leakage dielectric mimcap diode
05/21/15Methods to control sio2 etching during fluorine doping of si/sio2 interface
05/14/15Flexible non-volatile memory
05/14/15Method to etch cu/ta/tan selectively using dilute aqueous hf/h2so4 solution
05/14/15Etching of semiconductor structures that include titanium-based layers
05/14/15Methods and systems for forming reliable gate stack on semiconductors
05/07/15Method for forming metal oxides and silicides in a memory device
04/30/15Reduction of native oxides by annealing in reducing gas or plasma
04/16/15Barrier layers for silver reflective coatings and hpc workflows for rapid screening of materials for such barrier layers
04/16/15Aqua regia and hydrogen peroxide hcl combination to remove ni and nipt residues
04/16/15Touchless site isolation using gas bearing
04/16/15Combinatorial flow system and method
04/09/15Non-volatile resistive-switching memories
Social Network Patent Pack
04/02/15Continuous tuning of erbium silicide metal gate effective work function via a pvd nanolaminate approach for mosfet applications
04/02/15Doped oxide dielectrics for resistive random access memory cells
04/02/15Nickel-titanium and related alloys as silver diffusion barriers
04/02/15Corrosion-resistant silver coatings with improved adhesion to iii-v materials
04/02/15Combinatorial process system
03/26/15Dram mim capacitor using non-noble electrodes
03/19/15Amorphous igzo devices and methods for forming the same
03/12/15Method of forming anneal-resistant embedded resistor for non-volatile memory application
03/05/15Controlling composition of multiple oxides in resistive switching layers using atomic layer deposition
03/05/15Conductive transparent reflector
03/05/15Uv treatment for ald film densification
03/05/15Controlling reram forming voltage with doping
02/26/15Multistate nonvolatile memory elements
02/26/15Methods for forming resistive switching memory elements by heating deposited layers
02/26/15Atomic layer deposition of metal oxide materials for memory applications
02/26/15Processing substrates using site-isolated processing
02/26/15Full wafer processing by multiple passes through a combinatorial reactor
02/12/15Gate stacks including taxsiyo for mosfets
02/05/15Resistive-switching nonvolatile memory elements
02/05/15Confined defect profiling within resistive random memory access cells
Social Network Patent Pack
02/05/15Doped high-k dielectrics and methods for forming the same
02/05/15Bipolar multistate nonvolatile memory
01/29/15Shadow mask for patterned deposition on substrates
01/22/15Mixed-metal barrier films optimized by high-productivity combinatorial pvd
01/22/15Antireflective coatings with self-cleaning, moisture resistance and antimicrobial properties
01/22/15Molecular self-assembly in substrate processing
01/22/15Substrate processing including correction for deposition location
01/15/15All around electrode for novel 3d rram applications
01/15/15Reducing voids caused by trapped acid on a dielectric surface
01/15/15Nonvolatile resistive memory element with an integrated oxygen isolation structure
01/15/15Combinatorial non-contact wet processing
01/08/15Morphology control of ultra-thin meox layer
01/08/15Methods for forming templated materials
01/01/15Methods for coating a substrate with an amphiphilic compound
01/01/15Method of forming an asymmetric mimcap or a schottky device as a selector element for a cross-bar memory array
12/25/14Multifunctional electrode
12/25/14Metal aluminum nitride embedded resistors for resistive random memory access cells
12/18/14Absorber layer for a thin film photovoltaic device with a double-graded band gap
10/30/14Systems, methods, and production coatings of low-emissivity glass
10/30/14Nonvolatile resistive memory element with a silicon-based switching layer
10/23/14Screening of surface passivation processes for germanium channels
10/16/14Systems, methods, and production coatings of low-emissivity glass
10/09/14Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition
09/18/14Tcos for heterojunction solar cells
09/18/14High-selectivity wet patterning of source-drain electrodes over taos for a bce device structure
09/18/14Using multi-layer mimcaps in the tunneling regime as selector element for a cross-bar memory array
09/18/14Low-emissivity panels including magnetic layers
09/18/14Systems, methods, and production coatings of low-emissivity glass including a ternary alloy
09/18/14High solar gain low-e panel and forming the same
09/18/14Anti-reflective coatings with porosity gradient and methods for forming the same
Social Network Patent Pack
09/18/14Optical coatings with plate-shaped particles and methods for forming the same
09/18/14Nonvolatile resistive memory element with an oxygen-gettering layer
09/18/14Anti-glare coatings with sacrificial surface roughening agents and methods for forming the same
09/18/14Polymer anti-glare coatings and methods for forming the same
09/18/14Low-e glazing performance by seed structure optimization
09/18/14Color shift of high lsg low emissivity coating after heat treatment
09/18/14Method to generate high lsg low-emissivity coating with same color after heat treatment
09/18/14Anti-reflection coatings with aqueous particle dispersions and methods for forming the same
09/18/14Anti-glare coatings with aqueous particle dispersions and methods for forming the same
09/18/14Low-e panel with improved barrier layer process window and forming the same
09/18/14Low-emissivity glass including spacer layers compatible with heat treatment
09/18/14Barrier layers for silver reflective coatings and hpc workflows for rapid screening of materials for such barrier layers
09/18/14Titanium nickel niobium alloy barrier for low-emissivity coatings
09/18/14Methods for fabricating znose alloys
09/18/14Polycrystalline-silicon etch with low-peroxide apm
09/18/14Wet processing systems and methods with replenishment
09/18/14Non-contact wet-process cell confining liquid to a region of a solid surface by differential pressure
09/18/14Methods of plasma surface treatment in a pvd chamber
09/18/14Performance enhancement of forming-free reram devices using 3d nanoparticles
09/18/14Znte on tin or pt electrodes as a resistive switching element for reram applications
09/18/14Current selector for non-volatile memory in a cross bar array based on defect and band engineering metal-dielectric-metal stacks
09/18/14Channel-last methods for making fets
09/18/14Compositional graded igzo thin film transistor
09/18/14Method of fabricating igzo by sputtering in oxidizing gas
09/18/14Counter-doped low-power finfet
09/18/14Fluorine passivation in cmos image sensors
09/18/14Finfet for rf and analog integrated circuits
09/18/14Optical absorbers
09/18/14Deposition of anisotropic dielectric layers orientationally matched to the physically separated substrate







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