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Invensense Inc
Invensense Incorporated

Invensense Inc patents


Recent patent applications related to Invensense Inc. Invensense Inc is listed as an Agent/Assignee. Note: Invensense Inc may have other listings under different names/spellings. We're not affiliated with Invensense Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "I" | Invensense Inc-related inventors


Method and system for path-based point of sale ordering

Anchor points associated with point of sale information may be ordered by segmenting a trajectory derived from sensor data defined by adjacent turns to generate candidate links for each segment from which possible paths for the trajectory are derived. Each derived possible path may be scored with a multi-objective function... Invensense Inc

Systems and methods for synthetic sensor signal generation

Systems and devices are disclosed for providing sensor data First and second sensors integrated with a portable device may have multiple axes of measurement By combining data from the first sensor and the second sensor, a synthetic signal may be generated for a first axis of the first sensor.... Invensense Inc

Method and system for using offline map information aided enhanced portable navigation

The navigation solution of a portable device may be enhanced using map information. Sensor data for the portable device may be used to derive navigation solutions at a plurality of epochs over a first period of time. Position information for the device may be estimated at a time subsequent to... Invensense Inc

Systems and methods for storing images and sensor data

Systems and methods are disclosed for storing a plurality of images with a portable device. Inertial sensor data from a sensor assembly associated with the portable device may be obtained as each image is captured, allowing determination of a motion of the portable device for each image. Each captured image... Invensense Inc

Systems and methods for determining engagement of a portable device

A portable device is provided having a motion sensor and an engagement sensor. A determination may be made whether the portable device is engaged with the platform. The data being output by the sensor may be used accordingly.... Invensense Inc

Multi-path signal processing for microelectromechanical systems (mems) sensors

Multi-path signal processing for microelectromechanical systems (MEMS) sensors is described. An exemplary MEMS sensor apparatus can comprise a single MEMS sensor element and an associated integrated circuit (IC) that facilitates generating multiple output signals having different output signal electrical characteristics required by a host system. Provided implementations can minimize cost... Invensense Inc

Two different conductive bump stops on cmos-mems bonded structure

Provided herein is a method including forming a micro-electro-mechanical system (“MEMS”) wafer including a first MEMS device and a second MEMS device. A complementary metal-oxide semiconductor (“CMOS”) wafer is formed including a first electrically conductive via and a second electrically conductive via. A layer stack including a first conductive layer,... Invensense Inc

Sensor with low power with closed-loop-force-feedback loop

A device includes a proof mass of a sensor, capacitive elements, an electrode circuitry, a time multiplexing circuitry, a sense circuitry, and a force feedback circuitry. The proof mass moves from a first position to a second position responsive to an external actuation. The capacitive elements change capacitive charge in... Invensense Inc

Cmos-mems-cmos platform

A sensor chip includes a first substrate with a first surface and a second surface including at least one CMOS circuit, a first MEMS substrate with a first surface and a second surface on opposing sides of the first MEMS substrate, a second substrate, a second MEMS substrate, and a... Invensense Inc

Mems sensor with high voltage switch

A system and/or method for utilizing MEMS switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to... Invensense Inc

Method and system for mems devices with dual damascene formed electrodes

Methods and systems for MEMS devices with dual damascene formed electrodes is disclosed and may include forming first and second dielectric layers on a semiconductor substrate that includes a conductive layer at least partially covered by the first dielectric layer; removing a portion of the second dielectric layer; forming vias... Invensense Inc

Method of fabrication of al/ge bonding in a wafer packaging environment and a product produced therefrom

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between... Invensense Inc

Demodulation phase calibration

A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature... Invensense Inc

Cmos-mems structures with out-of-plane mems sensing gap

A micro-electro-mechanical system sensor device is disclosed. The sensor device comprises a micro-electro-mechanical system (MEMS) layer, comprising: an actuator layer and a cover layer, wherein a portion of the actuator layer is coupled to the cover layer via a dielectric; and an out-of-plane sense element interposed between the actuator layer... Invensense Inc

Integrated package containing mems acoustic sensor and pressure sensor

Integrated microelectromechanical systems (MEMS) acoustic sensor devices are disclosed. Integrated MEMS acoustic sensor devices can comprise a MEMS acoustic sensor element and a pressure sensor within the back cavity associated with the MEMS acoustic sensor element. Integrated MEMS acoustic sensor devices can comprise a port adapted to receive acoustic waves... Invensense Inc

Transducer with enlarged back volume

A packaged integrated device includes a package substrate having a first surface and a second surface opposite the first surface, and the package substrate has a hole therethrough. The integrated device package also includes a first lid mounted on the first surface of the package substrate to define a first... Invensense Inc

Mems circuit for capacitive non-linear correction

A micro-electro-mechanical system includes a proof mass, an anchor, an amplifier, a sense element, a reference element, and a feedback element. The proof mass is configured to move in response to a stimulus. The anchor is coupled to the proof mass via a spring. The amplifier is configured to receive... Invensense Inc

Ultrasonic transducer operable in a surface acoustic wave (saw) mode

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to... Invensense Inc

Supplemental sensor modes and systems for ultrasonic transducers

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow... Invensense Inc

Receive operation of an ultrasonic sensor

An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers including a plurality of sub-arrays of ultrasonic transducers, wherein a sub-array of ultrasonic transducers of the plurality of sub-arrays of ultrasonic transducers is independently controllable, and wherein a sub-array of ultrasonic transducers has an associated receive channel. A plurality of... Invensense Inc

Ultrasonic transducer with a non-uniform membrane

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device includes a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies, the membrane... Invensense Inc

Aluminum nitride (aln) devices with infrared absorption structural layer

A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a... Invensense Inc

Sensing device with a temperature sensor

An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation... Invensense Inc

Operation of an ultrasonic sensor

In a method of using an ultrasonic sensor comprising a two-dimensional array of ultrasonic transducers, a plurality of ultrasonic signals are transmitted according to a beamforming pattern at a position of the two-dimensional array. The beamforming pattern focuses the plurality of ultrasonic signals to location above the two-dimensional array, wherein... Invensense Inc

Operating a fingerprint sensor comprised of ultrasonic transducers

In a method for operating a fingerprint sensor comprising a plurality of ultrasonic transducers, a first subset of ultrasonic transducers of the fingerprint sensor are activated, the first subset of ultrasonic transducers for detecting interaction between an object and the fingerprint sensor. Subsequent to detecting interaction between an object and... Invensense Inc

Transmit operation of an ultrasonic sensor

An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers. A signal generator is configured to generate a plurality of transmit signals, wherein each transmit signal of the plurality of transmit signals has a different phase delay relative to other transmit signals of the plurality of transmit signals. A plurality... Invensense Inc

Transmit beamforming of a two-dimensional array of ultrasonic transducers

In a method for transmit beamforming of a two-dimensional array of ultrasonic transducers, a beamforming pattern to apply to a beamforming space of the two-dimensional array of ultrasonic transducers is defined. The beamforming space includes a plurality of elements, where each element of the beamforming space corresponds to an ultrasonic... Invensense Inc

3d integration using al-ge eutectic bond interconnect

A method includes aligning a germanium feature on a first CMOS wafer with an aluminum feature on a second CMOS wafer. The aluminum feature and the germanium feature are pressed together. A eutectic bond is formed connecting the aluminum feature to the germanium feature. The eutectic bond has a melting... Invensense Inc

Piezoelectric micromachined ultrasonic transducer (pmut)

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to... Invensense Inc

Two-dimensional array of cmos control elements

An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes two semiconductor devices. The plurality of CMOS control elements include a first subset of CMOS control elements, each CMOS control element of... Invensense Inc

Two-dimensional array of cmos control elements

An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes semiconductor devices. The plurality of CMOS control elements each including a PMOS semiconductor device portion comprising a high voltage PMOS device and... Invensense Inc

Operating a two-dimensional array of ultrasonic transducers

In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers.... Invensense Inc

Device mountable packaging of ultrasonic transducers

An electronic device including an array of ultrasonic transducers for generating and receiving ultrasonic signals, and an acoustic coupling layer overlying the array of ultrasonic transducers, where the ultrasonic signals are propagated through the acoustic coupling layer.... Invensense Inc

Gyroscope self test by applying rotation on coriolis sense mass

A self-test method by rotating the proof mass at a high frequency enables testing the functionality of both the drive and sense systems at the same time. In this method, the proof mass is rotated at a drive frequency. An input force which is substantially two times the drive frequency... Invensense Inc

11/02/17 / #20170318385

Microelectromechanical systems (mems) microphone bias voltage

Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available... Invensense Inc

11/02/17 / #20170318395

Micro-electro-mechanical system microphone with dual backplates

Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first... Invensense Inc

10/26/17 / #20170307374

Compensating circuit for a microelectromechanical (mems) resonator

A circuit comprising a microelectromechanical (MEMS) gyroscope and a gain circuit coupled with the MEMS gyroscope. The gain circuit is configured to receive a digitized drive signal based at least in part on a digitized drive voltage amplitude of the MEMS gyroscope. The gain circuit is also configured to determine... Invensense Inc

10/19/17 / #20170297900

Mems device and process for rf and low resistance applications

MEMS device for low resistance applications are disclosed. In a first aspect, the MEMS device comprises a MEMS wafer including a handle wafer with one or more cavities containing a first surface and a second surface and an insulating layer deposited on the second surface of the handle wafer. The... Invensense Inc

10/19/17 / #20170297907

Methods for cmos-mems integrated devices with multiple sealed cavities maintained at various pressures

A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity... Invensense Inc

10/19/17 / #20170297909

Dual cavity pressure structures

An apparatus includes a cavity within a substrate. A MEMS structure is within the cavity, wherein the cavity includes the MEMS structure. A trench is connected to the cavity, wherein the trench is not directly opposite the MEMS structure. An oxide layer lines the trench and the cavity. A seal... Invensense Inc

10/19/17 / #20170297911

Mems gap control structures

Provided herein is a method including forming a cavity in a first side of a first silicon wafer. An oxide layer is formed on the first side and in the cavity. The first side of the first silicon wafer is bonded to a first side of a second silicon wafer,... Invensense Inc

09/28/17 / #20170275158

Integration of ain ultrasonic transducer on a cmos substrate using fusion bonding process

Provided herein is a method including bonding a first oxide layer on a handle substrate to a second oxide layer on a complementary metal oxide semiconductor (“CMOS”), wherein the fusion bonding forms a unified oxide layer including a diaphragm overlying a cavity on the CMOS. The handle substrate is removed... Invensense Inc

09/14/17 / #20170260039

Offset rejection electrodes

A MEMS sensor includes a sensing reference plane, an anchor, a proof mass, and sensing elements. The anchor is coupled to the sensing reference plane and to the proof mass that moves under an external excitation. The sensing elements detect motion normal to the sensing reference plane. A summation of... Invensense Inc

09/07/17 / #20170255338

Determining force applied to an ultrasonic sensor

In a method for determining force applied to an ultrasonic sensor, ultrasonic signals are emitted from an ultrasonic sensor. A plurality of reflected ultrasonic signals from a finger interacting with the ultrasonic sensor is captured. A first data based at least in part on a first reflected ultrasonic signal of... Invensense Inc

08/31/17 / #20170251316

Electrical testing and feedthrough cancellation for an acoustic sensor

A method and circuit for testing an acoustic sensor are disclosed. In a first aspect, the method comprises using electro-mechanical features of the acoustic sensor to measure characteristic of the acoustic sensor. In a second aspect, the method comprises utilizing an actuation signal to evaluate mechanical characteristics of the acoustic... Invensense Inc

08/24/17 / #20170241799

Systems and methods to compensate for gyroscope offset

A gyroscope signal may be compensated for offset by performing a low frequency adaptive noise cancellation process. Noise corresponding to user dynamics may be reduced by performing a motion sensor based adaptive noise cancellation process. Further, noise corresponding to vibratory motion of the portable device may be reduced by applying... Invensense Inc

08/24/17 / #20170242622

Adaptive buffering

In a method of adaptive buffering in a mobile device having a host processor and a sensor processor coupled with the host processor, the sensor processor is used to buffer data received from a sensor that is operated by the sensor processor, wherein the data is buffered by the sensor... Invensense Inc

08/24/17 / #20170242806

Adaptive buffering

In a method of adaptive buffering in a mobile device having a host processor and a sensor processor coupled with the host processor, the sensor processor is used to buffer data received from a sensor that is operated by the sensor processor. The data is buffered by the sensor processor... Invensense Inc

08/17/17 / #20170234756

Systems and methods for differential pressure sensor calibration

Systems and methods are disclosed for calibrating a pressure sensor associated with a mobile device. The reference pressure information may be obtained from an associated device and then be used to calibrate the pressure sensor.... Invensense Inc

08/03/17 / #20170219359

Method and system for estimating uncertainty for offline map information aided enhanced portable navigation

The navigation solution of a portable device may be enhanced using map information. Sensor data for the portable device may be used to derive navigation solutions at a plurality of epochs over a first period of time. Position information for the device may be estimated at a time subsequent to... Invensense Inc

07/27/17 / #20170215001

Microphone module with sound pipe

A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering... Invensense Inc

07/20/17 / #20170205368

Cmos integrated microheater for a gas sensor device

A gas sensor device with temperature uniformity is presented herein. In an implementation, a device includes a complementary metal-oxide semiconductor (CMOS) substrate layer, a dielectric layer and a gas sensing layer. The dielectric layer is deposited on the CMOS substrate layer. Furthermore, the dielectric layer includes a temperature sensor and... Invensense Inc

07/20/17 / #20170206559

Associating a single entity with multiple electronic devices

In a method of associating a single entity with multiple electronic devices, a server accesses user data collected via internet communications with a plurality of electronic devices. Each item of user data includes a location signature and a unique identifier. The server determines an intersection of location between two electronic... Invensense Inc

07/13/17 / #20170199035

Mems gyroscope amplitude control via quadrature

A system and/or method for utilizing quadrature signals, for example in a MEMS gyroscope, to control drive signal characteristics (e.g., amplitude, etc.). As a non-limiting example, a quadrature signal in a MEMS gyroscope may be isolated and/or processed to generate a drive signal that is used to drive a proof... Invensense Inc

07/06/17 / #20170190571

Integrated package containing mems acoustic sensor and environmental sensor and methodology for fabricating same

An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes... Invensense Inc

06/29/17 / #20170183225

Cmos-mems integrated device including multiple cavities at different controlled pressures and methods of manufacture

An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing... Invensense Inc

06/29/17 / #20170184627

Mems device to selectively measure excitation in different directions

A method and system for a sensor system of a device is disclosed. The sensor system includes a first MEMS sensor (FMEMS), a second MEMS sensor (SMEMS) and a signal processor (SP). An excitation is imparted to the device along a first axis (FA). The FMEMS has a first primary... Invensense Inc

06/22/17 / #20170176062

Temperature stabilizing enclosure

A device includes a substrate, a micro-electro-mechanical system (MEMS) device disposed on the substrate, a controller disposed on the substrate, a heating element, and an enclosure. The heating element is configured to generate heat in response to a signal generated by the controller. The enclosure encloses the MEMS sensor device,... Invensense Inc

06/22/17 / #20170176188

Apparatus and methods for ultrasonic sensor navigation

An apparatus and methods are disclosed for determining a navigational constraint for a portable device using an ultrasonic sensor. The navigational constraint may be used to supplement other navigational solutions or may be used independently. The ultrasonic sensor may provide a plurality of samples to be processed to determine the... Invensense Inc

06/22/17 / #20170178102

Method and system for point of sale ordering

Anchor points associated with point of sale information may be ordered by deriving a trajectory for the portable device, associating known positions of the anchor points with a map encompassing the trajectory, characterizing turns of the trajectory, generating candidate paths by comparing the characterized turns to the map, selecting a... Invensense Inc

06/22/17 / #20170178681

Music detection and identification

A sensor processing unit comprises a microphone and a sensor processor. The sensor processor is coupled with the microphone. The sensor processor is configured to operate the microphone to capture an audio sample from an environment in which the microphone is disposed. The sensor processor is configured to perform music... Invensense Inc

06/15/17 / #20170167933

Pressure sensor

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of... Invensense Inc

06/15/17 / #20170167946

Dual-sealed mems package with cavity pressure monitoring

A microelectromechanical sensor (MEMS) package includes a gyroscope and an accelerometer. The gyroscope is located within a low-pressure cavity that is sealed from an external pressure. The accelerometer is located within a cavity, and the seal for the accelerometer cavity is entirely within the gyroscope cavity. Under normal operating conditions,... Invensense Inc

06/15/17 / #20170168088

Accelerometer common mode self-test

An accelerometer has a plurality of proof masses and a plurality of sense electrodes, which collectively form at least two capacitors. A first sense drive signal is applied to a first capacitor and a second sense drive signal is applied to a second capacitor. Both of the sense drive signals... Invensense Inc

Patent Packs
06/15/17 / #20170169444

Systems and methods for determining consumer analytics

Systems and methods are disclosed for deriving consumer analytics. A portable device associated with a user that output sensor data representing motion of the portable device, and by extension, the user. A trajectory may be derived using the sensor data and dwell periods occurring in the trajectory may be identified.... Invensense Inc

06/08/17 / #20170164107

Microphone package with an integrated digital signal processor

Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first... Invensense Inc

05/04/17 / #20170122771

Sensor output configuration

In a method of sensor output configuration, sensor output specifications for a plurality of sensor clients of a sensor are acquired. A first sensor output specification for a first of the sensor clients defines a first value for a sensor parameter. A second sensor output specification for a second of... Invensense Inc

05/04/17 / #20170127178

Distributed automatic level control for a microphone array

A distributed automatic level control function is provided, in which information relating to a common automatic level control parameter is transmitted to each of a plurality of microphone devices, wherein the information transmitted to at least one microphone device is derived from an audio sample of at least one different... Invensense Inc

04/06/17 / #20170096330

Cavity pressure modification using local heating with a laser

A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when... Invensense Inc

03/23/17 / #20170081181

Micromechanical component

A method for forming a MEMS device includes coupling a MEMS substrate and a base substrate. The MEMS substrate and the base substrate contain at least two enclosures. One enclosures has a first vertical gap between the bonding surface of the MEMS substrate and the bonding surface of the base... Invensense Inc

03/23/17 / #20170082648

Systems and methods for thermally controlling sensors

A sensor may be compensated by selectively activating a temperature element to drive temperature within the thermal envelope encompassing the sensor towards an operating temperature and applying a compensation to output of the sensor based at least in part on the operating temperature. The initial ambient temperature may be estimated... Invensense Inc

03/16/17 / #20170073217

Mems-cmos device that minimizes outgassing and methods of manufacture

A MEMS device is disclosed. The MEMS device includes a first substrate. At least one structure is formed within the first substrate. The first substrate includes at least one first conductive pad thereon. The MEMS device also includes a second substrate. The second substrate includes a passivation layer. The passivation... Invensense Inc

03/16/17 / #20170073223

Method of fabrication of al/ge bonding in a wafer packaging environment and a product produced therefrom

A method of bonding of germanium to aluminum between two substrates to create a robust electrical and mechanical contact is disclosed. An aluminum-germanium bond has the following unique combination of attributes: (1) it can form a hermetic seal; (2) it can be used to create an electrically conductive path between... Invensense Inc

03/09/17 / #20170066648

Cmos-mems integrated device with selective bond pad protection

A method and system for preparing a semiconductor wafer are disclosed. In a first aspect, the method comprises providing a passivation layer over a patterned top metal on the semiconductor wafer, etching the passivation layer to open a bond pad in the semiconductor wafer using a first mask, depositing a... Invensense Inc

03/09/17 / #20170067841

Gas sensor platform and the making the same

The present invention relates to low power, low cost, and compact gas sensors and methods for making the same. In one embodiment, the gas sensor includes a heating element embedded in a suspended structure overlying a substrate. The heating element is configured to generate an amount of heat to bring... Invensense Inc

03/02/17 / #20170057813

Cmos-mems integration using metal silicide formation

A method and system for forming a MEMS device are disclosed. In a first aspect, the method comprises providing a conductive material over at least a portion of a top metal layer of a base substrate, patterning the conductive material and the at least a portion of the top metal... Invensense Inc

02/23/17 / #20170052161

Gas sensing material for a gas sensor device

Gas sensing material for a gas sensor device is presented herein. In an implementation, a method includes generating a tin dioxide material by adding metal chloride and metal acetate to a mixture comprising tin dioxide and ammonium hydroxide, generating a precipitate substance by adding an organic solvent to the tin... Invensense Inc

02/23/17 / #20170053152

Always-on sensor device for human touch

Always-on or nearly always-on sensing of human touch at a device is provided. The sensing is split into a low-power detection stage and a full-power analysis stage, where the detection stage is implemented continually or nearly continually and causes system circuitry to perform analysis of the human touch after the... Invensense Inc

02/23/17 / #20170055093

Dynamically programmable microphone

Various embodiments provide for a dynamically programmable acoustic sensor that can adjust various parameters affecting sensitivity, acoustic overload point, signal to noise ratio and other parametric choices that affect the performance and function of the acoustic sensor. A sound analysis engine can monitor the ambient noise in real time and... Invensense Inc

Patent Packs
02/16/17 / #20170044007

Assembly and packaging of mems device

A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder... Invensense Inc

02/09/17 / #20170041545

Systems and methods for stabilizing images

Systems and methods are disclosed for stabilizing digital images. Sensor representing a condition of the portable device may be obtained and used to classify a context of the portable device based at least in part on the sensor data. One or more stabilization parameters may be determined based on the... Invensense Inc

02/02/17 / #20170030714

Reducing resonance peaks and drive tones from a micro-electro-mechanical system gyroscope response

Reducing noise from drive tone and sense resonance peaks of a micro-electro-mechanical system (MEMS) gyroscope output using a notch filter is presented herein. The MEMS gyroscope can include a drive oscillation component configured to vibrate a sensor mass at a drive resonance frequency; a sense circuit configured to detect a... Invensense Inc

02/02/17 / #20170030716

Method and user and moving vehicle detection

An apparatus and method are disclosed for user and moving vehicle detection in which sensor data for a portable device is processed to determine whether the portable device is in a moving vehicle. Following a determination the portable device is in a moving vehicle, the sensor data is to characterize... Invensense Inc

02/02/17 / #20170033754

Multipath digital microphones

Multipath digital microphone systems comprising a multipath digital audio combiner component are described. Exemplary multipath digital microphone systems can switch from conveying one digital audio signal to conveying another digital audio signal based on one or more switching criteria determined by an exemplary multipath digital audio combiner component. Provided implementations... Invensense Inc

01/26/17 / #20170022054

Aluminum nitride (aln) devices with infrared absorption structural layer

A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a... Invensense Inc

01/19/17 / #20170015547

Release chemical protection for integrated complementary metal-oxide-semiconductor (cmos) and micro-electro-mechanical (mems) devices

Systems and methods that protect CMOS layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (MEMS) device integrated with the CMOS wafer. Sidewalls of passivation openings created in a complementary metal-oxide-semiconductor (CMOS) wafer expose a dielectric layer of the CMOS wafer... Invensense Inc

01/19/17 / #20170016723

Duty-cycled gyroscope

A gyroscope system comprises a MEMS gyroscope coupled to a drive system and a sense system. The drive system maintains the MEMS gyroscope in a state of oscillation and the sense system for receiving, amplifying, and demodulating an output signal of the MEMS gyroscope that is indicative of the rate... Invensense Inc

01/12/17 / #20170008760

Mems-cmos-mems platform

A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first... Invensense Inc

01/12/17 / #20170013363

Microelectromechanical microphone having a stationary inner region

A microelectromechanical microphone has a stationary region or another type of mechanically supported region that can mitigate or avoid mechanical instabilities in the microelectromechanical microphone. The stationary region can be formed in a diaphragm of the microelectromechanical microphone by rigidly attaching, via a rigid dielectric member, an inner portion of... Invensense Inc

01/05/17 / #20170001861

Method of increasing mems enclosure pressure using outgassing material

Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a... Invensense Inc

01/05/17 / #20170004630

Method and speed or velocity estimation using optical sensor

Systems and methods are disclosed for estimating speed and/or velocity for a portable device using an optical sensor. The optical sensor may capture a plurality of samples to be processed to estimate speed. The speed or velocity may be estimated based on a determined context and/or usage of the portable... Invensense Inc

01/05/17 / #20170006378







ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



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