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J devices Corporation patents


Recent patent applications related to J devices Corporation. J devices Corporation is listed as an Agent/Assignee. Note: J devices Corporation may have other listings under different names/spellings. We're not affiliated with J devices Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "J" | J devices Corporation-related inventors


Semiconductor package and producing same

An object of the present invention is to provide a semiconductor package with which it is possible to reduce a volume of an encapsulation resin and to easily embed a resin regardless of thicknesses of semiconductor chips and a small distance between adjacent semiconductor chips, as well as to provide... J devices Corporation

Manufacturing semiconductor package

A manufacturing method of a semiconductor package includes etching a first surface and a side surface of a base substrate, the base substrate including the first, a second and the side surfaces positioned between the first and the second surfaces, the base substrate containing a metal, attaching a metal different... J devices Corporation

Manufacturing semiconductor package

A manufacturing method of a semiconductor package includes disposing one or more semiconductor devices on a base substrate, each of the one or more semiconductor devices having an external terminal; forming a frame on the base substrate, the frame surrounding the one or more semiconductor devices; and forming a resin... J devices Corporation

Semiconductor manufacturing apparatus and semiconductor manufacturing method

A semiconductor manufacturing apparatus includes a stage connected to a vacuum generator to suction a semiconductor wafer including a plurality of semiconductor chips; a suction control unit connected to a connecting portion of the stage and the vacuum generator to control the connection of the stage and the vacuum generator;... J devices Corporation

Semiconductor package and manufacturing semiconductor package

A semiconductor package includes a substrate having at least one recessed portion, a semiconductor device located on a surface of the substrate, the surface having the at least one recessed portion, and a resin insulating layer covering the semiconductor device.... J devices Corporation

Semiconductor package and manufacturing semiconductor package

A manufacturing method of a semiconductor package includes locating a plurality of semiconductor packages on a substrate, forming a resin insulating layer covering the plurality of semiconductor devices, forming grooves, in the resin insulating layer, enclosing each of the plurality of semiconductor devices and reaching the substrate, and irradiating the... J devices Corporation

Manufacturing semiconductor package

A manufacturing method of a semiconductor package includes locating, on a substrate, a semiconductor device having an external terminal provided on a top surface thereof, forming a resin insulating layer covering the semiconductor device, forming an opening, exposing the external terminal, in the resin insulating layer, performing plasma treatment on... J devices Corporation

Semiconductor device

A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the... J devices Corporation

Semiconductor package and a manufacturing a semiconductor device

A semiconductor package includes a die pad; a plurality of external connection terminals located around the die pad; a semiconductor chip located on a top surface of the die pad and electrically connected with the plurality of external connection terminals; and a sealing member covering the die pad, the plurality... J devices Corporation

Interconnect structure, printed circuit board, semiconductor device, and manufacturing interconnect structure

An object of the present invention is to provide an interconnect structure in which the current capacity of an interconnect pattern involving a large amount of current is increased without preventing miniaturization of signal lines and increasing film thickness. To accomplish this object, the present invention is configured as an... J devices Corporation

Method of manufacturing semiconductor package and semiconductor package

A manufacturing method of a semiconductor package which improves productivity and can manufacture high-quality semiconductor packages is provided. The manufacturing method of a semiconductor package includes arranging a plurality of semiconductor devices at intervals on a first surface side of a support substrate, forming a first insulating resin layer forming... J devices Corporation

Method for manufacturing semiconductor package, and semiconductor package

A method for manufacturing a semiconductor package includes: forming an insulating layer on a support plate; forming a via in the insulating layer; locating a semiconductor device on the insulating layer such that an electrode of the semiconductor device is on the via; removing the support plate; forming a seed... J devices Corporation

Wiring substrate, semiconductor package having the wiring substrate, and manufacturing method thereof

Provided is a wiring substrate and its manufacturing method in which a thick wiring layer capable of being applied with a large current and a thin wiring layer capable of being subjected to microfabrication coexist in the same layer. The wiring substrate includes: an insulating film located over a first... J devices Corporation

Semiconductor package and its manufacturing method

Provided is a bonding method to construct a bonding with high thermal reliability between electrodes formed on both chip surfaces of a semiconductor device and wiring. The bonding method includes: bonding a semiconductor chip over a first substrate with a bonding film interposed therebetween; forming a first insulating film over... J devices Corporation

Semiconductor package

A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the... J devices Corporation

Press fitting head and semiconductor manufacturing apparatus using the same

A press fitting head comprising an elastic member in a part where the press fitting head contacts a semiconductor device, and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device is provided. Additionally, a semiconductor manufacturing... J devices Corporation

Semiconductor device and manufacturing same

The present invention is to provide a semiconductor device in which an insulating material layer contains no reinforced fibers such as a glass cloth or a nonwoven cloth and which enables miniaturization of metal thin-film wiring layers, a reduction in the diameter of metal vias, and a reduction in interlayer... J devices Corporation








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with J devices Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for J devices Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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