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Jx Nippon Mining & Metals Corporation patents


Recent patent applications related to Jx Nippon Mining & Metals Corporation. Jx Nippon Mining & Metals Corporation is listed as an Agent/Assignee. Note: Jx Nippon Mining & Metals Corporation may have other listings under different names/spellings. We're not affiliated with Jx Nippon Mining & Metals Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "J" | Jx Nippon Mining & Metals Corporation-related inventors


Method for manufacturing sputtering target

(1) The present invention provides a method for manufacturing a sputtering target in which the controllability of crystal orientation is improved. Specifically, the present invention provides a method for manufacturing a sputtering target, comprising a step of shaping at least one raw material powder selected from a metal and a... Jx Nippon Mining & Metals Corporation

Cdte-based compound single crystal and producing the same

Provided are a high resistance CdTe-based compound single crystal with miniaturized Te precipitates and a method for producing the same. According to one embodiment of the present invention, a CdTe based compound single crystal is provided including a precipitate having a particle size of less than 0.1 μm obtained from... Jx Nippon Mining & Metals Corporation

Tantalum sputtering target, and production method therefor

Provided is a tantalum sputtering target, which includes an area ratio of crystal grains of which a {111} plane is oriented in a direction normal to a rolling surface (ND) is 35% or more when the ND, which is a cross section orthogonal to a sputtering surface of a target,... Jx Nippon Mining & Metals Corporation

Indium phosphide wafer, photoelectric conversion element, and producing a monocrystalline indium phosphide

In this photoelectric conversion element wherein group III-IV compound semiconductor single crystals containing zinc as an impurity are used as a substrate, the substrate is increased in size without lowering conversion efficiency. A heat-resistant crucible is filled with raw material and a sealant, and the raw material and sealant are... Jx Nippon Mining & Metals Corporation

Sintered compact target and producing sintered compact

A sintered compact target containing an element(s) (A) and an element(s) (B) as defined below is provided. The sintered compact target is free from pores having an average diameter of 1 μm or more, and the number of micropores having an average diameter of less than 1 μm existing in... Jx Nippon Mining & Metals Corporation

Method for removing copper from lithium ion battery scrap and recovering metals

The present invention provides a method for removing copper from lithium ion battery scrap containing copper, comprising a leaching step of adding the lithium ion battery scrap to an acidic solution and leaching the lithium ion battery scrap under a condition that an aluminum solid is present in the acidic... Jx Nippon Mining & Metals Corporation

Method of producing high-purity erbium

A method of purifying erbium is provided to produce a high-purity erbium having a purity of 5N or higher excluding rare earth elements and gas components, and containing Al, Fe, Cu, and Ta each in an amount of 1 wtppm or less, W in an amount of 10 wtppm or... Jx Nippon Mining & Metals Corporation

Method for recovering at least one valuable containing tungsten

Provided is a method for efficiently separating and recovering tungsten and other valuable(s) from at least one valuable containing tungsten. The present invention relates to a method for recovering at least one valuable containing tungsten, comprising subjecting a raw material mixture comprising at least one valuable containing tungsten to electrolysis... Jx Nippon Mining & Metals Corporation

Electromagnetic shielding material

Provided is an electromagnetic shielding material having improved electromagnetic shielding properties. The present invention relates to an electromagnetic shielding material having a structure in which at least two metal foils are laminated via at least one insulating layer, the electromagnetic shielding material comprising at least one metal oxide layer on... Jx Nippon Mining & Metals Corporation

Electromagnetic shielding material

the symbol dR represents the thickness of each insulating layer (m).... Jx Nippon Mining & Metals Corporation

Method for producing tungsten

Provided is a method for efficiently producing tungsten from a raw material mixture comprising at least one valuable containing tungsten. The present invention relates to a method for producing tungsten, comprising the steps of subjecting a raw material mixture comprising at least one valuable containing tungsten to electrolysis using an... Jx Nippon Mining & Metals Corporation

Method for treating lithium ion battery

The present invention provides a method for treating at least one lithium ion battery enclosed in a housing containing aluminum, comprising heating the lithium ion battery using a combustion furnace in which a combustion object is incinerated by flames, while preventing the flames from being directly applied to the housing... Jx Nippon Mining & Metals Corporation

Method for producing tungsten carbide

Provided is a method for efficiently producing tungsten carbide from a raw material mixture comprising at least one valuable containing tungsten. The present invention relates to a method for producing tungsten carbide, comprising the steps of subjecting a raw material mixture comprising at least one valuable containing tungsten to electrolysis... Jx Nippon Mining & Metals Corporation

Method for removing iron from iron-containing solution and recovering valuable metals

The present invention provides a method for removing iron from an iron-containing solution containing an iron ion, comprising adding a lithium ion battery cathode material containing manganese to an acidic sulfuric acid solution to obtain a cathode material-containing solution, and then precipitating a manganese ion as manganese dioxide in a... Jx Nippon Mining & Metals Corporation

Oxide sintered compact and sputtering target formed from said oxide sintered compact

An IGZO sintered compact composed of indium (In), gallium (Ga), zinc (Zn), oxygen (O) and unavoidable impurities, wherein the IGZO sintered compact has a transverse intensity of 50 MPa or more, and a bulk resistance of 100 mΩcm or less. Provided is a sputtering target capable of suppressing the target... Jx Nippon Mining & Metals Corporation

Cylindrical compact, manufacturing cylindrical sputtering target, and manufacturing cylindrical sintered compact

A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a... Jx Nippon Mining & Metals Corporation

Polyoxometalate and producing polyoxometalate

Provided is a novel polyoxometalate and a method for producing the polyoxometalate. The polyoxometalate is represented by the compositional formula: MxOy in which M is tungsten, molybdenum or vanadium; 4≦x≦1000; and 2.5≦y/x≦7.... Jx Nippon Mining & Metals Corporation

Oxide sintered compact and sputtering target formed from said oxide sintered compact

An IGZO sintered compact composed of indium (In), gallium (Ga), zinc (Zn), oxygen (O) and unavoidable impurities, wherein an average length of cracks existing in the IGZO sintered compact is 3 μm or more and 15 μm or less. Provided is a sputtering target capable of suppressing the target cracks... Jx Nippon Mining & Metals Corporation

Ubm (under bump metal) electrode structure for radiation detector, radiation detector and production method thereof

An UBM electrode structure body for a radiation detector and a radiation detector arranged with the UBM electrode structure body are provided for suppressing peeling and having high electrode adhesion. In addition, a manufacturing method of an UBM electrode structure body for a radiation detector and a manufacturing method of... Jx Nippon Mining & Metals Corporation

Copper foil provided with carrier, laminate, printed wiring board, electronic device and fabricating printed wiring board

Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an... Jx Nippon Mining & Metals Corporation

Fe-pt-based sputtering target with dispersed c grains

A sintered compact sputtering target in which a composition ratio based on atomicity is represented by a formula of (Fe100−X—PtX)100−A—CA (provided A is a number which satisfies 20≦A≦50 and X is a number which satisfies 35≦X≦55), wherein C grains are finely dispersed in an alloy, and the relative density is... Jx Nippon Mining & Metals Corporation

Punching processing method, manufacturing press-formed product, and press-formed product

The punching processing method of the present invention is a punching processing method in which a metallic sheet material 1a is sequentially subjected to multiple punching processing steps by a punch and a die, comprising, in first step punching processing, forming a first step punched surface 2 on the sheet... Jx Nippon Mining & Metals Corporation

Structure having metal material for heat radiation, printed circuit board, electronic apparatus, and metal material for heat radiation

A structure having a metal material for heat radiation that is capable of favorably radiating heat from a heat generating component is provided. A structure having a metal material for heat radiation, containing a heat generating component and a heat radiating member for radiating heat from the heat generating component,... Jx Nippon Mining & Metals Corporation

Printed wiring board, electronic device, catheter, and metallic material

Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one... Jx Nippon Mining & Metals Corporation

Magnetic material sputtering target and producing same

A magnetic material sputtering target formed from a sintered body containing at least Co and/or Fe and B, and containing B in an amount of 10 to 50 at %, wherein an oxygen content is 100 wtppm or less. Since the magnetic material sputtering target of the present invention can... Jx Nippon Mining & Metals Corporation

Sputtering target and/or coil, and process for producing same

A sputtering target and/or a coil disposed at a periphery of a plasma-generating region for confining plasma are provided. The target and/or coil has a surface to be eroded having a hydrogen content of 500 μL/cm2 or less. In dealing with reduction in hydrogen content of the surface of the... Jx Nippon Mining & Metals Corporation

Method of leaching copper from copper sulfide ore and evaluating iodine loss content of column leaching test of the copper sulfide ore

A method of leaching copper from a copper sulfide ore which includes adding a potential adjustment agent for lowering a potential of a leaching solution obtained after leaching copper from the copper sulfide ore by using iodide ion and iron (III) ion, the leaching solution being stored in a tank... Jx Nippon Mining & Metals Corporation

Magnetic material sputtering target and manufacturing method thereof

Provided is an oxide-containing magnetic material sputtering target wherein the oxides have an average grain diameter of 400 nm or less. Also provided is a method of producing an oxide-containing magnetic material sputtering target. The method involves depositing a magnetic material on a substrate by the PVD or CVD method,... Jx Nippon Mining & Metals Corporation

Activated carbon regeneration method and gold recovery method

An activated carbon regeneration method of the present invention is for eluting gold from activated carbon on which the gold has been adsorbed and thereafter recycling, in adsorption of the gold, the used activated carbon from which the gold has been eluted, the method including: washing the used activated carbon... Jx Nippon Mining & Metals Corporation

Tantalum sputtering target, and production method therefor

Provided is a tantalum target, wherein, when a direction normal to a rolling surface (ND), which is a cross section perpendicular to a sputtering surface of a target, is observed via an electron backscatter diffraction pattern method, an area ratio of crystal grains of which a {100} plane is oriented... Jx Nippon Mining & Metals Corporation

Copper foil with release layer, laminated material, producing printed wiring board, and producing electronic apparatus

A copper foil with a release layer is provided that capable of forming a circuit, of such as an embedded trace substrate, by a subtractive method in a simple process. A copper foil with a release layer, containing, in this order, a release layer; a barrier layer having dissolution resistance... Jx Nippon Mining & Metals Corporation

Method for recovering gold from activated carbon

The present invention is intended for effectively removing copper, iron, sulfur, which are impurities, from activated carbon on which gold is adsorbed before gold eluting in the point of view of gold recovery, and is related to a method for eluting gold from an activated carbon on which at least... Jx Nippon Mining & Metals Corporation

Rare earth thin-film magnet and producing same

A rare earth thin-film magnet of a Nd—Fe—B film deposited on a Si substrate, wherein, when the film thickness of the rare earth thin film is 70 μm or less, the Nd content satisfies the conditional expression of 0.15≦Nd/(Nd+Fe)≦0.25 in terms of an atomic ratio; when the film thickness of... Jx Nippon Mining & Metals Corporation

Copper alloy sputtering target and manufacturing same

Provided is a copper alloy sputtering target, wherein, based on charged particle activation analysis, the copper alloy sputtering target has an oxygen content of 0.6 wtppm or less, or an oxygen content of 2 wtppm or less and a carbon content of 0.6 wtppm or less. Additionally provided is a... Jx Nippon Mining & Metals Corporation

Roll laminate, producing roll laminate, producing laminate, producing build-up substrate, producing printed wiring board, and producing electronic device

Provided herein is a roll laminate that can desirably reduce scrapes on a metal foil surface even when a long metal foil is wound into a roll, and that can improve the productivity in use of the unwound roll metal foil. The roll laminate includes a long first metal foil... Jx Nippon Mining & Metals Corporation

11/30/17 / #20170347493

Structure having metal material for heat radiation, printed circuit board, electronic apparatus, and metal material for heat radiation

A structure having a metal material for heat radiation that is capable of favorably radiating heat from a heat generating component is provided. A structure having a metal material for heat radiation, comprising a heat generating component, a heat generating component protective member that is provided to cover a part... Jx Nippon Mining & Metals Corporation

10/26/17 / #20170306473

Sputtering target comprising al-te-cu-zr-based alloy and manufacturing same

A sputtering target containing 20 at % to 40 at % of Te, 5 at % to 20 at % of Cu, 5 at % to 15 at % of Zr, and remainder being Al, wherein a structure of the sputtering target is comprise of an Al phase, a Cu... Jx Nippon Mining & Metals Corporation

10/26/17 / #20170309460

Niobium oxide sintered compact, sputtering target formed from said sintered compact, and producing niobium oxide sintered compact

The present invention provides a niobium oxide sintered compact having a composition of NbOx (2<x<2.5), and specifically provides a niobium oxide sintered compact which can be applied to a sputtering target for forming a high-quality resistance change layer for use in ReRAM. In particular, the present invention aims to provide... Jx Nippon Mining & Metals Corporation

10/19/17 / #20170303405

Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, manufacturing printed wiring board, and manufacturing electronic device

A copper foil including a roughened layer, and the roughened layer includes a primary particle layer, a surface roughness Ra of a surface on the side of the primary particle layer is 0.12 μm or less, and the average particle size of primary particles of the primary particle layer is... Jx Nippon Mining & Metals Corporation

10/12/17 / #20170291397

Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and manufacturing the printed wiring board

A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz... Jx Nippon Mining & Metals Corporation

10/12/17 / #20170294203

Sputtering target for forming magnetic recording film and producing same

An FePt-based sintered sputtering target containing C and/or BN, wherein an area ratio of AgCu alloy grains on a polished surface of a cross section that is perpendicular to a sputtered surface of the sputtering target is 0.5% or more and 15% or less. An object of this invention is... Jx Nippon Mining & Metals Corporation

10/05/17 / #20170283924

Copper alloy sheet material and producing copper alloy sheet material

A copper alloy sheet material which contains 0.5 to 2.5% by mass of Ni, 0.5 to 2.5% by mass of Co, 0.30 to 1. 2% by mass of Si and 0.0 to 0.5% by mass of Cr, the balance being Cu and unavoidable impurities. The material fulfills the relationships 1.0≦I... Jx Nippon Mining & Metals Corporation

10/05/17 / #20170283925

Copper alloy sheet material and manufacturing the same

A copper alloy sheet material includes 0.5 to 2.5 mass % of Ni, 0.5 to 2.5 mass % of Co, 0.30 to 1.2 mass % of Si and 0.0 to 0.5 mass % of Cr and the balance Cu and unavoidable impurities, wherein an X-ray diffraction intensity ratio is 1.0≦I{200}/I0{200}≦5.0... Jx Nippon Mining & Metals Corporation

10/05/17 / #20170285294

Titanium copper foil having plated layer

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil... Jx Nippon Mining & Metals Corporation

10/05/17 / #20170285295

Copper-titanium alloy foil having plated layer

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil... Jx Nippon Mining & Metals Corporation

09/21/17 / #20170271134

Lithium cobalt sintered body and sputtering target produced by using the sintered body, production lithium cobalt oxide sintered body, and thin film formed from lithium cobalt oxide

A lithium cobalt oxide sintered body having a bending strength of 100 MPa or more, and a sputtering target formed using the sintered body are provided. In particular, a cylindrical sputtering target for use in rotary sputtering is provided. The sputtering target is useful in forming a cathode material thin... Jx Nippon Mining & Metals Corporation

08/17/17 / #20170236696

Cobalt sputtering target

A Co sputtering target having a purity of 99.99% to 99.999% and a Si content of 1 wtppm or less. Provided is a Co sputtering target capable of improving barrier properties and adhesiveness by suppressing conversion into highly reactive silicide by a reduction in the Si content in cobalt.... Jx Nippon Mining & Metals Corporation

08/10/17 / #20170231101

Laminate for printed wiring board, manufacturing printed wiring board, and manufacturing electronic device

A laminate for printed wiring board is used in a method of manufacturing printed wiring boards that includes a process of forming a circuit by any one of a semi-additive method, a partly additive method, a modified semi-additive method, and an embedding method. The laminate includes an insulating resin substrate,... Jx Nippon Mining & Metals Corporation

08/03/17 / #20170218502

Master alloy for sputtering target and producing sputtering target

Provided is a master alloy for a sputtering target, wherein, when elements constituting the master alloy are following X1, X2, Y1, Y2, Y2, and Y3; specifically, where X1 is one or two types of Ta or W; X2 is at least one type of Ru, Mo, Nb or Hf; Y1... Jx Nippon Mining & Metals Corporation

07/27/17 / #20170211176

Tungsten sputtering target and producing same

A sputtering target containing 0.01 to 0.5 wt % of Ag, and remainder being W and unavoidable impurities. The object of the present invention is to provide a sputtering target capable of forming a film having a relatively low specific resistance by sputtering, wherein the obtained film is endowed with... Jx Nippon Mining & Metals Corporation

07/27/17 / #20170213712

Backing plate obtained by diffusion-bonding anticorrosive metal and mo or mo alloy, and sputtering target-backing plate assembly provided with said backing plate

Particularly in semiconductor applications, reductions in size have progressed and control of particles during sputtering has become stricter. The present invention aims to resolve the problem of warpage of sputtering targets formed from low thermal expansion materials and problems occurring with respect to the anticorrosive properties of Mo or Mo... Jx Nippon Mining & Metals Corporation

07/20/17 / #20170208680

Copper foil, copper-clad laminate board, producing printed wiring board, producing electronic apparauts, producing transmission channel, and producing antenna

To provide a copper foil and a copper-clad laminate board that have a good circuit formability and have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board. A copper foil comprising a gloss face, a surface roughness Ra of a surface of the... Jx Nippon Mining & Metals Corporation

07/20/17 / #20170208686

Copper foil, copper-clad laminate board, producing printed wiring board, producing electronic apparatus, producing transmission channel, and producing antenna

To provide a copper foil and a copper-clad laminate board that have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board that is folded in use or bent in use. A copper foil having a number of times of folding of 1 or... Jx Nippon Mining & Metals Corporation

07/06/17 / #20170196083

Surface-treated copper foil

To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil... Jx Nippon Mining & Metals Corporation

06/22/17 / #20170175252

Sputtering target comprising al-te-cu-zr alloy, and producing same

An Al—Te—Cu—Zr alloy sputtering target, comprising 20 at % to 40 at % of Te, 5 at % to 20 at % of Cu, 5 at % to 15 at % of Zr and the remainder of Al, wherein a Te phase, a Cu phase and a CuTe phase are... Jx Nippon Mining & Metals Corporation

06/15/17 / #20170169998

In-cu alloy sputtering target and producing the same

The purpose of the present invention is to provide an In—Cu alloy sputtering target member having high compositional homogeneity in the thickness direction. The present invention provides a sputtering target member having a composition containing from 1 to 70 at. % of Cu relative to a total number of atoms... Jx Nippon Mining & Metals Corporation

05/25/17 / #20170148614

Licoo2 sputtering target, production method therefor, and positive electrode material thin film

A sputtering target having a composition of LiCoO2, wherein a resistivity of the target is 100 Ωcm or less, and a relative density is 80% or higher. The sputtering target of the present invention is effective for use in forming a positive electrode thin film in all-solid-state thin-film lithium ion... Jx Nippon Mining & Metals Corporation

05/11/17 / #20170133116

Indium oxide transparent conductive film

An indium oxide sintered compact containing zirconium as an additive, wherein the ratio of atomic concentration of zirconium to the sum of the atomic concentration of indium and the atomic concentration of zirconium is in the range of 0.5 to 4%, the relative density is 99.3% or higher, and the... Jx Nippon Mining & Metals Corporation

05/04/17 / #20170121811

Sputtering target comprising ni-p alloy or ni-pt-p alloy and production method therefor

A method of producing a Ni—P alloy sputtering target, wherein a Ni—P alloy having a P content of 15 to 21 wt % and remainder being Ni and unavoidable impurities is melted and atomized to prepare a Ni—P alloy atomized powder having an average grain size of 100 μm or... Jx Nippon Mining & Metals Corporation

04/20/17 / #20170108594

Radiation detector ubm electrode structure body, radiation detector, and manufacturing same

The present invention provides a radiation detector UBM electrode structure body and a radiation detector which suppress the degradation of metal electrode layers at the time of formation of UBM layers and achieve sufficient electric characteristics, and a method of manufacturing the same. A radiation detector UBM electrode structure body... Jx Nippon Mining & Metals Corporation

04/13/17 / #20170101718

Copper chloride, cvd raw material, copper wiring film, and producing copper chloride

Provided are: copper chloride which can provide an organometallic complex that contains impurities at a small content and therefore has high purity; a CVD raw material; a copper wiring film; and a method for producing copper chloride. Copper chloride which has purity of 6 N or more and has an... Jx Nippon Mining & Metals Corporation

04/06/17 / #20170096725

Cu-co-ni-si alloy for electronic components

[Solution] The present invention is a Cu—Co—Ni—Si alloy for an electronic component comprising 0.5 to 3.0% by mass of Co and 0.1 to 1.0% by mass of Ni, a concentration (% by mass) ratio of Ni to Co (Ni/Co) being adjusted in the range of 0.1 to 1.0, the alloy... Jx Nippon Mining & Metals Corporation

02/09/17 / #20170042025

Carrier-attached copper foil, laminate, producing printed wiring board, and producing electronic device

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached... Jx Nippon Mining & Metals Corporation

02/09/17 / #20170042036

Carrier-attached copper foil, laminate, producing printed wiring board, and producing electronic device

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine... Jx Nippon Mining & Metals Corporation

02/09/17 / #20170042044

Carrier-attached copper foil, laminate, producing printed wiring board, and producing electronic device

Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the... Jx Nippon Mining & Metals Corporation

Patent Packs
02/02/17 / #20170029921

Method for producing high-purity calcium

A high-purity calcium and method of producing same are provided. The method includes performing first sublimation purification by introducing calcium starting material having a purity, excluding gas components, of 4N or less into a crucible of a sublimation vessel, subjecting the starting material to sublimation by heating at 750° C.... Jx Nippon Mining & Metals Corporation

02/02/17 / #20170032978

Carrier-attached copper foil, laminate, manufacturing printed-wiring board and manufacturing electronic device

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point... Jx Nippon Mining & Metals Corporation

02/02/17 / #20170034926

Carrier-attached copper foil, laminate, manufacturing printed-wiring board and manufacturing electronic device

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the number of crystal grains per unit cross-sectional area of the ultra-thin copper layer in the through-thickness direction is 0.1 to 5... Jx Nippon Mining & Metals Corporation

01/19/17 / #20170019991

Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method

Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a... Jx Nippon Mining & Metals Corporation

01/12/17 / #20170009335

Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride

A target is formed of a sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride or high-melting point metal boride comprising a structure in which a material formed of a sintering-resistant material of high-melting point metal alloy, high-melting point metal... Jx Nippon Mining & Metals Corporation








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