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Jx Nippon Mining & Metals Corporation patents

Recent patent applications related to Jx Nippon Mining & Metals Corporation. Jx Nippon Mining & Metals Corporation is listed as an Agent/Assignee. Note: Jx Nippon Mining & Metals Corporation may have other listings under different names/spellings. We're not affiliated with Jx Nippon Mining & Metals Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "J" | Jx Nippon Mining & Metals Corporation-related inventors




Date Jx Nippon Mining & Metals Corporation patents (updated weekly) - BOOKMARK this page
05/25/17 new patent  Licoo2 sputtering target, production method therefor, and positive electrode material thin film
05/11/17Indium oxide transparent conductive film
05/04/17Sputtering target comprising ni-p alloy or ni-pt-p alloy and production method therefor
04/20/17Radiation detector ubm electrode structure body, radiation detector, and manufacturing same
04/13/17Copper chloride, cvd raw material, copper wiring film, and producing copper chloride
04/06/17Cu-co-ni-si alloy for electronic components
02/09/17Carrier-attached copper foil, laminate, producing printed wiring board, and producing electronic device
02/09/17Carrier-attached copper foil, laminate, producing printed wiring board, and producing electronic device
02/09/17Carrier-attached copper foil, laminate, producing printed wiring board, and producing electronic device
02/02/17Method for producing high-purity calcium
02/02/17Carrier-attached copper foil, laminate, manufacturing printed-wiring board and manufacturing electronic device
02/02/17Carrier-attached copper foil, laminate, manufacturing printed-wiring board and manufacturing electronic device
01/19/17Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
01/12/17Process for producing a target formed of a sintering-resistant material of a high-melting point metal alloy, silicide, carbide, nitride or boride
12/29/16Copper foil with carrier, laminate, printed wiring board, and producing electronic devices
12/29/16Copper foil with carrier, laminate, printed wiring board, and producing electronic devices
12/22/16Copper foil with carrier, laminate, producing printed wiring board, and producing electronic devices
12/22/16Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable
12/01/16Carrier-attached copper foil, laminate, printed-wiring board and manufacturing the printed wiring board
11/24/16Rare earth thin film magnet, process for producing same, and target for forming rare earth thin film magnet
11/24/16Lithium complex oxide
11/17/16Sputtering target comprising tungsten carbide or titanium carbide
11/10/16Copper-titanium alloy for electronic component
10/27/16Sputtering target of sintered sb-te-based alloy
10/20/16Surface treated copper foil, copper clad laminate, printed wiring board, electronic manufacturing printed wiring board
10/20/16Copper-titanium alloy for electronic component
10/06/16Cu-ni-si based rolled copper alloy and production method thereof
10/06/16Laminate structure and manufacturing method thereof
10/06/16High purity indium and manufacturing method therefor
09/29/16Cylindrical sputtering target, cylindrical compact, manufacturing cylindrical sputtering target, and manufacturing cylindrical sintered compact
09/29/16Cylindrical sputtering target
09/29/16Copper foil for printed circuit
08/18/16Magnetic material sputtering target and producing same
08/18/16Copper foil with carrier
08/11/16Metal powder paste and producing same
08/11/16Positive electrode active material for lithium-ion battery, a positive electrode for lithium-ion battery, and lithium-ion battery
08/11/16Copper foil provided with carrier, laminate, printed wiring board, electronic device and fabricating printed wiring board
07/28/16Tantalum sputtering target
07/21/16Tantalum sputtering target and producing same
07/21/16Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and manufacturing printed wiring board
07/21/16Copper foil provided with carrier, laminate, printed wiring board, electronic device, and fabricating printed wiring board
07/21/16Copper foil provided with carrier, laminate, printed wiring board, and fabricating printed wiring board
07/14/16Titanium-copper alloy having plating layer
07/14/16Surface-treated metal powder, and producing same
06/30/16Copper alloy plate having excellent electrical conductivity and bending deflection coefficient
06/23/16Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and producing printed wiring board
06/16/16High purity cobalt chloride and manufacturing method therefor
06/09/16Method of producing low alpha-ray emitting bismuth, and low alpha-ray emitting bismuth
06/09/16Method for electrolytically refining lead in sulfamate bath
06/09/16Metal foil for electromagnetic shielding, electromagnetic shielding material, and shielding cable
06/02/16Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and producing printed wiring board
05/26/16Tungsten sintered sputtering target
05/05/16Sputtering target and production thereof
04/28/16Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and manufacturing the printed wiring board
04/07/16Method for manufacturing high purity tin, electrowinning high purity tin and high purity tin
03/24/16Sputtering target-backing plate assembly
03/10/16Backing plate-integrated metal sputtering target and producing same
03/03/16High-strength titanium copper foil and producing same
03/03/16High-strength titanium copper foil and producing same
02/25/16Compound semiconductor single crystal ingot for photoelectric conversion devices, photoelectric conversion device, and production compound semiconductor single crystal ingot for photoelectric conversion devices
02/25/16Compound semiconductor single crystal ingot for photoelectric conversion devices, photoelectric conversion device, and production compound semiconductor single crystal ingot for photoelectric conversion devices
02/18/16Positive electrode active material for lithium-ion battery, positive electrode for lithium-ion battery, and lithium-ion battery
02/11/16Indium phosphide wafer, photoelectric conversion element, and producing a monocrystalline indium phosphide
02/04/16Method for manufacturing high purity manganese and high purity manganese
01/07/16Method for manufacturing high purity manganese and high purity manganese
Patent Packs
01/07/16Titanium target for sputtering and manufacturing method thereof
12/17/15Rolled copper foil for producing two-dimensional hexagonal lattice compound and producing two-dimensional hexagonal lattice compound
12/10/15High-purity copper-cobalt alloy sputtering target
12/10/15Tungsten sintered compact sputtering target and producing same
12/03/15Tantalum sputtering target and production method therefor
11/26/15Camera module and titanium-copper foil
11/19/15Tantalum sputtering target and producing same
10/22/15Indium cylindrical sputtering target and manufacturing method thereof
10/22/15Tungsten sintered compact sputtering target and tungsten film formed using said target
10/15/15Electronic component metal material and manufacturing the same
10/01/15Tantalum sputtering target and producing same
10/01/15Copper alloy sputtering target
09/17/15Surface treated plating material and producing the same, and electronic components
09/17/15Sputtering target for rare-earth magnet and production method therefor
09/10/15Nbo2 sintered compact, sputtering target comprising the sintered compact, and producing nbo2 sintered compact
Patent Packs
09/10/15Electronic component metal material and manufacturing the same
08/27/15Surface treated copper foil and laminate using the same
08/20/15Rolled copper foil for producing graphene and producing graphene using the same
08/20/15Cu-ga alloy sputtering target, and producing same
08/20/15Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate
07/30/15Fe-pt based magnetic material sintered compact
07/30/15Metallic material for electronic components and producing same, and connector terminals, connectors and electronic components using same
07/16/15Sputtering target
07/09/15Metallic material for electronic components and producing same, and connector terminals, connectors and electronic components using same
07/09/15Ultrathin copper foil and manufacturing the same, and ultrathin copper layer
07/02/15Cathode active material for lithium-ion battery, cathode for lithium-ion battery and lithium-ion battery
06/18/15Sputtering target
06/18/15Metallic material for electronic components and producing same, and connector terminals, connectors and electronic components using same
06/18/15Method of producing laminated body, and laminated body
06/11/15Thin film comprising titanium oxide, and producing thin film comprising titanium oxide
05/28/15Metallic material for electronic components and producing same, and connector terminals, connectors and electronic components using same
05/14/15Ruthenium sputtering target and ruthenium alloy sputtering target
05/07/15Positive electrode active material for lithium-ion battery, positive electrode for a lithium-ion battery, lithium-ion battery using same, and precursor to a positive electrode active material for a lithium-ion battery
04/23/15Fe-based magnetic material sintered compact
04/23/15Fe-pt-based sputtering target having nonmagnetic substance dispersed therein
04/23/15Polycrystalline silicon wafer
04/23/15Cu-ni-si based copper alloy
04/23/15Copper foil composite, formed product and producing the same
03/26/15Carrier-attached copper foil
03/19/15Surface-treated copper foil
03/05/15Sputtering target for forming magnetic recording film and process for producing same
03/05/15Tantalum sputtering target, manufacturing same, and barrier film for semiconductor wiring formed by using target
03/05/15Copper foil composite, formed product and producing the same
02/19/15Method for recovering rare earth from rare earth element-containing alloy
02/19/15Metallic material for electronic components, and connector terminals, connectors and electronic components using same
Social Network Patent Pack
02/19/15Copper foil with carrier, producing same, copper foil with carrier for printed wiring board, and printed wiring board
01/22/15High-purity titanium ingots, manufacturing method therefor, and titanium sputtering target
01/22/15Magnetic material sputtering target and manufacturing same
01/22/15Tungsten sintered compact sputtering target and tungsten film formed using same target
01/15/15Ferromagnetic material sputtering target containing chromium oxide
01/15/15Neodymium-based rare earth permanent magnet and process for producing same
01/08/15Press-fit terminal and electronic component using the same
01/08/15Press-fit terminal and electronic component using the same
01/01/15Polycrystalline silicon sputtering target
12/18/14Sputtering target assembly
Patent Packs
12/18/14High-purity copper sputtering target
12/18/14Co-cr-pt-based sputtering target and producing same
12/04/14Copper foil for producing graphene and producing graphene using the same
12/04/14High purity manganese and producing same
11/06/14Metal material for electronic component and manufacturing the same
10/30/14Sputtering target and manufacturing method therefor
10/30/14Electrolytic copper foil and production electrolytic copper foil
10/23/14Magnetic material sputtering target and manufacturing method thereof
10/02/14Material fuel cell separator, fuel cell separator using same, fuel cell stack, and producing fuel cell separator material
09/25/14Sintered compact magnesium oxide target for sputtering, and producing same
09/18/14Indium oxide transparent conductive film
09/11/14Titanium target for sputtering
09/04/14Copper foil for producing graphene, production method thereof and producing graphene
08/07/14Copper foil for producing graphene and producing graphene using the same
07/17/14Copper foil for producing graphene and producing graphene using the same
07/17/14High-purity lanthanum, producing same, sputtering target comprising high-purity lanthanum, and metal gate film comprising high-purity lanthanum as main component
07/10/14Copper alloy sheet with excellent heat dissipation and workability in repetitive bending
07/03/14Copper foil for producing graphene and producing graphene using the same
06/26/14Recycling tantalum coil for sputtering and tantalum coil obtained by the recycling method
06/19/14Fe-al based alloy sputtering target
06/12/14High-purity copper-manganese-alloy sputtering target
06/12/14Electrolytic copper plating solution for filling for forming microwiring of copper for ulsi
06/12/14Copper foil composite, copper foil used for the same, formed product and producing the same
05/22/14High-purity yttrium, process of producing high-purity yttrium, high-purity yttrium sputtering target, metal gate film deposited with high-purity yttrium sputtering target, and semiconductor element and device equipped with the metal gate film
05/08/14High-purity erbium, sputtering target comprising high-purity erbium, metal gate film having high-purity erbium as main component thereof, and production high-purity erbium
04/24/14Copper-titanium alloy sputtering target, semiconductor wiring line formed using the sputtering target, and semiconductor element and device each equipped with the semiconductor wiring line
04/10/14High-purity copper-manganese-alloy sputtering target
04/03/14Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
03/27/14Fe-pt-c based sputtering target
03/06/14Co-si based copper alloy plate
Patent Packs
02/27/14Copper foil for printed circuit
02/13/14Metal foil provided with electrically resistive layer, and board for printed circuit using said metal foil
02/06/14Rolled copper or copper-alloy foil provided with roughened surface
01/30/14Titanium target for sputtering
01/30/14Electrolytic copper foil for an anode of a negative electrode collector in a secondary battery and producing the same
01/23/14Sputtering target of sintered ti-nb based oxide, thin film of ti-nb based oxide, and producing the thin film
01/23/14Liquid crystal polymer film based copper-clad laminate and producing same
01/16/14Cu-si-co-based copper alloy for electronic materials and producing the same
01/16/14Strip of cu-co-si-based copper alloy for electronic materials and the producing the same
01/16/14Method for manufacturing metal foil provided with electrical resistance layer
01/16/14Metal foil having electrical resistance layer, and manufacturing same
01/16/14Two-layered copper-clad laminate material, and producing same
01/09/14Copper or copper reduced in alpha ray emission, and bonding wire obtained from the copper or copper alloy as raw material
01/09/14Two-layered copper-clad laminate material, and producing same
01/02/14Ferromagnetic sputtering target with less particle generation
01/02/14Cu-ga alloy sputtering target and producing same
12/26/13Co-cr-pt-b-based alloy sputtering target and producing same
12/26/13Polycrystalline silicon wafer
12/26/13Metal foil provided with electrically resistive film, and producing same
12/05/13Cu-ga target, producing same, light-absorbing layer formed from cu-ga based alloy film, and cigs system solar cell having the light-absorbing layer
Social Network Patent Pack
11/28/13Method for producing high-purity lanthanum, high-purity lanthanum, sputtering target formed from high-purity lanthanum, and metal gate film having highy-purity lanthanum as main component
11/28/13Positive electrode active material for lithium ion batteries, positive electrode for lithium ion batteries, and lithium ion battery
11/21/13Sputtering target for magnetic recording film
11/14/13High purity copper and producing high purity copper based on electrolysis
11/07/13Fe-pt-based ferromagnetic sputtering target and producing same
10/31/13Cu-co-si-zr alloy material and manufacturing method thereof
10/24/13Method of storing metal lanthanum target, vacuum-sealed metal lanthanum target, and thin film formed by sputtering the metal lanthanum target
10/24/13Apparatus for producing polycrystalline silicon and method therefor
10/17/13Indium sputtering target and manufacturing same
10/10/13Cu-ni-si-co copper alloy for electronic materials and manufacturing method thereof
10/03/13Method for forming circuit on flexible laminate substrate
10/03/13Electrolytic copper foil
09/26/13Method for leaching copper from copper sulfide ore
09/26/13Method for feeding zinc gas and apparatus therefor
09/26/13Sputtering target for magnetic recording film and process for production thereof
09/26/13Copper-clad laminate and manufacturing same
09/19/13Method of leaching copper ore
09/19/13Copper foil for printed wiring board
09/19/13Production high-purity lanthanum, high-purity lanthanum, sputtering target composed of high-purity lanthanum, and metal gate film containing high-purity lanthanum as main component
09/19/13Fuel cell separator material, and fuel cell stack using the same
Social Network Patent Pack
08/29/13Copper foil for printed wiring board, producing said copper foil, resin substrate for printed wiring board and printed wiring board
08/29/13Ferromagnetic material sputtering target
08/29/13Sputtering target-backing plate assembly and producing same
08/29/13Positive electrode active material for lithium-ion battery, positive electrode for a lithium-ion battery, lithium-ion battery using same, and precursor to a positive electrode active material for a lithium-ion battery
08/22/13Sintered compact sputtering target
08/22/13Fe-pt-based sputtering target with dispersed c grains
08/22/13Ferromagnetic material sputtering target
08/22/13Carrier-attached copper foil
08/15/13Sputtering target for magnetic recording film and producing same
08/15/13Ferromagnetic sputtering target
08/15/13Ferromagnetic material sputtering target
08/15/13Copper-cobalt-silicon alloy for electrode material
07/25/13Titanium target for sputtering
07/25/13Method of manufacturing copper foil for printed wiring board, and copper foil printed wiring board
07/18/13Cu-co-si-based alloy for electronic material and manufacturing the same
07/11/13Ferromagnetic sputtering target and manufacturing same
07/11/13Cathode active material for lithium ion battery and producing the same
07/04/13Fe-pt-based ferromagnetic material sputtering target
07/04/13Cu-in-ga-se quaternary alloy sputtering target
06/20/13Indium target and manufacturing same
06/06/13Recovery high purity platinum
06/06/13Laminated structure and producing the same
06/06/13Positive electrode active material for lithium-ion battery, a positive electrode for lithium-ion battery, and lithium-ion battery
05/30/13Ferromagnetic material sputtering target
05/09/13Sputtering target of ferromagnetic material with low generation of particles
05/09/13Sputtering target and/or coil, and process for producing same
05/02/13Indium target and producing the same
04/25/13Cu-si-co alloy for electronic materials, and producing same
04/25/13Tantalum sputtering target
04/25/13Sputtering target for magnetic recording film, and process for producing same
Social Network Patent Pack
04/18/13Cu-co-si system alloy sheet and manufacturing same
04/18/13Tantalum sputtering target
04/18/13Melt container
04/11/13Cu-co-si-based copper alloy for electronic materials, and manufacturing same
04/11/13Magnetic material sputtering target provided with groove in rear face of target
03/21/13Laminate for flexible wiring
03/21/13Copper foil composite
03/07/13Method for processing acidic solution that contains iodide ions and iron ions
02/21/13Method for producing positive electrode active material for lithium ion batteries and positive electrode active material for lithium ion batteries
02/14/13Indium target and manufacturing method thereof
02/07/13Ni alloy sputtering target, ni alloy thin film and ni silicide film
01/31/13Low alpha-dose tin or tin alloy, and producing same
01/31/13Method for synthesizing group ii-vi compound semiconductor polycrystals
01/24/13Cu-co-si alloy material
01/10/13Copper foil for printed circuit
01/10/13Copper foil for negative electrode current collector of secondary battery
01/03/13Method of forming circuit on flexible laminate substrate
01/03/13Positive electrode active substance for lithium ion batteries, positive electrode for lithium ion batteries, and lithium ion battery
01/03/13Positive electrode active material for lithium-ion battery, positive electrode for lithium-ion battery, and lithium-ion battery
12/27/12Positive electrode active substance for lithium ion batteries, positive electrode for lithium ion batteries, and lithium ion battery
12/27/12Positive electrode active material for lithium-ion batteries, positive electrode for lithium-ion batteries, and lithium-ion battery
12/27/12Positive electrode active material for lithium ion battery, positive electrode for lithium ion battery, and lithium ion battery
12/27/12Positive electrode active material for lithium-ion batteries, positive electrode for lithium-ion batteries,lithium-ion battery
12/27/12Positive electrode active material for lithium ion battery, positive electrode for lithium ion battery, and lithium ion battery
12/20/12Electronic circuit, forming same, and copper clad laminate for forming electronic circuit
12/20/12Tantalum coil for sputtering and processing the coil
12/20/12Sputtering target-backing plate assembly
12/20/12Positive electrode active material for lithium ion battery, positive electrode for lithium ion battery, and lithium ion battery
12/20/12Method for producing positive electrode active material for lithium ion battery and positive electrode active material for lithium ion battery







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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