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Kingpak Technology Inc patents


Recent patent applications related to Kingpak Technology Inc. Kingpak Technology Inc is listed as an Agent/Assignee. Note: Kingpak Technology Inc may have other listings under different names/spellings. We're not affiliated with Kingpak Technology Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kingpak Technology Inc-related inventors


Package base core and sensor package structure

The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper,... Kingpak Technology Inc

Sensor package structure

A sensor package structure includes a substrate, a sensing member, a shielding member, a metallic wire, and an encapsulating compound. The substrate includes a die bonding zone and a wiring zone. The sensing member is mounted on the die bonding zone and includes a sensing zone, a carrying zone arranged... Kingpak Technology Inc

Sensor package structure

A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, and an adhesive. A top surface of the sensor chip has a sensing region... Kingpak Technology Inc

Sensor package structure

A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, a combining layer firmly fixing the translucent layer to the sensor chip, and a... Kingpak Technology Inc

Optical package structure

An optical package structure is provided. The optical package structure includes a substrate, a frame layer, an optical unit, a bonding layer, a transparent plate and an encapsulation layer. The frame layer formed on the substrate surrounds a cavity where the optical unit is located. The bonding layer covers a... Kingpak Technology Inc

Universal connection recognition system

The present invention discloses a universal connection recognition system which includes a universal connector, a pin recognition module and a signal detection module, wherein the universal connector is composed of plural testing pins that are electrically connected to plural connection pads to be tested, while at least one testing pin... Kingpak Technology Inc

Detection system with quantum light source

The present invention discloses a detection system with quantum light source, it includes a quantum light source module and a detection module, wherein the quantum light source module is composed of plural quantum light sources and illuminating an object under test to generate an object image, while the detection module... Kingpak Technology Inc








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Kingpak Technology Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Kingpak Technology Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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