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Kinsus Interconnect Technology Corp patents

Recent patent applications related to Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp is listed as an Agent/Assignee. Note: Kinsus Interconnect Technology Corp may have other listings under different names/spellings. We're not affiliated with Kinsus Interconnect Technology Corp, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kinsus Interconnect Technology Corp-related inventors




Date Kinsus Interconnect Technology Corp patents (updated weekly) - BOOKMARK this page
11/02/17Multi-layer circuit board
10/26/17Double layer circuit board and manufacturing method thereof
10/19/17Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon
10/19/17Landless multilayer circuit board and manufacturing method thereof
10/05/17Buildup board structure
05/18/17Modified magnetic coil structure
04/13/17Winged coil structure and manufacturing the same
02/02/17Magnetic excitation coil structure
12/22/16Circuit board structure
12/22/16Method for manufacturing circuit board
09/08/16Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
09/08/16Copper etching manufacturing circuit board
07/07/16Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
06/23/16Ameliorated compound carrier board structure of flip-chip chip-scale package
03/17/16Method for manufacturing circuit board by etching polyimide
12/10/15Management system for process recipe
10/01/15Multilayer substrate structure for fine line
10/01/15Method of manufacturing a multilayer substrate structure for fine line
09/24/15Enhanced chip board package structure
05/21/15Insulation layer structure
02/12/15Chip board package structure
02/12/15Thin package structure with enhanced strength
02/12/15Method of manufacturing a thin support package structure
01/29/15Circuit board structure for high frequency signals
01/15/15Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof
10/02/14Method of manufacturing a stacked multilayer structure
10/02/14Stacked multilayer structure
10/02/14Package structure of a chip and a substrate
10/02/14Method of packaging a chip and a substrate
06/26/14Method of final defect inspection
05/01/14Method of manufacturing a chip support board structure
05/01/14Method of manufacturing a laminate circuit board
05/01/14Laminate circuit board structure
05/01/14Chip support board structure
10/17/13Method of thin printed circuit board wet process consistency on the same carrier
08/29/13Method of manufacturing a laminate circuit board with a multilayer circuit structure
08/29/13Laminate circuit board with a multi-layer circuit structure







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Kinsus Interconnect Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Kinsus Interconnect Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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