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Kinsus Interconnect Technology Corp patents


Recent patent applications related to Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp is listed as an Agent/Assignee. Note: Kinsus Interconnect Technology Corp may have other listings under different names/spellings. We're not affiliated with Kinsus Interconnect Technology Corp, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kinsus Interconnect Technology Corp-related inventors


Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled... Kinsus Interconnect Technology Corp

Multi-layer circuit board

A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The... Kinsus Interconnect Technology Corp

Double layer circuit board and manufacturing method thereof

Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar... Kinsus Interconnect Technology Corp

Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon

A printed circuit board (PCB) test fixture includes a substrate, a first insulation layer formed on the substrate, a conductor layer formed on the first insulation layer and electrically connected to the upper electrodes through at least one first connection member, a second insulation layer formed on the first insulation... Kinsus Interconnect Technology Corp

Landless multilayer circuit board and manufacturing method thereof

Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar... Kinsus Interconnect Technology Corp

Buildup board structure

A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All... Kinsus Interconnect Technology Corp

Modified magnetic coil structure

Disclosed is a modified magnetic coil structure. A substrate, at least one circuit pattern layer and a permeability enforced ring are included. The substrate is formed of an electrical insulation material, and has a through hole. The circuit pattern layer is formed of an electrically conductive material and configured in... Kinsus Interconnect Technology Corp

Winged coil structure and manufacturing the same

A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower... Kinsus Interconnect Technology Corp

Magnetic excitation coil structure

Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil... Kinsus Interconnect Technology Corp








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Kinsus Interconnect Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Kinsus Interconnect Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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