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Kinsus Interconnect Technology Corp patents


Recent patent applications related to Kinsus Interconnect Technology Corp. Kinsus Interconnect Technology Corp is listed as an Agent/Assignee. Note: Kinsus Interconnect Technology Corp may have other listings under different names/spellings. We're not affiliated with Kinsus Interconnect Technology Corp, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kinsus Interconnect Technology Corp-related inventors


Multi-layer circuit board

A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. ... Kinsus Interconnect Technology Corp

Manufacturing method of double layer circuit board

A manufacturing method of a double layer circuit board comprises forming at least one connecting pillar on a first circuit, wherein the at least one connecting pillar comprises a first end, connected to the first circuit, and a second end, opposite to the first end; forming a substrate on the first circuit and the at least one connecting pillar; drilling the substrate to expose a portion of the second end of the at least one connecting pillar, wherein the other portion of the second end of the at least one connecting pillar is covered by the substrate; and forming a second circuit on the substrate and the portion of the second end of the at least one connecting pillar, wherein an area of the first end connected to the first circuit layer is greater than an area of the portion of the second end connected to the second circuit layer.. . ... Kinsus Interconnect Technology Corp

Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structure

A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. ... Kinsus Interconnect Technology Corp

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

A compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. ... Kinsus Interconnect Technology Corp

Double layer circuit board and manufacturing method thereof

Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar formed in and covered by the substrate. ... Kinsus Interconnect Technology Corp

Buildup board structure

A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. ... Kinsus Interconnect Technology Corp

Modified magnetic coil structure

Disclosed is a modified magnetic coil structure. A substrate, at least one circuit pattern layer and a permeability enforced ring are included. ... Kinsus Interconnect Technology Corp

Winged coil structure and method of manufacturing the same

A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. ... Kinsus Interconnect Technology Corp

Magnetic excitation coil structure

Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. ... Kinsus Interconnect Technology Corp








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