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Kla tencor Corporation
Kla tencor Corporation A Delaware Corporation
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Kla tencor Corporation patents

Recent patent applications related to Kla tencor Corporation. Kla tencor Corporation is listed as an Agent/Assignee. Note: Kla tencor Corporation may have other listings under different names/spellings. We're not affiliated with Kla tencor Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kla tencor Corporation-related inventors

Date Kla tencor Corporation patents (updated weekly) - BOOKMARK this page
12/14/17 new patent  Simultaneous multi-angle spectroscopy
12/14/17 new patent  Apparatus, techniques, and target designs for measuring semiconductor parameters
12/14/17 new patent  System and reducing the bandwidth of a laser and an inspection system and method using a laser
12/07/17System and spectral tuning of broadband light sources
12/07/17Electrically relevant placement of metrology targets using design analysis
12/07/17Systems and methods incorporating a neural network and a forward physical model for semiconductor applications
12/07/17System, method and computer program product for automatically generating a wafer image to design coordinate mapping
11/30/17System and fabricating metrology targets oriented with an angle rotated with respect to device features
11/30/17System and defect classification based on electrical design intent
11/30/17Generating simulated images from input images for semiconductor applications
11/30/17Combined patch and design-based defect detection
11/30/17System and inhibiting vuv radiative emission of a laser-sustained plasma source
11/23/17Apparatus and methods for detecting overlay errors using scatterometry
11/23/17System and compensation of illumination beam misalignment
11/23/17Systems and methods for automatic correction of drift between inspection and design for massive pattern searching
11/23/17Anti-reflection layer for back-illuminated sensor
11/16/17Scanning electron microscope and methods of inspecting and reviewing samples
11/09/17System, method and computer program product for detecting defects in a fabricated target component using consistent modulation for the target and reference components
11/09/17183nm laser and inspection system
11/02/17Measurement of semiconductor structures with capillary condensation
11/02/17Critical dimension measurements with gaseous adsorption
11/02/17Porosity measurement of semiconductor structures
11/02/17System and separation of pump light and collected light in a laser pumped light source
10/26/17Structured illumination for contrast enhancement in overlay metrology
10/26/17Apparatus and methods for finding a best aperture and mode to enhance defect detection
10/26/17Beam shaping slit for small spot size transmission small angle x-ray scatterometry
10/26/17System, method and computer program product for correcting a difference image generated from a comparison of target and reference dies
10/26/17Apparatus and methods for predicting wafer-level defect printability
10/26/17Computer assisted weak pattern detection and quantification system
10/12/17Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
10/12/17Design aware system, method and computer program product for detecting overlay-related defects in multi-patterned fabricated devices
10/12/17Permanent-magnet particle beam apparatus and method incorporating a non-magnetic metal portion for tunability
10/12/17Dual-column-parallel ccd sensor and inspection systems using a sensor
10/05/17System and wafer inspection with a noise boundary threshold
10/05/17System and defining care areas in repeating structures of design data
10/05/17Adaptive local threshold and color filtering
10/05/17Method and system for charge control for imaging floating metal structures on non-conducting substrates
10/05/17Multi-channel photomultiplier tube assembly
10/05/17Semiconductor metrology with information from multiple processing steps
10/05/17Systems and methods for automated multi-zone detection and modeling
09/28/17Methods and polarized wafer inspection
09/28/17All surface film metrology system
09/28/17System and drift compensation on an electron beam based characterization tool
09/28/17High brightness laser-sustained plasma broadband source
09/21/17New approaches in first order scatterometry overlay based on introduction of auxiliary electromagnetic fields
09/21/17System, method and computer program product for identifying fabricated component defects using a local adaptive threshold
09/07/17Methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers
09/07/17Integrated multi-pass inspection
08/31/17Method and system for detecting defects on a substrate
08/24/17Method and system for regional phase unwrapping with pattern-assisted correction
08/10/17Dynamic determination of metal film thickness from sheet resistance and tcr value
08/10/17Dynamic determination of metal film thickness from sheet resistance and tcr value
08/10/17Automatic deskew using design files or inspection images
08/10/17Field curvature correction for multi-beam inspection systems
08/10/17Inspection system using 193nm laser
08/03/17Instrumented substrate acquiring measurement parameters in high temperature process applications
08/03/17System and hyperspectral imaging metrology
08/03/17Wafer defect inspection and review systems
08/03/17Overlay variance stabilization methods and systems
08/03/17Machine learning inspecting reticles
07/27/17Focus metrology and targets which utilize transformations based on aerial images of the targets
07/20/17Systems and methods for extended infrared spectroscopic ellipsometry
07/20/17Simultaneous multi-spot inspection and imaging
07/20/17Defect sensitivity of semiconductor wafer inspectors using design data with wafer image data
07/13/17Accelerating semiconductor-related computations using learning based models
Patent Packs
07/13/17Image based specimen process control
07/13/17Generating simulated output for a specimen
07/13/17Heat-spreading blanking system for high throughput electron beam apparatus
07/06/17Systems and methods for defect detection using image reconstruction
07/06/17Optical die to database inspection
07/06/17Feature selection and automated process window monitoring through outlier detection
07/06/17Accelerated training of a machine learning based model for semiconductor applications
07/06/17Generating high resolution images from low resolution images for semiconductor applications
07/06/17Hybrid inspectors
06/29/17Shape based grouping
06/22/17Inspection systems and techniques with enhanced detection
06/22/17Adaptive alignment methods and systems
06/15/17X-ray scatterometry metrology for high aspect ratio structures
06/15/17Defect signal to noise enhancement by reducing die to die process noise
06/08/17Using three-dimensional representations for defect-related applications
Patent Packs
06/08/17Reducing registration and design vicinity induced noise for intra-die inspection
06/08/17Laser sustained plasma light source with graded absorption features
06/01/17Non-contact thermal measurements of vuv optics
06/01/17Methods to store dynamic layer content inside a design file
05/25/17Systems for providing illumination in optical metrology
05/25/17Self-moire target design principles for measuring unresolved device-like pitches
05/25/17Topographic phase control for overlay measurement
05/25/17Generating simulated images from design information
05/25/17System and electrodeless plasma ignition in laser-sustained plasma light source
05/18/17Systems and methods for region-adaptive defect detection
05/18/17Single image detection
05/18/17Laser produced plasma light source having a target material coated on a cylindrically-symmetric element
05/18/17Plasma based light source having a target material coated on a cylindrically-symmetric element
05/11/17Droplet generation for a laser produced plasma light source
05/04/17Pick-and-place head and picking work-pieces
04/27/17Multi-spot scanning collection optics
04/13/17Design based sampling and binning for yield critical defects
03/30/17Detecting defects on a wafer using defect-specific and multi-channel information
03/30/17System and laser-sustained plasma illumination
03/23/17Increasing dynamic range of a height sensor for inspection and metrology
03/23/17Adaptive automatic defect classification
03/23/17Spectroscopic beam profile overlay metrology
03/23/17Backscattered electrons (bse) imaging using multi-beam tools
03/23/17Multi-beam dark field imaging
03/23/17Method and system for noise mitigation in a multi-beam scanning electron microscopy system
03/23/17Method and system for focus adjustment of a multi-beam scanning electron microscopy system
03/23/17Systems and methods for controlling an etch process
03/16/17Method and inspecting a substrate
03/16/17Compressive sensing for metrology
03/16/17Wafer defect discovery
Social Network Patent Pack
03/09/17Method of improving lateral resolution for height sensor using differential detection technology for semiconductor inspection and metrology
03/09/17Techniques and systems for model-based critical dimension measurements
03/09/17Photocathode including silicon substrate with boron layer
03/09/17Cw duv laser with improved stability
03/02/17System and imaging a sample with an illumination source modified by a spatial selective wavelength filter
03/02/17Determining one or more characteristics of a pattern of interest on a specimen
03/02/17Verification metrology targets and their design
03/02/17Imaging performance optimization methods for semiconductor wafer inspection
03/02/17Model-based metrology using images
03/02/17193nm laser and inspection system
Patent Packs
02/23/17Broadband and wide field angle compensator
02/23/17Monitoring changes in photomask defectivity
02/16/17System, method and computer program product for calibration of metrology tools
02/16/17Process-sensitive metrology systems and methods
02/16/17Polygon-based geometry classification for semiconductor mask inspection
02/16/17Method and system for edge-of-wafer inspection and review
02/16/17Determining a position of a defect in an electron beam image
02/16/17Electron source
02/16/17Dark-field inspection using a low-noise sensor
02/09/17Periodic patterns and technique to control misalignment between two layers
02/09/17Range-based real-time scanning electron microscope non-visual binner
01/26/17Metrology target design for tilted device designs
01/26/17Automated metrology system selection
01/26/17Passivation of nonlinear optical crystals
01/19/17Optical metrology tool equipped with modulated illumination sources
01/19/17Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control
01/12/17Front quartersphere scattered light analysis
01/12/17Methods and speckle suppression in laser dark-field systems
01/05/17Measurement of multiple patterning parameters
01/05/17Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
01/05/17Power-scalable nonlinear optical wavelength converter
12/29/16Methods and measuring height on a semiconductor wafer
12/29/16Determining multi-patterning step overlay error
12/29/16System and defect detection and photoluminescence measurement of a sample
12/29/16System and production line monitoring
12/29/16System and dynamic care area generation on an inspection tool
12/29/16High efficiency laser-sustained plasma light source
12/22/16Method and system for process control with flexible sampling
12/22/16System and monitoring parameters of a semiconductor factory automation system
12/22/16Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements
Patent Packs
12/22/16Automated image-based process monitoring and control
12/22/16Pre-layer defect site review using design
12/22/16Self directed metrology and pattern classification
12/22/16Method and system for charged particle microscopy with improved image beam stabilization and interrogation
12/22/16Overlay and semiconductor process control using a wafer geometry metric
12/15/16Inspection system using 193nm laser
12/08/16Method and system for iterative defect classification
12/08/16System and providing a clean environment in an electron-optical system
12/08/16Laser repetition rate multiplier and flat-top beam profile generators using mirrors and/or prisms
12/01/16High-speed hotspot or defect imaging with a charged particle beam system
11/24/16Voltage contrast based fault and defect inference in logic chips
11/24/16Multi-oscillator, continuous cody-lorentz model of optical dispersion
11/24/16Photocathode including field emitter array on a silicon substrate with boron layer
11/17/16Optical metrology with small illumination spot size
11/17/16Sensor with electrically controllable aperture for inspection and metrology systems
11/17/16System and reducing radiation-induced false counts in an inspection system
11/17/16System and focus determination using focus-sensitive overlay targets
11/17/16Machine learning inspecting reticles
11/10/16System and oblique incidence scanning with 2d array of spots
11/10/16Model-based hot spot monitoring
Social Network Patent Pack
11/10/16Method and system for defect classification
11/10/16Method and system for aberration correction in an electron beam system
11/03/16Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing
11/03/16Computationally efficient x-ray based overlay measurement
11/03/16Multiple pin probes with support for performing parallel measurements
11/03/16Hybrid phase unwrapping patterned wafer measurement
11/03/16Intra-die defect detection
11/03/16Method and system for controlling convective flow in a light-sustained plasma
11/03/16Multi-model metrology
10/27/16Apparatus for measuring overlay errors
10/27/16Systems and methods for run-time alignment of a spot scanning wafer inspection system
10/27/16Apparatus, method and computer program product for defect detection in work pieces
10/27/16Methods of analyzing and utilizing landscapes to reduce or eliminate inaccuracy in overlay optical metrology
10/27/16Outlier detection on pattern of interest image populations
10/27/16Image sensor, an inspection system and a inspecting an article
10/20/16Spectral control system
10/13/16Photomultiplier tube, image sensor, and an inspection system using a pmt or image sensor
10/06/16Method and system for determining in-plane distortions in a substrate
10/06/16Feed forward of metrology data in a metrology system
10/06/16Back-illuminated sensor with boron layer
Social Network Patent Pack
10/06/16Optical die to database inspection
10/06/16Interleaved acousto-optical device scanning for suppression of optical crosstalk
10/06/16Sub-pixel and sub-resolution localization of defects on patterned wafers
09/29/16Model-based single parameter measurement
09/29/16Method for shape classification of an object
09/29/16Methods and determining focus
09/29/16System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
09/29/16Semiconductor inspection and metrology system using laser pulse multiplier
09/22/16Adaptive sampling for process window determination
09/22/16Systems and methods for enhancing inspection sensitivity of an inspection tool
09/22/16Sub-pixel alignment of inspection to design
09/15/16Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
09/15/16Wafer and reticle inspection selecting illumination pupil configurations
09/15/16Device metrology targets and methods
09/15/16Continuous-wave laser-sustained plasma illumination source
09/15/16Apparatus and chucking warped wafers
09/08/16All reflective wafer defect inspection and review systems and methods
09/08/16Adaptive nuisance filter
09/08/16Method and system for reducing charging artifacts in scanning electron microscopy images
09/08/16Method and inspection of scattered hot spot areas on a manufactured substrate
09/01/16End effectors and reticle handling at a high throughput
09/01/16Metrology using overlay and yield critical patterns
09/01/16Alignment of multi-beam patterning tool
08/25/16Optical metrology with reduced focus error sensitivity
08/25/16Optimizing computational efficiency by multiple truncation of spatial harmonics
08/25/16Plasma-based light source
08/18/16Prediction based chucking and lithography control optimization
08/11/16Quality estimation and improvement of imaging metrology targets
08/11/16System and high throughput work-in-process buffer
08/04/16Design based sampling and binning for yield critical defects
Social Network Patent Pack
08/04/16Method and system for imaging of a photomask through a pellicle
07/28/16Flipping apparatus, processing articles
07/28/16Symmetric target design in scatterometry overlay metrology
07/21/16Rotated boundaries of stops and targets
07/21/16Wafer inspection with focus volumetric method
07/21/16Visual feedback for inspection algorithms and filters
07/14/16System and semiconductor wafer inspection and metrology
07/14/16Measurement system optimization for x-ray based metrology
07/14/16System and inhibiting radiative emission of a laser-sustained plasma source
07/07/16Low noise, high stability, deep ultra-violet, continuous wave laser
06/30/16Alignment of inspection to design using built in targets
06/23/16Polarization measurements of metrology targets and corresponding target designs
06/23/16Line scan knife edge height sensor for semiconductor inspection and metrology
06/23/16Compound imaging metrology targets
06/16/16Passivation of nonlinear optical crystals
06/16/16Apparatus and methods for aberration correction in electron beam based system
06/09/16Spectroscopic beam profile metrology
06/09/16Lens array-based illumination for wafer inspection
06/09/16Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometry
06/09/16Automatic defect classification without sampling and feature selection
06/09/16Open plasma lamp for forming a light-sustained plasma
06/09/16Determining critical parameters using a high-dimensional variable selection model
06/09/16Chucking warped wafer with bellows
06/09/16Generating a wafer inspection process using bit failures and virtual inspection
06/02/16Inspection systems and techniques with enhanced detection
06/02/16Method and system for adaptively scanning a sample during electron beam inspection
05/26/16Dual wavelength dual interferometer with combiner-splitter
05/26/16Virtual inspection systems for process window characterization
05/19/16Method and system for measuring radiation and temperature exposure of wafers along a fabrication process line

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Kla tencor Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Kla tencor Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by