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Kla tencor Corporation
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Kla tencor Corporation patents

Recent patent applications related to Kla tencor Corporation. Kla tencor Corporation is listed as an Agent/Assignee. Note: Kla tencor Corporation may have other listings under different names/spellings. We're not affiliated with Kla tencor Corporation, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kla tencor Corporation-related inventors

Date Kla tencor Corporation patents (updated weekly) - BOOKMARK this page
03/23/17 new patent  Increasing dynamic range of a height sensor for inspection and metrology
03/23/17 new patent  Adaptive automatic defect classification
03/23/17 new patent  Spectroscopic beam profile overlay metrology
03/23/17 new patent  Backscattered electrons (bse) imaging using multi-beam tools
03/23/17 new patent  Multi-beam dark field imaging
03/23/17 new patent  Method and system for noise mitigation in a multi-beam scanning electron microscopy system
03/23/17 new patent  Method and system for focus adjustment of a multi-beam scanning electron microscopy system
03/23/17 new patent  Systems and methods for controlling an etch process
03/16/17Method and inspecting a substrate
03/16/17Compressive sensing for metrology
03/16/17Wafer defect discovery
03/09/17Method of improving lateral resolution for height sensor using differential detection technology for semiconductor inspection and metrology
03/09/17Techniques and systems for model-based critical dimension measurements
03/09/17Photocathode including silicon substrate with boron layer
03/09/17Cw duv laser with improved stability
03/02/17System and imaging a sample with an illumination source modified by a spatial selective wavelength filter
03/02/17Determining one or more characteristics of a pattern of interest on a specimen
03/02/17Verification metrology targets and their design
03/02/17Imaging performance optimization methods for semiconductor wafer inspection
03/02/17Model-based metrology using images
03/02/17193nm laser and inspection system
02/23/17Broadband and wide field angle compensator
02/23/17Monitoring changes in photomask defectivity
02/16/17System, method and computer program product for calibration of metrology tools
02/16/17Process-sensitive metrology systems and methods
02/16/17Polygon-based geometry classification for semiconductor mask inspection
02/16/17Method and system for edge-of-wafer inspection and review
02/16/17Determining a position of a defect in an electron beam image
02/16/17Electron source
02/16/17Dark-field inspection using a low-noise sensor
02/09/17Periodic patterns and technique to control misalignment between two layers
02/09/17Range-based real-time scanning electron microscope non-visual binner
01/26/17Metrology target design for tilted device designs
01/26/17Automated metrology system selection
01/26/17Passivation of nonlinear optical crystals
01/19/17Optical metrology tool equipped with modulated illumination sources
01/19/17Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control
01/12/17Front quartersphere scattered light analysis
01/12/17Methods and speckle suppression in laser dark-field systems
01/05/17Measurement of multiple patterning parameters
01/05/17Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
01/05/17Power-scalable nonlinear optical wavelength converter
12/29/16Methods and measuring height on a semiconductor wafer
12/29/16Determining multi-patterning step overlay error
12/29/16System and defect detection and photoluminescence measurement of a sample
12/29/16System and production line monitoring
12/29/16System and dynamic care area generation on an inspection tool
12/29/16High efficiency laser-sustained plasma light source
12/22/16Method and system for process control with flexible sampling
12/22/16System and monitoring parameters of a semiconductor factory automation system
12/22/16Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements
12/22/16Automated image-based process monitoring and control
12/22/16Pre-layer defect site review using design
12/22/16Self directed metrology and pattern classification
12/22/16Method and system for charged particle microscopy with improved image beam stabilization and interrogation
12/22/16Overlay and semiconductor process control using a wafer geometry metric
12/15/16Inspection system using 193nm laser
12/08/16Method and system for iterative defect classification
12/08/16System and providing a clean environment in an electron-optical system
12/08/16Laser repetition rate multiplier and flat-top beam profile generators using mirrors and/or prisms
12/01/16High-speed hotspot or defect imaging with a charged particle beam system
11/24/16Voltage contrast based fault and defect inference in logic chips
11/24/16Multi-oscillator, continuous cody-lorentz model of optical dispersion
11/24/16Photocathode including field emitter array on a silicon substrate with boron layer
11/17/16Optical metrology with small illumination spot size
Patent Packs
11/17/16Sensor with electrically controllable aperture for inspection and metrology systems
11/17/16System and reducing radiation-induced false counts in an inspection system
11/17/16System and focus determination using focus-sensitive overlay targets
11/17/16Machine learning inspecting reticles
11/10/16System and oblique incidence scanning with 2d array of spots
11/10/16Model-based hot spot monitoring
11/10/16Method and system for defect classification
11/10/16Method and system for aberration correction in an electron beam system
11/03/16Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing
11/03/16Computationally efficient x-ray based overlay measurement
11/03/16Multiple pin probes with support for performing parallel measurements
11/03/16Hybrid phase unwrapping patterned wafer measurement
11/03/16Intra-die defect detection
11/03/16Method and system for controlling convective flow in a light-sustained plasma
11/03/16Multi-model metrology
Patent Packs
10/27/16Apparatus for measuring overlay errors
10/27/16Systems and methods for run-time alignment of a spot scanning wafer inspection system
10/27/16Apparatus, method and computer program product for defect detection in work pieces
10/27/16Methods of analyzing and utilizing landscapes to reduce or eliminate inaccuracy in overlay optical metrology
10/27/16Outlier detection on pattern of interest image populations
10/27/16Image sensor, an inspection system and a inspecting an article
10/20/16Spectral control system
10/13/16Photomultiplier tube, image sensor, and an inspection system using a pmt or image sensor
10/06/16Method and system for determining in-plane distortions in a substrate
10/06/16Feed forward of metrology data in a metrology system
10/06/16Back-illuminated sensor with boron layer
10/06/16Optical die to database inspection
10/06/16Interleaved acousto-optical device scanning for suppression of optical crosstalk
10/06/16Sub-pixel and sub-resolution localization of defects on patterned wafers
09/29/16Model-based single parameter measurement
09/29/16Method for shape classification of an object
09/29/16Methods and determining focus
09/29/16System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
09/29/16Semiconductor inspection and metrology system using laser pulse multiplier
09/22/16Adaptive sampling for process window determination
09/22/16Systems and methods for enhancing inspection sensitivity of an inspection tool
09/22/16Sub-pixel alignment of inspection to design
09/15/16Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate
09/15/16Wafer and reticle inspection selecting illumination pupil configurations
09/15/16Device metrology targets and methods
09/15/16Continuous-wave laser-sustained plasma illumination source
09/15/16Apparatus and chucking warped wafers
09/08/16All reflective wafer defect inspection and review systems and methods
09/08/16Adaptive nuisance filter
09/08/16Method and system for reducing charging artifacts in scanning electron microscopy images
Social Network Patent Pack
09/08/16Method and inspection of scattered hot spot areas on a manufactured substrate
09/01/16End effectors and reticle handling at a high throughput
09/01/16Metrology using overlay and yield critical patterns
09/01/16Alignment of multi-beam patterning tool
08/25/16Optical metrology with reduced focus error sensitivity
08/25/16Optimizing computational efficiency by multiple truncation of spatial harmonics
08/25/16Plasma-based light source
08/18/16Prediction based chucking and lithography control optimization
08/11/16Quality estimation and improvement of imaging metrology targets
08/11/16System and high throughput work-in-process buffer
Patent Packs
08/04/16Design based sampling and binning for yield critical defects
08/04/16Method and system for imaging of a photomask through a pellicle
07/28/16Flipping apparatus, processing articles
07/28/16Symmetric target design in scatterometry overlay metrology
07/21/16Rotated boundaries of stops and targets
07/21/16Wafer inspection with focus volumetric method
07/21/16Visual feedback for inspection algorithms and filters
07/14/16System and semiconductor wafer inspection and metrology
07/14/16Measurement system optimization for x-ray based metrology
07/14/16System and inhibiting radiative emission of a laser-sustained plasma source
07/07/16Low noise, high stability, deep ultra-violet, continuous wave laser
06/30/16Alignment of inspection to design using built in targets
06/23/16Polarization measurements of metrology targets and corresponding target designs
06/23/16Line scan knife edge height sensor for semiconductor inspection and metrology
06/23/16Compound imaging metrology targets
06/16/16Passivation of nonlinear optical crystals
06/16/16Apparatus and methods for aberration correction in electron beam based system
06/09/16Spectroscopic beam profile metrology
06/09/16Lens array-based illumination for wafer inspection
06/09/16Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometry
06/09/16Automatic defect classification without sampling and feature selection
06/09/16Open plasma lamp for forming a light-sustained plasma
06/09/16Determining critical parameters using a high-dimensional variable selection model
06/09/16Chucking warped wafer with bellows
06/09/16Generating a wafer inspection process using bit failures and virtual inspection
06/02/16Inspection systems and techniques with enhanced detection
06/02/16Method and system for adaptively scanning a sample during electron beam inspection
05/26/16Dual wavelength dual interferometer with combiner-splitter
05/26/16Virtual inspection systems for process window characterization
05/19/16Method and system for measuring radiation and temperature exposure of wafers along a fabrication process line
Patent Packs
05/19/16Inspection system and method using an off-axis unobscured objective lens
05/19/16System and enhanced defect detection with a digital matched filter
05/19/16Photomultiplier tube (pmt) having a reflective photocathode array
05/19/16System, method and computer program product for combining raw data from multiple metrology tools
05/12/16Optimizing the utilization of metrology tools
05/05/16Illumination system, inspection tool with illumination system, and operating an illumination system
05/05/16Measurement systems having linked field and pupil signal detection
05/05/16Wafer defect discovery
05/05/16Apparatus and methods for optics protection from debris in plasma-based light source
04/28/16Automated pattern fidelity measurement plan generation
04/28/16Automated decision-based energy-dispersive x-ray methodology and apparatus
04/28/16Image based signal response metrology
04/28/16Signal response metrology for image based and scatterometry overlay measurements
04/21/16Metrology of multiple patterning processes
04/21/16Measurement of small box size targets
04/21/16Dynamic binning for diversification and defect discovery
04/21/16Critical dimension uniformity enhancement techniques and apparatus
04/14/16Focus measurements using scatterometry metrology
04/14/16Defect detection using structural information
04/07/16Tdi sensor in a darkfield system
Social Network Patent Pack
04/07/16183nm laser and inspection system
03/31/16Wafer edge inspection with trajectory following edge profile
03/31/16Integrated multi-pass inspection
03/31/16Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
03/24/16Periodic patterns and technique to control misalignment between two layers
03/24/16Metrology imaging targets having reflection-symmetric pairs of reflection-asymmetric structures
03/24/16Wafer notch detection
03/17/16Method for correcting position measurements for optical errors and determining mask writer errors
03/10/16Detecting defects on a wafer using defect-specific information
03/10/16Enhanced patterned wafer geometry measurements based design improvements for optimal integrated chip fabrication performance
03/03/16Repeater detection
03/03/16Array mode repeater detection
03/03/16Breakdown analysis of geometry induced overlay and utilization of breakdown analysis for improved overlay control
03/03/16Scanning electron microscope and methods of inspecting and reviewing samples
03/03/16Method and system for controlling convection within a plasma cell
02/25/16System and apodization in a semiconductor device inspection system
02/25/16193nm laser and an inspection system using a 193nm laser
02/18/16Apparatus and methods for detecting overlay errors using scatterometry
02/18/16Image acquisition system, image acquisition method, and inspection system
02/11/16Target and process sensitivity analysis to requirements
Social Network Patent Pack
02/04/16Inspection for multiple process steps in a single inspection process
01/28/16System and simultaneous dark field and phase contrast inspection
01/28/16Compressive sensing with illumination patterning
01/28/16Virtual inspection systems with multiple modes
01/28/16Determining coordinates for an area of interest on a specimen
01/28/16Detecting defects on a wafer using defect-specific and multi-channel information
01/28/16High resolution high quantum efficiency electron bombarded ccd or cmos imaging sensor
01/21/16Identifying registration errors of dsa lines
01/14/16System for electron beam detection
01/14/16Apparatus and methods for predicting wafer-level defect printability
01/07/16Signal response metrology based on measurements of proxy structures
01/07/16Structured illumination for contrast enhancement in overlay metrology
12/31/15Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate
12/31/15Defect detection using surface enhanced electric field
12/31/15Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
12/24/15Confocal line inspection optical system
12/24/15Wafer inspection
12/24/15In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
12/24/15Automated inline inspection of wafer edge strain profiles using rapid photoreflectance spectroscopy
12/24/15Laser repetition rate multiplier and flat-top beam profile generators using mirrors and/or prisms
12/17/15Automatic recipe stability monitoring and reporting
12/17/15Extracting comprehensive design guidance for in-line process control tools and methods
12/17/15Semiconductor inspection and metrology system using laser pulse multiplier
12/10/15Miniaturized imaging wafer edge
12/10/15Broadband light source including transparent portion with high hydroxide content
11/26/15Pillar-supported array of micro electron lenses
11/26/15Electron beam imaging with dual wien-filter monochromator
11/19/15Library expansion system, method, and computer program product for metrology
11/19/15Method and producing and measuring dynamically focused, steered, and shaped oblique laser illumination for spinning wafer inspection system
11/19/15Defect sampling for electron beam review based on defect attributes from optical inspection and optical review
Social Network Patent Pack
11/19/15Wafer edge detection and inspection
11/19/15High power broadband light source
11/12/15Signal response metrology for scatterometry based overlay measurements
11/12/15Apparatus, techniques, and target designs for measuring semiconductor parameters
11/12/15Automatic calibration sample selection for die-to-database photomask inspection
11/12/15Reticle inspection using near-field recovery
11/12/15Inspection recipe setup from reference image variation
11/12/15Using high resolution full die image data for inspection
11/05/15Method and system for intrinsic led heating for measurement
11/05/15Removing process-variation-related inaccuracies from scatterometry measurements
11/05/15Light-emitting device test systems
11/05/15Apodization for pupil imaging scatterometry
10/29/15Target element types for process parameter metrology
10/29/15Method, system and computer program product for generating high density registration maps for masks
10/22/15Patterned wafer geometry measurements for semiconductor process controls
10/22/15Pick and place device with automatic pick-up-height adjustment and a method and a computer program product to automatically adjust the pick-up-height of a pick and place device
10/22/15Multi-stage ramp-up annealing for frequency-conversion crystals
10/22/15Periodic patterns and techniques to control misalignment between two layers
10/22/15Scatterometry-based imaging and critical dimension metrology
10/22/15On-product derivation and adjustment of exposure parameters in a directed self-assembly process
10/22/15Predictive modeling based focus error prediction
10/15/15Estimating and eliminating inter-cell process variation inaccuracy
10/15/15Pattern suppression in logic for wafer inspection
10/08/15Multiple angles of incidence semiconductor metrology systems and methods
10/01/15Variable image field curvature for object inspection
10/01/15Delta die and delta database inspection
10/01/15Production sample shaping that preserves re-normalizability
10/01/15Notched magnetic lens for improved sample access in an sem
10/01/15Open plasma lamp for forming a light-sustained plasma

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Kla tencor Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Kla tencor Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by