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Kla tencor Corporation patents


Recent patent applications related to Kla tencor Corporation. Kla tencor Corporation is listed as an Agent/Assignee. Note: Kla tencor Corporation may have other listings under different names/spellings. We're not affiliated with Kla tencor Corporation, we're just tracking patents.

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System and generation of wafer inspection critical areas

A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one... Kla tencor Corporation

High sensitivity repeater defect detection

Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle... Kla tencor Corporation

Method and computer program product for controlling the positioning of patterns on a substrate in a manufacturing process

In a method for controlling the positioning of patterns on a substrate in a manufacturing process at least one registration measurement is conducted with a registration tool on at least one pattern formed in at least one layer on the substrate by a previous process step of the manufacturing process.... Kla tencor Corporation

Hybrid metrology for patterned wafer characterization

Methods and systems for evaluating the geometric characteristics of patterned structures are presented. More specifically, geometric structures generated by one or multiple patterning processes are measured by two or more metrology systems in accordance with a hybrid metrology methodology. A measurement result from one metrology system is communicated to at... Kla tencor Corporation

Calibration of a small angle x-ray scatterometry based metrology system

Methods and systems for calibrating the location of x-ray beam incidence onto a specimen in an x-ray scatterometry metrology system are described herein. The precise location of incidence of the illumination beam on the surface of the wafer is determined based on occlusion of the illumination beam by two or... Kla tencor Corporation

Method and system for generating programmed defects for use in metrology measurements

A system for generating and implementing programmed defects includes a lithography tool configured to form a multi-pattern structure including a first array pattern and a second array pattern on a sample. The first array pattern or the second array pattern contains a programmed defect to differentiate the first array pattern... Kla tencor Corporation

Quantifying and reducing total measurement uncertainty

A process control technique uses production data from multiple manufacturing tools and multiple inspection or metrology tools. Total measurement uncertainty (TMU) can be calculated on the production data, which can include measurements of one or more devices manufactured using the manufacturing tools. Manufacturing steps can be ranked or otherwise compared... Kla tencor Corporation

Method and system for defect classification

Defect classification includes acquiring one or more images of a specimen, receiving a manual classification of one or more training defects based on one or more attributes of the one or more training defects, generating an ensemble learning classifier based on the received manual classification and the attributes of the... Kla tencor Corporation

Process condition sensing device and plasma chamber

A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma... Kla tencor Corporation

High brightness laser-sustained plasma broadband source

A high brightness laser-sustained broadband light source includes a gas containment structure and a pump laser configured to generate a pump beam including illumination of a wavelength at least proximate to a weak absorption line of a neutral gas contained in the gas containment structure. The broadband light source includes... Kla tencor Corporation

Process modules integrated into a metrology and/or inspection tool

Systems and methods for performing one or more processes on a specimen are provided. One system includes a deposition module incorporated into an existing tool configured to perform an inspection and/or metrology process. The deposition module is configured to deposit one or more materials on a specimen prior to the... Kla tencor Corporation

Scanning in angle-resolved reflectometry and algorithmically eliminating diffraction from optical metrology

Angle-resolved reflectometers and reflectometry methods are provided, which comprise a coherent light source, an optical system arranged to scan a test pattern using a spot of coherent light from the light source to yield realizations of the light distribution in the collected pupil, wherein the spot covers a part of... Kla tencor Corporation

Optimizing training sets used for setting up inspection-related algorithms

Methods and systems for training an inspection-related algorithm are provided. One system includes one or more computer subsystems configured for performing an initial training of an inspection-related algorithm with a labeled set of defects thereby generating an initial version of the inspection-related algorithm and applying the initial version of the... Kla tencor Corporation

Full beam metrology for x-ray scatterometry systems

Methods and systems for characterizing dimensions and material properties of semiconductor devices by full beam x-ray scatterometry are described herein. A full beam x-ray scatterometry measurement involves illuminating a sample with an X-ray beam and detecting the intensities of the resulting zero diffraction order and higher diffraction orders simultaneously for... Kla tencor Corporation

Defect review sampling and normalization based on defect and design attributes

A decision tree and normalized reclassification are used to classify defects. Defect review sampling and normalization can be used for accurate Pareto ranking and defect source analysis. A defect review system, such as a broadband plasma tool, and a controller can be used to bin defects using the decision tree... Kla tencor Corporation

Diagnostic deep learning models configured for semiconductor applications

Methods and systems for performing diagnostic functions for a deep learning model are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a deep learning model configured for determining information from an image generated for a specimen by... Kla tencor Corporation

Multi-column electron beam lithography including field emitters on a silicon substrate with boron layer

A multi-column electron beam device includes an electron source comprising multiple field emitters fabricated on a surface of a silicon substrate. To prevent oxidation of the silicon, a thin, contiguous boron layer is disposed directly on the output surface of the field emitters. The field emitters can take various shapes... Kla tencor Corporation

Methods and systems for chucking a warped wafer

Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible bellows that move above the chuck and into contact with a warped substrate. The bellows seal and vacuum clamp onto the backside surface of the... Kla tencor Corporation

Metrology process control

Methods and systems for estimating values of parameters of interest based on repeated measurements of a wafer during a process interval are presented herein. In one aspect, one or more optical metrology subsystems are integrated with a process tool, such as an etch tool or a deposition tool. Values of... Kla tencor Corporation

Periodic patterns and technique to control misalignment between two layers

A method and system to measure misalignment error between two overlying or interlaced periodic structures are proposed. The overlying or interlaced periodic structures are illuminated by incident radiation, and the diffracted radiation of the incident radiation by the overlying or interlaced periodic structures are detected to provide an output signal.... Kla tencor Corporation

Metrology system calibration refinement

Methods and systems for matching measurement spectra across one or more optical metrology systems are presented. The values of one or more system parameters used to determine the spectral response of a specimen to a measurement performed by a target metrology system are optimized. The system parameter values are optimized... Kla tencor Corporation

Phase contrast monitoring for extreme ultra-violet (euv) masks defect inspection

Disclosed are methods and apparatus for inspecting an extreme ultraviolet (EUV) reticle using an optical inspection tool. An inspection tool having a pupil filter positioned at an imaging pupil is used to obtain a test image or signal from an output beam that is reflected and scattered from a test... Kla tencor Corporation

Three-dimensional imaging for semiconductor wafer inspection

Methods and systems for improved detection and classification of defects of interest (DOI) on semiconductor wafers based on three-dimensional images are described herein. Three dimensional imaging of volumes of thick, layered structures enables accurate defect detection and estimation of defect location in three dimensions at high throughput. A series of... Kla tencor Corporation

Spectroscopy with tailored spectral sampling

A spectrometer for tailored spectral sampling includes a dispersive element for spatially dispersing a spectrum of a light beam, a detector including a plurality of pixels distributed along a sampling direction, and a spectrum reshaping element including at least one of a reflective surface or a transmissive surface for reshaping... Kla tencor Corporation

System and process-induced distortion prediction during wafer deposition

A system is disclosed. The system includes a tool cluster. The tool cluster includes a first deposition tool configured to deposit a first layer on a wafer. The tool cluster additionally includes an interferometer tool configured to obtain one or more measurements of the wafer. The tool cluster additionally includes... Kla tencor Corporation

Optical near-field metrology

Systems and methods are provided which utilize optical microcavity probes to map wafer topography by near-field interactions therebetween in a manner which complies with high volume metrology requirements. The optical microcavity probes detect features on a wafer by shifts in an interference signal between reference radiation and near-field interactions of... Kla tencor Corporation

Infrared spectroscopic reflectometer for measurement of high aspect ratio structures

Methods and systems for performing spectroscopic reflectometry measurements of semiconductor structures at infrared wavelengths are presented herein. In some embodiments measurement wavelengths spanning a range from 750 nanometers to 2,600 nanometers, or greater, are employed. In one aspect, reflectometry measurements are performed at oblique angles to reduce the influence of... Kla tencor Corporation

Defect marking for semiconductor wafer inspection

Methods and systems for accurately locating buried defects previously detected by an inspection system are described herein. A physical mark is made on the surface of a wafer near a buried defect detected by an inspection system. In addition, the inspection system accurately measures the distance between the detected defect... Kla tencor Corporation

Method for defocus detection

Two or more color data can be combined to form a new data source to enhance sensitivity to defocus signal. Defocus detection can be performed on the newly formed data source. In a setup step, a training wafer can be used to select the best color combination, and obtain defocus... Kla tencor Corporation

Measurement of overlay and edge placement errors with an electron beam column array

Methods and systems for performing measurements of multiple die with an array of electron beam columns are presented herein. The wafer is scanned in a direction parallel to the die rows disposed on the wafer. The electron beam measurement columns are spatially separated in a column alignment direction. The wafer... Kla tencor Corporation

Power-conserving clocking for scanning sensors

A time delay and integration charge coupled device includes an array of pixels and a clock generator. The array of pixels is distributed in a scan direction and a line direction perpendicular to the scan direction in which at least some of the pixels of the array include three or... Kla tencor Corporation

Critical dimension uniformity monitoring for extreme ultra-violet reticles

Disclosed are methods and apparatus for facilitating an inspection of a sample using an inspection tool. An inspection tool is used to obtain an image or signal from an EUV reticle that specifies an intensity variation across the EUV reticle, and this intensity variation is converted to a CD variation... Kla tencor Corporation

Self-moiré target design principles for measuring unresolved device-like pitches

Metrology targets and methods are provided, which provide self-Moiré measurements of unresolved target features, i.e., interaction of electromagnetic fields re-scattered off elements within a single target layer provides signals with Moiré pitches that are measurable, although the actual target pitches are unresolved and possibly device-like. Targets comprise cell(s) with interlaced... Kla tencor Corporation

Apparatus and methods for inspecting reticles

Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire a plurality of images at different imaging configurations from each of a plurality of pattern areas of a test reticle. A reticle near field is recovered for each of the pattern areas... Kla tencor Corporation

Simultaneous multi-directional laser wafer inspection

Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of... Kla tencor Corporation

03/15/18 / #20180075594

Convolutional neural network-based mode selection and defect classification for image fusion

Systems and methods for classifying defects using hot scans and convolutional neural networks (CNNs) are disclosed. Primary scanning modes are identified by a processor and a hot scan of a wafer is performed. Defects of interest and nuisance data are selected and images of those areas are captured using one... Kla tencor Corporation

03/08/18 / #20180067058

Speed enhancement of chromatic confocal metrology

Systems and methods for height measurements, such as those for bumps, pillars, or film thickness, can use chromatic confocal techniques. The system can include a white light source that emits white light and lenses that vary a focal distance of each wavelength of the white light from the white light... Kla tencor Corporation

03/08/18 / #20180067377

Power-scalable nonlinear optical wavelength converter

A system includes a nonlinear crystal positioned such that a focus of a laser beam is outside the nonlinear crystal in at least one plane perpendicular to a beam propagation direction of the laser beam. The nonlinear crystal is disposed in a crystal mount assembly. A laser beam may be... Kla tencor Corporation

03/08/18 / #20180068825

Apparatus and correcting arrayed astigmatism in a multi-column scanning electron microscopy system

A multi-beam scanning electron microscopy (SEM) system is disclosed. The system includes an electron beam source configured to generate a source electron beam. The system includes a set of electron-optical elements configured to generate a flood electron beam from the source electron beam. The system includes a multi-beam lens array... Kla tencor Corporation

03/08/18 / #20180070040

Sensor with electrically controllable aperture for inspection and metrology systems

Pixel aperture size adjustment in a linear sensor is achieved by applying more negative control voltages to central regions of the pixel's resistive control gate, and applying more positive control voltages to the gate's end portions. These control voltages cause the resistive control gate to generate an electric field that... Kla tencor Corporation

03/01/18 / #20180059019

Model based optical measurements of semiconductor structures with anisotropic dielectric permittivity

Methods and systems for performing optical, model based measurements of a small sized semiconductor structure employing an anisotropic characterization of the optical dispersion properties of one or more materials comprising the structure under measurement are presented herein. This reduces correlations among geometric parameters and results in improved measurement sensitivity, improved... Kla tencor Corporation

03/01/18 / #20180059033

Apparatus for high-speed imaging sensor data transfer

An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on... Kla tencor Corporation

03/01/18 / #20180061691

Spectral reflectometry for in-situ process monitoring and control

Methods and systems for performing in-situ, selective spectral reflectometry (SSR) measurements of semiconductor structures disposed on a wafer are presented herein. Illumination light reflected from a wafer surface is spatially imaged. Signals from selected regions of the image are collected and spectrally analyzed, while other portions of the image are... Kla tencor Corporation

02/22/18 / #20180051984

Measurement of multiple patterning parameters

Methods and systems for evaluating the performance of multiple patterning processes are presented. Patterned structures are measured and one or more parameter values characterizing geometric errors induced by the multiple patterning process are determined. In some examples, a single patterned target and a multiple patterned target are measured, the collected... Kla tencor Corporation

02/22/18 / #20180052045

Method and system for measuring radiation and temperature exposure of wafers along a fabrication process line

A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement... Kla tencor Corporation

02/22/18 / #20180052099

System and generating multi-channel tunable illumination from a broadband source

A metrology system includes an illumination source to generate an illumination beam, a multi-channel spectral filter, a focusing element to direct illumination from the single optical column to a sample, and at least one detector to capture the illumination collected from the sample. The multi-channel spectral filter includes two or... Kla tencor Corporation

02/22/18 / #20180052118

Virtual inspection systems with multiple modes

Methods and systems for determining one or more characteristics for defects detected on a specimen are provided. One system includes one or more computer subsystems configured for identifying a first defect that was detected on a specimen by an inspection system with a first mode but was not detected with... Kla tencor Corporation

02/22/18 / #20180052189

Multi-pin dense array resistivity probe

Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection... Kla tencor Corporation

02/15/18 / #20180045837

System and reducing radiation-induced false counts in an inspection system

An inspection system with radiation-induced false count mitigation includes a radiation count controller coupled to one or more radiation sensors positioned proximate to an illumination sensor oriented to detect illumination from a sample. The radiation count controller may identify a set of radiation detection events based on radiation signals received... Kla tencor Corporation

02/15/18 / #20180045932

Off-axis reflective afocal optical relay

An optical relay system includes four or more reflective optical elements oriented in a tilted configuration. Each of the four or more reflective optical elements is tilted about one of four or more tilt axes. Further, the four or more tilt axes are oriented to correct for aberrations induced by... Kla tencor Corporation

02/15/18 / #20180047646

Accuracy improvements in optical metrology

Methods, metrology modules and target designs are provided, which improve the accuracy of metrology measurements. Methods provide flexible handling of multiple measurement recipes and setups and enable relating them to landscape features that indicate their relation to resonance regions and to flat regions. Clustering of recipes, self-consistency tests, common processing... Kla tencor Corporation

02/15/18 / #20180047857

Back-illuminated sensor with boron layer

An inspection system including an optical system (optics) to direct light from an illumination source to a sample, and to direct light reflected/scattered from the sample to one or more image sensors. At least one image sensor of the system is formed on a semiconductor membrane including an epitaxial layer... Kla tencor Corporation

02/08/18 / #20180038803

Surface defect inspection with large particle monitoring and laser power control

Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while... Kla tencor Corporation

02/08/18 / #20180040518

Oven enclosure for optical components with integrated purge gas pre-heater

A cartridge in an oven enclosure includes a pre-heating feature for an incoming purge gas before the purge gas enters the space around an optical component, such as a nonlinear optical crystal, in an oven cell. The incoming purge gas can be pre-heated as it travels along a gas pathway... Kla tencor Corporation

02/01/18 / #20180031424

Simultaneous capturing of overlay signals from multiple targets

Metrology methods and systems are provided, in which the detected image is split at a field plane of the collection path of the metrology system's optical system into at least two pupil plane images. Optical elements such as prisms may be used to split the field plane images, and multiple... Kla tencor Corporation

02/01/18 / #20180031470

Control of amplitude and phase of diffraction orders using polarizing targets and polarized illumination

Metrology scatterometry targets, optical systems and corresponding metrology tools and measurement methods are provided. Targets and/or optical systems are designed to enhance first order diffraction signals with respect to a zeroth order diffraction signal from the scatterometry target by creating a phase shift of 180° between zeroth order diffraction signals... Kla tencor Corporation

02/01/18 / #20180032662

Metrology target identification, design and verification

A semiconductor fabrication system includes a target design device and a multi-stage fabrication tool configured to fabricate one or more layers of a sample using the fabrication process. The target design device receives metrology design rules associated with a metrology tool in which the metrology design rules include criteria for... Kla tencor Corporation

01/25/18 / #20180021818

Apparatus and cleaning wafer handling equipment

A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the... Kla tencor Corporation

01/25/18 / #20180023950

Analyzing root causes of process variation in scatterometry metrology

Method, metrology modules and RCA tool are provided, which use the behavior of resonance region(s) in measurement landscapes to evaluate and characterize process variation with respect to symmetric and asymmetric factors, and provide root cause analysis of the process variation with respect to process steps. Simulations of modeled stacks with... Kla tencor Corporation

01/25/18 / #20180025952

Reverse decoration for defect detection amplification

Reverse decoration can be used to detect defects in a device. The wafer can include NAND stacks or other devices. The defect can be a channel bridge, a void, or other types of defects. Reverse decoration can preserve a defect and/or can improve defect detection. A portion of a layer... Kla tencor Corporation

01/18/18 / #20180017873

Method for computer modeling and simulation of negative-tone-developable photoresists

In some embodiments, a method may include improving a development process of a photoresist. The method may include simulating a negative-tone development process of a photoresist. The method may include determining a reaction of a developer with a soluble photoresist surface. Determining the reaction of the developer may include applying... Kla tencor Corporation

01/04/18 / #20180003630

Scatterometry generating non-overlapping and non-truncated diffraction images

A scatterometry measurement system includes an objective lens with a central obscuration and an illumination source configured to illuminate a scatterometry target through the objective lens with a first illumination beam at a first illumination angle and a second illumination beam at a second illumination angle in which the scatterometry... Kla tencor Corporation

01/04/18 / #20180003647

Block-to-block reticle inspection

Block-to-block reticle inspection includes acquiring a swath image of a portion of a reticle with a reticle inspection sub-system, identifying a first occurrence of a block in the swatch image and at least a second occurrence of the block in the swath image substantially similar to the first occurrence of... Kla tencor Corporation

01/04/18 / #20180003648

Apparatus and methods for combined brightfield, darkfield, and photothermal inspection

Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has... Kla tencor Corporation

01/04/18 / #20180005367

Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression

Systems and methods for removing nuisance data from a defect scan of a wafer are disclosed. A processor receives a design file corresponding to a wafer having one or more z-layers. The processor receives critical areas of the wafer and instructs a subsystem to capture corresponding images of the wafer.... Kla tencor Corporation

Patent Packs
01/04/18 / #20180005791

High brightness boron-containing electron beam emitters for use in a vacuum environment

An emitter containing a metal boride material has an at least partly rounded tip with a radius of 1 μm or less. An electric field can be applied to the emitter and an electron beam is generated from the emitter. To form the emitter, material is removed from a single... Kla tencor Corporation

12/21/17 / #20170365495

Encapsulated instrumented substrate acquiring measurement parameters in high temperature process applications

An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium... Kla tencor Corporation

12/14/17 / #20170356800

Simultaneous multi-angle spectroscopy

Methods and systems for performing simultaneous spectroscopic measurements of semiconductor structures over a broad range of angles of incidence (AOI), azimuth angles, or both, are presented herein. Spectra including two or more sub-ranges of angles of incidence, azimuth angles, or both, are simultaneously measured over different sensor areas at high... Kla tencor Corporation

12/14/17 / #20170356853

Apparatus, techniques, and target designs for measuring semiconductor parameters

In one embodiment, apparatus and methods for determining a parameter of a target are disclosed. A target having an imaging structure and a scatterometry structure is provided. An image of the imaging structure is obtained with an imaging channel of a metrology tool. A scatterometry signal is also obtained from... Kla tencor Corporation

12/14/17 / #20170356854

System and reducing the bandwidth of a laser and an inspection system and method using a laser

A DUV laser includes an optical bandwidth filtering device, such as etalon, which is disposed outside of the laser oscillator cavity of the fundamental laser, and which directs one range of wavelengths into one portion of a frequency conversion chain and another range of wavelengths into another portion of the... Kla tencor Corporation

12/07/17 / #20170350575

System and spectral tuning of broadband light sources

A tunable spectral filter includes a first tunable dispersive element, a first optical element, a spatial filtering element located at the focal plane, a second optical element, and a second dispersive element. The first tunable dispersive element introduces spectral dispersion to an illumination beam with an adjustable dispersion. The first... Kla tencor Corporation

12/07/17 / #20170351804

Electrically relevant placement of metrology targets using design analysis

Methods and systems for determining electrically relevant placement of metrology targets using design analysis are disclosed. The method may include: identifying at least one critical design element of an integrated circuit based on a design of the integrated circuit; determining whether the design of the integrated circuit allows for an... Kla tencor Corporation

12/07/17 / #20170351952

Systems and methods incorporating a neural network and a forward physical model for semiconductor applications

Methods and systems for training a neural network are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a neural network configured for determining inverted features of input images in a training set for a specimen input to... Kla tencor Corporation

12/07/17 / #20170352146

System, method and computer program product for automatically generating a wafer image to design coordinate mapping

A system, method, and computer program product are provided for automatically generating a wafer image to design coordinate mapping. In use, a design of a wafer is received by a computer processor. In addition, an image of a wafer fabricated from the design is received by the computer processor. Further,... Kla tencor Corporation

11/30/17 / #20170343903

System and fabricating metrology targets oriented with an angle rotated with respect to device features

A lithography system includes an illumination source including two illumination poles separated along a first direction and symmetrically distributed around an optical axis, a pattern mask to receive illumination from the illumination source, and a set of projection optics to generate an image corresponding to the pattern mask onto a... Kla tencor Corporation

11/30/17 / #20170344695

System and defect classification based on electrical design intent

A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the... Kla tencor Corporation

11/30/17 / #20170345140

Generating simulated images from input images for semiconductor applications

Methods and systems for generating a simulated image from an input image are provided. One system includes one or more computer subsystems and one or more components executed by the one or more computer subsystems. The one or more components include a neural network that includes two or more encoder... Kla tencor Corporation

11/30/17 / #20170345142

Combined patch and design-based defect detection

Defect detection is performed by comparing a test image and a reference image with a rendered design image, which may be generated from a design file. This may occur because a comparison of the test image and another reference image was inconclusive due to noise. The results of the two... Kla tencor Corporation

11/30/17 / #20170345639

System and inhibiting vuv radiative emission of a laser-sustained plasma source

A system for forming a laser-sustained plasma includes a gas containment element, an illumination source configured to generate pump illumination, and a collector element configured to focus the pump illumination from the pumping source into the volume of the gas mixture in order to generate a plasma within the volume... Kla tencor Corporation

11/23/17 / #20170336198

Apparatus and methods for detecting overlay errors using scatterometry

Disclosed is a method for determining an overlay error between at least two layers in a multiple layer sample. An imaging optical system is used to measure multiple measured optical signals from multiple periodic targets on the sample, and the targets each have a first structure in a first layer... Kla tencor Corporation

Patent Packs
11/23/17 / #20170336329

System and compensation of illumination beam misalignment

A system includes a beam steering assembly configured to adjust an incident beam to form a corrected beam; a beam monitoring assembly configured to generate monitoring data for the corrected beam including one or more offset parameters of the corrected beam; and a controller configured to store one or more... Kla tencor Corporation

11/23/17 / #20170337673

Systems and methods for automatic correction of drift between inspection and design for massive pattern searching

Systems and methods for automatic correction of drift between inspection and design for massive pattern searching are disclosed herein. Defects are identified in a scan of a wafer. The defects are associated with tool coordinates. An SEM review tool captures centered images of the defects. The SEM review tool is... Kla tencor Corporation

11/23/17 / #20170338257

Anti-reflection layer for back-illuminated sensor

An image sensor for short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. An anti-reflection or protective layer is formed on top of the pure boron layer. This image sensor... Kla tencor Corporation

11/16/17 / #20170329025

Scanning electron microscope and methods of inspecting and reviewing samples

A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain... Kla tencor Corporation

11/09/17 / #20170323434

System, method and computer program product for detecting defects in a fabricated target component using consistent modulation for the target and reference components

A fabricated device having consistent modulation between target and reference components is provided. The fabricated device includes a target component having a first modulation. The fabricated device further includes at least two reference components for the target component including a first reference component and a second reference component, where the... Kla tencor Corporation

11/09/17 / #20170323716

183nm laser and inspection system

A laser assembly for generating laser output light at an output wavelength of approximately 183 nm includes a fundamental laser, an optical parametric system (OPS), a fifth harmonic generator, and a frequency mixing module. The fundamental laser generates fundamental light at a fundamental frequency. The OPS generates a down-converted signal... Kla tencor Corporation

11/02/17 / #20170314912

Measurement of semiconductor structures with capillary condensation

Methods and systems for performing optical measurements of geometric structures filled by a capillary condensation process are presented herein. Measurements are performed while the structures under measurement are treated with a flow of purge gas that includes a controlled amount of fill material. A portion of the fill material condenses... Kla tencor Corporation

11/02/17 / #20170314913

Critical dimension measurements with gaseous adsorption

Methods and systems for performing optical measurements of geometric structures filled with an adsorbate by a gaseous adsorption process are presented herein. Measurements are performed while the metrology target under measurement is treated with a flow of purge gas that includes a controlled amount of fill material. A portion of... Kla tencor Corporation

11/02/17 / #20170315044

Porosity measurement of semiconductor structures

Methods and systems for performing optical measurements of the porosity of geometric structures filled with a fill material by a capillary condensation process are presented herein. Measurements are performed while the structure under measurement is treated with a flow of purge gas that includes a controlled amount of vaporized fill... Kla tencor Corporation

11/02/17 / #20170315369

System and separation of pump light and collected light in a laser pumped light source

A system for separating plasma pumping light and collected broadband light includes a pump source configured to generate pumping illumination including at least a first wavelength, a gas containment element for containing a volume of gas, a collector configured to focus the pumping illumination from the pumping source into the... Kla tencor Corporation

10/26/17 / #20170307523

Structured illumination for contrast enhancement in overlay metrology

Contrast enhancement in a metrology tool may include generating a beam of illumination, directing a portion of the generated beam onto a surface of a spatial light modulator (SLM), directing at least a portion of the generated beam incident on the surface of the SLM through an aperture of an... Kla tencor Corporation

10/26/17 / #20170307545

Apparatus and methods for finding a best aperture and mode to enhance defect detection

Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations... Kla tencor Corporation

10/26/17 / #20170307548

Beam shaping slit for small spot size transmission small angle x-ray scatterometry

Methods and systems for reducing the effect of finite source size on illumination beam spot size for Transmission, Small-Angle X-ray Scatterometry (T-SAXS) measurements are described herein. A beam shaping slit having a slender profile is located in close proximity to the specimen under measurement and does not interfere with wafer... Kla tencor Corporation

10/26/17 / #20170309007

System, method and computer program product for correcting a difference image generated from a comparison of target and reference dies

A system, method, and computer program product are provided for correcting a difference image generated from a comparison of target and reference dies. In use, an intra-die inspection of a target die image is performed to generate, for each pattern of interest, a first representative image. An intra-die inspection of... Kla tencor Corporation

10/26/17 / #20170309008

Apparatus and methods for predicting wafer-level defect printability

Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire images at different imaging configurations from each of a plurality of pattern areas of a test reticle. A reticle near field for each of the pattern areas of the test reticle is... Kla tencor Corporation

10/26/17 / #20170309009

Computer assisted weak pattern detection and quantification system

Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication... Kla tencor Corporation

10/12/17 / #20170292918

Determining a configuration for an optical element positioned in a collection aperture during wafer inspection

Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element... Kla tencor Corporation

10/12/17 / #20170294012

Design aware system, method and computer program product for detecting overlay-related defects in multi-patterned fabricated devices

A design aware system, method, and computer program product are provided for detecting overlay-related defects in multi-patterned fabricated devices. In use, a design of a multi-patterned fabricated device is received by a computer system. Then, the computer system automatically determines from the design one or more areas of the design... Kla tencor Corporation

10/12/17 / #20170294286

Permanent-magnet particle beam apparatus and method incorporating a non-magnetic metal portion for tunability

A permanent-magnet particle beam apparatus and method incorporating a non-magnetic portion for tunability are provided. The permanent-magnet particle beam apparatus includes a particle beam emitter that emits a charged particle beam, and includes a set of permanent magnets forming a magnetic field for controlling condensing of the charged particle beam.... Kla tencor Corporation

10/12/17 / #20170295334

Dual-column-parallel ccd sensor and inspection systems using a sensor

A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at... Kla tencor Corporation

10/05/17 / #20170284944

System and wafer inspection with a noise boundary threshold

A method includes receiving one or more images of three or more die of a wafer, determining a median intensity value of a set of pixel intensity values acquired from a same location on each of the three or more die, determining a difference intensity value for the set of... Kla tencor Corporation

10/05/17 / #20170286589

System and defining care areas in repeating structures of design data

A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity... Kla tencor Corporation

10/05/17 / #20170287128

Adaptive local threshold and color filtering

Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing... Kla tencor Corporation

10/05/17 / #20170287675

Method and system for charge control for imaging floating metal structures on non-conducting substrates

A scanning electron microscopy system is disclosed. The system includes a sample stage configured to secure a sample having conducting structures disposed on an insulating substrate. The system includes an electron-optical column including an electron source configured to generate a primary electron beam and a set of electron-optical elements configured... Kla tencor Corporation

10/05/17 / #20170287686

Multi-channel photomultiplier tube assembly

A multi-channel photomultiplier tube (PMT) detector assembly includes a photocathode. The detector assembly includes a first dynode channel including a first set of dynode pathways. The first set of dynode pathways include a plurality of dynode stages configured to receive a first portion of the photoelectrons and direct a first... Kla tencor Corporation

10/05/17 / #20170287751

Semiconductor metrology with information from multiple processing steps

Methods and systems for measuring process induced errors in a multiple patterning semiconductor fabrication process based on measurements of a specimen and process information from one or more previous process steps employed to fabricate the specimen are presented herein. A metrology tool is employed after a number of process steps... Kla tencor Corporation

10/05/17 / #20170287754

Systems and methods for automated multi-zone detection and modeling

A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the illumination beam to a sample, a detector, one or more collection optical elements to direct radiation emanating from the sample to the detector, and a controller... Kla tencor Corporation








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