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Kulicke And Soffa Industries Inc patents

Recent patent applications related to Kulicke And Soffa Industries Inc. Kulicke And Soffa Industries Inc is listed as an Agent/Assignee. Note: Kulicke And Soffa Industries Inc may have other listings under different names/spellings. We're not affiliated with Kulicke And Soffa Industries Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "K" | Kulicke And Soffa Industries Inc-related inventors




Date Kulicke And Soffa Industries Inc patents (updated weekly) - BOOKMARK this page
08/03/17Thermocompression bonding systems and methods of operating the same
06/29/17Systems and methods for bonding semiconductor elements
06/29/17Systems and methods for bonding semiconductor elements
06/22/17Systems and methods for bonding semiconductor elements
05/04/17On-bonder automatic overhang die optimization tool for wire bonding and related methods
04/27/17Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
03/02/17Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving uph on such bonding machines
02/09/17Methods of forming wire interconnect structures
02/02/17Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
11/24/16Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding
11/10/16Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
10/27/16Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
09/01/16Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same
09/01/16Systems and methods for bonding semiconductor elements
01/07/16Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
12/31/15Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
12/31/15Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly
12/03/15Systems and methods for bonding semiconductor elements
10/08/15Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
09/03/15Thermocompression bonding systems and methods of operating the same
07/16/15Short tail recovery techniques in wire bonding operations
06/18/15Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
06/04/15Systems and methods for bonding semiconductor elements
06/04/15Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
05/14/15Methods of forming wire interconnect structures
04/09/15Systems and methods for bonding semiconductor elements
01/08/15Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
09/04/14Automatic rework processes for non-stick conditions in wire bonding operations
10/24/13Methods of adjusting ultrasonic bonding energy on wire bonding machines
05/23/13Wire loops, methods of forming wire loops, and related processes
11/15/12Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
06/28/12Wire feed system and operating the same
05/24/12Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
05/24/12Imaging operations for a wire bonding system
05/03/12Method of operating a clamping system of a wire bonding machine
03/29/12Methods of forming wire bonds for wire loops and conductive bumps
03/15/12Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
02/09/12Gas delivery system for reducing oxidation in wire bonding operations
02/02/12Methods of teaching bonding locations and inspecting wire loops on a wire bonding machine, and apparatuses for performing the same
01/12/12Conductive bumps, wire loops, and methods of forming the same
07/21/11Method of teaching eyepoints for wire bonding and related semiconductor processing operations
05/26/11Z-axis motion system for a wire bonding machine
05/19/11Z-axis motion system for a wire bonding machine
03/31/11Gas delivery system for reducing oxidation in wire bonding operations
03/10/11Method of calibrating a constant voltage supply for an ultrasonic transducer of a wire bonding machine
01/06/11Wire payout measurement and calibration techniques for a wire bonding machine
09/16/10Reduced oxidation system for wire bonding
09/16/10Wire loop and forming the wire loop
09/09/10Linear motor with reduced cogging
07/29/10Conductive bumps, wire loops including the improved conductive bumps, and methods of forming the same
07/22/10Method of teaching eyepoints for wire bonding and related semiconductor processing operations
06/17/10Method of forming bends in a wire loop
05/06/10Closed loop wire bonding methods and bonding force calibration
12/24/09Method of controlling the trajectory of a bonding tool during the formation of a wire loop
12/17/09Wire feed system and operating the same
10/08/09Z-axis motion system for a wire bonding machine







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Kulicke And Soffa Industries Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Kulicke And Soffa Industries Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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