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Lam Research Corporation patents

Recent patent applications related to Lam Research Corporation. Lam Research Corporation is listed as an Agent/Assignee. Note: Lam Research Corporation may have other listings under different names/spellings. We're not affiliated with Lam Research Corporation, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "L" | Lam Research Corporation-related inventors

Date Lam Research Corporation patents (updated weekly) - BOOKMARK this page
03/23/17 new patent  Apparatus for determining process rate
03/23/17 new patent  Ion energy control by rf pulse shape
03/23/17 new patent  Multiple control modes
03/23/17 new patent  Plasma etching systems and methods using empirical mode decomposition
03/23/17 new patent  Method and determining process rate
03/16/17Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
03/16/17Durable low cure temperature hydrophobic coating in electroplating cup assembly
03/16/17Method for treating a nonhomogenous surface
03/16/17Cycle-averaged frequency tuning for low power voltage mode operation
03/16/17Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching
03/16/17Mask shrink layer for high aspect ratio dielectric etch
03/16/17Technique to deposit sidewall passivation for high aspect ratio cylinder etch
03/16/17Systems and methods for performing in-situ deposition of sidewall image transfer spacers
03/16/17Social network service for semiconductor manufacturing equipment and users
03/09/17Method of casting internal features
03/09/17Plasma excitation for spatial atomic layer deposition (ald) reactors
03/09/17Ale smoothness: in and outside semiconductor industry
03/09/17Systems and methods for selectively etching tungsten in a downstream reactor
03/02/17Liquid phase bonding of a silicon or silicon carbide component to another silicon or silicon carbide component
03/02/17Monolithic manifold mask and substrate concepts
03/02/17Edge flow element for electroplating apparatus
03/02/17Use of ion beam etching to generate gate-all-around structure
03/02/17Methods for detecting endpoint for through-silicon via reveal applications
02/23/17Radical generator and generating ammonia radicals
02/23/17Ammonia radical generator
02/23/17Multi-station chamber having symmetric grounding plate
02/23/17Application of powered electrostatic faraday shield to recondition dielectric window in icp plasmas
02/23/17Method of densifying films in semiconductor device
02/23/17Self limiting lateral atomic layer etch
02/23/17Atomic layer etching of tungsten and other metals
02/23/17Pulsing rf power in etch process to enhance tungsten gapfill performance
02/23/17Wear detection of consumable part in semiconductor manufacturing equipment
02/23/17Edge ring assembly for improving feature profile tilting at extreme edge of wafer
02/16/17Magnetized edge ring for extreme edge control
02/16/17Shadow trim line edge roughness reduction
02/16/17Annular edge seal with convex inner surface for electrostatic chuck
02/09/17Plasma etching device with plasma etch resistant coating
02/09/17Systems comprising silicon coated gas supply conduits and methods for applying coatings
02/09/17Hollow rf feed with coaxial dc power feed
02/09/17Systems and methods for separately applying charged plasma constituents and ultraviolet light in a mixed mode processing operation
02/09/17Systems and methods for reverse pulsing
02/09/17Systems and methods for reverse pulsing
02/09/17High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transfer
02/09/17Atomic layer etching of tungsten for enhanced tungsten deposition fill
02/09/17Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide
02/02/17System and wafer alignment and centering with ccd camera and robot
02/02/17System, real time control of rapid alternating processes (rap)
02/02/17Time multiplexed chemical delivery system
02/02/17Vision-based wafer notch position measurement
02/02/17Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems
02/02/17Electrostatic chuck including embedded faraday cage for rf delivery and associated methods for operation, monitoring, and control
02/02/17Time varying segmented pressure control
02/02/17Using modeling to determine wafer bias associated with a plasma system
02/02/17Gas delivery system
01/26/17Fluid mixing hub for semiconductor processing tool
01/19/17Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
01/19/17Methods and systems for determining a fault in a gas heater channel
01/19/17Use of sintered nanograined yttrium-based ceramics as etch chamber components
01/19/17Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
01/12/17Multi-cycle ald process for film uniformity and thickness profile modulation
01/12/17Chemical deposition apparatus having conductance control
01/12/17Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
01/12/17Smart window for semiconductor processing tool
01/12/17Systems and methods for removing particles from a substrate processing chamber using rf plasma cycling and purging
01/12/17Pretreatment photoresist wafer processing
Patent Packs
01/05/17Separation of plasma suppression and wafer edge to improve edge film thickness uniformity
01/05/17System for instantaneous radiofrequency power measurement and associated methods
12/29/16Use of atomic layer deposition coatings to protect brazing line against corrosion, erosion, and arcing
12/29/16Selective removal of boron doped carbon hard mask layers
12/29/16Controlling ion energy within a plasma chamber
12/29/16Use of plasma-resistant atomic layer deposition coatings to extend the lifetime of polymer components in etch chambers
12/29/16Low roughness euv lithography
12/29/16Capped ald films for doping fin-shaped channel regions of 3-d ic transistors
12/22/16Flexible temperature compensation substrate processing systems
12/22/16Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
12/22/16System and determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
12/22/16Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges
12/22/16Auto-correction of electrostatic chuck temperature non-uniformity
12/22/16System and reducing temperature transition in an electrostatic chuck
12/15/16Apparatus and modulating azimuthal uniformity in electroplating
Patent Packs
12/15/16Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface
12/15/16Systems and methods for forming ultra-shallow junctions
12/15/16Plasma etching device with doped quartz surfaces
12/08/16Polarization stabilizer additive for electroplating
12/08/16Plasma etching device with plasma etch resistant coating
12/08/16Systems, methods and choked flow element extraction
12/08/16Large dynamic range rf voltage sensor and voltage mode rf bias application of plasma processing systems
12/08/16Atomic layer etching of gan and other iii-v materials
12/08/16Plasma-enhanced etching in an augmented plasma processing system
12/08/16Hybrid 200 mm/300 mm semiconductor processing apparatuses
12/01/16Anti-transient showerhead
12/01/16Electrolyte delivery and generation equipment
12/01/16Arrangement for plasma processing system control based on rf voltage
12/01/16Deposition of low fluorine tungsten by sequential cvd process
12/01/16Residue free oxide etch
12/01/16Tungsten films having low fluorine content
12/01/16Lightup prevention using multi-layer ceramic fabrication techniques
11/24/16Deposition apparatus including edge plenum showerhead assembly
11/24/16Low volume showerhead with faceplate holes for improved flow uniformity
11/24/16Systems and methods for providing characteristics of an impedance matching model for use with matching networks
11/24/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
11/24/16Corrosion resistant gas distribution manifold with thermally controlled faceplate
11/24/16Feature fill with multi-stage nucleation inhibition
11/24/16Interface passivation layers and methods of fabricating
11/17/16Substrate pedestal module including backside gas delivery tube and making
11/17/16Apparatus and electodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
11/17/16Adjustment of power and frequency based on three or more states
11/17/16Plasma assisted atomic layer deposition of multi-layer films for patterning applications
11/17/16High temperature substrate pedestal module and components thereof
11/10/16Methods of modulating residual stress in thin films
Social Network Patent Pack
11/10/16Highly selective deposition of amorphous carbon as a metal diffusion barrier layer
11/10/16Isotropic atomic layer etch for silicon oxides using no activation
11/10/16Inhibitor plasma mediated atomic layer deposition for seamless feature fill
11/03/16Gas inlet valve with incompatible materials isolation
11/03/16Apparatus for thermal control of tubing assembly and associated methods
11/03/16Apparatus with a spectral reflectometer for processing substrates
11/03/16Mixed mode pulsing etching in plasma processing systems
11/03/16Edge ramping
11/03/16Systems and methods for using one or more fixtures and efficiency to determine parameters of a match network model
11/03/16Inter-electrode gap variation methods for compensating deposition non-uniformity
Patent Packs
10/27/16Long lifetime thermal spray coating for etching or deposition chamber application
10/27/16Plasma etching systems and methods using empirical mode decomposition
10/27/16Gap fill using carbon-based films
10/27/16Cobalt etch back
10/20/16End effector assembly for clean/dirty substrate handling
10/20/16Systems and methods for reducing reflected power during state transitions by using radio frequency values
10/20/16Systems and methods for controlling a plasma edge region
10/20/16Control of impedance of rf delivery path
10/20/16Chamber with vertical support stem for symmetric conductance and rf delivery
10/20/16Ion injector and lens system for ion beam milling
10/20/16Measuring individual layer thickness during multi-layer deposition semiconductor processing
10/20/16Dry plasma etch method to pattern mram stack
10/20/16Systems and methods for reducing power reflected towards a higher frequency rf generator during a period of a lower rf generator and for using a relationship to reduce reflected power
10/13/16Monitoring electrolytes during electroplating
10/13/16Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems
10/13/16Substrate support with thermal zones for semiconductor processing
10/06/16Plasma processing systems and structures having sloped confinement rings
10/06/16Apparatus for thermal control of tubing assembly and associated methods
10/06/16Systems and methods for reversing rf current polarity at one output of a multpile output rf matching network
10/06/16Fault detection using showerhead voltage variation
10/06/16Deposition of conformal films by atomic layer deposition and atomic layer etch
10/06/16Cyclical, non-isobaric, pore sealing method to prevent precursor penetration into the substrate
10/06/16Sulfur and fluorine containing etch chemistry for improvement of distortion and bow control for har etch
10/06/16Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformity
10/06/16Method and detecting defects on wafers
10/06/16Plasma assisted atomic layer deposition titanium oxide for patterning applications
10/06/16Radio frequency generator having multiple mutually exclusive oscillators for use in plasma processing
09/29/16Minimizing radical recombination using ald silicon oxide surface coating with intermittent restoration plasma
09/29/16Deposition of metal dielectric film for hardmasks
09/29/16Method for forming stair-step structures
Patent Packs
09/22/16Two-step deposition with improved selectivity
09/22/16Chemistry additives and process for cobalt film electrodeposition
09/22/16Control of electrolyte flow dynamics for uniform electroplating
09/22/16Control of current density in an electroplating apparatus
09/22/16Sub-pulsing during a state
09/22/16Ground state hydrogen radical sources for chemical vapor deposition of silicon-carbon-containing films
09/22/16Ultrathin atomic layer deposition film accuracy thickness control
09/15/16Dynamic modulation of cross flow manifold during electroplating
09/15/16Methods and synchronizing rf pulses in a plasma processing system
09/15/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/15/16Copper interconnect device including surface functionalized graphene capping layer and fabrication method thereof
09/08/16Clean resistant windows for ultraviolet thermal processing
09/08/16Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
09/08/16Systems and methods for tuning an impedance matching network in a step-wise fashion
09/08/16Impedance matching circuit for operation with a kilohertz rf generator and a megahertz rf generator to control plasma processes
09/08/16Method and apparatus to minimize seam effect during teos oxide film deposition
09/08/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/08/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/01/16Systems and methods for synchronizing execution of recipe sets
09/01/16Method for coating surfaces
Social Network Patent Pack
09/01/16Image reversal with ahm gap fill for multiple patterning
09/01/16Metallization of the wafer edge for optimized electroplating performance on resistive substrates
08/25/16Method for achieving ultra-high selectivity while etching silicon nitride
08/18/16Systems and methods for using multiple inductive and capacitive fixtures for applying a variety of plasma conditions to determine a match network model
08/11/16Control of impedance of rf return path
08/11/16Fabrication of a silicon structure and deep silicon etch with profile control
08/11/16Chambers for particle reduction in substrate processing systems
08/11/16Tungsten for wordline applications
08/04/16Modular vaporizer
08/04/16Geometry and process optimization for ultra-high rpm plating
08/04/16Plasma processing systems including side coils and methods related to the plasma processing systems
08/04/16Systems and methods for decreasing carbon-hydrogen content of amorphous carbon hardmask films
08/04/16Metal doping of amorphous carbon and silicon films used as hardmasks in substrate processing systems
07/28/16Apparatus and dynamic control of plated uniformity with the use of remote electric current
07/28/16Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber
07/28/16Gas distribution system for ceramic showerhead of plasma etch reactor
07/28/16End effector for wafer transfer system and transferring wafers
07/28/16Dual push between a host computer system and an rf generator
07/21/16Ion beam etching system
07/21/16Moveable edge coupling ring for edge process control during semiconductor wafer processing
Social Network Patent Pack
07/21/16Moveable edge coupling ring for edge process control during semiconductor wafer processing
07/14/16Multi-contact lipseals and associated electroplating methods
07/14/16Ceramic gas distribution plate with embedded electrode
07/14/16Internal plasma grid for semiconductor fabrication
07/14/16Integrating atomic scale processes: ald (atomic layer deposition) and ale (atomic layer etch)
07/14/16System, generating pressure pulses in small volume confined process reactor
07/14/16System and monitoring temperatures of and controlling multiplexed heater array
07/07/16Selective deposition and co-deposition processes for ferromagnetic thin films
07/07/16Isotropic atomic layer etch for silicon oxides using no activation
07/07/16Isotropic atomic layer etch for silicon and germanium oxides
07/07/16Method and anisotropic tungsten etching
07/07/16Multiplexed heater array using ac drive for semiconductor processing
06/30/16Tuning a parameter associated with plasma impedance
06/30/16Determining a value of a variable on an rf transmission model
06/30/16Pre-fill wafer cleaning formulation
06/23/16Hardware and process for film uniformity improvement
06/23/16Reducing backside deposition at wafer edge
06/23/16Methods and apparatuses for dynamically tunable wafer-edge electroplating
06/23/16Pecvd films for euv lithography
06/23/16Silicon etch and clean
06/23/16Method for forming stair-step structures
06/23/16Selective nitride etch
06/23/16Integrated etch/clean for dielectric etch applications
06/23/16Internal plasma grid for semiconductor fabrication
06/16/16Multi-station plasma reactor with rf balancing
06/16/16Inlet for effective mixing and purging
06/16/16Computation of statistics for statistical data decimation
06/16/16Carrier ring structure and chamber systems including the same
06/16/16Fast-gas switching for etching
06/16/16Ion energy control by rf pulse shape
Social Network Patent Pack
06/09/16Multichannel thermocouple compensation for three dimensional temperature gradient
06/09/16Methods for depositing silicon oxide
06/09/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
06/09/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
06/09/16Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch
06/09/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
06/09/16Faraday shield having plasma density decoupling structure between tcp coil zones
06/09/16Method and system related to semiconductor processing equipment
06/09/16Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications
06/02/16Methods and a hybrid capacitively-coupled and an inductively-coupled plasma processing system
06/02/16Line width roughness improvement with noble gas plasma
06/02/16Etch process with pre-etch transient conditioning
05/26/16Valve manifold deadleg elimination via reentrant flow path
05/26/16Pulsed plasma chamber in dual chamber configuration
05/26/16Selective inhibition in atomic layer deposition of silicon-containing films
05/26/16Method of depositing ammonia free and chlorine free conformal silicon nitride film
05/26/16Gas injection uniformly processing a semiconductor substrate in a semiconductor substrate processing apparatus
05/19/16Reactive ultraviolet thermal processing of low dielectric constant materials
05/19/16Systems and methods for forming selective metal electrode layers for resistive switching memories
05/19/16Fast-gas switching for etching
05/19/16Dual phase cleaning chambers and assemblies comprising the same
05/19/16Dry development and image transfer of si-containing self-assembled block copolymers
05/19/16Internal plasma grid for semiconductor fabrication
05/12/16Adjustment of vuv emission of a plasma via collisional resonant energy transfer to an energy absorber gas
05/05/16Arrangements for manipulating plasma confinement within a plasma processing system and methods thereof
05/05/16Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and implementing the same
04/28/16System, refining rf transmission system models
04/28/16System, rf power compensation in a plasma processing system
04/28/16Gapfill of variable aspect ratio features with a composite peald and pecvd method

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Lam Research Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Lam Research Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by