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Lam Research Corporation patents

Recent patent applications related to Lam Research Corporation. Lam Research Corporation is listed as an Agent/Assignee. Note: Lam Research Corporation may have other listings under different names/spellings. We're not affiliated with Lam Research Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "L" | Lam Research Corporation-related inventors

Date Lam Research Corporation patents (updated weekly) - BOOKMARK this page
06/22/17 new patent  Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
06/22/17 new patent  Methods and apparatuses for etch profile matching by surface kinetic model optimization
06/22/17 new patent  Impedance-based adjustment of power and frequency
06/22/17 new patent  Determining a malfunctioning device in a plasma system
06/22/17 new patent  Variable temperature hardware and methods for reduction of wafer backside deposition
06/22/17 new patent  Directional deposition on patterned structures
06/22/17 new patent  Self limiting lateral atomic layer etch
06/22/17 new patent  Technique to tune sidewall passivation deposition conformality for high aspect ratio cylinder etch
06/15/17Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ald system
06/15/17Silicon or silicon carbide gas injector for substrate processing systems
06/15/17Showerhead assembly
06/15/17Bubble and foam solutions using a completely immersed air-free feedback flow control valve
06/15/17Multi-plane heater for semiconductor substrate support
06/15/17Apparatuses and methods for avoiding electrical breakdown from rf terminal to adjacent non-rf terminal
06/15/17Conformal doping using dopant gas on hydrogen plasma treated surface
06/15/17Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch
06/15/17Adjustment of vuv emission of a plasma via collisional resonant energy transfer to an energy absorber gas
06/15/17Wafer support pedestal with wafer anti-slip and anti-rotation features
06/15/17Multilayer film including a tantalum and titanium alloy as a scalable barrier diffusion layer for copper interconnects
06/08/17Surface coating treatment
06/08/17Impedance matching circuit for operation with a kilohertz rf generator and a megahertz rf generator to control plasma processes
06/08/17Design for storing and organizing minimum contact area features and wafer transfer pins during system maintenance
06/08/17Interlevel conductor pre-fill utilizing selective barrier deposition
06/01/17Control of the incidence angle of an ion beam on a substrate
05/25/17Cable power loss determination for virtual metrology
05/25/17Euv photopatterning of vapor-deposited metal oxide-containing hardmasks
05/25/17Matched tcr joule heater designs for electrostatic chucks
05/18/17Apparatus for uv flowable dielectric
05/18/17Pneumatic exhaust system
05/18/17Low k dielectric deposition via uv driven photopolymerization
05/18/17Systems and methods for controlling plasma instability in semiconductor fabrication
05/18/17Systems and methods for detection of plasma instability by electrical measurement
05/18/17Systems and methods for detection of plasma instability by optical diagnosis
05/18/17Systems and methods for frequency modulation of radiofrequency power supply for controlling plasma instability
05/11/17Interface engineering during mgo deposition for magnetic tunnel junctions
05/11/17Computer addressable plasma density modification for etch and deposition processes
05/11/17Method for depositing extremely low resistivity tungsten
05/11/17Stacked wafer cassette loading system
05/11/17Lift pin assembly and associated methods
05/11/17Sensor and adjuster for a consumable
05/04/17Systems and methods for tilting a wafer for achieving deposition uniformity
05/04/17Systems and methods for filtering radio frequencies from a signal of a thermocouple and controlling a temperature of an electrode in a plasma chamber
05/04/17Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabrication
05/04/17Systems and methods for calibrating conversion models and performing position conversions of variable capacitors in match networks of plasma processing systems
05/04/17Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level
05/04/17Methods and systems for advanced ion control for etching processes
05/04/17Wafer transfer microclimate techniques and apparatuses, including horizontal slot implementations and/or travelling showerheads
04/27/17Automated replacement of consumable parts using end effectors interfacing with plasma processing system
04/27/17Systems for removing and replacing consumable parts from a semiconductor process module in situ
04/27/17Selective inhibition in atomic layer deposition of silicon-containing films
04/27/17Method of forming low resistivity fluorine free tungsten film without nucleation
04/27/17Integrating atomic scale processes: ald (atomic layer deposition) and ale (atomic layer etch)
04/27/17Front opening ring pod
04/27/17Automated replacement of consumable parts using interfacing chambers
04/27/17Multiple-output radiofrequency matching module and associated methods
04/20/17Temperature controlled substrate support assembly
04/20/17Systems and methods for ultrahigh selective nitride etch
04/20/17Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs
04/20/17Load lock interface and integrated post-processing module
04/20/17Wafer transport assembly with integrated buffers
04/20/17Electrostatic chuck design for cooling-gas light-up prevention
04/20/17Mutually induced filters
04/13/17Chemical deposition chamber having gas seal
04/13/17Uniformity control circuit for use within an impedance matching circuit
04/13/17Systems and methods for tuning an impedance matching network in a step-wise fashion for multiple states of an rf generator
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04/13/17Temperature control in rf chamber with heater and air amplifier
04/13/17Methods for formation of low-k aluminum-containing etch stop films
04/06/17Dynamic precursor dosing for atomic layer deposition
04/06/17Purge and pumping structures arranged beneath substrate plane to reduce defects
04/06/17Substrate holder having integrated temperature measurement electrical devices
04/06/17Electrostatic chuck with thermal choke
04/06/17Virtual collaboration systems and methods
03/30/17Electroless plating solution with at least two borane containing reducing agents
03/30/17Modular system layout utilizing three-dimensions
03/30/17Method for encapsulating a chalcogenide material
03/30/17Bromine containing silicon precursors for encapsulation layers
03/23/17Apparatus for determining process rate
03/23/17Ion energy control by rf pulse shape
03/23/17Multiple control modes
03/23/17Plasma etching systems and methods using empirical mode decomposition
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03/23/17Method and determining process rate
03/16/17Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
03/16/17Durable low cure temperature hydrophobic coating in electroplating cup assembly
03/16/17Method for treating a nonhomogenous surface
03/16/17Cycle-averaged frequency tuning for low power voltage mode operation
03/16/17Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching
03/16/17Mask shrink layer for high aspect ratio dielectric etch
03/16/17Technique to deposit sidewall passivation for high aspect ratio cylinder etch
03/16/17Systems and methods for performing in-situ deposition of sidewall image transfer spacers
03/16/17Social network service for semiconductor manufacturing equipment and users
03/09/17Method of casting internal features
03/09/17Plasma excitation for spatial atomic layer deposition (ald) reactors
03/09/17Ale smoothness: in and outside semiconductor industry
03/09/17Systems and methods for selectively etching tungsten in a downstream reactor
03/02/17Liquid phase bonding of a silicon or silicon carbide component to another silicon or silicon carbide component
03/02/17Monolithic manifold mask and substrate concepts
03/02/17Edge flow element for electroplating apparatus
03/02/17Use of ion beam etching to generate gate-all-around structure
03/02/17Methods for detecting endpoint for through-silicon via reveal applications
02/23/17Radical generator and generating ammonia radicals
02/23/17Ammonia radical generator
02/23/17Multi-station chamber having symmetric grounding plate
02/23/17Application of powered electrostatic faraday shield to recondition dielectric window in icp plasmas
02/23/17Method of densifying films in semiconductor device
02/23/17Self limiting lateral atomic layer etch
02/23/17Atomic layer etching of tungsten and other metals
02/23/17Pulsing rf power in etch process to enhance tungsten gapfill performance
02/23/17Wear detection of consumable part in semiconductor manufacturing equipment
02/23/17Edge ring assembly for improving feature profile tilting at extreme edge of wafer
02/16/17Magnetized edge ring for extreme edge control
Social Network Patent Pack
02/16/17Shadow trim line edge roughness reduction
02/16/17Annular edge seal with convex inner surface for electrostatic chuck
02/09/17Plasma etching device with plasma etch resistant coating
02/09/17Systems comprising silicon coated gas supply conduits and methods for applying coatings
02/09/17Hollow rf feed with coaxial dc power feed
02/09/17Systems and methods for separately applying charged plasma constituents and ultraviolet light in a mixed mode processing operation
02/09/17Systems and methods for reverse pulsing
02/09/17Systems and methods for reverse pulsing
02/09/17High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transfer
02/09/17Atomic layer etching of tungsten for enhanced tungsten deposition fill
Patent Packs
02/09/17Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide
02/02/17System and wafer alignment and centering with ccd camera and robot
02/02/17System, real time control of rapid alternating processes (rap)
02/02/17Time multiplexed chemical delivery system
02/02/17Vision-based wafer notch position measurement
02/02/17Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems
02/02/17Electrostatic chuck including embedded faraday cage for rf delivery and associated methods for operation, monitoring, and control
02/02/17Time varying segmented pressure control
02/02/17Using modeling to determine wafer bias associated with a plasma system
02/02/17Gas delivery system
01/26/17Fluid mixing hub for semiconductor processing tool
01/19/17Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
01/19/17Methods and systems for determining a fault in a gas heater channel
01/19/17Use of sintered nanograined yttrium-based ceramics as etch chamber components
01/19/17Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
01/12/17Multi-cycle ald process for film uniformity and thickness profile modulation
01/12/17Chemical deposition apparatus having conductance control
01/12/17Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
01/12/17Smart window for semiconductor processing tool
01/12/17Systems and methods for removing particles from a substrate processing chamber using rf plasma cycling and purging
01/12/17Pretreatment photoresist wafer processing
01/05/17Separation of plasma suppression and wafer edge to improve edge film thickness uniformity
01/05/17System for instantaneous radiofrequency power measurement and associated methods
12/29/16Use of atomic layer deposition coatings to protect brazing line against corrosion, erosion, and arcing
12/29/16Selective removal of boron doped carbon hard mask layers
12/29/16Controlling ion energy within a plasma chamber
12/29/16Use of plasma-resistant atomic layer deposition coatings to extend the lifetime of polymer components in etch chambers
12/29/16Low roughness euv lithography
12/29/16Capped ald films for doping fin-shaped channel regions of 3-d ic transistors
12/22/16Flexible temperature compensation substrate processing systems
Patent Packs
12/22/16Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
12/22/16System and determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
12/22/16Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges
12/22/16Auto-correction of electrostatic chuck temperature non-uniformity
12/22/16System and reducing temperature transition in an electrostatic chuck
12/15/16Apparatus and modulating azimuthal uniformity in electroplating
12/15/16Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface
12/15/16Systems and methods for forming ultra-shallow junctions
12/15/16Plasma etching device with doped quartz surfaces
12/08/16Polarization stabilizer additive for electroplating
12/08/16Plasma etching device with plasma etch resistant coating
12/08/16Systems, methods and choked flow element extraction
12/08/16Large dynamic range rf voltage sensor and voltage mode rf bias application of plasma processing systems
12/08/16Atomic layer etching of gan and other iii-v materials
12/08/16Plasma-enhanced etching in an augmented plasma processing system
12/08/16Hybrid 200 mm/300 mm semiconductor processing apparatuses
12/01/16Anti-transient showerhead
12/01/16Electrolyte delivery and generation equipment
12/01/16Arrangement for plasma processing system control based on rf voltage
12/01/16Deposition of low fluorine tungsten by sequential cvd process
Social Network Patent Pack
12/01/16Residue free oxide etch
12/01/16Tungsten films having low fluorine content
12/01/16Lightup prevention using multi-layer ceramic fabrication techniques
11/24/16Deposition apparatus including edge plenum showerhead assembly
11/24/16Low volume showerhead with faceplate holes for improved flow uniformity
11/24/16Systems and methods for providing characteristics of an impedance matching model for use with matching networks
11/24/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
11/24/16Corrosion resistant gas distribution manifold with thermally controlled faceplate
11/24/16Feature fill with multi-stage nucleation inhibition
11/24/16Interface passivation layers and methods of fabricating
11/17/16Substrate pedestal module including backside gas delivery tube and making
11/17/16Apparatus and electodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
11/17/16Adjustment of power and frequency based on three or more states
11/17/16Plasma assisted atomic layer deposition of multi-layer films for patterning applications
11/17/16High temperature substrate pedestal module and components thereof
11/10/16Methods of modulating residual stress in thin films
11/10/16Highly selective deposition of amorphous carbon as a metal diffusion barrier layer
11/10/16Isotropic atomic layer etch for silicon oxides using no activation
11/10/16Inhibitor plasma mediated atomic layer deposition for seamless feature fill
11/03/16Gas inlet valve with incompatible materials isolation
Social Network Patent Pack
11/03/16Apparatus for thermal control of tubing assembly and associated methods
11/03/16Apparatus with a spectral reflectometer for processing substrates
11/03/16Mixed mode pulsing etching in plasma processing systems
11/03/16Edge ramping
11/03/16Systems and methods for using one or more fixtures and efficiency to determine parameters of a match network model
11/03/16Inter-electrode gap variation methods for compensating deposition non-uniformity
10/27/16Long lifetime thermal spray coating for etching or deposition chamber application
10/27/16Plasma etching systems and methods using empirical mode decomposition
10/27/16Gap fill using carbon-based films
10/27/16Cobalt etch back
10/20/16End effector assembly for clean/dirty substrate handling
10/20/16Systems and methods for reducing reflected power during state transitions by using radio frequency values
10/20/16Systems and methods for controlling a plasma edge region
10/20/16Control of impedance of rf delivery path
10/20/16Chamber with vertical support stem for symmetric conductance and rf delivery
10/20/16Ion injector and lens system for ion beam milling
10/20/16Measuring individual layer thickness during multi-layer deposition semiconductor processing
10/20/16Dry plasma etch method to pattern mram stack
10/20/16Systems and methods for reducing power reflected towards a higher frequency rf generator during a period of a lower rf generator and for using a relationship to reduce reflected power
10/13/16Monitoring electrolytes during electroplating
10/13/16Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems
10/13/16Substrate support with thermal zones for semiconductor processing
10/06/16Plasma processing systems and structures having sloped confinement rings
10/06/16Apparatus for thermal control of tubing assembly and associated methods
10/06/16Systems and methods for reversing rf current polarity at one output of a multpile output rf matching network
10/06/16Fault detection using showerhead voltage variation
10/06/16Deposition of conformal films by atomic layer deposition and atomic layer etch
10/06/16Cyclical, non-isobaric, pore sealing method to prevent precursor penetration into the substrate
10/06/16Sulfur and fluorine containing etch chemistry for improvement of distortion and bow control for har etch
10/06/16Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformity
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10/06/16Method and detecting defects on wafers
10/06/16Plasma assisted atomic layer deposition titanium oxide for patterning applications
10/06/16Radio frequency generator having multiple mutually exclusive oscillators for use in plasma processing
09/29/16Minimizing radical recombination using ald silicon oxide surface coating with intermittent restoration plasma
09/29/16Deposition of metal dielectric film for hardmasks
09/29/16Method for forming stair-step structures
09/22/16Two-step deposition with improved selectivity
09/22/16Chemistry additives and process for cobalt film electrodeposition
09/22/16Control of electrolyte flow dynamics for uniform electroplating
09/22/16Control of current density in an electroplating apparatus
09/22/16Sub-pulsing during a state
09/22/16Ground state hydrogen radical sources for chemical vapor deposition of silicon-carbon-containing films
09/22/16Ultrathin atomic layer deposition film accuracy thickness control
09/15/16Dynamic modulation of cross flow manifold during electroplating
09/15/16Methods and synchronizing rf pulses in a plasma processing system
09/15/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/15/16Copper interconnect device including surface functionalized graphene capping layer and fabrication method thereof
09/08/16Clean resistant windows for ultraviolet thermal processing
09/08/16Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
09/08/16Systems and methods for tuning an impedance matching network in a step-wise fashion
09/08/16Impedance matching circuit for operation with a kilohertz rf generator and a megahertz rf generator to control plasma processes
09/08/16Method and apparatus to minimize seam effect during teos oxide film deposition
09/08/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/08/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/01/16Systems and methods for synchronizing execution of recipe sets
09/01/16Method for coating surfaces
09/01/16Image reversal with ahm gap fill for multiple patterning
09/01/16Metallization of the wafer edge for optimized electroplating performance on resistive substrates
08/25/16Method for achieving ultra-high selectivity while etching silicon nitride

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Lam Research Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Lam Research Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by