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Lam Research Corporation patents

Recent patent applications related to Lam Research Corporation. Lam Research Corporation is listed as an Agent/Assignee. Note: Lam Research Corporation may have other listings under different names/spellings. We're not affiliated with Lam Research Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "L" | Lam Research Corporation-related inventors




Date Lam Research Corporation patents (updated weekly) - BOOKMARK this page
12/14/17 new patent  Line edge roughness improvement with photon-assisted plasma process
12/14/17 new patent  Method of sealing open pores on surface of porous dielectric material using icvd process
12/07/17Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
12/07/17Valve operation booster
11/30/17Vapor manifold with integrated vapor concentration sensor
11/30/17Dynamic modulation of cross flow manifold during elecroplating
11/30/17Modulation of applied current during sealed rotational electroplating
11/23/17Automated replacement of consumable parts using end effectors interfacing with plasma processing system
11/23/17Vapor delivery solid and liquid precursors
11/23/17Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching
11/23/17Permanent secondary erosion containment for electrostatic chuck bonds
11/23/17Method and determining process rate
11/16/17Tandem source activation for cvd of films
11/16/17Apparatus for electroless metal deposition having filter system and associated oxygen source
11/16/17Adjustable side gas plenum for edge rate control in a downstream reactor
11/16/17Adjustment of power and frequency based on three or more states
11/16/17Confinement ring for use in a plasma processing system
11/16/17Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabrication
11/16/17Methods and apparatuses for controlling transitions between continuous wave and pulsing plasmas
11/16/17Automated replacement of consumable parts using interfacing chambers
11/16/17Control of the incidence angle of an ion beam on a substrate
11/16/17Manganese barrier and adhesion layers for cobalt
11/16/17Metallization of the wafer edge for optimized electroplating performance on resistive substrates
11/16/17Laminated heater with different heater trace materials
11/16/17Connections between laminated heater and heater voltage inputs
11/09/17Substrate pedestal module including backside gas delivery tube and making
11/09/17Method of determining thermal stability of a substrate support assembly
11/09/17Method to deposit conformal and low wet etch rate encapsulation layer using pecvd
11/09/17Gapfill of variable aspect ratio features with a composite peald and pecvd method
11/09/17Methods of encapsulation
11/02/17Chamber undercoat preparation low temperature ald films
11/02/17Variable cycle and time rf activation film thickness matching in a multi-station deposition system
11/02/17Etching substrates using ale and selective deposition
10/26/17Apparatus for measuring condition of electroplating cell components and associated methods
10/26/17Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing
10/26/17Oxidizing treatment of aluminum nitride films in semiconductor device manufacturing
10/26/17Methods for forming germanium and silicon germanium nanowire devices
10/19/17Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes
10/19/17Remote detection of plating on wafer holding apparatus
10/19/17Baffle plate and showerhead assemblies and corresponding manufacturing method
10/19/17Upper plasma-exclusion-zone rings for a bevel etcher
10/19/17Lower plasma-exclusion-zone rings for a bevel etcher
10/12/17Systems and methods for tuning an impedance matching network in a step-wise fashion for multiple states of an rf generator
10/12/17Chuck for edge bevel removal and centering a wafer prior to edge bevel removal
10/05/17Ceramic layer for electrostatic chuck including embedded faraday cage for rf delivery and associated methods
10/05/17Systems and methods for performing edge ring characterization
10/05/17Selective self-aligned patterning of silicon germanium, germanium and type iii/v materials using a sulfur-containing mask
10/05/17Systems and methods for aligning measurement device in substrate processing systems
09/28/17Asymmetric pedestal/carrier ring arrangement for edge impedance modulation
09/28/17Method and controlling process within wafer uniformity
09/28/17Substrate processing system including coil with rf powered faraday shield
09/28/17Carrier ring wall for reduction of back-diffusion of reactive species and suppression of local parasitic plasma ignition
09/21/17Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level
09/14/17Plasma suppression behind a showerhead through the use of increased pressure
09/14/17Electrostatic chuck including embedded faraday cage for rf delivery and associated methods for operation, monitoring, and control
09/14/17Edge ramping
09/14/17Plasma assisted atomic layer deposition metal oxide for patterning applications
09/14/17Detection system for tunable/replaceable edge coupling ring
09/07/17Components such as edge rings including chemical vapor deposition (cvd) diamond coating with high purity sp3 bonds for plasma processing systems
09/07/17Systems and methods for in-situ wafer edge and backside plasma cleaning
09/07/17Atomic layer etching of al203 using a combination of plasma and vapor treatments
09/07/17Apparatus for purging semiconductor process chamber slit valve opening
09/07/17Etch metric sensitivity for endpoint detection
09/07/17Rare earth metal surface-activated plasma doping on semiconductor substrates
09/07/17Dual push between a host computer system and an rf generator
Patent Packs
08/31/17Direct current pulsing plasma systems
08/31/17Methods and apparatuses for controlling plasma properties by controlling conductance between sub-chambers of a plasma processing chamber
08/31/17Ion beam etching utilizing cryogenic wafer temperatures
08/24/17Tsv bath evaluation using field versus feature contrast
08/24/17Flow through line charge volume
08/24/173d printed plasma arrestor for an electrostatic chuck
08/24/17Systems and methods for achieving uniformity across a redistribution layer
08/17/17Universal service cart for semiconductor system maintenance
08/17/17Chamber memeber of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring
08/17/17System and increasing electron density levels in a plasma of a substrate processing system
08/17/17Anisotropic high resistance ionic current source (ahrics)
08/17/17Systems and methods for selectively etching film
08/17/17Common terminal heater for ceramic pedestals used in semiconductor fabrication
08/17/17Line charge volume with integrated pressure measurement
08/17/17Variable depth edge ring for etch uniformity control
Patent Packs
08/17/17Wafer lift ring system for wafer transfer
08/10/17Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
08/10/17Atomic layer etching in continuous plasma
08/10/17Atomic layer etching 3d structures: si and sige and ge smoothness on horizontal and vertical surfaces
08/10/17Chamber for patterning non-volatile metals
08/10/17Substrate supports with multi-layer structure including independent operated heater zones
08/10/17Systems and methods for creating airgap seals using atomic layer deposition and high density plasma chemical vapor deposition
08/03/17Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing
07/27/17Verifying end effector flatness using electrical continuity
07/27/17Hybrid stair-step etch
07/27/17Ion to neutral control for wafer processing with dual plasma source reactor
07/20/17Additively manufactured gas distribution manifold
07/20/17Additively manufactured gas distribution manifold
07/20/17System and detecting a process point in mult-mode pulse processes
07/20/17Pre-fill wafer cleaning formulation
07/13/17Substrate processing chamber including multiple gas injection points and dual injector
07/13/17System, using optical data to monitor rf generator operations
07/06/17Actuator to dynamically adjust showerhead tilt in a semiconductor processing apparatus
07/06/17Self-sustained in-situ thermal control apparatus
07/06/17Control of etch rate using modeling, feedback and impedance match
07/06/17Method and anisotropic tungsten etching
06/22/17Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
06/22/17Methods and apparatuses for etch profile matching by surface kinetic model optimization
06/22/17Impedance-based adjustment of power and frequency
06/22/17Determining a malfunctioning device in a plasma system
06/22/17Variable temperature hardware and methods for reduction of wafer backside deposition
06/22/17Directional deposition on patterned structures
06/22/17Self limiting lateral atomic layer etch
06/22/17Technique to tune sidewall passivation deposition conformality for high aspect ratio cylinder etch
06/15/17Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ald system
Social Network Patent Pack
06/15/17Silicon or silicon carbide gas injector for substrate processing systems
06/15/17Showerhead assembly
06/15/17Bubble and foam solutions using a completely immersed air-free feedback flow control valve
06/15/17Multi-plane heater for semiconductor substrate support
06/15/17Apparatuses and methods for avoiding electrical breakdown from rf terminal to adjacent non-rf terminal
06/15/17Conformal doping using dopant gas on hydrogen plasma treated surface
06/15/17Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch
06/15/17Adjustment of vuv emission of a plasma via collisional resonant energy transfer to an energy absorber gas
06/15/17Wafer support pedestal with wafer anti-slip and anti-rotation features
06/15/17Multilayer film including a tantalum and titanium alloy as a scalable barrier diffusion layer for copper interconnects
Patent Packs
06/08/17Surface coating treatment
06/08/17Impedance matching circuit for operation with a kilohertz rf generator and a megahertz rf generator to control plasma processes
06/08/17Design for storing and organizing minimum contact area features and wafer transfer pins during system maintenance
06/08/17Interlevel conductor pre-fill utilizing selective barrier deposition
06/01/17Control of the incidence angle of an ion beam on a substrate
05/25/17Cable power loss determination for virtual metrology
05/25/17Euv photopatterning of vapor-deposited metal oxide-containing hardmasks
05/25/17Matched tcr joule heater designs for electrostatic chucks
05/18/17Apparatus for uv flowable dielectric
05/18/17Pneumatic exhaust system
05/18/17Low k dielectric deposition via uv driven photopolymerization
05/18/17Systems and methods for controlling plasma instability in semiconductor fabrication
05/18/17Systems and methods for detection of plasma instability by electrical measurement
05/18/17Systems and methods for detection of plasma instability by optical diagnosis
05/18/17Systems and methods for frequency modulation of radiofrequency power supply for controlling plasma instability
05/11/17Interface engineering during mgo deposition for magnetic tunnel junctions
05/11/17Computer addressable plasma density modification for etch and deposition processes
05/11/17Method for depositing extremely low resistivity tungsten
05/11/17Stacked wafer cassette loading system
05/11/17Lift pin assembly and associated methods
05/11/17Sensor and adjuster for a consumable
05/04/17Systems and methods for tilting a wafer for achieving deposition uniformity
05/04/17Systems and methods for filtering radio frequencies from a signal of a thermocouple and controlling a temperature of an electrode in a plasma chamber
05/04/17Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabrication
05/04/17Systems and methods for calibrating conversion models and performing position conversions of variable capacitors in match networks of plasma processing systems
05/04/17Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level
05/04/17Methods and systems for advanced ion control for etching processes
05/04/17Wafer transfer microclimate techniques and apparatuses, including horizontal slot implementations and/or travelling showerheads
04/27/17Automated replacement of consumable parts using end effectors interfacing with plasma processing system
04/27/17Systems for removing and replacing consumable parts from a semiconductor process module in situ
Patent Packs
04/27/17Selective inhibition in atomic layer deposition of silicon-containing films
04/27/17Method of forming low resistivity fluorine free tungsten film without nucleation
04/27/17Integrating atomic scale processes: ald (atomic layer deposition) and ale (atomic layer etch)
04/27/17Front opening ring pod
04/27/17Automated replacement of consumable parts using interfacing chambers
04/27/17Multiple-output radiofrequency matching module and associated methods
04/20/17Temperature controlled substrate support assembly
04/20/17Systems and methods for ultrahigh selective nitride etch
04/20/17Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs
04/20/17Load lock interface and integrated post-processing module
04/20/17Wafer transport assembly with integrated buffers
04/20/17Electrostatic chuck design for cooling-gas light-up prevention
04/20/17Mutually induced filters
04/13/17Chemical deposition chamber having gas seal
04/13/17Uniformity control circuit for use within an impedance matching circuit
04/13/17Systems and methods for tuning an impedance matching network in a step-wise fashion for multiple states of an rf generator
04/13/17Temperature control in rf chamber with heater and air amplifier
04/13/17Methods for formation of low-k aluminum-containing etch stop films
04/06/17Dynamic precursor dosing for atomic layer deposition
04/06/17Purge and pumping structures arranged beneath substrate plane to reduce defects
Social Network Patent Pack
04/06/17Substrate holder having integrated temperature measurement electrical devices
04/06/17Electrostatic chuck with thermal choke
04/06/17Virtual collaboration systems and methods
03/30/17Electroless plating solution with at least two borane containing reducing agents
03/30/17Modular system layout utilizing three-dimensions
03/30/17Method for encapsulating a chalcogenide material
03/30/17Bromine containing silicon precursors for encapsulation layers
03/23/17Apparatus for determining process rate
03/23/17Ion energy control by rf pulse shape
03/23/17Multiple control modes
03/23/17Plasma etching systems and methods using empirical mode decomposition
03/23/17Method and determining process rate
03/16/17Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
03/16/17Durable low cure temperature hydrophobic coating in electroplating cup assembly
03/16/17Method for treating a nonhomogenous surface
03/16/17Cycle-averaged frequency tuning for low power voltage mode operation
03/16/17Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching
03/16/17Mask shrink layer for high aspect ratio dielectric etch
03/16/17Technique to deposit sidewall passivation for high aspect ratio cylinder etch
03/16/17Systems and methods for performing in-situ deposition of sidewall image transfer spacers
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03/16/17Social network service for semiconductor manufacturing equipment and users
03/09/17Method of casting internal features
03/09/17Plasma excitation for spatial atomic layer deposition (ald) reactors
03/09/17Ale smoothness: in and outside semiconductor industry
03/09/17Systems and methods for selectively etching tungsten in a downstream reactor
03/02/17Liquid phase bonding of a silicon or silicon carbide component to another silicon or silicon carbide component
03/02/17Monolithic manifold mask and substrate concepts
03/02/17Edge flow element for electroplating apparatus
03/02/17Use of ion beam etching to generate gate-all-around structure
03/02/17Methods for detecting endpoint for through-silicon via reveal applications
02/23/17Radical generator and generating ammonia radicals
02/23/17Ammonia radical generator
02/23/17Multi-station chamber having symmetric grounding plate
02/23/17Application of powered electrostatic faraday shield to recondition dielectric window in icp plasmas
02/23/17Method of densifying films in semiconductor device
02/23/17Self limiting lateral atomic layer etch
02/23/17Atomic layer etching of tungsten and other metals
02/23/17Pulsing rf power in etch process to enhance tungsten gapfill performance
02/23/17Wear detection of consumable part in semiconductor manufacturing equipment
02/23/17Edge ring assembly for improving feature profile tilting at extreme edge of wafer
02/16/17Magnetized edge ring for extreme edge control
02/16/17Shadow trim line edge roughness reduction
02/16/17Annular edge seal with convex inner surface for electrostatic chuck
02/09/17Plasma etching device with plasma etch resistant coating
02/09/17Systems comprising silicon coated gas supply conduits and methods for applying coatings
02/09/17Hollow rf feed with coaxial dc power feed
02/09/17Systems and methods for separately applying charged plasma constituents and ultraviolet light in a mixed mode processing operation
02/09/17Systems and methods for reverse pulsing
02/09/17Systems and methods for reverse pulsing
02/09/17High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transfer
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02/09/17Atomic layer etching of tungsten for enhanced tungsten deposition fill
02/09/17Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide
02/02/17System and wafer alignment and centering with ccd camera and robot
02/02/17System, real time control of rapid alternating processes (rap)
02/02/17Time multiplexed chemical delivery system
02/02/17Vision-based wafer notch position measurement
02/02/17Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems
02/02/17Electrostatic chuck including embedded faraday cage for rf delivery and associated methods for operation, monitoring, and control
02/02/17Time varying segmented pressure control
02/02/17Using modeling to determine wafer bias associated with a plasma system
02/02/17Gas delivery system
01/26/17Fluid mixing hub for semiconductor processing tool
01/19/17Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
01/19/17Methods and systems for determining a fault in a gas heater channel
01/19/17Use of sintered nanograined yttrium-based ceramics as etch chamber components
01/19/17Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
01/12/17Multi-cycle ald process for film uniformity and thickness profile modulation
01/12/17Chemical deposition apparatus having conductance control
01/12/17Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
01/12/17Smart window for semiconductor processing tool
01/12/17Systems and methods for removing particles from a substrate processing chamber using rf plasma cycling and purging
01/12/17Pretreatment photoresist wafer processing
01/05/17Separation of plasma suppression and wafer edge to improve edge film thickness uniformity
01/05/17System for instantaneous radiofrequency power measurement and associated methods
12/29/16Use of atomic layer deposition coatings to protect brazing line against corrosion, erosion, and arcing
12/29/16Selective removal of boron doped carbon hard mask layers
12/29/16Controlling ion energy within a plasma chamber
12/29/16Use of plasma-resistant atomic layer deposition coatings to extend the lifetime of polymer components in etch chambers
12/29/16Low roughness euv lithography







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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