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Lam Research Corporation patents

Recent patent applications related to Lam Research Corporation. Lam Research Corporation is listed as an Agent/Assignee. Note: Lam Research Corporation may have other listings under different names/spellings. We're not affiliated with Lam Research Corporation, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "L" | Lam Research Corporation-related inventors




Date Lam Research Corporation patents (updated weekly) - BOOKMARK this page
03/23/17 new patent  Apparatus for determining process rate
03/23/17 new patent  Ion energy control by rf pulse shape
03/23/17 new patent  Multiple control modes
03/23/17 new patent  Plasma etching systems and methods using empirical mode decomposition
03/23/17 new patent  Method and determining process rate
03/16/17Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
03/16/17Durable low cure temperature hydrophobic coating in electroplating cup assembly
03/16/17Method for treating a nonhomogenous surface
03/16/17Cycle-averaged frequency tuning for low power voltage mode operation
03/16/17Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching
03/16/17Mask shrink layer for high aspect ratio dielectric etch
03/16/17Technique to deposit sidewall passivation for high aspect ratio cylinder etch
03/16/17Systems and methods for performing in-situ deposition of sidewall image transfer spacers
03/16/17Social network service for semiconductor manufacturing equipment and users
03/09/17Method of casting internal features
03/09/17Plasma excitation for spatial atomic layer deposition (ald) reactors
03/09/17Ale smoothness: in and outside semiconductor industry
03/09/17Systems and methods for selectively etching tungsten in a downstream reactor
03/02/17Liquid phase bonding of a silicon or silicon carbide component to another silicon or silicon carbide component
03/02/17Monolithic manifold mask and substrate concepts
03/02/17Edge flow element for electroplating apparatus
03/02/17Use of ion beam etching to generate gate-all-around structure
03/02/17Methods for detecting endpoint for through-silicon via reveal applications
02/23/17Radical generator and generating ammonia radicals
02/23/17Ammonia radical generator
02/23/17Multi-station chamber having symmetric grounding plate
02/23/17Application of powered electrostatic faraday shield to recondition dielectric window in icp plasmas
02/23/17Method of densifying films in semiconductor device
02/23/17Self limiting lateral atomic layer etch
02/23/17Atomic layer etching of tungsten and other metals
02/23/17Pulsing rf power in etch process to enhance tungsten gapfill performance
02/23/17Wear detection of consumable part in semiconductor manufacturing equipment
02/23/17Edge ring assembly for improving feature profile tilting at extreme edge of wafer
02/16/17Magnetized edge ring for extreme edge control
02/16/17Shadow trim line edge roughness reduction
02/16/17Annular edge seal with convex inner surface for electrostatic chuck
02/09/17Plasma etching device with plasma etch resistant coating
02/09/17Systems comprising silicon coated gas supply conduits and methods for applying coatings
02/09/17Hollow rf feed with coaxial dc power feed
02/09/17Systems and methods for separately applying charged plasma constituents and ultraviolet light in a mixed mode processing operation
02/09/17Systems and methods for reverse pulsing
02/09/17Systems and methods for reverse pulsing
02/09/17High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transfer
02/09/17Atomic layer etching of tungsten for enhanced tungsten deposition fill
02/09/17Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide
02/02/17System and wafer alignment and centering with ccd camera and robot
02/02/17System, real time control of rapid alternating processes (rap)
02/02/17Time multiplexed chemical delivery system
02/02/17Vision-based wafer notch position measurement
02/02/17Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems
02/02/17Electrostatic chuck including embedded faraday cage for rf delivery and associated methods for operation, monitoring, and control
02/02/17Time varying segmented pressure control
02/02/17Using modeling to determine wafer bias associated with a plasma system
02/02/17Gas delivery system
01/26/17Fluid mixing hub for semiconductor processing tool
01/19/17Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
01/19/17Methods and systems for determining a fault in a gas heater channel
01/19/17Use of sintered nanograined yttrium-based ceramics as etch chamber components
01/19/17Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation
01/12/17Multi-cycle ald process for film uniformity and thickness profile modulation
01/12/17Chemical deposition apparatus having conductance control
01/12/17Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
01/12/17Smart window for semiconductor processing tool
01/12/17Systems and methods for removing particles from a substrate processing chamber using rf plasma cycling and purging
01/12/17Pretreatment photoresist wafer processing
Patent Packs
01/05/17Separation of plasma suppression and wafer edge to improve edge film thickness uniformity
01/05/17System for instantaneous radiofrequency power measurement and associated methods
12/29/16Use of atomic layer deposition coatings to protect brazing line against corrosion, erosion, and arcing
12/29/16Selective removal of boron doped carbon hard mask layers
12/29/16Controlling ion energy within a plasma chamber
12/29/16Use of plasma-resistant atomic layer deposition coatings to extend the lifetime of polymer components in etch chambers
12/29/16Low roughness euv lithography
12/29/16Capped ald films for doping fin-shaped channel regions of 3-d ic transistors
12/22/16Flexible temperature compensation substrate processing systems
12/22/16Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
12/22/16System and determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
12/22/16Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges
12/22/16Auto-correction of electrostatic chuck temperature non-uniformity
12/22/16System and reducing temperature transition in an electrostatic chuck
12/15/16Apparatus and modulating azimuthal uniformity in electroplating
Patent Packs
12/15/16Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface
12/15/16Systems and methods for forming ultra-shallow junctions
12/15/16Plasma etching device with doped quartz surfaces
12/08/16Polarization stabilizer additive for electroplating
12/08/16Plasma etching device with plasma etch resistant coating
12/08/16Systems, methods and choked flow element extraction
12/08/16Large dynamic range rf voltage sensor and voltage mode rf bias application of plasma processing systems
12/08/16Atomic layer etching of gan and other iii-v materials
12/08/16Plasma-enhanced etching in an augmented plasma processing system
12/08/16Hybrid 200 mm/300 mm semiconductor processing apparatuses
12/01/16Anti-transient showerhead
12/01/16Electrolyte delivery and generation equipment
12/01/16Arrangement for plasma processing system control based on rf voltage
12/01/16Deposition of low fluorine tungsten by sequential cvd process
12/01/16Residue free oxide etch
12/01/16Tungsten films having low fluorine content
12/01/16Lightup prevention using multi-layer ceramic fabrication techniques
11/24/16Deposition apparatus including edge plenum showerhead assembly
11/24/16Low volume showerhead with faceplate holes for improved flow uniformity
11/24/16Systems and methods for providing characteristics of an impedance matching model for use with matching networks
11/24/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
11/24/16Corrosion resistant gas distribution manifold with thermally controlled faceplate
11/24/16Feature fill with multi-stage nucleation inhibition
11/24/16Interface passivation layers and methods of fabricating
11/17/16Substrate pedestal module including backside gas delivery tube and making
11/17/16Apparatus and electodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
11/17/16Adjustment of power and frequency based on three or more states
11/17/16Plasma assisted atomic layer deposition of multi-layer films for patterning applications
11/17/16High temperature substrate pedestal module and components thereof
11/10/16Methods of modulating residual stress in thin films
Social Network Patent Pack
11/10/16Highly selective deposition of amorphous carbon as a metal diffusion barrier layer
11/10/16Isotropic atomic layer etch for silicon oxides using no activation
11/10/16Inhibitor plasma mediated atomic layer deposition for seamless feature fill
11/03/16Gas inlet valve with incompatible materials isolation
11/03/16Apparatus for thermal control of tubing assembly and associated methods
11/03/16Apparatus with a spectral reflectometer for processing substrates
11/03/16Mixed mode pulsing etching in plasma processing systems
11/03/16Edge ramping
11/03/16Systems and methods for using one or more fixtures and efficiency to determine parameters of a match network model
11/03/16Inter-electrode gap variation methods for compensating deposition non-uniformity
Patent Packs
10/27/16Long lifetime thermal spray coating for etching or deposition chamber application
10/27/16Plasma etching systems and methods using empirical mode decomposition
10/27/16Gap fill using carbon-based films
10/27/16Cobalt etch back
10/20/16End effector assembly for clean/dirty substrate handling
10/20/16Systems and methods for reducing reflected power during state transitions by using radio frequency values
10/20/16Systems and methods for controlling a plasma edge region
10/20/16Control of impedance of rf delivery path
10/20/16Chamber with vertical support stem for symmetric conductance and rf delivery
10/20/16Ion injector and lens system for ion beam milling
10/20/16Measuring individual layer thickness during multi-layer deposition semiconductor processing
10/20/16Dry plasma etch method to pattern mram stack
10/20/16Systems and methods for reducing power reflected towards a higher frequency rf generator during a period of a lower rf generator and for using a relationship to reduce reflected power
10/13/16Monitoring electrolytes during electroplating
10/13/16Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems
10/13/16Substrate support with thermal zones for semiconductor processing
10/06/16Plasma processing systems and structures having sloped confinement rings
10/06/16Apparatus for thermal control of tubing assembly and associated methods
10/06/16Systems and methods for reversing rf current polarity at one output of a multpile output rf matching network
10/06/16Fault detection using showerhead voltage variation
10/06/16Deposition of conformal films by atomic layer deposition and atomic layer etch
10/06/16Cyclical, non-isobaric, pore sealing method to prevent precursor penetration into the substrate
10/06/16Sulfur and fluorine containing etch chemistry for improvement of distortion and bow control for har etch
10/06/16Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch feature profile uniformity
10/06/16Method and detecting defects on wafers
10/06/16Plasma assisted atomic layer deposition titanium oxide for patterning applications
10/06/16Radio frequency generator having multiple mutually exclusive oscillators for use in plasma processing
09/29/16Minimizing radical recombination using ald silicon oxide surface coating with intermittent restoration plasma
09/29/16Deposition of metal dielectric film for hardmasks
09/29/16Method for forming stair-step structures
Patent Packs
09/22/16Two-step deposition with improved selectivity
09/22/16Chemistry additives and process for cobalt film electrodeposition
09/22/16Control of electrolyte flow dynamics for uniform electroplating
09/22/16Control of current density in an electroplating apparatus
09/22/16Sub-pulsing during a state
09/22/16Ground state hydrogen radical sources for chemical vapor deposition of silicon-carbon-containing films
09/22/16Ultrathin atomic layer deposition film accuracy thickness control
09/15/16Dynamic modulation of cross flow manifold during electroplating
09/15/16Methods and synchronizing rf pulses in a plasma processing system
09/15/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/15/16Copper interconnect device including surface functionalized graphene capping layer and fabrication method thereof
09/08/16Clean resistant windows for ultraviolet thermal processing
09/08/16Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
09/08/16Systems and methods for tuning an impedance matching network in a step-wise fashion
09/08/16Impedance matching circuit for operation with a kilohertz rf generator and a megahertz rf generator to control plasma processes
09/08/16Method and apparatus to minimize seam effect during teos oxide film deposition
09/08/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/08/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
09/01/16Systems and methods for synchronizing execution of recipe sets
09/01/16Method for coating surfaces
Social Network Patent Pack
09/01/16Image reversal with ahm gap fill for multiple patterning
09/01/16Metallization of the wafer edge for optimized electroplating performance on resistive substrates
08/25/16Method for achieving ultra-high selectivity while etching silicon nitride
08/18/16Systems and methods for using multiple inductive and capacitive fixtures for applying a variety of plasma conditions to determine a match network model
08/11/16Control of impedance of rf return path
08/11/16Fabrication of a silicon structure and deep silicon etch with profile control
08/11/16Chambers for particle reduction in substrate processing systems
08/11/16Tungsten for wordline applications
08/04/16Modular vaporizer
08/04/16Geometry and process optimization for ultra-high rpm plating
08/04/16Plasma processing systems including side coils and methods related to the plasma processing systems
08/04/16Systems and methods for decreasing carbon-hydrogen content of amorphous carbon hardmask films
08/04/16Metal doping of amorphous carbon and silicon films used as hardmasks in substrate processing systems
07/28/16Apparatus and dynamic control of plated uniformity with the use of remote electric current
07/28/16Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber
07/28/16Gas distribution system for ceramic showerhead of plasma etch reactor
07/28/16End effector for wafer transfer system and transferring wafers
07/28/16Dual push between a host computer system and an rf generator
07/21/16Ion beam etching system
07/21/16Moveable edge coupling ring for edge process control during semiconductor wafer processing
Social Network Patent Pack
07/21/16Moveable edge coupling ring for edge process control during semiconductor wafer processing
07/14/16Multi-contact lipseals and associated electroplating methods
07/14/16Ceramic gas distribution plate with embedded electrode
07/14/16Internal plasma grid for semiconductor fabrication
07/14/16Integrating atomic scale processes: ald (atomic layer deposition) and ale (atomic layer etch)
07/14/16System, generating pressure pulses in small volume confined process reactor
07/14/16System and monitoring temperatures of and controlling multiplexed heater array
07/07/16Selective deposition and co-deposition processes for ferromagnetic thin films
07/07/16Isotropic atomic layer etch for silicon oxides using no activation
07/07/16Isotropic atomic layer etch for silicon and germanium oxides
07/07/16Method and anisotropic tungsten etching
07/07/16Multiplexed heater array using ac drive for semiconductor processing
06/30/16Tuning a parameter associated with plasma impedance
06/30/16Determining a value of a variable on an rf transmission model
06/30/16Pre-fill wafer cleaning formulation
06/23/16Hardware and process for film uniformity improvement
06/23/16Reducing backside deposition at wafer edge
06/23/16Methods and apparatuses for dynamically tunable wafer-edge electroplating
06/23/16Pecvd films for euv lithography
06/23/16Silicon etch and clean
06/23/16Method for forming stair-step structures
06/23/16Selective nitride etch
06/23/16Integrated etch/clean for dielectric etch applications
06/23/16Internal plasma grid for semiconductor fabrication
06/16/16Multi-station plasma reactor with rf balancing
06/16/16Inlet for effective mixing and purging
06/16/16Computation of statistics for statistical data decimation
06/16/16Carrier ring structure and chamber systems including the same
06/16/16Fast-gas switching for etching
06/16/16Ion energy control by rf pulse shape
Social Network Patent Pack
06/09/16Multichannel thermocouple compensation for three dimensional temperature gradient
06/09/16Methods for depositing silicon oxide
06/09/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
06/09/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
06/09/16Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch
06/09/16Technique to deposit sidewall passivation for high aspect ratio cylinder etch
06/09/16Faraday shield having plasma density decoupling structure between tcp coil zones
06/09/16Method and system related to semiconductor processing equipment
06/09/16Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications
06/02/16Methods and a hybrid capacitively-coupled and an inductively-coupled plasma processing system
06/02/16Line width roughness improvement with noble gas plasma
06/02/16Etch process with pre-etch transient conditioning
05/26/16Valve manifold deadleg elimination via reentrant flow path
05/26/16Pulsed plasma chamber in dual chamber configuration
05/26/16Selective inhibition in atomic layer deposition of silicon-containing films
05/26/16Method of depositing ammonia free and chlorine free conformal silicon nitride film
05/26/16Gas injection uniformly processing a semiconductor substrate in a semiconductor substrate processing apparatus
05/19/16Reactive ultraviolet thermal processing of low dielectric constant materials
05/19/16Systems and methods for forming selective metal electrode layers for resistive switching memories
05/19/16Fast-gas switching for etching
05/19/16Dual phase cleaning chambers and assemblies comprising the same
05/19/16Dry development and image transfer of si-containing self-assembled block copolymers
05/19/16Internal plasma grid for semiconductor fabrication
05/12/16Adjustment of vuv emission of a plasma via collisional resonant energy transfer to an energy absorber gas
05/05/16Arrangements for manipulating plasma confinement within a plasma processing system and methods thereof
05/05/16Methods for controlling plasma constituent flux and deposition during semiconductor fabrication and implementing the same
04/28/16System, refining rf transmission system models
04/28/16System, rf power compensation in a plasma processing system
04/28/16Gapfill of variable aspect ratio features with a composite peald and pecvd method







ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009



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