Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch
  

Lingsen Precision Industries Ltd patents

Recent patent applications related to Lingsen Precision Industries Ltd. Lingsen Precision Industries Ltd is listed as an Agent/Assignee. Note: Lingsen Precision Industries Ltd may have other listings under different names/spellings. We're not affiliated with Lingsen Precision Industries Ltd, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "L" | Lingsen Precision Industries Ltd-related inventors




Date Lingsen Precision Industries Ltd patents (updated weekly) - BOOKMARK this page
12/15/16Optical module integrated package
06/02/16Flip-chip mems microphone
05/05/16Optical module package and its packaging method
04/28/16Pressure sensor package
03/31/16Optical sensing module and manufacturing the same
03/31/16Quad-flat non-lead package structure and packaging the same
02/25/16Mems microphone packaging method
02/25/16Stacked mems microphone packaging method
10/01/15Quad-flat no-leads package structure and manufacturing the same
10/01/15Optical module with optical concentration structure and packaging method thereof
10/01/15Optical module integrated package
09/10/15Copper clad laminate having barrier structure and manufacturing the same
07/23/15Copper clad laminate having barrier structure and manufacturing the same
07/02/15Gas sensor having micro-package structure and making the same
07/02/15Chip stack structure using conductive film bridge adhesive technology
07/02/15Micro optical package structure with filtration layer and making the same
05/28/15Led package and manufacturing process of same
04/23/15Package structure of optical module
04/02/15Package structure of optical module
03/12/15Led package and manufacturing process of same
03/12/15Chip package, chip package module based on the chip package, and manufacturing the chip package
01/29/15Package structure of an optical module
01/29/15Package structure of an optical module
01/29/15Package structure of an optical module
01/29/15Package structure of optical module
01/29/15Package structure of optical module
01/29/15Package structure of optical module
10/09/14Quad flat non-lead package
05/08/14Led lamp strip and manufacturing process thereof
12/01/11Microelectromechanical microphone carrier module
10/06/11Pre-molded support mount of lead frame-type for led light module
07/28/11Mems module package
07/21/11Cap for mems package
07/01/10Lead frame for quad flat no-lead package
05/27/10Lead frame
04/22/10Microelectromechanical system microphone package
11/19/09Flip-chip process by photo-curing adhesive
09/24/09Method of stacking dies for die stack package
09/24/09Ic package having reduced thickness
09/24/09Ic packaging process
07/23/09Ic packaging process by photo-curing adhesive
07/16/09Method of arranging stacked chip by photo-curing adhesive
07/16/09Package for mems microphone
07/16/09Ic packaging process







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Lingsen Precision Industries Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Lingsen Precision Industries Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###




';