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Lingsen Precision Industries Ltd patents


Recent patent applications related to Lingsen Precision Industries Ltd. Lingsen Precision Industries Ltd is listed as an Agent/Assignee. Note: Lingsen Precision Industries Ltd may have other listings under different names/spellings. We're not affiliated with Lingsen Precision Industries Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "L" | Lingsen Precision Industries Ltd-related inventors


Microphone package structure

A microphone package structure includes a substrate, sound wave transducer, processing chip, lid, sound aperture, at least one first solder pad and at least one second solder pad. The substrate has a top side, a bottom side and two opposing lateral sides. The top and bottom sides each connect the... Lingsen Precision Industries Ltd

Mems microphone package

A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end... Lingsen Precision Industries Ltd

Microelectromechanical microphone package structure

A microelectromechanical microphone package structure includes a substrate, sidewall, lid, sound wave transducer and processing module. The substrate has a plate, sound aperture penetrating the plate, and conduction portion disposed on the plate. The sidewall has one end disposed on the plate and has a conduction circuit electrically connected to... Lingsen Precision Industries Ltd

Mems microphone package

A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to... Lingsen Precision Industries Ltd

Mems microphone package

A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one... Lingsen Precision Industries Ltd








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Lingsen Precision Industries Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Lingsen Precision Industries Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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