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Megica Corporation patents

Recent patent applications related to Megica Corporation. Megica Corporation is listed as an Agent/Assignee. Note: Megica Corporation may have other listings under different names/spellings. We're not affiliated with Megica Corporation, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "M" | Megica Corporation-related inventors




Date Megica Corporation patents (updated weekly) - BOOKMARK this page
01/23/14Chip packages with power management integrated circuits and related techniques
01/23/14High performance ic chip having discrete decoupling capacitors attached to its ic surface
11/21/13Integrated chip package structure using ceramic substrate and manufacturing the same
09/19/13Integrated circuit chip using top post-passivation technology and bottom structure technology
08/29/13Structure and manufacturing chip scale package
08/22/13Chip structure with a passive device and forming the same
08/01/13High performance system-on-chip inductor using post passivation process
05/23/13Integrated circuit chips with fine-line metal and over-passivation metal
09/13/12Image and light sensor chip packages
08/02/12Multichip packages
07/05/12Waveguide structures for signal and/or power transmission in a semiconductor device
04/26/12Chip structure and process for forming the same
02/02/12Solder interconnect on ic chip
01/12/12Chip package
12/22/11Chip package with die and substrate
12/01/11Reliable metal bumps on top of i/o pads after removal of test probe marks
12/01/11Chip structure
12/01/11Method of assembling chips
11/24/11Multiple selectable function integrated circuit module
11/24/11Integrated circuit and fabricating the same
11/17/11Chip structure and process for forming the same
11/03/11Semiconductor chip with post-passivation scheme formed over passivation layer
11/03/11Carbon nanotube circuit component structure
10/20/11High performance sub-system design and assembly
10/06/11Stacked chip package with redistribution lines
09/29/11Semiconductor chip with coil element over passivation layer
09/08/11Chip package and fabricating the same
09/08/11Method for forming a double embossing structure
09/08/11Method for fabricating circuit component
09/01/11Chip package
08/25/11Chip structure and fabricating the same
08/25/11Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
08/25/11Integrated chip package structure using organic substrate and manufacturing the same
08/18/11Semiconductor chip
07/21/11Method for making high-performance rf integrated circuits
07/21/11Post passivation interconnection schemes on top of the ic chips
03/03/11Chip structure with bumps and testing pads
02/03/11Structure and manufacturing a chip scale package with low fabrication cost, fine pitch and high reliability solder bump
02/03/11Structure and manufacturing a chip scale package with low fabrication cost, fine pitch and high reliability solder bump
02/03/11System-in packages
11/18/10System-in packages
09/30/10Chip packages
09/30/10Integrated circuit chip using top post-passivation technology and bottom structure technology
08/12/10Image and light sensor chip packages
07/01/10Chip packages with power management integrated circuits and related techniques
05/13/10Top layers of metal for high performance ic's
02/18/10Low fabrication cost, high performance, high reliability chip scale package
01/21/10Chip package and fabricating the same
12/17/09Top layers of metal for high performance ic's
11/26/09Structure and manufacturing chip scale package
11/26/09Semiconductor chip and fabricating the same
10/29/09Structure and manufacturing a chip scale package with low fabrication cost, fine pitch and high reliability solder bump
10/22/09Low fabrication cost, fine pitch and high reliability solder bump
09/03/09Semiconductor chip with passivation layer comprising metal interconnect and contact pads
08/20/09Wirebond over post passivation thick metal
07/23/09High performance system-on-chip inductor using post passivation process
06/11/09Post passivation interconnection schemes on top of the ic chips
06/11/09Top layers of metal for high performance ic's
05/28/09High performance sub-system design and assembly
05/28/09Low fabrication cost, high performance, high reliability chip scale package
05/14/09High performance sub-system design and assembly
05/14/09High performance sub-system design and assembly
05/14/09Chip package
05/07/09High performance sub-system design and assembly
04/30/09Chip structure and fabricating the same
Patent Packs
04/30/09Over-passivation process of forming polymer layer over ic chip
04/23/09Semiconductor chip with coil element over passivation layer
03/12/09Semiconductor chip and process for forming the same
03/12/09Structure of high performance combo chip and processing method
03/05/09Multiple chips bonded to packaging structure with low noise and multiple selectable functions
03/05/09Structure of gold bumps and gold conductors on one ic die and methods of manufacturing the structures
03/05/09Post passivation structure for a semiconductor device and packaging process for same
03/05/09Stacked chip package with redistribution lines
03/05/09Structure of high performance combo chip and processing method
03/05/09Multiple chips bonded to packaging structure with low noise and multiple selectable functions
02/26/09Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
02/26/09Wirebond pad for semiconductor chip or wafer
02/19/09Top layers of metal for high performance ic's







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Megica Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Megica Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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